JP2000091871A - Envelope and surface acoustic wave device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a surface acoustic wave device for realizing the flatness and low loss of a pass band and the high attenuation of a blocking band. SOLUTION: An envelope 11 forms an input pattern 12 corresponding to an input part, forms an output pattern 13 corresponding to an output part, and forms a ground pattern 14 between the input pattern 12 and the output pattern 13 in response to an interdigital transducer pattern. The ground pattern 14 forms a non-conductive groove-shaped non-conductive part 17 between the input pattern 12 and the output pattern 13, and separately forms an input side ground pattern 18 and an output side ground pattern 19. The input side ground pattern 18 and the output side ground pattern 19 are electrically separated so that any influence of an unnecessary signal between the input and output can be prevented, therefore leakage can be prevented. Thus, the flatness and low loss of a pass band and the high attenuation of a blocking band can be attained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an envelope and a surface acoustic wave device which achieve flatness and low loss in a pass band and high attenuation in a stop band.

[0002]

2. Description of the Related Art In general, a surface acoustic wave filter device using a surface acoustic wave device has been used in many fields because of its small size, high performance, and high reliability. Has been used for transmission / reception filters.

[0003] In transmission / reception filters for mobile communication, a high attenuation of a stop band is required, and an interdigital transducer (ID) as a surface acoustic wave element is required.
T) is generally connected in multiple stages.

However, in the case of the face-down bonding type envelope, the ground pattern on the input side and the ground pattern on the output side are shared, and unnecessary signals have an influence between input and output, so that a high blocking area is required. This hinders attenuation.

In recent years, a surface acoustic wave filter device capable of handling a plurality of passbands has been demanded. However, unnecessary signals affect the plurality of surface acoustic wave filter elements to make the passband flat and low. This hinders the loss and the high attenuation of the stop band.

[0006]

As described above, the conventional surface acoustic wave device has a problem that an unnecessary signal between input and output prevents high attenuation of the stop band.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an envelope and a surface acoustic wave device which achieve flatness and low loss of a pass band and high attenuation of a stop band. With the goal.

[0008]

According to the present invention, an input pattern connected to an input section of a surface acoustic wave element, an output pattern connected to an output section of the surface acoustic wave element, And a ground pattern formed with a non-conductive non-conductive portion connected to the ground portion.

Since the non-conductive non-conductive portion is formed in the ground pattern, the effect of unnecessary signals between the input and output of the surface acoustic wave element is eliminated, so that the stop band is increased and the pass band is flattened. Performance and low loss.

The present invention provides a piezoelectric substrate, a surface acoustic wave device formed on the piezoelectric substrate and having an input portion, an output portion, and a ground portion, an input pattern connected to the input portion,
An envelope provided with an output pattern connected to the output section and a ground pattern connected to the ground section and formed with a non-conductive non-conductor section.

Since the non-conductive non-conductive portion is formed on the ground pattern, the influence of unnecessary signals between input and output is eliminated, so that the attenuation of the stop band is improved, and the flatness and the loss of the pass band are reduced. Plan.

Further, the non-conductor portion is located between the input pattern and the output pattern and formed between the input pattern and the output pattern.

Further, the non-conductor portion is formed of a groove.

Further, the grounding section has an input-side grounding section and an output-side grounding section, and the grounding pattern includes the input-side grounding pattern connected to the input-side grounding section and the output grounding section connected to the output-side grounding section. And the input-side ground pattern and the output-side ground pattern are at least partially electrically connected and not separated by a non-conductor portion.

Still further, the grounding portion has an input side grounding portion and an output side grounding portion, and the grounding pattern is connected to the input side grounding portion connected to the input side grounding portion and the output side grounding portion. An output-side pattern, wherein the input-side ground pattern and the output-side ground pattern are electrically separated by a non-conductor portion.

Further, the surface acoustic wave element section has a plurality of stages.

The piezoelectric substrate and the envelope are joined by a face-down bonding method.

Further, a plurality of surface acoustic wave element portions are formed.

The ground pattern is electrically separated for each surface acoustic wave element.

Further, the surface acoustic wave element is provided so as to be connected in multiple stages.

Still further, the non-conductor portion is formed between multiple stages of the surface acoustic wave device.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A surface acoustic wave device according to an embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 2, an interdigital transducer (IDT) pattern 2 as a surface acoustic wave element is formed on a piezoelectric substrate 1, and this interdigital transducer pattern 2 has an input section 3 and an output section 4. At the same time, the input side grounding section 5,
6 and the output unit 4 have output-side grounding units 7 and 8. Further, four reflector patterns 9 are formed around the interdigital transducer pattern 2.

As shown in FIG. 1, reference numeral 11 denotes an envelope.
The envelope 11 corresponds to the interdigital transducer pattern 2 and the input pattern 12 corresponding to the input section 3.
Is formed, an output pattern 13 is formed corresponding to the output unit 4, a ground pattern 14 is formed between the input pattern 12 and the output pattern 13, and the ground pattern 14 is formed around the input pattern 12 and the output pattern 13, respectively. U-shaped non-conductive groove-shaped non-conductive portions 15 and 16 are formed.
15 and 16, the input pattern 12 and output pattern 13
And the ground pattern 14 are electrically separated and insulated.

Further, the ground pattern 14 is the input pattern
Non-conductive groove-shaped non-conductive part between 12 and output pattern 13
An input-side ground pattern corresponding to the input-side ground portions 5 and 6 is provided on the input pattern 12 side of the non-conductive portion 17
18 are formed, and on the output pattern 13 side, the output side grounding portion 7,
An output-side ground pattern 19 corresponding to 8 is formed.

Then, as shown in FIG.
And an envelope 11 are provided facing each other, and are bump-bonded by bumps 21 by a face-down bonding method.

As described above, by electrically separating the input-side ground pattern 18 and the output-side ground pattern 19,
The influence of the unnecessary signal between the input and the output is eliminated, and the leakage is eliminated, so that the flatness of the pass band, low loss, and high attenuation of the stop band can be achieved.

The same effect can be obtained even if the input-side ground pattern 18 and the output-side ground pattern 19 are completely divided by the non-conductor portion 17.

Next, another embodiment will be described with reference to FIGS.

The embodiment shown in FIG. 4 and FIG.
In the embodiment shown in FIGS. 1 to 3, the envelope 11 also corresponds to the interdigital transducers 2a and 2b,
First and second pattern portions 22a and 22b are formed, and between these first and second pattern portions 22a and 22b,
A non-conductive groove-shaped non-conductive portion 23 is formed.
At 23, a first pattern portion 22a and a second pattern portion 22b
Are separated. Further, the non-conductive groove-shaped non-conductive portion 17 between the input pattern 12 and the output pattern 13 completely separates the input pattern 12 and the output pattern 13, respectively. Note that, similarly to the embodiment shown in FIGS. 1 to 3, a part may be left connected.

As described above, the ground pattern 14 of the envelope 11 between the plurality of interdigital transducers 2a and 2b is divided to cope with the plurality of pass bands, and the input side ground pattern 18 and the output side Ground pattern 19
Is electrically isolated from each other, the influence of an unnecessary signal between input and output is eliminated, and flatness of the pass band, low loss, and high attenuation of the stop band can be achieved.

[0032]

According to the present invention, since the non-conductive non-conductive portion is formed in the ground pattern, the influence of unnecessary signals between the input and output is eliminated, so that the attenuation of the stop band is increased and the flatness of the pass band is improved. And low loss can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan view showing an envelope of an embodiment of a surface acoustic wave device according to the present invention.

FIG. 2 is a sectional view showing the surface acoustic wave device according to the first embodiment;

FIG. 3 is a schematic diagram showing a circuit of the piezoelectric substrate.

FIG. 4 is a plan view showing a surface acoustic wave device according to another embodiment of the present invention;

FIG. 5 is a schematic diagram showing a circuit of the piezoelectric substrate according to the first embodiment.

[Description of Signs] 1 Piezoelectric substrate 2 Interdigital transducer pattern as surface acoustic wave element 3 Input section 4 Output section 5, 6 Input side grounding section 7, 8 Output side grounding section 11 Envelope 12 Input pattern 13 Output pattern 14 Grounding pattern 17 Non-conductor part 18 Input side grounding pattern 19 Output side grounding pattern

Claims (12)

[Claims] An input pattern connected to an input section of the surface acoustic wave element; an output pattern connected to an output section of the surface acoustic wave element; and a non-conductive connected to a ground section of the surface acoustic wave element. And a ground pattern on which the non-conductor portion is formed. 2. A piezoelectric substrate, a surface acoustic wave element formed on the piezoelectric substrate and having an input unit, an output unit, and a ground unit, an input pattern connected to the input unit, and connected to the output unit. A surface acoustic wave device, comprising: an output pattern provided by the user; and an envelope provided with a ground pattern formed with a non-conductive non-conductive portion connected to the ground portion. 3. The surface acoustic wave device according to claim 2, wherein the non-conductor portion is located between the input pattern and the output pattern and formed between the input pattern and the output pattern. 4. The surface acoustic wave device according to claim 2, wherein the non-conductor portion is formed by a groove. 5. The grounding section has an input-side grounding section and an output-side grounding section, and the grounding pattern includes an input-side grounding pattern connected to the input-side grounding section and the output connected to an output-side grounding section. 5. The input-side ground pattern and the output-side ground pattern are at least partially electrically connected and are not separated by a non-conductor portion. 6. Surface acoustic wave device. 6. The grounding section has an input-side grounding section and an output-side grounding section, and the grounding pattern includes an input-side grounding pattern connected to the input-side grounding section and the output connected to an output-side grounding section. The surface acoustic wave device according to any one of claims 2 to 4, further comprising a side pattern, wherein the input-side ground pattern and the output-side ground pattern are electrically separated by a non-conductor portion. 7. The surface acoustic wave device according to claim 2, wherein the surface acoustic wave element section has a plurality of stages. 8. The surface acoustic wave device according to claim 2, wherein the piezoelectric substrate and the envelope are joined by a face-down bonding method. 9. The surface acoustic wave device according to claim 2, wherein a plurality of surface acoustic wave element sections are formed. 10. The surface acoustic wave device according to claim 9, wherein the ground pattern is electrically separated for each surface acoustic wave element. 11. The surface acoustic wave device according to claim 9, wherein the surface acoustic wave elements are provided so as to be connected in multiple stages. 12. The surface acoustic wave device according to claim 11, wherein the non-conductor portion is formed between multiple stages of the surface acoustic wave element.