JP2000091164A - Aluminum-clad material and aluminum foil for electrolytic capacitor electrode - Google Patents

Aluminum-clad material and aluminum foil for electrolytic capacitor electrode

Info

Publication number
JP2000091164A
JP2000091164A JP10256190A JP25619098A JP2000091164A JP 2000091164 A JP2000091164 A JP 2000091164A JP 10256190 A JP10256190 A JP 10256190A JP 25619098 A JP25619098 A JP 25619098A JP 2000091164 A JP2000091164 A JP 2000091164A
Authority
JP
Japan
Prior art keywords
ppm
purity
aluminum
foil
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10256190A
Other languages
Japanese (ja)
Inventor
Tomoaki Yamanoi
智明 山ノ井
Kimitoku Sugimoto
公徳 杉本
Susumu Cho
進 張
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Aluminum Can Corp
Original Assignee
Showa Aluminum Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Aluminum Corp filed Critical Showa Aluminum Corp
Priority to JP10256190A priority Critical patent/JP2000091164A/en
Publication of JP2000091164A publication Critical patent/JP2000091164A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To increase capacitance and improve break resistance by cladding an Al reinforced layer that has an Al layer with a specific purity or higher, at the same time contains a specific amount of Sc, and has a remaining part being made of an unavoidable impurity onto at least one layer. SOLUTION: In Al foil for electrolytic capacitor electrode, an Al-clad material is subjected to foil rolling, Al purity is set to 99.8 wt.% or higher, at the same time Sc that is 5 ppm or higher and less than 2,000 ppm is contained, and a high-purity Al with an Al purity of 99.8 wt.% is clad on at least one surface of a reinforced surface where a remaining part is made of an unavoidable impurity. Or, an Al concentration is set to 99.8% or higher. At the same time, Sc that is 5 ppm or higher and less than 2,000 ppm, Fe that is 5-60 ppm, Si that is 5-80 ppm, and Cu that is 5-150 ppm are contained, and an etching layer made of high-purity Al with an Al purity of 99.8% or higher is clad onto at least one surface of the reinforced layer where a remaining part is made of an unavoidable impurity, thus improving a surface-spread rate and achieving both improved capacitance and strength.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、アルミニウムク
ラッド材および電解コンデンサ電極用アルミニウム箔に
関する。
The present invention relates to an aluminum clad material and an aluminum foil for an electrode of an electrolytic capacitor.

【0002】なお、この明細書において、「アルミニウ
ム」の語はアルミニウムおよびその合金の両者を含む意
味で用いられる。
[0002] In this specification, the term "aluminum" is used to include both aluminum and its alloys.

【0003】[0003]

【従来の技術およびその問題点】アルミニウム電解コン
デンサ電極材として用いられるアルミニウム箔には、そ
の実行面積を拡大して単位面積当たりの静電容量を増大
するため、電気化学的あるいは化学的エッチング処理が
施される。特に、製品のダウンサイジングに伴う部品の
小型化要求から、高静電容量化へのニーズがますます高
まっている。
2. Description of the Related Art An aluminum foil used as an electrode material of an aluminum electrolytic capacitor is required to be subjected to an electrochemical or chemical etching process in order to increase its effective area and increase the capacitance per unit area. Will be applied. In particular, there is a growing need for higher capacitance due to the demand for downsizing of components due to downsizing of products.

【0004】しかし、箔を単にエッチングしただけでは
十分な静電容量を得られず、エッチング特性を高めるた
めに、微量のPbやCuを添加する等の合金組成、熱処
理方法、結晶組織などの種々の観点から改良がなされて
いる。
However, simply etching the foil cannot provide a sufficient capacitance. In order to improve the etching characteristics, a variety of alloy compositions such as adding a small amount of Pb or Cu, heat treatment methods, crystal structures, etc. Improvements have been made from the point of view.

【0005】一方、高静電容量化のための拡面率の向上
にともなってエッチング層が厚くなる傾向にあり、アル
ミニウム箔の耐折強度の確保が難しくなっている。
[0005] On the other hand, the etching layer tends to be thicker with an increase in the surface area for higher capacitance, and it is difficult to secure the bending strength of the aluminum foil.

【0006】この発明は、このような技術背景に鑑み、
エッチング特性に優れて高静電容量を実現できるととも
に、耐折強度にも優れた電解コンデンサ電極用アルミニ
ウム箔、および箔の材料となるアルミニウムクラッド材
の提供を目的とする。
The present invention has been made in view of such technical background,
An object of the present invention is to provide an aluminum foil for an electrolytic capacitor electrode, which is excellent in etching characteristics and can realize high capacitance and has excellent bending strength, and an aluminum clad material as a material of the foil.

【0007】[0007]

【課題を解決するための手段】この発明のアルミニウム
クラッド材は、前記目的を達成するために、少なくとも
一層に、Al純度を99.8wt%以上とするとともに、
5ppm以上2000ppm未満のScを含有し、残部
が不可避不純物からなる強化層がクラッドされてなるこ
と、あるいは少なくとも一層に、Al純度を99.8wt
%以上とするとともに、5ppm以上2000ppm未
満のSc、5〜60ppmのFe、5〜80ppmのS
iおよび5〜150ppmのCuを含有し、残部が不可
避不純物からなる強化層がクラッドされてなることを特
徴とする。
In order to achieve the above object, the aluminum clad material of the present invention has at least one layer having an Al purity of at least 99.8 wt%,
A reinforcing layer containing 5 ppm or more and less than 2000 ppm of Sc and the balance of unavoidable impurities is clad, or at least one layer has an Al purity of 99.8 wt.
% And at least 5 ppm and less than 2000 ppm of Sc, 5 to 60 ppm of Fe, and 5 to 80 ppm of S
It is characterized in that a reinforcing layer containing i and 5 to 150 ppm of Cu, the remainder being inevitable impurities, is clad.

【0008】また、この発明の電解コンデンサ電極用ア
ルミニウム箔は、前述のアルミニウムクラッド材を箔圧
延したものであって、Al純度を99.8wt%以上とす
るとともに、5ppm以上2000ppm未満のScを
含有し、残部が不可避不純物からなる強化層の少なくと
も片面に、Al純度が99.8%以上の高純度アルミニ
ウムからなるエッチング層がクラッドされてなること、
あるいはAl純度を99.8wt%以上とするとともに、
5ppm以上2000ppm未満のSc、5〜60pp
mのFe、5〜80ppmのSiおよび5〜150pp
mのCuを含有し、残部が不可避不純物からなる強化層
の少なくとも片面に、Al純度が99.8%以上の高純
度アルミニウムからなるエッチング層がクラッドされて
なることを特徴とする。また、前記エッチング層は、箔
表面において、立方体方位{001}〈100〉からの
ずれ角が10°以下の結晶粒が80%以上を占めること
が好ましい。
The aluminum foil for an electrolytic capacitor electrode according to the present invention is obtained by foil rolling the above-mentioned aluminum clad material and has an Al purity of not less than 99.8 wt% and contains Sc of not less than 5 ppm and less than 2,000 ppm. An etching layer made of high-purity aluminum having an Al purity of 99.8% or more is clad on at least one surface of the reinforcing layer whose remainder is made of unavoidable impurities;
Alternatively, while making the Al purity 99.8 wt% or more,
Sc of 5 ppm or more and less than 2000 ppm, 5 to 60 pp
m Fe, 5-80 ppm Si and 5-150 pp
An etching layer made of high-purity aluminum having an Al purity of 99.8% or more is clad on at least one surface of a reinforcing layer containing m of Cu and the remainder made of unavoidable impurities. Further, in the etching layer, it is preferable that 80% or more of crystal grains having a deviation angle of 10 ° or less from the cubic orientation {001} <100> on the foil surface.

【0009】この発明のアルミニウムクラッド材および
電解コンデンサ電極用アルミニウム箔において、強化層
は微量のSc添加により強度や伸びを確保している。一
般に、電極用高純度アルミニウム箔は、エッチング後の
乾燥工程や化成処理工程において300℃以上の高温雰
囲気に曝される。このとき、硬質箔であっても軟化や再
結晶が起こり強度が低下する。また、軟質箔の場合は、
Al純度が高いために結晶粒径が大きくなり、板厚方向
の結晶粒の数が減少して伸びや耐折強度が低下する。こ
のような現象に対し、Al中に微量のScを添加するこ
とで最終焼鈍後の再結晶を遅延させ、且つ微細粒に再結
晶させて、再結晶後も強度や伸びを維持することができ
る。そして、Scが添加された強化層を高純度Alから
なるエッチング層にクラッドさせることにより、エッチ
ング特性を損なうことなく、強度や伸びに優れたアルミ
ニウム箔とすることができる。
In the aluminum clad material and the aluminum foil for an electrolytic capacitor electrode of the present invention, the reinforcing layer secures strength and elongation by adding a small amount of Sc. Generally, a high-purity aluminum foil for an electrode is exposed to a high-temperature atmosphere of 300 ° C. or more in a drying step or a chemical conversion step after etching. At this time, even if the hard foil is used, softening or recrystallization occurs, and the strength is reduced. In the case of soft foil,
Since the Al purity is high, the crystal grain size increases, the number of crystal grains in the thickness direction decreases, and elongation and bending strength decrease. In response to such a phenomenon, by adding a small amount of Sc to Al, recrystallization after final annealing can be delayed and recrystallized into fine grains, so that strength and elongation can be maintained even after recrystallization. . Then, by cladding the Sc-added reinforcing layer on the etching layer made of high-purity Al, an aluminum foil having excellent strength and elongation can be obtained without impairing the etching characteristics.

【0010】前記強化層の化学組成において、Al純度
は、不純物量を規制して過溶解によるエッチング特性の
低下を防ぐために、99.8%以上とする必要がある。
また、Sc含有量は、5ppm未満では前記効果に乏し
く、2000ppm以上では効果が飽和して多量添加は
無駄になりコストアップとなるため、5ppm以上20
00ppm未満とする必要がある。Sc含有量の好まし
い下限値は50ppmであり、特に好ましい下限値は2
00ppmであり上限値は1000ppmである。
[0010] In the chemical composition of the reinforcing layer, the Al purity needs to be 99.8% or more in order to restrict the amount of impurities and prevent the etching characteristics from being deteriorated due to overdissolution.
If the Sc content is less than 5 ppm, the above effect is poor, and if it is 2,000 ppm or more, the effect is saturated and a large amount is wasted and the cost is increased.
It must be less than 00 ppm. A preferred lower limit of the Sc content is 50 ppm, and a particularly preferred lower limit is 2 ppm.
It is 00 ppm and the upper limit is 1000 ppm.

【0011】さらに、Scに加えて、微量のFe、S
i、Cuを添加することが好ましい。Feを添加するの
は、結晶粒の粗大化の防止による耐折強度向上効果が認
められるためである。また、Fe含有量は、5ppm未
満ではその効果がなく、60ppmを超えるとScによ
る再結晶遅延効果を減じて強化効果を減ずるため、5〜
60ppmとする必要がある。Fe含有量の好ましい下
限値は8ppmであり、好ましい上限値は50ppmで
ある。また、Siの添加理由は結晶粒の粗大化抑止であ
る。Si含有量は、5ppm未満では再結晶時に粗大な
結晶粒が発生し、80ppmを超えるとFeと同様にS
cによる再結晶遅延効果を減じて強化効果を減ずるた
め、5〜80ppmとする必要がある。Si含有量の好
ましい下限値は8ppmであり、好ましい上限値は50
ppmである。また、Cuの添加理由は、結晶粒の粗大
化抑止である。Cu含有量は、5ppm未満では粗大粒
が発生し、150ppmを超えるとFe、Siと同様に
Scによる再結晶遅延効果を減じて強化効果を減ずるた
め、5〜150ppmとする必要がある。Cu含有量の
好ましい下限値は25ppmであり、好ましい上限値は
80ppmである。
Further, in addition to Sc, a small amount of Fe, S
It is preferable to add i and Cu. The reason why Fe is added is that the effect of improving the bending strength by preventing the crystal grains from becoming coarse is recognized. When the Fe content is less than 5 ppm, the effect is not obtained. When the Fe content is more than 60 ppm, the recrystallization delay effect by Sc is reduced and the strengthening effect is reduced.
It is necessary to be 60 ppm. A preferred lower limit of the Fe content is 8 ppm, and a preferred upper limit is 50 ppm. The reason for adding Si is to suppress the coarsening of crystal grains. When the Si content is less than 5 ppm, coarse crystal grains are generated during recrystallization, and when the Si content exceeds 80 ppm, S
In order to reduce the recrystallization delay effect by c and reduce the strengthening effect, the content needs to be 5 to 80 ppm. A preferred lower limit of the Si content is 8 ppm, and a preferred upper limit is 50 ppm.
ppm. The reason for adding Cu is to suppress the coarsening of crystal grains. If the Cu content is less than 5 ppm, coarse grains are generated, and if it exceeds 150 ppm, the recrystallization retarding effect by Sc is reduced and the strengthening effect is reduced similarly to Fe and Si. Therefore, the Cu content needs to be 5 to 150 ppm. A preferred lower limit of the Cu content is 25 ppm, and a preferred upper limit is 80 ppm.

【0012】請求項1および請求項2のアルミニウムク
ラッド材は、少なくとも一層に前記強化層を有するもの
であって、他の層の組成は限定しない。
The aluminum clad material according to the first and second aspects has the reinforcing layer in at least one layer, and the composition of the other layers is not limited.

【0013】請求項3〜5の電解コンデンサ電極用アル
ミニウム箔は、前記強化層を芯材としてその片面あるい
は両面に高純度アルミニウムからなるエッチング層がク
ラッドされた箔である。これらのアルミニウム箔は、請
求項1または2のアルミニウムクラッド材において、一
層を前記強化層で構成し、この強化層の片面あるいは両
面に高純度アルミニウム層をクラッドしたアルミニウム
クラッド材を、所要厚さに箔圧延して製造される。エッ
チング層には、エッチング特性の優れた99.8%以
上、好ましくは99.9%以上の高純度アルミニウムを
用いる。前記強化層の存在により箔強度が確保されるた
め、エッチング層の拡面率を増大させることが可能とな
り、高静電容量化が可能となる。
The aluminum foil for an electrolytic capacitor electrode according to any one of claims 3 to 5 is a foil in which an etching layer made of high-purity aluminum is clad on one or both sides of the reinforcing layer as a core material. These aluminum foils are the aluminum clad material according to claim 1 or 2, wherein one layer is composed of the reinforcing layer, and the high-purity aluminum layer clad on one or both sides of the reinforcing layer is reduced to a required thickness. It is manufactured by foil rolling. For the etching layer, high-purity aluminum having excellent etching characteristics of 99.8% or more, preferably 99.9% or more is used. Since the strength of the foil is ensured by the presence of the reinforcing layer, it is possible to increase the surface area of the etching layer and to increase the capacitance.

【0014】また、箔の強度を確保する上で、上で前記
エッチング層は箔表面において立方体方位占有率の高い
結晶組織であることが好ましい。エッチング面の立方体
方位の方位差が大きいと、エッチング時に箔表面の溶解
量が増し、箔厚が部分的に薄くなり、局部的な強度低下
を招来するからである。さらに、箔強度を維持できるこ
とで、拡面率の増大が可能となり、高静電容量化が可能
となる。このような過溶解現象は結晶粒単位で起こるた
め、立方体方位からのずれの大きい結晶粒はできるだけ
少ないことが望ましい。具体的には、箔表面において、
立方体方位{001}〈100〉からのずれ角が10°
以下の結晶粒が80%以上を占めることが必要であり、
特に95%以上占める時に顕著な効果が得られる。この
ような結晶組織は、中間焼鈍と軽圧下圧延の組合せや、
鋳塊の低温(400〜500℃)均熱処理、最終焼鈍時
の高温加熱(500〜580℃)によって得られる。
In order to secure the strength of the foil, it is preferable that the etching layer has a crystal structure having a high cubic orientation occupancy on the foil surface. This is because if the difference in cubic orientation of the etched surface is large, the amount of dissolution of the foil surface at the time of etching increases, the foil thickness becomes partially thin, and local strength is reduced. Further, by maintaining the foil strength, the area expansion ratio can be increased, and the capacitance can be increased. Since such an overdissolution phenomenon occurs in units of crystal grains, it is desirable that the number of crystal grains having a large deviation from the cubic orientation be as small as possible. Specifically, on the foil surface,
Angle of deviation from cubic orientation {001} <100> is 10 °
It is necessary that the following crystal grains occupy 80% or more,
In particular, a remarkable effect is obtained when occupying 95% or more. Such a crystal structure, the combination of intermediate annealing and light reduction rolling,
It is obtained by low-temperature (400 to 500 ° C) soaking heat treatment of the ingot and high-temperature heating (500 to 580 ° C) during final annealing.

【0015】また、この発明の電解コンデンサ電極用ア
ルミニウム箔は、箔の厚さや強化層(芯材)とエッチン
グ層との厚さの比率を限定するものではない。耐折強度
の向上が認められ且つ高静電容量を確保できる範囲とし
て、片面クラッドの場合で芯材比率が10〜60%、両
面クラッドの場合で5〜40%を推奨できる。
The aluminum foil for an electrolytic capacitor electrode of the present invention does not limit the thickness of the foil or the ratio of the thickness of the reinforcing layer (core material) to the thickness of the etching layer. As a range in which an improvement in bending strength is recognized and a high capacitance can be ensured, a core material ratio of 10 to 60% for single-sided cladding and 5 to 40% for double-sided cladding can be recommended.

【0016】[0016]

【実施例】次に、本発明のアルミニウムクラッド材およ
び電解コンデンサ電極用アルミニウム箔の具体的実施例
について詳述する。
Next, specific examples of the aluminum clad material and the aluminum foil for an electrode of an electrolytic capacitor of the present invention will be described in detail.

【0017】まず、表1に示すb〜fの5種類の組成の
アルミニウム鋳塊に対し、面削、熱間圧延、冷間圧延を
順次施して厚さ5mmの平板を作製した。一方、組成aの
アルミニウム鋳塊についても、同様に5mm、10mm、2
2.5mmの平板を作製した。そして、b〜f材を芯材,
a材をエッチング層として、表2に示す組み合わせと芯
材比率で芯材の片面または両面にエッチング層をクラッ
ドし、熱間圧延、冷間圧延、箔圧延を経て、それぞれ厚
さ0.1mmのアルミニウム箔を製作した。さらに、これ
らのアルミニウム箔を、Ar雰囲気中で550℃×10
時間、昇温速度50℃/時間という条件で最終焼鈍し
た。
First, aluminum ingots having five compositions of b to f shown in Table 1 were sequentially subjected to face milling, hot rolling and cold rolling to produce a flat plate having a thickness of 5 mm. On the other hand, for the aluminum ingot of the composition a,
A 2.5 mm flat plate was prepared. And b to f are core materials,
Using the material a as an etching layer, an etching layer is clad on one or both sides of the core material in a combination and a core material ratio shown in Table 2 and subjected to hot rolling, cold rolling, and foil rolling, each having a thickness of 0.1 mm. Aluminum foil was manufactured. Further, these aluminum foils were placed at 550 ° C. × 10 in an Ar atmosphere.
The final annealing was performed under the conditions of a time and a heating rate of 50 ° C./hour.

【0018】焼鈍箔について、結晶組織の立方体方位を
調べ、{001}〈100〉からのずれ角が10°以下
の結晶粒の占有率を調べた。結果を表2に示す。
With respect to the annealed foil, the cubic orientation of the crystal structure was examined, and the occupation ratio of crystal grains having a deviation angle of 10 ° or less from {001} <100> was examined. Table 2 shows the results.

【0019】次に、製作した各アルミニウム箔を前処理
をすることなく、次の条件でエッチングを施した。
Next, each of the manufactured aluminum foils was etched under the following conditions without any pretreatment.

【0020】 一次エッチング:液組成5%HCl+10%H 2
4、液温75℃、電流密度D.C.20A/dm2
時間100sec 二次エッチング:液組成5%HCl、液温80℃、電流
密度D.C.5A/dm2 ,時間8min エッチング箔について、耐折強度を測定し、エッチング
層のみからなる比較例1の耐折強度を100%として相
対的に評価した。また、化成処理後、静電容量を測定
し、比較例1を100%として相対的に評価した。これ
らの結果を表2に示す。
Primary etching: liquid composition 5% HCl + 10% H 2 S
O 4 , liquid temperature 75 ° C, current density C. 20A / dm 2 ,
Time 100 sec Secondary etching: liquid composition 5% HCl, liquid temperature 80 ° C., current density C. 5A / dm 2 For 8 minutes, the bending strength of the etched foil was measured, and the bending strength of Comparative Example 1 consisting of only the etching layer was relatively evaluated as 100%. Further, after the chemical conversion treatment, the capacitance was measured, and Comparative Example 1 was relatively evaluated as 100%. Table 2 shows the results.

【0021】[0021]

【表1】 [Table 1]

【0022】[0022]

【表2】 [Table 2]

【0023】表2の結果より、本発明のアルミニウム箔
は優れた静電容量と耐折強度とを兼ね備えるものであっ
た。これに対して、エッチング層のみからなる比較例1
は耐折強度が低く、また、強化層に2000ppmのS
cを含有する比較例6,11は耐折強度が優れているも
のの、静電容量にさらなる向上は認められずコスト的に
も不利である。
From the results shown in Table 2, it was found that the aluminum foil of the present invention has both excellent capacitance and bending strength. On the other hand, Comparative Example 1 consisting of only an etching layer
Has low bending strength, and 2,000 ppm of S
Comparative Examples 6 and 11 containing c have excellent bending strength, but are not disadvantageous in terms of cost because no further improvement in capacitance is observed.

【0024】[0024]

【発明の効果】以上の説明したように、この発明のアル
ミニウムクラッド材は、少なくとも一層に、Al純度を
99.8wt%以上とするとともに、5ppm以上200
0ppm未満のScを含有し、残部が不可避不純物から
なる強化層、あるいは、Al純度を99.8wt%以上と
するとともに、5ppm以上2000ppm未満のS
c、5〜60ppmのFe、5〜80ppmのSiおよ
び5〜150ppmのCuを含有し、残部が不可避不純
物からなる強化層がクラッドされてなるため、クラッド
材の強度が高い。
As described above, the aluminum clad material of the present invention has an Al purity of at least 99.8% by weight and a content of at least 5 ppm of 200 ppm.
A reinforcing layer containing less than 0 ppm of Sc and the balance being unavoidable impurities, or having an Al purity of at least 99.8 wt% and an S content of at least 5 ppm and less than 2,000 ppm.
The strength of the clad material is high because the reinforcing layer containing c, 5 to 60 ppm of Fe, 5 to 80 ppm of Si, and 5 to 150 ppm of Cu and the remainder is made of unavoidable impurities is clad.

【0025】また、この発明の電解コンデンサ電極用ア
ルミニウム箔は、前記強化層の少なくとも片面に、Al
純度が99.8%以上の高純度アルミニウムからなるエ
ッチング層がクラッドされてなるため、箔強度が向上
し、且つ箔強度の向上により、拡面率の増大が可能とな
り、高静電容量化が可能となる。従って、エッチング特
性はエッチング層により確保した上で、箔としての耐折
強度や伸びは微量のScが添加された強化層により確保
することによりさらなる拡面率の向上が可能となり、優
れた静電容量と強度の両者を兼ね備える。
Further, the aluminum foil for an electrolytic capacitor electrode of the present invention is characterized in that at least one surface of the reinforcing layer has an aluminum foil.
Since the etching layer made of high-purity aluminum having a purity of 99.8% or more is clad, the foil strength is improved, and the enhancement of the foil strength enables an increase in the area coverage, thereby increasing the capacitance. It becomes possible. Therefore, the etching characteristics are secured by the etching layer, and the bending strength and elongation as a foil are secured by the reinforcing layer to which a small amount of Sc is added. It has both capacity and strength.

【0026】さらに、前記エッチング層が、箔表面にお
いて、立方体方位{001}〈100〉からのずれ角が
10°以下の結晶粒が80%以上を占める場合は、エッ
チングによる過溶解を阻止されて箔強度の低下が抑制さ
れ、さらなる拡面率の増大が可能となり、高静電容量化
が可能となる。
Further, when the etching layer occupies 80% or more of crystal grains having a deviation angle of 10 ° or less from the cubic orientation {001} <100> on the foil surface, overdissolution due to etching is prevented. A decrease in foil strength is suppressed, and the area enlargement ratio can be further increased, so that a higher capacitance can be achieved.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも一層に、Al純度を99.8
wt%以上とするとともに、5ppm以上2000ppm
未満のScを含有し、残部が不可避不純物からなる強化
層がクラッドされてなることを特徴とするアルミニウム
クラッド材。
(1) at least one layer having an Al purity of 99.8;
not less than wt% and 5 ppm or more and 2000 ppm
An aluminum clad material comprising: a clad reinforcing layer containing less than Sc and a balance of inevitable impurities.
【請求項2】 少なくとも一層に、Al純度を99.8
wt%以上とするとともに、5ppm以上2000ppm
未満のSc、5〜60ppmのFe、5〜80ppmの
Siおよび5〜150ppmのCuを含有し、残部が不
可避不純物からなる強化層がクラッドされてなることを
特徴とするアルミニウムクラッド材。
2. At least one layer having an Al purity of 99.8.
not less than wt% and 5 ppm or more and 2000 ppm
An aluminum clad material comprising less than Sc, 5 to 60 ppm of Fe, 5 to 80 ppm of Si and 5 to 150 ppm of Cu, the remainder being clad with a reinforcing layer composed of unavoidable impurities.
【請求項3】 Al純度を99.8wt%以上とするとと
もに、5ppm以上2000ppm未満のScを含有
し、残部が不可避不純物からなる強化層の少なくとも片
面に、Al純度が99.8%以上の高純度アルミニウム
からなるエッチング層がクラッドされてなることを特徴
とする電解コンデンサ電極用アルミニウム箔。
3. An Al purity of at least 99.8% by weight, containing at least 5 ppm to less than 2,000 ppm of Sc, and a balance of at least one surface of a reinforcing layer composed of unavoidable impurities having an Al purity of at least 99.8%. An aluminum foil for an electrode of an electrolytic capacitor, characterized in that an etching layer made of pure aluminum is clad.
【請求項4】 Al純度を99.8wt%以上とするとと
もに、5ppm以上2000ppm未満のSc、5〜6
0ppmのFe、5〜80ppmのSiおよび5〜15
0ppmのCuを含有し、残部が不可避不純物からなる
強化層の少なくとも片面に、Al純度が99.8%以上
の高純度アルミニウムからなるエッチング層がクラッド
されてなることを特徴とする電解コンデンサ電極用アル
ミニウム箔。
4. An aluminum alloy having an Al purity of at least 99.8 wt% and a Sc, 5 to 6 ppm of 5 ppm to less than 2000 ppm.
0 ppm Fe, 5-80 ppm Si and 5-15
An electrolytic capacitor electrode characterized in that an etching layer made of high-purity aluminum having an Al purity of 99.8% or more is clad on at least one surface of a reinforcing layer containing 0 ppm of Cu and the remainder made of unavoidable impurities. Aluminum foil.
【請求項5】 前記エッチング層は、箔表面において、
立方体方位{001}〈100〉からのずれ角が10°
以下の結晶粒が80%以上を占める請求項4または5に
記載の電解コンデンサ電極用アルミニウム箔。
5. The etching layer according to claim 1, wherein the etching layer comprises:
Angle of deviation from cubic orientation {001} <100> is 10 °
The aluminum foil for an electrolytic capacitor electrode according to claim 4 or 5, wherein the following crystal grains occupy 80% or more.
JP10256190A 1998-09-10 1998-09-10 Aluminum-clad material and aluminum foil for electrolytic capacitor electrode Pending JP2000091164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10256190A JP2000091164A (en) 1998-09-10 1998-09-10 Aluminum-clad material and aluminum foil for electrolytic capacitor electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10256190A JP2000091164A (en) 1998-09-10 1998-09-10 Aluminum-clad material and aluminum foil for electrolytic capacitor electrode

Publications (1)

Publication Number Publication Date
JP2000091164A true JP2000091164A (en) 2000-03-31

Family

ID=17289169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10256190A Pending JP2000091164A (en) 1998-09-10 1998-09-10 Aluminum-clad material and aluminum foil for electrolytic capacitor electrode

Country Status (1)

Country Link
JP (1) JP2000091164A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006336058A (en) * 2005-05-31 2006-12-14 Showa Denko Kk Aluminum material for electrolytic capacitor electrode, method for manufacturing aluminum material for electrolytic capacitor, anode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor
JP2012062576A (en) * 2011-10-31 2012-03-29 Showa Denko Kk Aluminum material for electrolytic capacitor electrode, method for production thereof, positive electrode material for aluminum electrolytic capacitors, and aluminum electrolytic capacitor
JP2020026119A (en) * 2018-08-17 2020-02-20 住友化学株式会社 Aluminum clad material and method for producing the same
WO2022004021A1 (en) * 2020-06-29 2022-01-06 Tdk株式会社 Thin film capacitor and electronic circuit board equipped with same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006336058A (en) * 2005-05-31 2006-12-14 Showa Denko Kk Aluminum material for electrolytic capacitor electrode, method for manufacturing aluminum material for electrolytic capacitor, anode material for aluminum electrolytic capacitor, and aluminum electrolytic capacitor
JP2012062576A (en) * 2011-10-31 2012-03-29 Showa Denko Kk Aluminum material for electrolytic capacitor electrode, method for production thereof, positive electrode material for aluminum electrolytic capacitors, and aluminum electrolytic capacitor
JP2020026119A (en) * 2018-08-17 2020-02-20 住友化学株式会社 Aluminum clad material and method for producing the same
JP7179528B2 (en) 2018-08-17 2022-11-29 住友化学株式会社 Aluminum clad material and its manufacturing method
WO2022004021A1 (en) * 2020-06-29 2022-01-06 Tdk株式会社 Thin film capacitor and electronic circuit board equipped with same

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