JP2000100894A - Carrying device for semiconductor part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrying device of a semiconductor part which can effectively carry a semiconductor part, such as a wafer highly accurately at high throughput. SOLUTION: In a carrying device of a semiconductor part, where a pair of scalar type robots A, B with first and second arms 4, 6 which flexibly move mutually and an end effector 8 which is attached to the second arm 4 and moves forwards and backwards in one direction by bending operation of the first and second arms 4, 6 are provided almost symmetrically, so that the end effector 8 of one robot A and the end effector 8 of the other robot B are arranged above and below and move forwards and backwards mutually in the same straight direction, a space S for relief clearance is provided between the first arm 4 and the second arm 6 in one robot A to enable a semiconductor part to pass through, when the end effector 8 of the other robot B holds the semiconductor part and operates.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for transporting semiconductor components such as wafers and the like for use in transferring semiconductor components.

[0002]

2. Description of the Related Art Japanese Patent Laid-Open Publication No.
As disclosed in Japanese Patent No. 4140, a pair of SCARA type robots is used, and the end effector of one robot and the end effector of the other robot are alternately advanced and retracted in the same linear direction, so that semiconductor parts can be efficiently moved in and out. Has been proposed.

FIGS. 5 and 6 show the structure of the transfer device. The transfer device includes a base 1 on which a table 2 is rotatably provided.
A pair of SCARA-type robots A and B are provided so as to be arranged substantially symmetrically on the left and right.

[0004] These SCARA type robots A and B include a first rotating shaft 3 provided on a table 2, a first arm 4 attached to the first rotating shaft 3, and a first arm 4. A second rotating shaft 5 attached to the second rotating shaft 5, a second arm 6 attached to the second rotating shaft 5, a third rotating shaft 7 attached to the second arm 6, 3
And an end effector 8 as a third arm attached to the rotary shaft 7.

More specifically, a first rotating shaft 3 provided on a table 2 is connected and fixed to one end of a first arm 4, and a second rotating shaft 3 is attached to the other end of the first arm 4. 5 is rotatably mounted, and one end of a second arm 6 is connected and fixed to the second rotating shaft 5. A third rotating shaft 7 is rotatably attached to the other end of the second arm 6, and an end effector 8 is attached to the third rotating shaft 7.
Are fixedly connected.

The rotating shafts 3, 5, and 7 are connected by a power transmission means such as a pulley, and are rotated at a predetermined rotation ratio by a motor (not shown) incorporated in the table 2. It has become. With this rotation, the first arm 4 moves in the direction around the first rotation shaft 3, the second arm 6 moves in the direction around the second rotation shaft 5, and the end effector 8 moves in the third rotation shaft 7. The end effector 8 is linearly moved by the bending movement of the first arm 4 and the second arm 6 due to the rotation displacement.

The end effector 8 of one robot A and the end effector 8 of the other robot B are arranged so as to be vertically overlapped. When one end effector 8 advances in one direction, the other end effector 8 is moved to the table 2. When the other end effector 8 advances in one direction, one end effector 8 stops at a predetermined retreat position on the table 2.

In each end effector 8, a vacuum suction path 1 is provided.
0 is formed, and a through-hole 11 communicating with the vacuum suction path 10 is formed at the tip of the end effector 8. When the end effector 8 advances and extends to a predetermined advanced position, for example, a wafer W as a semiconductor component is sucked and held by a vacuum force acting on the through-hole 11, and the held wafer W is moved to the end effector. The reciprocating operation of the end effector 8 causes the other end effector 8 to advance to hold another wafer W when the end effector 8 retreats. Here, JP-A-8-
In the transfer device disclosed in Japanese Patent No. 274140, the end effector 8 of the other robot B holds and retreats the wafer W, and when the end effector 8 of the one robot A advances, the other end effector 8 holds the wafer W. In order to prevent the wafer W and the one end effector 8 from interfering with and contacting with each other, the base end of the one end effector 8 is formed in a U-shape, and the wafer W is passed through a space inside the U-shape. I let it pass.

[0009]

It is desired that the end effector 8 be thin and light in order to obtain the agility of its operation. However, if the end effector 8 has a U-shaped irregular shape, the end effector 8 may have a substantial shape. As a result, the overall length is increased, the weight is increased, the agility of operation is impaired, and the throughput in the transport process is reduced.

Further, since the end effector 8 is of a cantilever type and has a structure in which the end of the end effector 8 sucks and holds the wafer W, as the length of the end effector 8 increases, vibrations and the like are likely to occur when the wafer W is transferred. The accuracy of the transfer is reduced.

On the other hand, if the end effector 8 has a U-shaped irregular shape, it is difficult to provide a vacuum suction air pipe or electric wiring in the U-shaped bent portion. If this is done, the thickness of the end effector 8 is increased, the weight is further increased, the agility of operation is impaired, and the throughput in the transport process is further reduced.

The present invention has been made in view of such a point, and an object of the present invention is to provide a semiconductor component transfer apparatus capable of transferring semiconductor components such as wafers accurately and efficiently with high throughput. Is to provide.

[0013]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a first arm and a second arm that bend and extend relative to each other, and a first arm and a second arm that are attached to the second arm. A pair of scalar type robots having a semiconductor component holding end effector that moves forward and backward in one direction by the bending and stretching operation of the same robot, the end effector of one of the robots and the end effector of the other robot are arranged vertically and have the same In a semiconductor component transfer device provided substantially symmetrically so as to alternately advance and retreat in a linear direction, an end effector of the other robot is provided between the first arm and the second arm of the one of the robots. An escape space is provided to allow passage of the semiconductor component when the semiconductor component is held and operated.

According to a second aspect of the present invention, the end effector is provided with an air pipe or an electric wiring. In the third aspect of the present invention, the end effector is provided with a sensor for detecting a semiconductor component, The electric wiring is connected to the sensor.

According to the fourth aspect of the present invention, when the end effector of one of the robots advances, interference with the semiconductor parts held by the end effector of the other robot is avoided so that the first and the second robots of the other robot will not interfere with each other. The end effector of the other robot is retracted to a position where the second arm can extend substantially linearly.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Parts corresponding to those of the conventional configuration are denoted by the same reference numerals, and description thereof is omitted. 1 and 2 show a transfer device according to a first embodiment of the present invention. In this transfer device, the other of a pair of SCARA robots A and B provided on a table 2 is used. The SCARA type robot B has the same configuration as the conventional one. In one SCARA type robot A, the first rotary shaft 3 protruding from the table 2 and the second rotary shaft 5 protruding from the second arm 6
Are higher than the heights of the first rotary shaft 3 and the second rotary shaft 5 of the other robot B.

Therefore, the first and second arms 4 and 6 of one robot A are arranged at a higher level than the first and second arms 4 and 6 of the other robot B in a stepped manner. And the first of robot A
An escape space S having a certain height is secured between the second arm 6 and the second arm 6, and the end effector 8 of the other robot B is arranged at a position at the level of this space S.

The end effector 8 of each of the robots A and B is formed in a thin, substantially flat plate shape, and has a vacuum suction passage 10 formed therein, and a vacuum suction passage 1 at a tip portion.
A through-hole 11 leading to 0 is formed. On the base end of the end effector 8 of one robot A, for example, an optical detection sensor 12 for detecting the presence or absence of a wafer W as a semiconductor component is provided.
Are covered with the dust cover 13.

In the base 1, an exhaust pump 15 for vacuum suction and a control circuit section 16 are provided.
5, an air pipe 17 is derived from the control circuit unit 16, and an electric wiring 18 is respectively derived from the control circuit unit 16. The air pipe 17 and the electric wiring 18 are connected to the first rotating shaft 3, the first arm 4, The robot A is drawn out above the base end of the end effector 8 of one of the robots A through the respective internal spaces of the second rotating shaft 5, the second arm 6, and the third rotating shaft 7 in order. The air pipe 17 is connected to the vacuum suction path 10 of the end effector 8, and the electric wiring 18 is connected to the detection sensor 12.

Although not shown in the figure, also in the other robot B, the air pipe led out from the exhaust pump into the base 1 has the first rotary shaft 3 of the other robot B,
The air pipe is drawn out through the internal space of each of the first arm 4, the second rotating shaft 5, the second arm 6, and the third rotating shaft 7 onto the base end of the end effector 8 sequentially. Are connected to the vacuum suction path 10 of the end effector 8.

In the transfer device configured as described above, the end effector 8 of the other robot B
When one of the robots A advances, the wafer W held by the end effector 8 of the other robot B moves between the first arm 4 and the second arm 6 of the other robot A. Escape space S secured in between
The first arm 4 and the second arm 6 of one robot A that passes through and thus moves forward
It can operate without interfering with the wafer W held by the other robot B. The other robot B holding the wafer W and retreating stops at a predetermined retreat position on the table 2.

As described above, the escape space S through which the wafer W passes is constituted by the space between the first arm 4 and the second arm 6 of the robot A.
The end effector 8 does not need to be formed in a different shape bent in a U-shape as in the related art, and can be formed in a substantially flat shape extending linearly. Therefore, the end effector 8 has a substantially shorter overall length than the conventional U-shaped end effector, and is accordingly lighter,
The agility of the operation can be kept good, and the throughput at the time of the transfer step can be surely improved. In addition, since the length of the entire length of the end effector 8 is reduced, the occurrence of vibration and the like during the transfer of the wafer W is suppressed as much as possible, and the transfer accuracy can be increased.

Further, since the end effector 8 is not of a different shape, the air pipe 17 for vacuum suction and the electric wiring 18 can be easily provided while keeping the end effector 8 thin.

When the stop position of the end effector 8 in the other robot B holding and retreating the wafer W is the position shown in FIG. 2, that is, the position where the wafer W is disposed above the front side of the table 2. , The first and second arms 4 of one of the robots A performing the advance operation
When the robot 6 extends from the bent state, the range of the extension is restricted by the wafer W, so that the first and second arms 4 and 6 of the robot A cannot be extended to the linear state.

Therefore, in the transfer device according to the second embodiment shown in FIGS. 3 and 4, when the end effector 8 of the other robot B retreats while holding the wafer W, and the robot A advances. The wafer W held by the end effector 8 of the other robot B passes through the escape space S secured between the first arm 4 and the second arm 6 of one robot A, and the other W Robot B
The rear end of the end effector 8 is retracted to a position protruding rearward of the table 2 as shown by a chain line in FIG.

As described above, by retreating the end effector 8 of the other robot B greatly, the wafer W held by the end effector 8 is arranged above the front side of the table 2 on the rear side of the table 2, so that the advance operation is performed. The first and second arms 4 of the other robot A
When the arm 6 is extended from the bent state, the elongating operation is not interfered by the wafer W. Therefore, it is possible to extend the first and second arms 4 and 6 of the robot A to the linear state. Thus, there is an advantage that the stroke width of the forward / backward movement of the end effector 8 in the robot A can be greatly extended.

[0027]

As described above, according to the present invention,
Between the first arm and the second arm in one of the pair of SCARA robots, the end effector of the other robot passes through the semiconductor component when it operates while holding the semiconductor component Since an escape space is provided, the end effector does not need to be formed into a U-shape in a different shape as in the related art, and therefore, semiconductor parts such as wafers can be efficiently transported with high accuracy and high throughput. .

[0028] In particular, in the invention according to claim 4, the first and second arms of one of the advancing robots are extended from the bent state to the linear state, and the stroke width of the advancing / retreating operation is greatly extended. Can be.

[Brief description of the drawings]

FIG. 1 is a front view of a transport device according to a first embodiment of the present invention.

FIG. 2 is a plan view of the transfer device.

FIG. 3 is a plan view of a transfer device according to a second embodiment of the present invention.

FIG. 4 is a front view of the transfer device.

FIG. 5 is a front view of a conventional transport device.

FIG. 6 is a plan view of the transfer device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Table 3 ... 1st rotating shaft 4 ... 1st arm 5 ... 2nd rotating shaft 6 ... 2nd arm 7 ... 3rd rotating shaft 8 ... End effector 10 ... Vacuum suction path 11 … Through hole 12… detection sensor 17… air pipe 18… electric wiring

Claims (4)

[Claims] A first arm and a second arm which bend and extend relative to each other; and first and second arms attached to the second arm.
A pair of scalar type robots having a semiconductor component holding end effector that moves forward and backward in one direction due to the bending and extension of the arm, the end effector of one of the robots and the end effector of the other robot are arranged vertically. In a semiconductor component transfer device provided substantially symmetrically so as to alternately advance and retreat in the same linear direction, an end of the other robot is provided between a first arm and a second arm of the one of the robots. A semiconductor component transfer device, wherein an escape space is provided to allow passage of the semiconductor component when the effector holds and operates the semiconductor component. 2. An apparatus according to claim 1, wherein said end effector is provided with air piping or electric wiring. 3. The semiconductor component conveying apparatus according to claim 2, wherein a sensor for detecting a semiconductor component is provided on the end effector, and the electric wiring is connected to the sensor. 4. When the end effector of one of the robots advances, the first and second arms of one of the robots move substantially straight to avoid interference with semiconductor components held by the end effector of the other robot. 4. The semiconductor component transfer device according to claim 1, wherein the end effector of the other robot retreats to a position within a range where the end effector can extend in a shape.