JP2005109111A - Electrical component and air-conditioning system - Google Patents

Electrical component and air-conditioning system Download PDF

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Publication number
JP2005109111A
JP2005109111A JP2003339959A JP2003339959A JP2005109111A JP 2005109111 A JP2005109111 A JP 2005109111A JP 2003339959 A JP2003339959 A JP 2003339959A JP 2003339959 A JP2003339959 A JP 2003339959A JP 2005109111 A JP2005109111 A JP 2005109111A
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Japan
Prior art keywords
electrical component
semiconductor element
circuit board
printed circuit
connector
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JP2003339959A
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Japanese (ja)
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Toshio Yabuki
俊生 矢吹
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Daikin Industries Ltd
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Daikin Industries Ltd
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Priority to JP2003339959A priority Critical patent/JP2005109111A/en
Publication of JP2005109111A publication Critical patent/JP2005109111A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrical component which retains an identical function, while intending to miniaturize it. <P>SOLUTION: A connector 5, which is an electrical component has such a structure that a lead 6 is made to project to the rear surface side of a printed board 1, and this projected lead 6 is fixed to the printed board 1 by a solder 7 formed on the rear surface side. In a semiconductor device 2, a recess 8 is formed on a side opposite to the side to which a heat sink 4 is mounted, and the lead 6 of the connector 5 projected to the rear surface side of the printed board 1 is inserted into the recess 8 for layout. It is not necessary that a space L1, corresponding to a projection length of the lead 6 of the connector 5, be provided between the printed board 1 and the semiconductor element 2, unlike the prior art. For this reason, a clearance L2 between the printed board 1 and the heat sink 4 can be reduced, and the electrical component can be miniaturized and thinning becomes possible. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

この発明は、空気調和機等に設けられる電装部品及びこの電装部品を備えて成る空気調和機に関するものである。   The present invention relates to an electrical component provided in an air conditioner or the like and an air conditioner including the electrical component.

図３は、空気調和機において使用されている従来の電装部品の模式図である（例えば、特許文献１参照）。同図において、２１は、プリント基板を示しているが、このプリント基板２１の一方の側に、インバータ用のパワーモジューウルのような半導体素子２２が、ハンダ部２３、２３によって取付けられている。また、半導体素子２２の外側（プリント基板２１とは反対側）には、半導体素子２２からの放熱を促進するため、ヒートシンク２４が、半導体素子２２の表面に密着状態で取付けられている。さらに、上記プリント基板２１には、半導体素子２２の配置側とは反対側であって、半導体素子２２の配置位置に対応した位置にコネクタ２５が取付けられている。このコネクタ２５は、上記半導体素子２２に電気的に接続されるものである。
特開２００２−２９１２６１号公報（図４） FIG. 3 is a schematic diagram of a conventional electrical component used in an air conditioner (see, for example, Patent Document 1). In the figure, reference numeral 21 denotes a printed circuit board. On one side of the printed circuit board 21, a semiconductor element 22 such as a power module for an inverter is attached by solder parts 23 and 23. In addition, a heat sink 24 is attached to the surface of the semiconductor element 22 in close contact with the outside of the semiconductor element 22 (on the side opposite to the printed board 21) in order to promote heat dissipation from the semiconductor element 22. Further, a connector 25 is attached to the printed board 21 at a position opposite to the arrangement side of the semiconductor element 22 and corresponding to the arrangement position of the semiconductor element 22. The connector 25 is electrically connected to the semiconductor element 22.
JP 2002-291261 A (FIG. 4)

ところで、上記電装部品においては、図３に示しているように、コネクタ２５のリード２６を、プリント基板２１の裏面側（半導体素子２２の取付け側）に突出させ、この突出したリード２６を、裏面側に形成したハンダ部２７にてプリント基板２１に固定している。この場合、上記プリント基板２１と半導体素子２２との間には、コネクタ２５のリード２６の突出長に応じたスペースＬ１を設ける必要がある。そのため、それに応じて、プリント基板２１とヒートシンク２４との間隔Ｌ２が大となり、電装部品の小形化、薄型化が困難であった。特に、インバータに代表される大電力半導体素子の入出力用コネクタ２５は、大形のリード部品であることから、上記のように半導体素子２２の反対側に配置するのが好ましいのであるが、上記のような理由から電装部品の小形化、薄型化が、特に困難となっている。   By the way, in the said electrical component, as shown in FIG. 3, the lead 26 of the connector 25 is protruded to the back side of the printed circuit board 21 (attachment side of the semiconductor element 22), and the protruding lead 26 is connected to the back side. The solder part 27 formed on the side is fixed to the printed circuit board 21. In this case, it is necessary to provide a space L <b> 1 according to the protruding length of the lead 26 of the connector 25 between the printed circuit board 21 and the semiconductor element 22. Therefore, the distance L2 between the printed circuit board 21 and the heat sink 24 is accordingly increased, and it is difficult to reduce the size and thickness of the electrical component. In particular, since the input / output connector 25 of the large power semiconductor element represented by the inverter is a large lead component, it is preferably disposed on the opposite side of the semiconductor element 22 as described above. For these reasons, it is particularly difficult to reduce the size and thickness of electrical components.

この発明は、上記従来の欠点を解決するためになされたものであって、その目的は、同一の機能を保持しながらも、小形化図ることが可能な電装部品及びこの電装部品を用いて成る空気調和機を提供することにある。   The present invention has been made to solve the above-described conventional drawbacks, and an object of the present invention is to use an electrical component that can be miniaturized while maintaining the same function, and the electrical component. The object is to provide an air conditioner.

そこで請求項１の電装部品は、プリント基板１に半導体素子２を取付け、半導体素子２のプリント基板１とは反対側にヒートシンク４を取付けた電装部品において、上記半導体素子２のプリント基板側に凹部８を設け、この凹部８内に他の電気部品５、９の少なくともその一部を配置したことを特徴としている。   Accordingly, the electrical component according to claim 1 is an electrical component in which the semiconductor element 2 is mounted on the printed board 1 and the heat sink 4 is mounted on the opposite side of the semiconductor element 2 from the printed board 1. 8, and at least a part of the other electrical components 5 and 9 is disposed in the recess 8.

請求項２の電装部品は、上記他の電気部品は、上記プリント基板１の半導体素子２とは反対側に取付けられたコネクタ５であり、プリント基板１から上記半導体素子２側に突出するコネクタ５のリード６の先端部を上記凹部８内に挿入、配置していることを特徴としている。   According to another aspect of the electrical component of the present invention, the other electrical component is a connector 5 attached to the opposite side of the printed circuit board 1 from the semiconductor element 2, and the connector 5 protrudes from the printed circuit board 1 toward the semiconductor element 2. The tip of the lead 6 is inserted and disposed in the recess 8.

請求項３の電装部品は、上記他の電気部品は、半導体素子１の温度を測定するための温度測定手段９であり、この温度測定手段９を上記凹部８内に挿入、配置すると共に、プリント基板１に取付けたことを特徴としている。   According to a third aspect of the present invention, the electrical component is the temperature measuring means 9 for measuring the temperature of the semiconductor element 1. The temperature measuring means 9 is inserted and arranged in the recess 8 and printed. It is characterized by being attached to the substrate 1.

請求項４の空気調和機は、上記請求項１〜請求項３のいずれかの電装部品を備えたことを特徴としている。   An air conditioner according to a fourth aspect includes the electrical component according to any one of the first to third aspects.

請求項１の電装部品では、電気部品５、９の少なくとのその一部が、半導体素子２の凹部８内に挿入、配置されるので、プリント基板１と半導体素子２との間に設ける隙間は、従来よりも小さくなり、そのため、プリント基板１とヒートシンク４との間隔Ｌ２を小さくでき、電装部品の小形化、薄型化が可能となる。   In the electrical component according to claim 1, at least a part of the electrical components 5 and 9 is inserted and arranged in the recess 8 of the semiconductor element 2, so that a gap provided between the printed circuit board 1 and the semiconductor element 2 is provided. Therefore, the distance L2 between the printed circuit board 1 and the heat sink 4 can be reduced, and the electrical component can be reduced in size and thickness.

請求項２の電装部品では、コネクタ５のリード６の突出部は、半導体素子２の凹部８内に挿入、配置されるので、プリント基板１と半導体素子２との間に設ける隙間は、従来よりも小さくなり、そのため、プリント基板１とヒートシンク４との間隔Ｌ２を小さくでき、電装部品の小形化、薄型化が可能となる。   In the electrical component according to the second aspect, since the protruding portion of the lead 6 of the connector 5 is inserted and arranged in the recess 8 of the semiconductor element 2, the gap provided between the printed circuit board 1 and the semiconductor element 2 is larger than the conventional one. Therefore, the distance L2 between the printed circuit board 1 and the heat sink 4 can be reduced, and the electrical component can be reduced in size and thickness.

請求項３の電装部品では、温度測定手段９が、半導体素子２の凹部８内に挿入、配置されるので、プリント基板１とヒートシンク４との間隔Ｌ２を小さくでき、電装部品の小形化、薄型化が可能となる。また、温度測定手段９を、プリント基板１に取付けたので、部品コストを低く抑え、部品製造に際して生産性を向上することが可能となる。また、発熱部分に近い場所の温度を直接に測定するため、測定精度が向上し、応答性も良好なものとなる。   In the electrical component of claim 3, since the temperature measuring means 9 is inserted and arranged in the recess 8 of the semiconductor element 2, the distance L2 between the printed circuit board 1 and the heat sink 4 can be reduced, and the electrical component can be made smaller and thinner. Can be realized. In addition, since the temperature measuring means 9 is attached to the printed circuit board 1, it is possible to keep the component cost low and improve the productivity when manufacturing the component. In addition, since the temperature near the heat generating part is directly measured, the measurement accuracy is improved and the responsiveness is also good.

請求項４の空気調和機では、電装品箱等の小形化、薄型化が可能となる。   In the air conditioner of claim 4, it is possible to reduce the size and thickness of the electrical component box and the like.

次に、この発明の電装部品及び電装部品を用いた空気調和機の具体的な実施の形態について、図面を参照しつつ詳細に説明する。図１は、電装部品の模式図である。同図において、１は、プリント基板を示しているが、このプリント基板１の一方の側に、インバータ用のパワーモジューウルのような半導体素子２が、ハンダ部３、３によって取付けられている。また、半導体素子２の外側（プリント基板１とは反対側）には、半導体素子２からの放熱を促進するため、ヒートシンク４が、半導体素子２の表面に密着状態で取付けられている。さらに、上記プリント基板１には、半導体素子２の配置側とは反対側であって、半導体素子２の配置位置に対応した位置にコネクタ５が取付けられている。このコネクタ５は、上記半導体素子２に電気的に接続されるものである。そして上記電装部品においては、図１に示しているように、コネクタ５のリード６を、プリント基板１の裏面側（半導体素子２の取付け側）に突出させ、この突出したリード６を、裏面側に形成したハンダ部７にてプリント基板１に固定している。   Next, specific embodiments of an electrical component of the present invention and an air conditioner using the electrical component will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram of an electrical component. In the figure, reference numeral 1 denotes a printed circuit board. A semiconductor element 2 such as a power module for an inverter is attached to one side of the printed circuit board 1 by solder parts 3 and 3. A heat sink 4 is attached to the surface of the semiconductor element 2 in close contact with the outside of the semiconductor element 2 (on the side opposite to the printed circuit board 1) in order to promote heat dissipation from the semiconductor element 2. Further, a connector 5 is attached to the printed board 1 at a position opposite to the arrangement side of the semiconductor element 2 and corresponding to the arrangement position of the semiconductor element 2. The connector 5 is electrically connected to the semiconductor element 2. In the electrical component, as shown in FIG. 1, the lead 6 of the connector 5 is protruded to the back side of the printed circuit board 1 (the side where the semiconductor element 2 is attached), and the protruding lead 6 is connected to the back side. It is fixed to the printed circuit board 1 with the solder portion 7 formed in the above.

この場合、上記半導体素子２においては、ヒートシンク４の取付け側とは反対側（プリント基板１に対向する側）には、凹部８が形成されている。そして、この凹部８内に、プリント基板１の裏面側（半導体素子２の取付け側）に突出したコネクタ５のリード６を挿入、配置している。なお、上記半導体素子２の凹部８は、半導体素子２を樹脂封止する際に、その成形過程において形成される溝状のもので、図１において、紙面に直交に延びるものである。   In this case, in the semiconductor element 2, a concave portion 8 is formed on the side opposite to the mounting side of the heat sink 4 (the side facing the printed circuit board 1). In the recess 8, the lead 6 of the connector 5 protruding to the back side of the printed circuit board 1 (the side where the semiconductor element 2 is attached) is inserted and arranged. The recess 8 of the semiconductor element 2 has a groove shape formed in the molding process when the semiconductor element 2 is resin-sealed, and extends perpendicular to the paper surface in FIG.

上記実施形態においては、コネクタ５のリード６の突出部は、半導体素子２の凹部８内に挿入、配置されるので、プリント基板１と半導体素子２との間には、従来のようにコネクタ５のリード６の突出長に応じたスペースＬ１を設ける必要はない。そのため、それに応じて、プリント基板１とヒートシンク４との間隔Ｌ２を小さくでき、電装部品の小形化、薄型化が可能となる。また、この電装部品を使用した空気調和機においても、電装品箱等の小形化、薄型化が可能となる。   In the above embodiment, the protruding portion of the lead 6 of the connector 5 is inserted and disposed in the recess 8 of the semiconductor element 2, so that the connector 5 is interposed between the printed circuit board 1 and the semiconductor element 2 as in the prior art. It is not necessary to provide the space L1 corresponding to the protruding length of the lead 6. Therefore, according to it, the space | interval L2 of the printed circuit board 1 and the heat sink 4 can be made small, and an electrical component can be reduced in size and thickness. Also, in an air conditioner using this electrical component, it is possible to reduce the size and thickness of an electrical component box or the like.

図２には、電装部品の第２実施形態を示している。これは、半導体素子２に設けた凹部８内に温度測定手段（例えば、サーミスタ）９を挿入、配置したものである。そして、温度測定手段９は、プリント基板１に、ハンダ部１０によって、直接的に取付けられている。この実施形態においても、プリント基板１とヒートシンク４との間隔Ｌ２を小さくでき、電装部品の小形化、薄型化が可能となる。また、この電装部品を使用した空気調和機においても、電装品箱等の小形化、薄型化が可能となる。また、温度測定手段９を、プリント基板１に、ハンダ部１０によって、直接的に取付けたので、部品コストを低く抑え、部品製造に際して生産性を向上することが可能となる。また、発熱部分に近い場所の温度を直接に測定するため、測定精度が向上し、応答性も良好なものとなる。   FIG. 2 shows a second embodiment of the electrical component. This is one in which a temperature measuring means (for example, a thermistor) 9 is inserted and arranged in a recess 8 provided in the semiconductor element 2. The temperature measuring means 9 is directly attached to the printed circuit board 1 by the solder portion 10. Also in this embodiment, the distance L2 between the printed circuit board 1 and the heat sink 4 can be reduced, and the electrical component can be reduced in size and thickness. Also, in an air conditioner using this electrical component, it is possible to reduce the size and thickness of an electrical component box or the like. Further, since the temperature measuring means 9 is directly attached to the printed circuit board 1 by the solder portion 10, it is possible to keep the component cost low and improve the productivity when manufacturing the component. In addition, since the temperature near the heat generating part is directly measured, the measurement accuracy is improved and the responsiveness is also good.

以上にこの発明の具体的な実施の形態について説明したが、この発明は上記形態に限定されるものではなく、この発明の範囲内で種々変更して実施することができる。上記では電気部品として、コネクタ５や温度測定手段９を使用しているが、電気部品としては、これに限られる訳ではない。また、上記半導体素子２の凹部８の形状も、溝状のものに限らず、スポット状のものであってもよい。   Although specific embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention. In the above description, the connector 5 and the temperature measuring means 9 are used as electrical components, but the electrical components are not limited to this. Further, the shape of the concave portion 8 of the semiconductor element 2 is not limited to the groove shape, but may be a spot shape.

この発明の電装部品の第１実施形態を示す断面略図である。1 is a schematic cross-sectional view showing a first embodiment of an electrical component of the present invention. この発明の電装部品の第２実施形態を示す断面略図である。It is a section schematic diagram showing a 2nd embodiment of an electrical component of this invention. 従来例の電装部品を示す断面略図である。It is a cross-sectional schematic diagram which shows the electrical component of a prior art example.

符号の説明Explanation of symbols

１ プリント基板
２ 半導体素子
４ ヒートシンク
５ コネクタ
８ 凹部
９ 温度測定手段（サーミスタ） DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Semiconductor element 4 Heat sink 5 Connector 8 Recessed part 9 Temperature measuring means (thermistor)

Claims (4)

プリント基板（１）に半導体素子（２）を取付け、半導体素子（２）のプリント基板（１）とは反対側にヒートシンク（４）を取付けた電装部品において、上記半導体素子（２）のプリント基板側に凹部（８）を設け、この凹部（８）内に他の電気部品（５）（９）の少なくともその一部を配置したことを特徴とする電装部品。 In an electrical component in which a semiconductor element (2) is mounted on a printed circuit board (1) and a heat sink (4) is mounted on the opposite side of the printed circuit board (1) of the semiconductor element (2), the printed circuit board of the semiconductor element (2) An electrical component comprising a recess (8) on the side, and at least a part of another electrical component (5) (9) disposed in the recess (8). 上記他の電気部品は、上記プリント基板（１）の半導体素子（２）とは反対側に取付けられたコネクタ（５）であり、プリント基板（１）から上記半導体素子（２）側に突出するコネクタ（５）のリード（６）の先端部を上記凹部（８）内に挿入、配置していることを特徴とする請求項１の電装部品。 The other electrical component is a connector (5) attached to the side opposite to the semiconductor element (2) of the printed circuit board (1), and protrudes from the printed circuit board (1) to the semiconductor element (2) side. 2. The electrical component according to claim 1, wherein the tip of the lead (6) of the connector (5) is inserted and arranged in the recess (8). 上記他の電気部品は、半導体素子（１）の温度を測定するための温度測定手段（９）であり、この温度測定手段（９）を上記凹部（８）内に挿入、配置すると共に、プリント基板（１）に取付けたことを特徴とする請求項１の電装部品。 The other electrical component is a temperature measuring means (9) for measuring the temperature of the semiconductor element (1). The temperature measuring means (9) is inserted and arranged in the recess (8), and printed. The electrical component according to claim 1, wherein the electrical component is attached to a substrate. 上記請求項１〜請求項３のいずれかの電装部品を備えた空気調和機。 An air conditioner comprising the electrical component according to any one of claims 1 to 3.
JP2003339959A 2003-09-30 2003-09-30 Electrical component and air-conditioning system Pending JP2005109111A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008232527A (en) * 2007-03-20 2008-10-02 Matsushita Electric Ind Co Ltd Air conditioner
US20160192472A1 (en) * 2005-03-22 2016-06-30 Sew-Eurodrive Gmbh & Co. Kg Device and method for determining the temperature of a heat sink
CN105805865A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Side surface mounting method of semiconductor refrigerating module
CN111149200A (en) * 2017-09-28 2020-05-12 Ｋｙｂ株式会社 Component mounting body and electronic apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160192472A1 (en) * 2005-03-22 2016-06-30 Sew-Eurodrive Gmbh & Co. Kg Device and method for determining the temperature of a heat sink
US9967966B2 (en) * 2005-03-22 2018-05-08 Sew-Eurodrive Gmbh & Co. Kg Device and method for determining the temperature of a heat sink
JP2008232527A (en) * 2007-03-20 2008-10-02 Matsushita Electric Ind Co Ltd Air conditioner
CN105805865A (en) * 2014-12-31 2016-07-27 青岛海尔智能技术研发有限公司 Side surface mounting method of semiconductor refrigerating module
CN111149200A (en) * 2017-09-28 2020-05-12 Ｋｙｂ株式会社 Component mounting body and electronic apparatus

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