JP2000096297A - Power feeding method for continuous plating device and device therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the formation of excess plating deposits on power feeding rollers. SOLUTION: This continuous plating device applies plating on both surfaces of a planar object to be plated by holding the object from both sides by the power feeding rollers 19, 20, 21, 22 and horizontal moving the object within a plating cell by rotation of the power feeding rollers 19, 20, 21, 22, in which the power feeding rollers 19, 20, 21, 22 are segmented circumferentially by electrical insulators 19b, 20b, 21b, 22b and only the sections of the power feeding rollers 19, 20, 21, 22 to be pressed to the object are energized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply method for a continuous plating apparatus and a power supply apparatus for continuously supplying power to an object to be plated.

[0002]

2. Description of the Related Art Conventionally, in order to perform plating on a plate-like object to be plated, a plurality of objects to be plated are attached one by one to a frame connected to a cathode with a fixture. Although this method was individually removed from the frame, this method was troublesome, and was a factor that hindered the efficiency of the plating operation. Therefore, in recent years, in order to avoid the work of fixing the object to be plated to the frame, the objects to be plated are individually and continuously supplied one by one into the plating tank, and the object to be plated is vertically set in the plating tank. There has been proposed a method of performing plating continuously by moving horizontally and efficiently.

FIG. 8 is a cross-sectional view showing an example of a continuous plating apparatus capable of continuously and efficiently performing plating, and a V extending in the direction perpendicular to the paper near the center bottom in the plating tank 1. A plate-shaped plating object 3 such as a printed circuit board is vertically placed on a rail 2 having a U-shaped cross section, and the lower end thereof is placed. Both sides of the plating object 3 are fixed to a vertical rotating cathode rod 4. The object to be plated 3 is immersed in the plating solution 6 by the rotation of the power supply roller 5 while the rail 2 is held between the rails 2.
And moves horizontally in the plating tank 1 along the line. In the plating solution 6, an anode 8 that can be moved up and down by a cylinder 7 and a shielding plate 9 that covers disturbance of current
Is provided.

A wheel 10 is provided at an appropriate position on the rotating cathode bar 4.
The pressing body 12 pressed by the spring 11 is brought into contact with the wheel 10. The pressing force of the spring 11 is transmitted from the wheel 10 to the power supply roller 5 via the rotating cathode rod 4 to ensure the contact between the power supply roller 5 and the object 3 to be plated, so that the flow of electricity to the surface of the object 3 is uniform. I am trying to become.

As a result, the surface of the object to be plated 3 is pressurized to a negative potential from the rotating cathode rod 4 via the power supply roller 5 and a current flows from the anode 8 so that plating is continuously performed. A protective film made of titanium nitride is formed on a peripheral surface of the power supply roller 5 that comes into contact with the object 3 to be plated, on a coating material harder than a target plating film, for example, a copper film, for example, a nickel plating film. Then, a brush 14 is pressed against the peripheral surface of the power supply roller 5 by a spring 13 so as to remove plating deposits generated on the peripheral surface of the power supply roller 5.

[0006]

A conventional power supply roller 5
Since the whole is a single conductor, a current always flows even in a portion that is not in contact with the object to be plated 3, and a plating adhered substance is generated on the entire power supply roller 5. Even if the brush 14 is pressed by the spring 13 on the peripheral surface of the power supply roller 5 as described above, it is difficult to remove the plating adhesion on the entire power supply roller 5, and it is difficult to remove the deposit. There is a problem that the power supply roller 5 is damaged due to the adhered plating material and the service life is shortened, so that a current does not flow evenly to the plated object 3 and uniform plating cannot be performed.

The present invention solves such a problem, and prevents the power supply roller 5 from generating extra plating deposits so that the power supply roller 5 can be used for a long period of time. It is an object of the present invention to provide a power supply method for a continuous plating apparatus capable of performing uniform plating by using the same, and an apparatus therefor.

[0008]

According to the present invention, a plate-shaped object to be plated is sandwiched between power supply rollers from both sides, and the object to be plated is moved horizontally in a plating tank by the rotation of the power supply roller. In the continuous plating apparatus for plating, the power supply roller is divided in the circumferential direction by an electric insulator, and the power is supplied only to the section of the power supply roller in contact with the object to be plated. In a continuous plating apparatus, a plate-shaped object to be plated is sandwiched from both sides by a power supply roller, and the object to be plated is horizontally moved in a plating tank by the rotation of the power supply roller to perform plating on both surfaces of the object to be plated. A cathode rod, a power supply roller attached to the rotating cathode rod and circumferentially divided by an electrical insulator and in contact with an object to be plated, and a power supply roller attached to the rotating cathode rod and corresponding to the section of the power supply roller. A current collecting disk which is circumferentially divided by an electric insulator and which energizes the section of the power supply roller when the section of the power supply roller is at a position in contact with the object to be plated; This is a power supply device, and power is supplied only to the section of the power supply roller that comes into contact with the object to be plated, so that the power supply roller does not have extra plating and the power supply roller can withstand long-term use. In this case, a current flows evenly so that uniform plating can be performed.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an example of an embodiment of a power supply device used in the method of the present invention, in which a bevel gear 16 is attached to an upper end of a vertical rotating cathode rod 15 and attached to a rotating drive shaft 17. The rotating cathode bar 15 is rotated by meshing with a certain bevel gear 18.

A portion of the rotating cathode bar 15 extending from a position slightly away from the bevel gear 18 to a lower portion penetrates through the centers of four flat cylindrical power supply rollers 19, 20, 21, and 22. Power supply rollers 19, 20, 21, 22
Are fixed to the rotating cathode bar 15 at intervals. Further, the portion of the rotating cathode bar 15 immediately below the bevel gear 18 is the same number of power supply rollers 19, 20, 21 and 22.
Penetrating the center of the current collecting disks 23, 24, 25, 26, these four power feeding rollers 19, 20, 21, 22
Are fixed to the rotating cathode bar 15 at a minute interval from each other.

The outer peripheral surface of the rotating cathode bar 15 between the current collecting disk 26 and the power supply roller 19, and the power supply roller 1 below the outer peripheral surface.
The outer peripheral surface of the rotating cathode rod 15 between 9, 20, 21 and 22 is covered with an insulating coating such as a synthetic resin coating so that the rotating cathode rod 15 does not come into contact with the plating solution.

As shown in the enlarged cross-sectional view of FIG. 2, the power supply roller 19 has a power supply section 19a at a central angle of 90 degrees corresponding to one section divided into four in the circumferential direction. The remaining portion having a center angle of 270 degrees corresponding to three sections divided into four in the circumferential direction is an electrical insulator 19b made of resin or the like. Similarly, the other power supply rollers 20, 21 and 22 shown in FIG. 1 also have power supply portions 20a, 21a and 22a whose central angles corresponding to one section divided into four in the circumferential direction are 90 degrees. The remaining portion having a center angle of 270 degrees corresponding to three sections divided into four in the circumferential direction of the power supply rollers 20, 21, 22 is the electric insulator 2
0b, 21b and 22b.

The above-described power supply units 19a, 20a, 21a,
22a is an electroless nickel plating film (phosphorus content 12% or more, nickel plating thickness 5 microns or more,
A protective coating further coated with titanium nitride is formed on a nickel plating layer having a phosphorus content of 6% or more and a nickel plating thickness of at least 3 μm, and as shown in FIG. It is fixed to the rotating cathode bar 15 out of phase. Accordingly, the electrical insulator 19b,
The phases of 20b, 21b and 22b are also shifted by 90 degrees in the circumferential direction.

The current collecting disks 23, 24, 25 and 26 fixed directly below the bevel gear 18 of the rotating cathode bar 15 are also shown in FIG.
As shown in FIG.
2, the power supply units 23a, 24a, and 25a (in FIG. 1, the current collecting disk 2) in which four portions are divided in the circumferential direction and the central angle corresponding to one segment and the central angle is 90 degrees are shifted in phase in the circumferential direction.
4), and 26a, and electric insulators 23b, 24b, 25b, 26b corresponding to three sections divided into four in the circumferential direction and having a remaining central angle of 270 degrees.

The rotating cathode bar 15 may be a long round bar of metal of Muku, but is divided into four sections at 90 degrees in the circumferential direction over the entire length as shown in FIGS. It may be divided into sections 15a, 15b, 15c and 15d. In this case, the power supply portion 23a of the current collection disk 23 shown in FIG. 1 is electrically connected to the power supply portion 19a of the power supply roller 19 via the section 15a of the rotating cathode bar 15, and similarly, the current collection disk 2
4, 25, and 26 feeders 24a, 25a, and 26a are respectively connected to the feeders 20a, 21a, and 22 of the feed rollers 20, 21, and 22 via the sections 15b, 15c, and 15d of the rotating cathode rod 15, respectively.
21a and 22a are electrically connected.

FIG. 4 is a vertical sectional front view showing a power supply state using the apparatus shown in FIG. 1, and FIG. 5 is a sectional view taken along line V--V in FIG. 4, wherein the above-mentioned current collecting disk 23 is shown in FIG. The power supply block 31 is incorporated into one of the insulating blocks 29 and 30 and a lead wire 32 is connected to the power supply block 31 so that a negative potential is applied to the power supply block 31. A tension spring 33 is provided between the insulating blocks 29 and 30 so that the power supply block 31 is
3 so that it abuts closely.

The rotating cathode bar 15 rotates, and the current collecting disk 23
Rotates with the rotating cathode bar 15, the current collecting disk 23
During rotation, the power supply portion 23a of the current collecting disk 23 contacts the power supply block 31 in a rotation range of approximately 90 degrees corresponding to the central angle, and at this time, the power supply portion 23a is in a state where a negative potential is pressurized. Become. As shown in FIG.
Similarly, 4, 25, 26 are sandwiched between insulating blocks 29, 30 from both sides, so that the power supply block 31 always contacts closely. Thus, the current collecting disks 23, 24, 25, 26
Power supply units 23a, 24a, 25a, 26a
9 (see FIG. 1) during rotation with the rotating cathode rod 15.
A pressure is applied to a negative potential with a rotation phase difference of 0 degrees.

As in the conventional case shown in FIG.
The workpiece 3 whose lower end is placed on the rail 2 having a V-shaped cross section provided near the bottom of the inside of the inside is supplied with the above-described power supply rollers 19, 20, 21, and 22 (see FIG. 1) as shown in FIG.
Both sides are pinched.

As shown in FIG. 4, the rotating cathode rod 15
A portion provided with a cover 27 such as a synthetic resin film is disposed so as to be immersed in the plating solution 6, and a guide roller 34 is provided.
The pressing body 12 pressed by a spring 11 is brought into contact with a wheel 10 mounted at an appropriate location, and the power supply rollers 19, 20, 21, 22 and the guide roller 34 and the plating object 3 are connected to each other. Ensures contact. When the rotating cathode bar 15 is rotated via the bevel gear 16, the current collecting disks 23, 24, 25, 26, the guide roller 34, the feeding rollers 19, 20, 21, 22, and the wheel 10 are also rotated, Guide roller 34, power supply rollers 19 and 2
Plated object 3 whose both surfaces are sandwiched by 0, 21 and 22
Moves horizontally in the plating tank.

As described above, the current collecting disks 23, 24, 2
5, 26 power supply units 23a, 24a, 25a, 26a
Power supply rollers 19, 2 are connected via a rotating cathode rod 15, respectively.
0, 21, 22 power supply units 19a, 20a, 21a, 22
a, and the current collecting disks 23, 24, 2
5, 26, respectively, power supply units 23a, 24a, 25a,
26a is pressurized to a negative potential with a rotation phase difference of 90 degrees, so that the power supply rollers 19, 20, and 2
The power supply units 19a, 20a, 21a, and 22a of the first and second 22 also have
A pressure is applied to a negative potential with a rotation phase difference of 0 degrees.

The rotating cathode rod is set so that the rotation phase when the power supply portions 19a, 20a, 21a, and 22a of the power supply rollers 19, 20, 21, and 22 are pressed to a negative potential is in the direction in contact with the workpiece 3. 15, the power supply portions 19a, 20 of the power supply rollers 19, 20, 21, 22 are fixed.
a, 21a and 22a are pressurized to a negative potential only during the rotation phase in contact with the plating object 3, and are not pressurized to the negative potential when not in contact with the plating object 3. it can. This allows the feeding roller 1
No extraneous plating deposits are generated on 9, 20, 21, and 22 and can withstand long-term use. Since the rotating cathode bar 15 is covered with the cover 27 at the portion immersed in the plating solution 6, no plating deposit is generated at all.

FIG. 6 is a perspective view showing another embodiment of the power supply roller and the current collecting disk used in the power supply device of the present invention. The portion having a central angle of 120 degrees corresponding to the section is the power supply portion 19a.
The portion having a remaining central angle of 240 degrees corresponding to two sections divided into three in the circumferential direction is the electric insulator 19b. And the current collecting disk 23 also corresponds to this,
The central angle corresponding to one section divided into three in the circumferential direction is 12
The 0-degree portion is defined as a power supply portion 23a, and is divided into three in the circumferential direction.
The remaining portion having a central angle of 240 degrees corresponding to the two sections is defined as an electrical insulator 23b, and the power supply portions 19a and 23a are fixed to the rotating cathode bar 15 in the same phase in the circumferential direction.

In the power supply roller 20, one of the two sections in the circumferential direction is a power supply section 20a, the other section is an electrical insulator 20b, and the current collecting disk 24 is also divided into two sections in the circumferential direction corresponding to this. Is defined as a power supply section 24a and the other section is defined as an electrical insulator 24b, and the power supply sections 20a and 24a
Are fixed to the rotating cathode bar 15 in the same phase in the circumferential direction.

The power supply roller 21 has a power supply portion 21a having a central angle of 60 degrees corresponding to one section divided into six in the circumferential direction, and the remaining part corresponding to five sections divided into six in the circumferential direction. A portion having a central angle of 300 degrees is an electric insulator 21b. In addition, the current collecting disk 25 also corresponds to this, and a portion having a central angle of 60 degrees corresponding to one section divided into six in the circumferential direction is set as the power supply portion 25a, and the remaining part corresponding to five sections divided into six in the circumferential direction is used. The part having a central angle of 300 degrees is defined as an electrical insulator 25b, and the power supply units 21a and 25a
The phase is fixed to the rotating cathode bar 15 in the same circumferential phase.

The power supply roller 19 and the current collecting disk 2 shown in FIG.
In the case where 3 is used, three are fixed to one rotating cathode bar 15 by shifting the phase in the circumferential direction by 120 degrees, respectively,
In the case of using the power supply roller 20 and the current collecting disk 24, two of them are fixed to one rotating cathode bar 15 by shifting the circumferential phase by 180 degrees, and the case of using the power supplying roller 21 and the current collecting disk 25. 6 are fixed to one rotating cathode bar 15 by shifting the phase in the circumferential direction by 60 degrees. Also in the embodiment shown in FIG.
The pressure is applied to the negative potential only when the rotating phases 20a and 21a are in contact with the object 3 (see FIG. 4), and are not applied to the negative potential when not in contact with the object 3. As a result, no extra plating deposit is generated.

FIG. 7 is a partial plan view showing another example of the power supply state.
9b is divided into six feeding portions 19a in the circumferential direction,
Correspondingly, the current collecting disk 23 also has a thin electric insulator 23b.
The rotating cathode bar 15 is further divided into six sections 15a in the circumferential direction with the electric insulator 28 interposed therebetween.

Thus, the power supply section 19 of the power supply roller 19
a and the power supply portion 23a of the current collecting disk 23 have the same phase in the circumferential direction.
Is electrically connected via the. Then, the power supply block 31 abuts against the one section of the power supply section 23a in the rotation phase facing the workpiece 3 of the current collecting disk 23 to pressurize the negative potential, and the rotation phase on the opposite side of the workpiece 3 to be plated. The positive power supply block 35 is in contact with the three sections of the power supply section 23a, and a positive potential is applied.

The negative potential and the positive potential are transmitted to the power supply portion 19a of the power supply roller 19 having the same circumferential phase through the section 15a of the rotating cathode bar 15, so that the plating object 3 of the power supply roller 19 Only the power supply section 19a in one section of the rotation phase that is in contact with is pressurized to a negative potential, and a positive potential is applied to the power supply section 19a in the three sections in the rotation phase on the opposite side to the workpiece 3. Becomes pressurized. Therefore, the power supply portion 19a of the power supply roller 19 is pressurized to a negative potential only during the rotation phase in contact with the workpiece 3, and is supplied with a positive potential during the rotation phase opposite to the workpiece 3 during the rotation phase. As a result, the extra plating does not adhere and can withstand long-term use.

[0029]

According to the first and second aspects of the present invention, since the power supply roller for sandwiching the object to be plated from both surfaces is not provided with extra plating, the power supply roller can withstand long-term use and cost is reduced. Inexpensive, in contact with the object to be plated on the power supply roller, but kept in a clean state for a long time, improving the plating finish, allowing a large current to flow, shortening the plating time, and reducing the product processing cost There is.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of a power supply device used in a method of the present invention.

FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

FIG. 3 is an enlarged sectional view taken along the line III-III of FIG. 1;

FIG. 4 is a vertical sectional front view showing a power supply state according to the present invention.

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is a perspective view showing another example of the embodiment of the power supply roller and the current collecting disk used in the power supply device of the present invention.

FIG. 7 is a partial plan view showing another example of a power supply state.

FIG. 8 is a vertical sectional front view showing an example of a continuous plating apparatus.

[Explanation of symbols]

 3 Plated object 15 Rotating cathode bar 19, 20, 21, 22 Power supply roller 19b, 20b, 21b, 22b Electrical insulator 23, 24, 25, 26 Collector disk 23b, 24b, 25b, 26b, 28 Electrical insulator

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[Procedure amendment]

[Submission date] September 28, 1999 (1999.9.2)
8)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction contents]

[0008]

According to the present invention, a plate-like object to be plated is sandwiched from both sides by a rotating shaft having a plurality of power supply rollers, and the object to be plated is placed in a plating tank by rotation of the power supply roller. In continuous plating, in which the power supply rollers are moved horizontally to apply plating on both sides of the object to be plated, a plurality of power supply rollers are separated by an electrical insulator in the circumferential direction, and the power supply sections of each power supply roller are shifted in phase.
Provided by the feeding method of the continuous plating apparatus negative potential only to the feeding section of the feeding roller abutting the object to be plated is characterized in that so as to pressurized conductive, and plate-shaped object to be plated from both sides plurality of and sandwiching a rotating shaft having a feed roller, in a continuous plating apparatus plating the object to be plated duplex by moving horizontally in the plating bath to be plated by the rotation of the feed roller, mounted on the rotary shaft, an electric insulator Shift the phase of the feed section divided in the circumferential direction by
A power supply roller that contacts the object to be plated, and a current collecting disk that applies a negative potential to the power supply section of the power supply roller when the power supply section of each of the power supply rollers is at a position where it comes into contact with the object to be plated. A power supply device for a continuous plating device, further characterized in that, in addition to the power supply device, a power supply roller
Positive power is supplied to the power supply section where no negative potential is applied.
Power supply device for continuous plating equipment
You. In the present invention, first, since a negative potential is applied only to the power supply section of the power supply roller that comes into contact with the object to be plated, the power supply roller is not provided with extra plating, so that the power supply roller can withstand long-term use. As a result, a current flows evenly through the object to be plated, so that uniform plating can be performed. Power supply category where negative potential is further applied
Power supply sections other than
The plating is slightly applied to the negative potential power supply section.
Even if it may be attached, it is located away from the object to be plated.
Is applied to the positive potential at
Elutes as ions, and the peripheral surface of
When hitting the surface of the object to be plated.
The current flows evenly, and the plating must be uniform.
And can be.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0027

[Correction method] Change

[Correction contents]

Thus, the power supply section 19 of the power supply roller 19
a and the power supply portion 23a of the current collecting disk 23 have the same phase in the circumferential direction.
Is electrically connected via the. Then, the power supply block 31 is brought into contact with one section of the power supply section 23a having a rotation phase facing the object to be plated 3 side of the current collecting disk 23, and the power supply block 31 is reset.
The negative potential is applied by the lead wire 32, and the plus feed block 35 abuts on the three feed sections 23 a in the rotation phase on the opposite side of the object to be plated 3, and the lead wire is applied.
36 causes the positive potential to be charged.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0028

[Correction method] Change

[Correction contents]

The negative potential and the positive potential are transmitted to the power supply portion 19a of the power supply roller 19 having the same circumferential phase through the section 15a of the rotating cathode bar 15, so that the plating object 3 of the power supply roller 19 Only the power supply section 19a in one section of the rotation phase that is in contact with is pressurized to a negative potential, and a positive potential is applied to the power supply section 19a in the three sections in the rotation phase on the opposite side to the workpiece 3. Becomes pressurized. Therefore, the power supply portion 19a of the power supply roller 19 is pressurized to a negative potential only during the rotation phase in contact with the workpiece 3, and is supplied with a positive potential during the rotation phase opposite to the workpiece 3 during the rotation phase. Is applied to the peripheral surface of the feed roller 19.
The extra plating product attached will be eluted ,
It can withstand long-term use even when no positive potential is applied .

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0029

[Correction method] Change

[Correction contents]

[0029]

According to the first and second aspects of the present invention, since the power supply roller for holding the object to be plated from both surfaces is not provided with extra plating, the power supply roller can withstand long-term use and cost is reduced. becomes cheaper, is maintained on the surface for a long period of time clean in contact with the object to be plated of the feed roller is improved finish of plating, to shorten the plating time so can flow a large current, it can be a product processing costs cheaper effective. The invention according to claim 3 is a method in which
By applying a positive potential to the
And may adhere slightly when negative potential is applied.
The jack is eluted with a positive potential, and
The surface in contact with the object to be plated can be kept clean for a long time.
it can.

[Procedure amendment 6]

[Document name to be amended] Drawing

[Correction target item name] Fig. 7

[Correction method] Change

[Correction contents]

FIG. 7

Claims (2)

[Claims] 1. A continuous plating apparatus in which a plate-shaped object to be plated is sandwiched between power supply rollers from both sides, and the object to be plated is horizontally moved in a plating tank by rotation of the power supply roller to perform plating on both surfaces of the object to be plated. And a power supply roller for the continuous plating apparatus, wherein the power supply roller is divided in a circumferential direction by an electric insulator, and the power is supplied only to the power supply roller in contact with the object to be plated. 2. A continuous plating apparatus in which a plate-shaped object to be plated is sandwiched between power supply rollers from both sides, and the object to be plated is horizontally moved in a plating tank by rotation of the power supply roller to perform plating on both surfaces of the object to be plated. A rotating cathode bar, a feed roller attached to the rotating cathode bar and circumferentially divided by an electrical insulator and in contact with an object to be plated, and a feed roller attached to the rotating cathode bar and corresponding to the section of the feed roller. A current collecting disk which is circumferentially divided by an electric insulator and which energizes the section of the power supply roller when the section of the power supply roller is at a position in contact with the object to be plated; Power supply.