JP2000091399A - Semiconductor manufacturing equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the quality of a product by preventing the infiltration of dust into a semiconductor manufacturing equipment. SOLUTION: A case 7 is provided with an intake port 51, for taking in gas into the inside of the case 7 and exhaust ports 52, 53 for exhausting gas outside the case. The intake port and the exhaust ports are connected by means of ducts 54, 55, 56. In the middle of the ducts, an air blower 57 and a filter 58 for eliminating dust in the air are installed. An independent clean gas circulation path 59 is formed by the air blower, the filter, the duct, and the case to circulate the gas, and the inside of the case is kept at a specified degree of cleanness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor manufacturing apparatus,
In particular, the present invention relates to a semiconductor manufacturing apparatus in which a flow of a clean gas for keeping the inside of a housing of the semiconductor manufacturing apparatus clean is formed.

[0002]

2. Description of the Related Art The cleanliness of an atmosphere in a semiconductor manufacturing process has a great effect on the improvement of product quality and yield. For that reason,
The semiconductor manufacturing apparatus is installed in a clean room and a clean unit is provided in the semiconductor manufacturing apparatus so that a steady flow of clean gas is formed inside the semiconductor manufacturing apparatus.

A conventional semiconductor manufacturing apparatus will be described with reference to FIGS.

A floor panel 2 is horizontally supported by a floor slab 1, and a lower gas flow passage 3 having a required height is formed between the floor slab 1 and the floor panel 2. A plurality (eight in the figure) of semiconductor manufacturing apparatuses 4 are installed on the floor panel 2 in a state of being connected sideways. A required number of floor inlets 5 are provided on the floor panel 2 in front of the semiconductor manufacturing apparatus 4 and a required number of floor outlets 6 are provided on the floor panel 2 behind the semiconductor manufacturing apparatus 4. I have. An inlet 8 is provided on the upper surface of the rear part of the housing 7 of each of the semiconductor manufacturing apparatuses 4, a front outlet 9 is provided on the lower front part of the housing 7, and a rear outlet 10 is provided on the rear surface. ing.

A ceiling panel 11 is suspended from a ceiling slab 12 above the semiconductor manufacturing apparatus 4, and an upper gas flow passage 13 is formed between the ceiling panel 11 and the ceiling slab 12. 13 and the blower 1 from the upstream side
4, a filter 15 is provided.

[0006] The ceiling panel 11 and the floor panel 2 are partitioned by a partition 16 into a first clean room 17 and a second clean room 18.
The front portion of the air-conditioner penetrates the partition 16 airtightly and faces the second clean room 18. The ceiling panel 11 of the first clean room 17 is provided with a first clean room side ceiling outlet 19 at a position corresponding to the inlet 8 and a ceiling inlet 20 at a position rearward of the semiconductor manufacturing apparatus 4. ing. The ceiling panel 11 of the second clean room 18 is provided with a second clean room side ceiling outlet 21.

Next, the semiconductor manufacturing apparatus 4 will be described.

[0008] A reaction furnace 22 is provided in an upper rear portion of the housing 7, and a boat 23 is detachably mounted on the reaction furnace 22 from below by a boat elevator (not shown).
A wafer transfer device 24 is provided to be movable up and down and rotatable beside the boat elevator (not shown), and a third clean unit 25 is provided beside the wafer transfer device 24.
Is provided. An upper cassette shelf 26 and a lower cassette shelf 27 are provided in front of the wafer transfer machine 24 in two upper and lower stages, and a first clean unit 28 and a second clean unit 29 in the upper and lower two stages behind the upper cassette shelf 26. Is provided. The upper cassette shelf 26 and the lower cassette shelf 27
Is provided in front of the cassette transfer device 30. The cassette transfer device 30 is a vertically movable and retractable cassette hand 3.
1 is provided.

A cassette stage 36 is provided in front of the cassette transporter 30 and below a front portion of the housing 7, and the cassette stage 36 has a mounting table 37 at an upper portion, and the mounting table 37 can be moved up and down. Is provided. Above the cassette stage 36, a wafer cassette transfer chamber 38 is defined facing the front surface of the housing 7. A transfer port 39 that can be hermetically closed by a shutter (not shown) is provided on the front surface of the wafer cassette transfer chamber 38.
Through a closed container such as SMIF (Standard
A mechanical interface (pod) 40 can be carried into the wafer cassette transfer chamber 38.

The SMIF pod 40 has a lid 41 that can be sealed on the bottom side, and the wafer cassette 35 in which the wafer 42 is loaded in a horizontal posture is placed inside the SMIF pod 40 while the wafer cassette 35 is placed on the lid 41. It is to be stored.

The bottom surface 4 of the wafer cassette transfer chamber 38
3 is provided with an opening 44, and the opening 44 is
1 is sized to be able to pass through and to be sealed by the SMIF pod 40 placed on the bottom surface 43. Further, a fourth clean unit 45 is provided between the wafer cassette transfer chamber 38 and the cassette transfer device 30, and an inner side surface of the housing 7 is located forward of the cassette transfer device 30 and slightly smaller than the bottom surface 43. Gripper 4 downward
6 is provided so as to be able to advance and retreat.

When a semiconductor is manufactured in the semiconductor manufacturing apparatus 4, a shutter (not shown) of the transfer port 39 is opened, and the wafer cassette 35 loaded with the wafer 42 from outside the housing 7 is removed. The stored SMIF
The pod 40 is carried into the wafer cassette transfer chamber 38 through the transfer port 39. The SMIF pod 40 is placed on the bottom surface 43, the opening 44 is airtightly closed, and the transfer port 39 is sealed by the shutter. After the mounting table 37 is lifted and the lid 41 on which the wafer cassette 35 is mounted is transferred onto the mounting table 37, the mounting table 37 is lowered and the wafer cassette 35 is pulled out from the SMIF pod 40.

The gripper 46 grips the upper end of the wafer cassette 35, and the mounting table 37 is further lowered while only the lid 41 is mounted. The gripper 46 is retracted, the front end is inclined downward, and the wafer cassette 3
After aligning the wafers 42 in 5, the wafer returns to the horizontal position again. The cassette hand 31 is connected to the wafer cassette 3
5, the gripper 46 releases the wafer cassette 35 and transfers the wafer cassette 35 onto the cassette hand 31.

The cassette hand 31 transports the wafer cassette 35 to required positions on the upper cassette shelf 26 and the lower cassette shelf 27, and the wafer transfer device 24 transfers the wafer 42 in the wafer cassette 35 to the boat 2
Transfer to 3. The boat elevator (not shown) raises the boat 23 loaded with the wafers 42 and charges the boats 23 into the reaction furnace 22, where necessary processing is performed on the wafers 42.

Thereafter, the processed wafer 42 is carried out to the outside in a procedure reverse to the above procedure.

During the semiconductor manufacturing process, the interior of the housing 7 must be maintained at a predetermined cleanliness in order to improve product quality and the like. And a steady flow is formed.

The operation of the blower 14 causes a gas, for example, air to flow, and the air from which dust is removed by the filter 15 becomes clean air of a required cleanliness. The clean air flows through the upper gas flow passage 13, is blown out to the first clean room 17 through the first clean room side ceiling outlet 19, and passes through the second clean room side ceiling outlet 21. 2 The air is blown out to the clean room 18.

The clean air blown out to the first clean room 17 is introduced into the housing 7 through the suction port 8 and then split into two systems. After one system of clean air passes through the third clean unit 25 and dust is removed,
Through the wafer transfer machine 24, the boat 23, and the boat elevator (not shown), the first
It is discharged to the clean room 17. The other one system of clean air passes through the first clean unit 28 and the second clean unit 29 and after dust is removed, passes through the upper cassette shelf 26 and descends. After passing through the transfer device 30 and the cassette stage 36, the second clean room 18
Is discharged to

The second clean room side outlet 21
The clean air blown out to the second clean room 18 descends and merges with the air discharged from the front discharge port 9, then reaches the lower gas flow passage 3 through the floor suction port 5, and further flows into the lower gas flow path 3. The air flows through the gas flow passage 3 backward, and is blown out from the floor outlet 6 to the first clean room 17. The air blown into the first clean room 17 merges with the air discharged from the rear outlet 10 and then rises, passes through the ceiling suction port 20, and rises.
3 and returns to the blower 14 again.

Thereafter, the circulation of the clean air is repeated, and the inside of the housing 7 of the semiconductor manufacturing apparatus 4 and the first clean room 17 and the second clean room 18 are each maintained at a predetermined cleanliness.

[0021]

In the semiconductor manufacturing process, other than the target semiconductor manufacturing apparatus 4 is operated even during maintenance or expansion work of the semiconductor manufacturing apparatus 4 to improve productivity. Is being planned.

However, in the above-described conventional example, the suction port 8, the front discharge port 9, and the rear discharge port 10 of all the connected semiconductor manufacturing apparatuses 4 are connected via the first clean room 17 and the second clean room 18. Therefore, dust is generated from some of the semiconductor manufacturing apparatuses 4 during maintenance or expansion work of the semiconductor manufacturing apparatus 4 and the like, and the dust is generated in the first clean room 17 or the second clean room 18. If diffused, the dust may enter the housing 7 of another active semiconductor manufacturing apparatus 4.

The present invention has been made in view of the above circumstances, and aims to prevent dust from entering a housing of a semiconductor manufacturing apparatus and improve the quality of products.

[0024]

According to the present invention, a suction port for sucking a gas into a housing and a discharge port for discharging the gas to the outside of the housing are provided in the housing, and the suction port and the discharge port are provided. And a filter for removing dust in the gas is provided in the middle of the duct, and a filter for removing dust in the gas is provided, and the independent clean gas circulation path is formed by the blower, the filter, the duct, and the housing. According to the apparatus, the inlet is provided at an upper position of the housing, and the outlet is provided at a lower position of the housing, and a clean gas flow is formed inside the housing from an upper position to a lower position. Further, the present invention relates to a semiconductor manufacturing apparatus in which a movable mechanism provided inside the housing is arranged on the downstream side of the clean gas, and further holds a substrate to be processed between the outside and a front lower part in the housing. Transfer of containers containing cassettes A set stage is provided, a cassette transporter for transporting the cassette between the cassette stage and a cassette shelf is provided behind the cassette stage, a reaction furnace is provided above a rear part in the housing, and a reaction furnace is provided in the housing. A boat elevator for loading and unloading the boat loaded with the substrate to be processed into and from the reaction furnace from below is provided below the rear part of the boat, and the boat elevator between the boat and the cassette shelf in a lowered state is provided beside the boat elevator. A substrate transfer device for transferring a processing substrate is provided, the suction port is provided at an upper position of the housing, and the discharge port is provided near the boat elevator and near the cassette transfer device and the cassette stage. Further, in the semiconductor manufacturing apparatus, the clean gas circulation path may have a closed structure, the container may be a closed container, and the substrate to be processed may be the case. A clean gas circulating through the clean gas circulation path without being affected by another system of the semiconductor manufacturing device. Maintain the cleanliness inside the body.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In FIGS. 1 and 2,
The same components as those in FIGS. 3 to 7 are denoted by the same reference numerals, and description thereof will be omitted.

A plurality (eight in the figure) of semiconductor manufacturing apparatuses 4 are installed on the floor panel 2 so as to be connected to each other. A suction port 51 is provided on the rear upper surface of the housing 7 of each semiconductor manufacturing apparatus 4, and a lower surface outlet 5 is provided on the front lower surface of the housing 7.
2 and a rear outlet 53 at a lower portion of the rear surface. Thus, the lower surface discharge port 52 is located near the cassette transporter 30 and the cassette stage 36 which are movable mechanisms, and the rear surface discharge port 53 is located near the boat elevator (not shown) which is a movable mechanism. are doing.

The intake port 51 is provided with an air supply duct 5 from above.
4 is connected, and the air supply duct 54 is bent rearward. A first exhaust duct 55 is connected to the lower outlet 52 downward, and a second exhaust duct 56 is connected horizontally to the rear outlet 53 rearward.

The first exhaust duct 55 is bent backward in the lower gas flow passage 3, further bent upward behind the semiconductor manufacturing apparatus 4, and penetrates through the floor panel 2. The first exhaust duct 55 includes the first clean room 17.
The second exhaust duct 56 is connected inside the first exhaust duct 55, and the first exhaust duct 55 in a portion above the connection point between the first exhaust duct 55 and the second exhaust duct 56 has a large diameter and rises up to near the ceiling panel 11. Then, it is bent forward and connected to the air supply duct 54 via an individual blower 57 and an individual filter 58.

The individual blower 57, the individual filter 58, the air supply duct 54, the housing 7, the first exhaust duct 5
5. Each of the semiconductor manufacturing apparatuses 4 by the second exhaust duct 56
The closed clean gas circulation paths 59 are formed independently of each other.

The operation will be described below.

A gas, for example, air flows by the action of the individual blower 57, and the air is cleaned of dust by the individual filter 58 to become clean air of a predetermined cleanliness. The clean air flows into the housing 7 through the air supply duct 54 and the suction port 51 and is divided into two systems in the same manner as the conventional flow in the housing 7. It is discharged from the rear outlet 53 through the second exhaust duct 56,
Another type of clean air is discharged from the lower surface outlet 52 through the first exhaust duct 55. At this time, since movable mechanisms such as the cassette transporter 30, the cassette stage 36, and the boat elevator (not shown) are located downstream of the clean air of each system, dust generated from the movable mechanisms may be removed. There is no fear of adhering to the wafer 42.

The air flowing in the first exhaust duct 55 and the air flowing in the second exhaust duct 56 are
After merging at the connection point between the exhaust duct 55 and the second exhaust duct 56, the air duct rises in the first exhaust duct 55 and returns to the individual blower 57 again.

Thereafter, the circulation of the clean air is repeated in the clean gas circulation path 59 in the same manner as described above, and the inside of the housing 7 is maintained at a predetermined cleanliness.

Further, the first clean room 17 and the second clean room 18 in the outer space of the housing 7 supply clean air to the blower 14, the filter 15, the upper gas flow passage 13,
The predetermined cleanliness is obtained by repeatedly circulating through the second clean room side ceiling outlet 21, the second clean room 18, the floor suction port 5, the lower gas flow passage 3, the floor blow outlet 6, the first clean room 17, and the ceiling suction port 20. Is maintained.

In the above embodiment, the independent clean gas circulation paths 59 are formed for each of the semiconductor manufacturing apparatuses 4. However, the clean gas circulation paths 59 are formed separately for each apparatus for producing the same type of film. Alternatively, an independent clean gas circulation path may be formed for each system.

Further, the present invention is not limited to the semiconductor manufacturing apparatus 4 which is housed in a sealed container such as the SMIF pod 40 and exchanges wafers in a state of being isolated from the external space of the housing 7, but also in a state where wafers are loaded in a wafer cassette. The present invention can also be applied to a semiconductor manufacturing apparatus that exchanges wafers.

Further, the inlet 51, the lower outlet 52,
Rear outlet 53, air supply duct 54, first exhaust duct 5
5. The installation positions of the second exhaust duct 56, the individual blower 57, and the individual filter 58 are not limited to the positions described above.
Further, the gas circulating in the clean gas circulation path 59 is not limited to air, but may be another gas such as nitrogen.

[0038]

As described above, according to the present invention, the flow of the clean gas is formed independently for each clean gas circulation path separately from the flow of the clean gas in the outer space of the housing. Even if dust is generated during the maintenance of the apparatus or at the time of expansion work and diffuses into the external space of the housing, the dust does not enter the housing of another operating semiconductor manufacturing apparatus.

Therefore, it is easy to maintain the inside of the casing at a predetermined cleanliness, and it is possible to improve the quality of the product.

Further, since the clean air is circulated independently for each of the clean gas circulation paths, the cleanliness of each of the clean gas circulation paths can be easily grasped, and abnormalities such as deterioration of the cleanliness in the housing can be obtained. The situation can be detected early, and the atmosphere of the manufacturing process can be easily managed.

Further, when the clean gas circulation path has a closed structure, the container is a closed container, and the substrate to be processed can be transferred to and from the cassette stage in a state of being isolated from the external space of the housing. Regardless of whether the substrate to be processed is transported outside the housing, transferred to or from the cassette stage, or transported or processed inside the housing, the substrate to be processed is located outside the housing. Since the gas is isolated from the space and the flow of gas between the inside of the housing and the space outside the housing is completely shut off, the above-mentioned effect can be further obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing the embodiment.

FIG. 3 is a sectional view showing a conventional example.

FIG. 4 is a perspective view showing a conventional example.

FIG. 5 is a perspective view showing the back side of the semiconductor manufacturing apparatus.

FIG. 6 is an explanatory diagram illustrating a configuration of a semiconductor manufacturing apparatus.

FIG. 7 is a perspective view showing a flow of clean air inside the semiconductor manufacturing apparatus.

[Explanation of symbols]

 Reference Signs List 4 semiconductor manufacturing apparatus 7 case 17 first clean room 18 second clean room 51 suction port 52 bottom discharge port 53 rear discharge port 54 air supply duct 55 first exhaust duct 56 second exhaust duct 57 individual blower 58 individual filter 59 clean gas circulation Road

Claims (4)

[Claims] An inlet for sucking gas into the housing and an outlet for discharging the gas to the outside of the housing are provided in the housing, and the inlet and the outlet are connected by a duct; And a filter for removing dust in the gas is provided in the middle of the process, and an independent clean gas circulation path is formed by the blower, the filter, the duct, and the housing. 2. The method according to claim 1, wherein the inlet is provided at an upper position of the housing, and the outlet is provided at a lower position of the housing, and a clean gas flow is formed inside the housing from the upper position to the lower position. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a movable mechanism provided inside said housing is disposed downstream of said clean gas. 3. A cassette stage for exchanging a container accommodating a cassette holding a substrate to be processed with the outside is provided below a front portion inside the housing, and the cassette stage is provided behind the cassette stage. A cassette transporter for transporting the cassette between cassette shelves is provided, a reaction furnace is provided above a rear portion in the housing, and a boat loaded with the substrate to be processed is mounted on the lower portion of the rear portion of the housing from below. A boat elevator for loading and unloading in the reaction furnace is provided, and a substrate transfer machine for transferring the substrate to be processed between the boat in a lowered state and the cassette shelf is provided on a side of the boat elevator. 2. The port is provided at an upper position of the housing, and the discharge port is provided near the boat elevator and near the cassette transporter and the cassette stage. The semiconductor manufacturing apparatus according to claim 2. 4. The clean gas circulation path has a closed structure,
4. The semiconductor manufacturing apparatus according to claim 1, wherein said container is a closed container, and said substrate to be processed can be transferred to and from said cassette stage in a state of being isolated from an external space of said housing.