JP2000101005A - Heat radiative material - Google Patents
Heat radiative materialInfo
- Publication number
- JP2000101005A JP2000101005A JP26308398A JP26308398A JP2000101005A JP 2000101005 A JP2000101005 A JP 2000101005A JP 26308398 A JP26308398 A JP 26308398A JP 26308398 A JP26308398 A JP 26308398A JP 2000101005 A JP2000101005 A JP 2000101005A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat dissipating
- metal
- heat radiating
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品等の発熱
体、又は該発熱体によって加熱される被加熱体の放熱を
行うために用いられる放熱材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating material used to radiate heat from a heating element such as an electronic component or a heated object heated by the heating element.
【０００２】[0002]
【従来の技術】近年、電子機器等に使用されているＩＣ
等の電子部品は、その集積度の向上及び動作の高速化に
より消費電力が増大すると共に発熱量も増大し、電子機
器の誤動作や電子部品自体の故障の一因となっているた
め、その放熱対策が大きな問題となっている。2. Description of the Related Art In recent years, ICs used in electronic devices and the like have been developed.
Electronic components such as these increase power consumption and heat generation due to the increase in their integration and the speed of their operation, which contributes to malfunction of electronic devices and failure of the electronic components themselves. Countermeasures have become a major problem.
【０００３】そこで、従来より、電子機器等において
は、その使用中に電子部品の温度上昇を抑えるために、
黄銅、アルミニウム等、熱伝導率の高い金属板を用いた
ヒートシンクが使用されている。このヒートシンクは、
その電子部品が発生する熱を伝導し、その熱を外気との
温度差によって表面から放出する。したがって、外気と
の接触面、すなわちヒートシンクの表面積が大きいほ
ど、放熱され易い。そのため、ヒートシンクには放熱フ
ィンを設けたものもあった。また、電子部品が発生する
熱をヒートシンクに効率よく伝導するための熱伝導部材
を、電子部品とヒートシンクとの間に介装させるのが一
般的であった。この熱伝導部材には、熱伝導性シリコー
ンゴム等を用いて柔軟性を高くし、電子部品及びヒート
シンクとの密着性を高める工夫がなされていた。Therefore, conventionally, in electronic devices and the like, in order to suppress a rise in the temperature of electronic components during use thereof,
A heat sink using a metal plate having high thermal conductivity, such as brass or aluminum, is used. This heat sink is
The heat generated by the electronic component is conducted, and the heat is released from the surface due to a temperature difference from the outside air. Therefore, the larger the contact surface with the outside air, that is, the larger the surface area of the heat sink, the more easily the heat is radiated. Therefore, some heat sinks are provided with radiation fins. In general, a heat conducting member for efficiently conducting heat generated by an electronic component to a heat sink is interposed between the electronic component and the heat sink. The heat conductive member has been devised to increase flexibility by using heat conductive silicone rubber or the like, and to improve adhesion to an electronic component and a heat sink.
【０００４】[0004]
【発明が解決しようとする課題】しかし、このような金
属板からなるヒートシンクは、使用場所の制約を受ける
と共に重量が大きくなるため、取り扱いにくいという問
題があった。例えば、このようなヒートシンクを使用す
る場合、予め種々の大きさ、形状のものを用意してお
き、プリント配線板あるいは電子部品の大きさに合わ
せ、また、プリント配線板に対しヒートシンクを配置す
る側の空間に合わせ、用意されたものの中から適当なも
のを選定して用いる必要があった。また、上述したよう
に重量が大きくなるため、電子部品の実装されたプリン
ト配線板に固定するために、ネジで止めたり、バネで押
さえたりする必要があった。However, such a heat sink made of a metal plate has a problem that it is difficult to handle because the heat sink is restricted in its use place and its weight increases. For example, when using such a heat sink, various sizes and shapes are prepared in advance, the size is adjusted according to the size of the printed wiring board or the electronic component, and the heat sink is arranged on the printed wiring board. It was necessary to select and use an appropriate one from those prepared according to the space. Further, since the weight increases as described above, it has been necessary to fix with a screw or hold down with a spring in order to fix the electronic component mounted on the printed wiring board.
【０００５】本発明は、ネジやバネを用いることなく固
定でき、使用場所の制約を少なくした放熱材を提供する
ことを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat dissipating material which can be fixed without using a screw or a spring and has less restrictions on the place of use.
【０００６】[0006]
【課題を解決するための手段及び発明の効果】上述の目
的を達成するためになされた請求項１に記載の放熱材
は、外部同士を連通する空隙を設けた３次元網状構造を
有し、金属材料又は金属メッキを施した材料で形成され
た放熱部材と、放熱部材に連接された部材であり、発熱
体に密接可能な柔軟性を有する基材中に熱伝導フィラー
を分散させて形成され、当該基材が表面に粘着性を有す
る又は当該基材の表面に粘着層を設けた熱伝導部材とを
備えることを特徴としている。Means for Solving the Problems and Effects of the Invention The heat dissipating material according to the first aspect of the present invention, which has been made to achieve the above object, has a three-dimensional net-like structure provided with a void communicating with the outside. A heat dissipating member formed of a metal material or a metal-plated material, a member connected to the heat dissipating member, formed by dispersing a heat conductive filler in a flexible base material that can be in close contact with the heating element. A heat conductive member having an adhesive layer on the surface of the substrate or having an adhesive layer on the surface of the substrate.
【０００７】本発明の放熱材は、放熱部材と熱伝導部材
とを備え、熱伝導部材が、ＩＣ等の電子部品に当接し、
その電子部品の熱を連接された放熱部材へ伝導する。そ
して、その熱は、外気との温度差によって放熱部材から
外気へ放出される。ここで、放熱部材は、外部同士を連
通する空隙を設けた３次元網状構造を有しているため、
外気との接触面積が大きく熱を放出し易い。また、金属
又は金属メッキを施した材料を用いているため、高い熱
伝導率を有する。したがって、放熱部材へ伝えられた熱
は、速やかに外気へ放出される。また、放熱部材に連接
された熱伝導部材は、発熱体に密接可能な柔軟性を有す
る基材で形成されているため、電子部品の凹凸に対し確
実に密接し、基材中に分散された熱伝導フィラーによっ
て、電子部品の熱を効率よく放熱部材に伝導する。した
がって、発熱体からの熱は、熱伝導部材を介し放熱部材
から効率よく外気中へ放出されることになる。The heat dissipating material of the present invention comprises a heat dissipating member and a heat conducting member, wherein the heat conducting member abuts on an electronic component such as an IC,
The heat of the electronic component is conducted to the connected heat dissipation member. Then, the heat is released from the heat radiating member to the outside air due to a temperature difference from the outside air. Here, since the heat radiation member has a three-dimensional net-like structure provided with a gap communicating with the outside,
The contact area with the outside air is large and heat is easily released. Further, since a metal or a metal-plated material is used, it has a high thermal conductivity. Therefore, the heat transmitted to the heat radiating member is quickly released to the outside air. In addition, since the heat conductive member connected to the heat radiating member is formed of a flexible base material that can be in close contact with the heating element, the heat conductive member is securely in contact with the unevenness of the electronic component and is dispersed in the base material. The heat of the electronic component is efficiently transmitted to the heat radiating member by the heat conductive filler. Therefore, the heat from the heating element is efficiently released from the heat dissipating member to the outside air via the heat conducting member.
【０００８】このような放熱機能に加え、特に、本発明
の放熱部材は、３次元網状構造を有するため、金属板を
用いた従来のヒートシンクと比較して容易に切断でき
る。つまり、本発明の放熱材は、プリント配線板あるい
は電子部品の大きさに合わせ、適当な大きさに切断して
使用することができるのである。その結果、使用場所の
制約が少なくなる。In addition to such a heat dissipation function, in particular, since the heat dissipation member of the present invention has a three-dimensional network structure, it can be cut more easily than a conventional heat sink using a metal plate. That is, the heat dissipating material of the present invention can be used after being cut into an appropriate size according to the size of the printed wiring board or electronic component. As a result, restrictions on the place of use are reduced.
【０００９】また、放熱部材が、３次元網状構造である
ことは、重量の低減につながる。そして、この放熱部材
に連接された熱伝導部材は、表面に粘着性を有している
ため、あるいは、表面に粘着層が設けられているため、
ＩＣ等の電子部品に貼着され、従来のようにネジやバネ
を用いて固定する必要がない。In addition, the fact that the heat dissipating member has a three-dimensional net-like structure leads to a reduction in weight. And, since the heat conductive member connected to this heat radiating member has adhesiveness on the surface, or because the adhesive layer is provided on the surface,
It is attached to an electronic component such as an IC, and does not need to be fixed using screws or springs as in the related art.
【００１０】ところで、上述したような３次元網状構造
を有する放熱部材は、例えば請求項２に示すように、連
続気泡を有する発泡金属又は連続気泡を有する金属メッ
キを施した発泡樹脂によって形成することが考えられ
る。ここで、連続気泡（open cell ）とは、壁によって
完全には囲まれていない気泡をいう。したがって、連続
気泡を有する発泡材では、大部分の気泡が相互に連結
し、気体がある気泡から他の気泡へと自由に移動するこ
とができ、外部同士を連通する。また、例えば請求項３
に示すように、金属繊維又は金属メッキを施した繊維に
よって形成することが考えられる。例えば金属製又は金
属メッキを施した糸状あるいはテープ状の材料を用いる
ことが考えられる。すなわち、このような糸状あるいは
テープ状の材料を編んだり、又は、編まずに適当に折り
曲げたりして、外部同士を連通する空隙をつくるという
具合である。The heat radiating member having a three-dimensional network structure as described above is formed of, for example, a foamed metal having open cells or a foamed resin plated with metal having open cells. Can be considered. Here, an open cell refers to an air bubble that is not completely surrounded by a wall. Therefore, in a foam having open cells, most of the cells are connected to each other, and the gas can freely move from one gas bubble to another gas bubble, and communicate with each other. Further, for example, claim 3
As shown in (1), it is conceivable to form with metal fibers or metal-plated fibers. For example, it is conceivable to use a thread-like or tape-like material made of metal or metal plating. That is, such a thread-like or tape-like material is knitted or bent appropriately without knitting, thereby creating a void for communicating the outside.
【００１１】なお、プリント配線板に対し放熱材を配置
する側の空間が小さい場合も考えられる。例えば、プリ
ント配線板が筐体の内面に近い位置に配置される場合等
が挙げられる。そこで、請求項４に示すように、外力に
よって弾性変形する材料を用いて放熱部材を形成すると
さらによい。例えば発泡樹脂を用いる場合は、ポリエス
テル系、ポリエーテル系のウレタン樹脂を用いることが
考えられ、また、金属繊維を用いる場合は、ベリリウム
銅線等を用いることが考えられる。このようにすれば、
放熱材を配置する空間が小さい場合であっても、放熱部
材の弾性変形によって、その空間に放熱材を配置できる
可能性が高くなる。結果として、使用場所の制約をより
少なくすることができる。It is also conceivable that the space on the side of the printed wiring board on which the heat radiating member is arranged is small. For example, there is a case where the printed wiring board is arranged at a position close to the inner surface of the housing. Therefore, it is more preferable to form the heat radiation member using a material that is elastically deformed by an external force. For example, when a foamed resin is used, a polyester-based or polyether-based urethane resin may be used, and when a metal fiber is used, a beryllium copper wire or the like may be used. If you do this,
Even when the space in which the heat radiating material is arranged is small, the possibility that the heat radiating material can be arranged in that space increases due to the elastic deformation of the heat radiating member. As a result, restrictions on the place of use can be reduced.
【００１２】このように、放熱部材が弾性を有する構成
とした場合、本発明の放熱材は、本放熱材とは別体の筐
体パネル等のヒートシンクとなる部品（以下、単に「ヒ
ートシンク」という。）と発熱体との間に介装され、発
熱体からヒートシンクへの熱を伝導する熱伝導材料とし
て利用することもできる。すなわち、この場合、発熱体
から熱伝導部材を介して放熱部材へ伝導された熱は、放
熱部材が当接するヒートシンクへ伝わり、ヒートシンク
から外部へ放出される。As described above, when the heat radiating member is configured to have elasticity, the heat radiating material of the present invention is a component serving as a heat sink such as a housing panel separate from the heat radiating material (hereinafter simply referred to as a “heat sink”). .) And a heat generating element, and can be used as a heat conductive material that conducts heat from the heat generating element to the heat sink. That is, in this case, the heat conducted from the heating element to the heat radiating member via the heat conducting member is transmitted to the heat sink to which the heat radiating member contacts, and is released from the heat sink to the outside.
【００１３】ところで、熱伝導部材は、例えば接着剤等
を用いて放熱部材に貼り合わせることで放熱部材に連接
してもよいが、請求項５に示すように、熱伝導フィラー
の分散に加え又は分散に代え、放熱部材の一部を基材中
に埋没させて、熱伝導部材を形成することも考えられ
る。放熱部材は金属あるいは金属メッキを施した材料で
できているため、熱伝導部材内部を伝導する熱の一部
は、熱伝導部材内部に埋没している放熱部材を介して伝
導する。すなわち、放熱部材の一部を熱伝導部材に埋没
させることによって、熱伝導率を向上させることができ
る。その結果、この場合、熱伝導部材の基材中に熱伝導
フィラーを分散させても、又は、分散させなくてもよ
い。放熱部材の一部を熱伝導部材に埋没させ、さらに、
熱伝導フィラーを分散させれば、より高い熱伝導性が得
られることになる点で有利であり、放熱部材の一部を熱
伝導部材に埋没させるだけで、熱伝導フィラーを分散さ
せなければ、放熱材の形成に要する手間が少なくなる点
で有利である。The heat conductive member may be connected to the heat radiating member by bonding it to the heat radiating member using, for example, an adhesive or the like. Instead of dispersion, it is conceivable to form a heat conducting member by burying a part of the heat radiating member in the base material. Since the heat dissipating member is made of a metal or a metal-plated material, part of the heat conducted inside the heat conducting member is conducted through the heat dissipating member embedded inside the heat conducting member. That is, the heat conductivity can be improved by burying a part of the heat dissipation member in the heat conduction member. As a result, in this case, the heat conductive filler may or may not be dispersed in the base material of the heat conductive member. Part of the heat dissipation member is buried in the heat conduction member,
Dispersing the heat conductive filler is advantageous in that higher thermal conductivity will be obtained, and only burying a part of the heat dissipating member in the heat conductive member, unless dispersing the heat conductive filler, This is advantageous in that the labor required for forming the heat radiating material is reduced.
【００１４】[0014]
【発明の実施の形態】以下、本発明を具体化した一実施
形態を図面を参照して説明する。図１及び図２は、本実
施形態の放熱材を示しており、図１は斜視図、図２は側
面図である。図１及び図２に示したように、本実施形態
の放熱材は、放熱部材１０と熱伝導部材２０とを備えて
いる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 and 2 show a heat radiating material of the present embodiment. FIG. 1 is a perspective view, and FIG. 2 is a side view. As shown in FIGS. 1 and 2, the heat dissipating material of the present embodiment includes a heat dissipating member 10 and a heat conducting member 20.
【００１５】放熱部材１０は、ポリエステル系ウレタン
又はポリエーテル系ウレタンの発泡材料に金属メッキを
施したものであり、外部同士を連通する連続気泡１１を
有している。一方、熱伝導部材２０は、ゲル状材料で形
成されている。ゲル状材料は、例えばスチレン系エラス
トマ等のベースポリマの網目状組織の間隙に液状成分
と、伝熱性フィラーであるアルミナの微粒子とを包含さ
せ、全体として流動性を失わせたものである。このよう
なゲル状材料は、包含される液状成分によって表面に粘
着性を有する。具体的には、特許公報第２７２８６０７
号に開示された製造方法にて形成される熱伝導シートを
利用することも考えられるし、米国特許公報第４６０２
６７８号，第４６８５９８７号に開示される熱伝導シー
トを利用することも考えられる。The heat dissipating member 10 is made of a foamed material of polyester urethane or polyether urethane and is subjected to metal plating, and has open cells 11 communicating with each other. On the other hand, the heat conducting member 20 is formed of a gel material. The gel material contains liquid components and fine particles of alumina as a heat conductive filler in gaps of a network structure of a base polymer such as a styrene-based elastomer, and loses fluidity as a whole. Such a gel-like material has tackiness on the surface due to the contained liquid component. Specifically, Patent Publication No. 2728607
It is also conceivable to use a heat conductive sheet formed by the manufacturing method disclosed in US Pat.
It is also conceivable to use the heat conductive sheets disclosed in Japanese Patent Nos. 678 and 4685987.
【００１６】ベースポリマとしては、スチレン系以外
に、エステル系、アミド系、ウレタン系などの各種の熱
可塑性エラストマ、シリコーン系、ウレタン系、エポキ
シ系のなどの熱硬化性エラストマ、スチレン系、ＡＢＳ
系、オレフィン系などの熱可塑性樹脂及びこれらの樹脂
のゴム変成物などを用いることが考えられる。As the base polymer, besides styrene, various thermoplastic elastomers such as ester, amide and urethane, thermosetting elastomers such as silicone, urethane and epoxy, styrene and ABS
It is conceivable to use thermoplastic resins of olefin type, olefin type or the like, and rubber modified products of these resins.
【００１７】また、ゲル状材料に用いる液状成分は、可
塑剤ないしは軟化剤として働くもので、室温で液体また
は液状の材料が好ましいが、必ずしもこの限りではな
い。また、親水性、疎水性のいずれの軟化剤も使用で
き、鉱物油系、植物油系、合成系などの各種のゴム用ま
たは樹脂用軟化剤を特に限定なく用いることができる。The liquid component used for the gel material functions as a plasticizer or a softening agent, and is preferably a liquid or liquid material at room temperature, but is not necessarily limited to this. Either hydrophilic or hydrophobic softeners can be used, and various rubber or resin softeners such as mineral oils, vegetable oils, and synthetic oils can be used without particular limitation.
【００１８】さらにまた、熱伝導フィラーとしては、ア
ルミナの他に、水酸化アルミ、ＳｉＣ、酸化ベリリウ
ム、窒化アルミ、窒化ボロン等を用いることができる。
そして、図２に示すように、本実施形態の放熱材は、熱
伝導部材２０を成形する際、放熱部材１０の一部を熱伝
導部材２０に埋没させて硬化させた。Further, as the heat conductive filler, aluminum hydroxide, SiC, beryllium oxide, aluminum nitride, boron nitride and the like can be used in addition to alumina.
Then, as shown in FIG. 2, the heat dissipating member of the present embodiment was cured by embedding a part of the heat dissipating member 10 in the heat conducting member 20 when forming the heat conducting member 20.
【００１９】次に、本実施形態の放熱材の発揮する効果
を説明する。本実施形態の放熱材では、放熱部材１０
が、金属メッキを施したウレタン樹脂を用いているため
高い熱伝導率を有することに加え、連続気泡１１を有す
るウレタン樹脂の発泡材で形成されているため、通気性
があり、外気との接触面積が大きく、熱を放出し易い。
したがって、放熱部材へ伝えられた熱は、速やかに外気
へ放出される。また、放熱部材１０に連接された熱伝導
部材２０は、ゲル状の基材で形成されているため、電子
部品に対し確実に密着し、基材中に分散されたアルミナ
の熱伝導フィラーによって、電子部品の熱を効率よく、
上述した放熱部材１０に伝導する。したがって、発熱体
からの熱は、熱伝導部材２０を介して放熱部材１０から
効率よく外気中へ放出されることになる。図３では、プ
リント配線板３０上に実装された電子部品３１に対して
熱伝導部材２０が確実に密着した様子を示している。Next, the effect of the heat radiating material of this embodiment will be described. In the heat dissipating material of the present embodiment, the heat dissipating member 10
However, in addition to having a high thermal conductivity due to the use of a urethane resin plated with metal, since it is formed of a urethane resin foam having open cells 11, it has air permeability and is in contact with the outside air. Large area and easy to release heat.
Therefore, the heat transmitted to the heat radiating member is quickly released to the outside air. Further, since the heat conductive member 20 connected to the heat radiating member 10 is formed of a gel base material, the heat conductive member 20 is securely adhered to the electronic component, and the heat conductive member of alumina dispersed in the base material is used. Efficiently heats electronic components,
The heat is transmitted to the heat dissipation member 10 described above. Therefore, heat from the heating element is efficiently released from the heat radiating member 10 to the outside air via the heat conducting member 20. FIG. 3 shows a state in which the heat conductive member 20 has securely adhered to the electronic component 31 mounted on the printed wiring board 30.
【００２０】このような放熱機能に加え、特に、本実施
形態の放熱部材１０は、ウレタン樹脂の発泡材であるた
め、多数の連続気泡１１を有する。したがって、金属板
を用いた従来のヒートシンクと比較して容易に切断でき
る。つまり、本実施形態の放熱材は、プリント配線板あ
るいは電子部品の大きさに合わせ、適当な大きさに切断
して使用することができるのである。その結果、使用場
所の制約を少なくすることができる。In addition to such a heat dissipation function, especially, the heat dissipation member 10 of the present embodiment has a large number of open cells 11 because it is a urethane resin foam material. Therefore, it can be cut more easily than a conventional heat sink using a metal plate. That is, the heat dissipating material of the present embodiment can be cut into an appropriate size according to the size of the printed wiring board or the electronic component and used. As a result, restrictions on the place of use can be reduced.
【００２１】また、放熱部材１０が、発泡材であり、多
数の連続気泡１１を有することは、重量の低減につなが
る。そして、この放熱部材１０に連接された熱伝導部材
２０は、表面に粘着性を有しているため、図３に示すよ
うなＩＣ等の電子部品３１に貼着され、従来のようにネ
ジやバネで固定する必要がない。Further, the fact that the heat radiating member 10 is a foam material and has a large number of open cells 11 leads to a reduction in weight. Since the heat conductive member 20 connected to the heat radiating member 10 has an adhesive property on its surface, it is attached to an electronic component 31 such as an IC as shown in FIG. There is no need to fix with a spring.
【００２２】さらに、本実施形態の放熱材では、放熱部
材１０がウレタン樹脂で形成されており、外力によって
弾性変形する。したがって、放熱材を配置する空間が小
さい場合であっても、放熱部材１０の弾性変形によっ
て、その空間に放熱材を配置できる可能性が高くなる。
すなわち、使用場所の制約がより少なくなっている。ま
た、放熱部材１０が弾性変形するため、本実施形態の放
熱材は、別体のヒートシンクと発熱体との間に介装さ
れ、発熱体からヒートシンクへの熱を伝導する熱伝導材
料として利用することもできる。すなわち、この場合、
発熱体から熱伝導部材２０を介して放熱部材１０へ伝導
された熱は、放熱部材１０が当接するヒートシンクへ伝
わり、ヒートシンクから外部へ放出される。例えば図３
（ｂ）に示すように、本実施形態の放熱材を、電子部品
３１の実装されたプリント配線板３０と、ヒートシンク
としての筐体パネル４０との間に介装するという具合で
ある。Further, in the heat dissipating material of this embodiment, the heat dissipating member 10 is formed of urethane resin, and is elastically deformed by an external force. Therefore, even if the space in which the heat radiating material is arranged is small, the possibility that the heat radiating material can be arranged in that space is increased by the elastic deformation of the heat radiating member 10.
In other words, there are fewer restrictions on the place of use. Further, since the heat radiating member 10 is elastically deformed, the heat radiating material of the present embodiment is interposed between the separate heat sink and the heat generating element, and is used as a heat conductive material that conducts heat from the heat generating element to the heat sink. You can also. That is, in this case,
The heat conducted from the heating element to the heat radiating member 10 via the heat conducting member 20 is transmitted to the heat sink with which the heat radiating member 10 contacts, and is released from the heat sink to the outside. For example, FIG.
As shown in (b), the heat radiating material of the present embodiment is interposed between the printed wiring board 30 on which the electronic components 31 are mounted and the housing panel 40 as a heat sink.
【００２３】また、本実施形態の放熱材は、放熱部材１
０の一部を熱伝導部材２０に埋没させて形成した。その
結果、熱伝導部材２０内部を伝導する熱の一部は熱伝導
部材２０に埋没した放熱部材１０の一部を伝わり、熱伝
導が促進される。以上、本発明はこのような実施形態に
何等限定されるものではなく、本発明の主旨を逸脱しな
い範囲において種々なる形態で実施し得る。The heat radiating material of the present embodiment is a heat radiating member 1.
0 was buried in the heat conducting member 20 and formed. As a result, a part of the heat conducted inside the heat conducting member 20 is transmitted through a part of the heat radiating member 10 buried in the heat conducting member 20, and the heat conduction is promoted. As described above, the present invention is not limited to such an embodiment at all, and can be implemented in various forms without departing from the gist of the present invention.
【００２４】例えば、上記実施形態では、放熱部材１０
をウレタン樹脂に金属メッキを施したもので形成した
が、連続気泡１１を有する発泡金属を用いて形成しても
よいし、鉄線、アルミ線、ベリリウム銅線又は細銅条状
の金属線を用い、あるいは、繊維材料に金属メッキを施
したものを用いて形成してもよい。例えば、図４（ａ）
に示すように、アルミ、銅などの金属製又は金属メッキ
を施したテープ状の材料を適当に折り曲げて放熱部材１
２を形成したり、図４（ｂ）に示すように、金属製又は
金属メッキを施した糸状の材料を編んで放熱部材１３を
形成したりするという具合である。なお、放熱部材１
２，１３には、外部同士を連通する空隙を設ければよ
く、材料を編むか否かは特に問題ではない。For example, in the above embodiment, the heat radiating member 10
Was formed by applying metal plating to urethane resin, but may be formed by using a foamed metal having open cells 11, or by using an iron wire, an aluminum wire, a beryllium copper wire, or a fine copper strip-shaped metal wire. Alternatively, it may be formed by using a metal material plated with a fiber material. For example, FIG.
As shown in FIG. 1, a heat-dissipating member 1 is formed by appropriately bending a metal or metal-plated tape material such as aluminum or copper.
4 or knitting a metal or metal-plated thread-like material to form the heat radiating member 13 as shown in FIG. 4 (b). In addition, the heat radiation member 1
The spaces 2 and 13 may be provided with a space for communicating the outsides, and it does not matter whether the material is knitted or not.
【００２５】ただし、弾性を有する材料で形成すれば、
上述したように、放熱材を配置する空間が小さい場合で
あっても、その空間に放熱材を配置できる可能性が高く
なり、使用場所の制約をより少なくすることができる点
で、また、別体のヒートシンクと発熱体との間の熱伝導
材料として利用することができる点で有利である。However, if formed of a material having elasticity,
As described above, even when the space in which the heat radiating material is arranged is small, the possibility that the heat radiating material can be arranged in that space is increased, and the restriction on the place of use can be further reduced. It is advantageous in that it can be used as a heat conducting material between the body heat sink and the heating element.
【００２６】また、上記実施形態では、熱伝導部材２０
に、熱伝導フィラーとしてのアルミナを分散させていた
が、放熱部材１０の一部を十分に埋没させて連結すれ
ば、熱伝導率を高く保つことができるため、この場合に
は、必ずしも熱伝導フィラーを分散させなくてもよい。
熱伝導フィラーを分散させずに熱伝導部材２０を形成す
れば、放熱材の形成に要する手間が少なくなる。In the above embodiment, the heat conducting member 20
In addition, alumina as a heat conductive filler is dispersed, but if a part of the heat radiating member 10 is sufficiently buried and connected, a high heat conductivity can be maintained. It is not necessary to disperse the filler.
If the heat conductive member 20 is formed without dispersing the heat conductive filler, the labor required for forming the heat radiating material is reduced.
【００２７】さらにまた、上記実施形態では、熱伝導部
材２０をゲル状の基材で形成したが、発熱体に密接可能
な柔軟性を有していればよく、ゴムやガム等の基材を用
いて形成してもよい。また、熱伝導部材２０が、ゲル状
材料で形成された場合には、包含される液状成分によっ
て表面に粘着性を有していたが、他の基材を用いて形成
される場合に表面に粘着性がなければ、発熱体との接着
面に粘着層を形成すればよい。Further, in the above-described embodiment, the heat conductive member 20 is formed of a gel-like base material. It may be formed by using. Further, when the heat conducting member 20 is formed of a gel-like material, the surface has tackiness due to the contained liquid component. However, when the heat conductive member 20 is formed by using another base material, the surface becomes sticky. If there is no tackiness, an adhesive layer may be formed on the surface to be bonded to the heating element.
【図１】実施形態の放熱材を示す斜視図である。FIG. 1 is a perspective view showing a heat dissipating material of an embodiment.
【図２】実施形態の放熱材を示す側面図である。FIG. 2 is a side view showing a heat dissipating material of the embodiment.
【図３】実施形態の放熱材の使用例を示す説明図であ
る。FIG. 3 is an explanatory diagram showing a usage example of the heat radiating material of the embodiment.
【図４】別実施形態の放熱材を示す側面図である。FIG. 4 is a side view showing a heat dissipating material of another embodiment.
１０，１２，１３…放熱部材 １１…連続気泡 ２０…熱伝導部材 ３０…プリント配
線板 ３１…電子部品 ４０…ヒートシン
ク10, 12, 13: heat dissipating member 11: open cell 20: heat conducting member 30: printed wiring board 31: electronic component 40: heat sink
Claims (5)
状構造を有し、金属材料又は金属メッキを施した材料で
形成された放熱部材と、 前記放熱部材に連接された部材であり、発熱体に密接可
能な柔軟性を有する基材中に熱伝導フィラーを分散させ
て形成され、当該基材が表面に粘着性を有する又は当該
基材の表面に粘着層を設けた熱伝導部材とを備えること
を特徴とする放熱材。1. A heat dissipating member having a three-dimensional net-like structure provided with a void communicating with the outside, formed of a metal material or a metal-plated material, and a member connected to the heat dissipating member; A heat conductive member formed by dispersing a heat conductive filler in a flexible base material that can be in close contact with a heating element, the base material having an adhesive property on its surface or an adhesive layer provided on the surface of the base material; A heat dissipating material comprising:
泡を有する金属メッキを施した発泡樹脂で形成したこと
を特徴とする放熱材。2. The heat dissipating material according to claim 1, wherein the heat dissipating member is formed of a foamed metal having open cells or a foamed resin plated with metal having open cells.
によって形成したことを特徴とする放熱材。3. The heat dissipating material according to claim 1, wherein the heat dissipating member is formed of a metal fiber or a metal-plated fiber.
おいて、 外力によって弾性変形する材料を用いて前記放熱部材を
形成したことを特徴とする放熱材。4. The heat radiating material according to claim 1, wherein said heat radiating member is formed using a material which is elastically deformed by an external force.
おいて、 前記熱伝導フィラーの分散に加え又は分散に代えて、前
記放熱部材の一部を前記基材中に埋没させ、前記熱伝導
部材を形成したことを特徴とする放熱材。5. The heat dissipating material according to claim 1, wherein a part of the heat dissipating member is buried in the base material in addition to or instead of dispersing the heat conductive filler. A heat dissipating material characterized by forming a heat conducting member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26308398A JP2951327B1 (en) | 1998-09-17 | 1998-09-17 | Heat dissipation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26308398A JP2951327B1 (en) | 1998-09-17 | 1998-09-17 | Heat dissipation material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2951327B1 JP2951327B1 (en) | 1999-09-20 |
| JP2000101005A true JP2000101005A (en) | 2000-04-07 |
Family
ID=17384605
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26308398A Expired - Fee Related JP2951327B1 (en) | 1998-09-17 | 1998-09-17 | Heat dissipation material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2951327B1 (en) |
Cited By (12)
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| JP2000355654A (en) * | 1999-06-15 | 2000-12-26 | Denki Kagaku Kogyo Kk | Heat-conductive silicone molding and its use |
| JP2003080629A (en) * | 2001-09-13 | 2003-03-19 | Achilles Corp | Heat dissipater |
| JP2003080628A (en) * | 2001-09-13 | 2003-03-19 | Achilles Corp | Heat transferable sheet-like laminate |
| JP2005107487A (en) * | 2003-09-26 | 2005-04-21 | Samsung Sdi Co Ltd | Display apparatus and plasma display apparatus |
| JP2006521025A (en) * | 2003-03-04 | 2006-09-14 | ユナイテッド・ディフェンス・リミテッド・パートナーシップ | Electric bus having porous metal heat sink and method of manufacturing the same |
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| JP2000355654A (en) * | 1999-06-15 | 2000-12-26 | Denki Kagaku Kogyo Kk | Heat-conductive silicone molding and its use |
| JP2003080629A (en) * | 2001-09-13 | 2003-03-19 | Achilles Corp | Heat dissipater |
| JP2003080628A (en) * | 2001-09-13 | 2003-03-19 | Achilles Corp | Heat transferable sheet-like laminate |
| JP2006521025A (en) * | 2003-03-04 | 2006-09-14 | ユナイテッド・ディフェンス・リミテッド・パートナーシップ | Electric bus having porous metal heat sink and method of manufacturing the same |
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| KR101331937B1 (en) * | 2011-06-13 | 2013-11-25 | 주식회사 글로벌원 | A cooling unite used enginer-plastic and its manufacturing method |
| JP2013231166A (en) * | 2012-03-30 | 2013-11-14 | Sekisui Chem Co Ltd | Shock absorbing material |
| JP2017183617A (en) * | 2016-03-31 | 2017-10-05 | 積水化学工業株式会社 | Foaming composite sheet |
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|---|---|
| JP2951327B1 (en) | 1999-09-20 |
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