JP2000090218A - Ic carrier with planar frame and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC carrier with planar frame and production thereof with which an IC carrier can be held on a planar frame without providing any bridge or lining film. SOLUTION: A planar frame 13 is composed of a core sheet 21 and over sheets 22 and 23 and an opening part 30 is formed on the planar frame 13. The over sheet 22 is left at the opening part 30 of the planar frame 13, and an IC carrier 11 is packaged in this opening part 30. The IC carrier 11 is adhered and held by the over sheet 22 left in the opening part 30.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small-sized IC carrier on which an IC module is mounted, an IC carrier with a plate-shaped frame provided with a plate-shaped frame, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIGS. 11A and 11B are diagrams illustrating a conventional IC carrier and a method of using the same.

As shown in FIG. 11A, an IC carrier 41 is mounted on a small base material (about 15 × 25 mm) by a CPU.
Module 42 with integrated memory and electrodes
, For example, a mobile phone subscriber identification card SIM (SUBSCRIBER IDENTITY)
MODULE) and the like.

[0004] If a user obtains a subscriber identification tag corresponding to the telephone subscription right, the user can purchase it according to the use of the mobile phone 50 of the common specification. The carrier 41) is used.

[0005] However, since the IC carrier 41 is not widely used and its use is limited, constructing a dedicated factory for mass production leads to an increase in cost. When used as the above-mentioned subscriber identification tag, the mail is put in an envelope and mailed, so that the enclosing and sealing work is difficult. In addition, the subscriber who has received it has a problem that it is erroneously handled before being attached to the mobile phone 50, and is damaged or lost.

[0006] For this purpose, an IC card 40 is manufactured using conventional equipment, and as shown in FIG.
Slit 4 for removal in plate frame 43 of C card 40
It has been proposed that the IC carrier 41 be formed while leaving a plurality of bridge portions 45, and only the IC carrier 41 be removed. In this way, not only the card manufacturing and inspection equipment but also the conventional IC card issuing / shipping system can be used as it is.

[0007]

However, in the conventional IC carrier 41, when the IC carrier is detached from the IC card base, a load such as bending or torsion is applied to the IC module 42 to prevent the IC module 42 from being broken or popped out. May cause. Further, when detaching from the plate-shaped frame 43, there is a problem that the bridge portion remains as a residual protrusion and is difficult to enter the mounting portion of the mobile phone 50, and conversely, there is a problem that a broken portion is generated on the IC carrier side. .

FIGS. 12A and 12B are diagrams for explaining another example of a conventional IC carrier.

The applicant's earlier application (Japanese Patent Application Laid-Open No. 7-276)
870) has a plate-shaped frame 43 having an opening as shown in FIGS. 12A and 12B, and an adhesive layer 46a on one surface as shown in FIG. 12B. An IC card 40 having a backing film 46 attached to the back surface of the plate-shaped frame 43 via the adhesive layer 46a has been proposed. The IC carrier 41 is fixed and held in the opening by the adhesive layer 46a of the backing film 46.

However, also in this case, since a step of specially providing the backing film 46 on the back surface of the plate-like frame 43 is required, the cost increases, and There is a problem that it is difficult to apply the film smoothly so as not to include an air layer.

The present invention has been made in view of such a point, and has a plate-like frame capable of appropriately holding an IC carrier on a plate-like frame without providing a bridge or a backing film. An object is to provide an IC carrier and a method for manufacturing the same.

[0012]

SUMMARY OF THE INVENTION The present invention relates to a plate-shaped sheet having a core sheet, an oversheet provided on at least one surface of the core sheet, and an opening formed by leaving the oversheet. An IC carrier with a plate-shaped frame, comprising: a frame; and an IC carrier having an IC module attached to an opening of the plate-shaped frame and held by an oversheet remaining in the opening. And a core sheet, an oversheet provided on at least one surface of the core sheet, a plate-shaped frame having an opening formed by leaving the oversheet, and an opening in the plate-shaped frame. And an IC carrier having an IC module attached and held by an oversheet remaining in the opening. At least one surface is laminated with an oversheet and the core sheet and the oversheet are fused and pressed; the core sheet is counterbored to form a counterbore recess; The step of forming the peripheral slit to be formed and the IC in the counterbore recess.
And a step of mounting a module.

According to the IC carrier with the plate-shaped frame of the present invention, since the IC carrier is temporarily detachably attached to the oversheet and held in the plate-shaped frame having the opening, the IC carrier is connected to the plate-shaped frame. It can be easily removed and used when needed from the body. In addition, the removed IC
As in the case where the carrier is supported by the plate-shaped frame via the bridge portion as in the conventional case, the edge portion does not remain or break due to the breakage of the bridge portion, and the carrier is supported by the adhesive film. As described above, no special material is used or another process is required.

Further, according to the method for manufacturing an IC carrier with a plate-shaped frame of the present invention, such an IC carrier with a plate-shaped frame can be easily and inexpensively manufactured by using conventional IC card equipment. Can be.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment of IC Carrier with Plate Frame
Embodiment Figure 1 of the embodiment (A) (B) (C ), FIGS. 5 and 6 are diagrams showing a first embodiment of the sheet-framed IC carrier according to the present invention. FIG. 1A is a plan view thereof, and FIG.
1A is a side sectional view taken along the line AA, and FIG. 1C is a rear view.

As shown in FIGS. 1A, 1B, and 1C, an IC carrier 10 with a plate-like frame includes a core sheet 21 and oversheets 22, 2 provided on both sides of the core sheet 21.
3 and a plate-shaped frame 13 provided with an opening 30 and an IC carrier 11 mounted in the opening 30 of the plate-shaped frame 13 and having the IC module 12 mounted thereon. One of the oversheets, for example, the oversheet 22, remains in the opening 30 of the plate-shaped frame 13, and the IC carrier 11 in the opening 30
2 are held by bonding.

The core sheet 21 and the oversheet 22 of the plate-shaped frame 13 are made of a resin sheet such as a vinyl chloride resin, and the IC carrier 11 is held by the oversheet 22 on the IC module 12 side. Also core sheet 2
1 and IC module 12 in overseat 23
Peripheral slit 1 which forms the peripheral edge of IC carrier 11 on the outer periphery of
3a are formed. The peripheral slit 13a is shown in FIG.
This is illustrated by a dotted line in FIG. 1A and by a solid line in FIG. The plate frame 13 is provided with a display 18a, the IC carrier 11 is provided with a display 18b, and the plate frame 13 is provided with a sign panel 19. Further, on the surface of the IC carrier 11 on the IC module 12 side, a fusion inhibition layer 14 for inhibiting fusion with the oversheet 22 is provided.

Next, the IC carrier 11 will be described in detail with reference to FIGS.

FIG. 5A shows the surface of an IC carrier.
FIG. 5B shows the back surface. IC carrier 11
Is vertical Y1 (about 15.00 mm) × as shown in FIG.
Resin base 11a about horizontal X1 (about 25.00 mm)
And the vertical Y2 (about 10.6 mm) mounted on the base 11a
× IC module 12 about horizontal X2 (about 12.0 mm)
And A cutout 11b is formed in the base 11a for positioning when the base 11a is mounted on a target device. The length Z of the cutout 11b is about 3.00 mm.

FIG. 6 shows another IC carrier 1 according to the present invention.
FIG. 2 is a plan view showing details of a first example. The IC carrier 11 includes a base 11a and an IC module 12 mounted on the base 11a.
Consists of Eight IC modules 12 (C1 to C
8) The external terminals 12c are formed of contact portions, and each external terminal 12c has a substantially square shape. Further, the position of the external terminal 12c is preferably arranged at a position conforming to ISO (terminal position of an IC module of an IC card conforming to ISO). That is, in FIG. 6, from the left end of the IC carrier 11, a is 4.0 mm at the maximum, b is 6.0 mm at the minimum, c is 11.62 mm at the maximum, and d is 13.2 at the minimum.
62 mm, e is 2.7 max. From the upper end of IC carrier 11
5mm, f is 4.45mm minimum, g is 5.29m maximum
m and h are minimum 6.99 mm, i is maximum 7.83 mm, j
Is a minimum of 9.53 mm, k is a maximum of 10.37 mm, and l is a minimum of 12.07 mm. In FIG. 6, the distance from the edge of the plate-shaped frame 13 to the IC carrier 11 is o = 1.
6.48 mm, and q becomes 6.25 mm. Furthermore, IC
The shape of the carrier 11 is such that p is 15 ± 0.1 mm and r is 25
± 0.1 mm. The size of the notches m and n is 3 ± 0.1 mm.

Next, the material of each part will be described. The plate frame 13 and the core sheet 21 of the IC carrier 11 are not limited to vinyl chloride, but may be PBT, acryl, polymethyl methacrylate, polycarbonate, acrylonitrile-butadiene-styrene copolymer (ABS) resin, or a resin of these resins. Various hard resins such as a polymer alloy resin in combination can be used. When an acrylic resin or a polycarbonate resin is used, the cutting workability is good and the spot facing can be easily and accurately performed. In the case of a vinyl chloride resin, generally, a hard resin not filled with a plasticizer or added in a small amount (1 to 5%) is used.

The material and thickness of the oversheets 22 and 23 are preferably 80% or more as measured by total light transmittance. Those having a high light transmittance are transparent and can be seen without impairing the color tone and aesthetic appearance of the printed pattern. In such a sheet, polyvinyl chloride, polycarbonate, polymethyl methacrylate, polyethylene terephthalate, polybutylene terephthalate, cellulose acetate, and the like, as long as the heat sealability with the core sheet 21 is good.
It is possible to use nylon, saponified ethylene / vinyl acetate copolymer, polypropylene, polyvinyl butyral, acrylonitrile-butadiene-styrene copolymer resin, methyl methacrylate-butadiene-styrene copolymer resin or a polymer alloy resin thereof. it can.

The printing ink vehicle for forming the fusion inhibiting layer 14 is preferably one that is incompatible with the core sheet 21 and the oversheets 22 and 23 when heated. That is, vinyl chloride and other vinyl-based materials can be avoided, and fiber-based materials such as nitrified cotton and ethyl cellulose can be used for this purpose. Further, when a solvent is contained, the material of the core sheet 21 is dissolved, so that fusion is easily caused. Therefore, it is also preferable to use a printing ink of a type that uses a photo-curing or thermosetting monomer and does not contain a solvent. As the photocurable ink, a resin monomer modified with (meth) acrylic acid such as urethane (meth) acrylate, epoxy (meth) acrylate, polyester (meth) acrylate, and the like, a reactive diluent, a photocuring initiator Can be used with.

Second Embodiment of IC Carrier with Plate Frame
FIG . 2A is a plan view showing a second embodiment of an IC carrier with a plate-shaped frame according to the present invention, and FIG.
2A is a cross-sectional view taken along line AA, and FIG. 2C is a rear view thereof.

In the second embodiment shown in FIGS. 2A, 2B, and 2C, the IC carrier is mounted in the opening 30 of the plate frame 13 and the IC carrier is mounted on the core sheet 21.
The only difference is that it is adhesively held by the lower oversheet 23, and the others are the first shown in FIGS. 1, 5 and 6.
This is substantially the same as the embodiment. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted.

In the present embodiment, the IC carrier 10 with a plate-like frame includes an IC carrier 11 and a plate-like frame 13, and the plate-like frame 13 is made of a resin sheet such as a vinyl chloride resin. The carrier 11 is held by an oversheet 23 on the opposite side of the IC module 12. A peripheral slit 13a is formed in the peripheral edge of the IC carrier 11. The peripheral slit 13a is shown by a solid line in FIG. 2A, and is shown by a dotted line on the back surface of FIG. 2C.

The IC module 1 of the IC carrier 11
On the surface opposite to 2, a fusion inhibition layer 14 for inhibiting fusion with the oversheet 23 is provided.

Third Embodiment of IC Carrier with Plate Frame
Embodiment Next, a third embodiment of the IC carrier with a plate-like frame will be described with reference to FIG.

The third embodiment shown in FIG. 3 is the same as the first embodiment shown in FIGS. 1, 5 and 6 except that the configuration of the IC carrier 11 is different. In the third embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals, and detailed description is omitted.

In FIG. 3, the plate-like frame 13 has a core sheet 21 composed of an upper core sheet 21a and a lower core sheet 21b, and oversheets 22 and 23. By counterbore processing with
A recess 17 is formed. The IC module 12 of the IC carrier 11 is bonded in a recess 17 formed by a counterbore machine, and an adhesive 31 is provided between the counterbore recess 17 and the IC carrier 12.
It is fixed at. The hollows 17a, 17
The b is formed and acts to absorb the excess adhesive 31 and relieve bending stress. The IC module 12 is mainly adhered to the projection 17 c in the recess 17. I
The C module 12 has, for example, an IC chip 12a mounted on a printed circuit board 12b, and the IC chip 12
can be formed by molding a. I
The surface of the C module 12 is an external terminal 12c.

In the present embodiment, the peripheral slit 13a which forms the peripheral edge of the IC carrier 11 is formed by cutting a counterbore from the surface opposite to the IC module 12 side, and the IC carrier 11 is held by the oversheet 22. Have been. Also, the oversheet 22 and the IC carrier 1
1, a fusion inhibiting layer 14 is formed to prevent complete fusion between the IC carrier 11 and the oversheet 22, and the IC carrier 11 can be easily peeled and removed from this portion. .

In this case, the fusion inhibiting layer 14 is provided on the surface of the upper core sheet 21a constituting the IC carrier 11. Further, printed layers 15 and 16 are provided on the front surface of the core sheet 21 and the back surface of the oversheet 23, respectively.

Fourth Embodiment of IC Carrier with Plate Frame
Next, a fourth embodiment of an IC carrier with a plate-like frame will be described with reference to FIG. In the fourth embodiment shown in FIG. 4, the IC carrier 11 is mounted in the opening 30 of the plate-shaped frame 13 and the IC carrier 11 is held by the oversheet 23 below the core sheet 21. Are different from those of the third embodiment shown in FIG.

In the fourth embodiment, the same parts as those in the third embodiment are denoted by the same reference numerals, and detailed description is omitted.

In FIG. 4, a peripheral slit 13 a, which forms a peripheral edge of the IC carrier 11, is cut and formed by a counterbore from the IC module 12 side, and the IC carrier 11 is held by an oversheet 23. Further, between the oversheet 23 and the IC carrier 11, a fusion inhibiting layer 14 is provided.
Is formed to prevent complete fusion between the IC carrier 11 and the oversheet 23, and to allow the IC carrier 11 to be easily peeled off from this portion and removed.

In this case, the fusion inhibiting layer 14 is provided on the surface of the lower core sheet 21b constituting the IC carrier 11.

In any of the third and fourth embodiments, the IC carrier 11 can be easily removed from the plate frame 11, but in the case of the fourth embodiment, in the case of the third embodiment. Since the IC carrier 11 is in contact with the oversheet 23 in a larger area, the IC carrier 11 can be strongly held. Further, since the oversheet 22 remains on the IC module 12 side even after the IC carrier 11 is removed, the appearance of the surface of the IC carrier 11 can be improved.

Manufacturing Process of IC Carrier with Plate Frame
Embodiment 7 Embodiment fine usage is a diagram showing a manufacturing process of the sheet-framed IC carrier according to the present invention.

First, the upper core sheet 21 serving as the front side and the back side according to a normal plastic card manufacturing method.
a and core sheet 21 comprising lower core sheet 21b
And the upper and lower oversheets 22 and 23 are laminated and pressed. The core sheet 21 may be constituted by a single sheet if necessary, and the upper and lower oversheets 22 and 23 may be omitted. A normal decorative print layer 15 is provided on the outer surface of the core sheet 21 by silk screen printing or offset printing as appropriate (S1, S2).
Further, the oversheets 22 and 23 are prepared by being cut to a required size (S3).

Further, the fusion inhibiting layer 14 is provided on the core sheet 21 by printing or other means (S4, S4).
5). As described above, the fusion inhibiting layer 14 is
1 to form a peeled portion between the oversheets 22 and 23. In the case of the third embodiment shown in FIG. 3, the fusion inhibiting layer 14 is provided on the surface of the upper core sheet 21a which contacts the oversheet 22 on the IC module 12 side in the case of the fourth embodiment shown in FIG. , Lower core sheet 21b
Is formed on the side of the surface that comes into contact with the oversheet 23. Therefore, S4 and S5 are optional to perform either one according to the specification. The fusion inhibiting layer 14 can be formed by a method other than offset printing. However, the function of the fusion inhibiting layer 14 is freely adjusted by the area ratio of the halftone dots (dots), and the fusion inhibiting layer 14 is thinned. In terms of forming into layers, offset printing is advantageous. Although the possibility of implementation is small, the same effect can be obtained in the case of a halftone letterpress or halftone gravure. In the case of silk screen printing and ordinary coating, it is considered that the area ratio is difficult to control.

In the fusion inhibiting layer 14, the area ratio of the halftone dots constituting the fusion inhibiting layer 14 which can be easily peeled is 60 to 80.
% Is appropriate. Also, if you want to have some fusion,
A dot area ratio of 40 to 60% is appropriate.
This is not preferable because there is a possibility that the IC carrier 11 may be damaged due to strong fusion with the IC carrier 11. However, the degree of fusion inhibition is determined by the characteristics of the ink used and the pressing conditions to be performed later, and the over sheets 22 and 23 and the core sheet 21
The above-mentioned halftone dot area percentage is not uniformly defined because of the relationship with the material.

The fusion inhibiting layer 14 can increase the dot area% at the periphery of the IC carrier 11 and can decrease the dot area at the center of the IC carrier 11. Usually I
When peeling the C carrier 11, it is conceivable that a fingertip force is applied to the peripheral portion and the finger is applied to the edge portion of the IC carrier 11 which has been partially peeled to peel. Therefore, it is not necessary to keep the IC carrier 11 in a state where the IC carrier 11 can be easily peeled off at a portion other than the peripheral portion, so that the dot area is reduced in the central portion of the IC carrier 11. IC carrier 1
If the adhesiveness of the entire 1 to the oversheets 22 and 23 is made extremely weak, there is a problem that the IC carrier 11 may unexpectedly fall off and be lost.

Next, the state of the formation of the halftone dots of the fusion inhibiting layer 14 will be described with reference to FIGS. 8A, 8B and 8C. Here, FIG. 8A shows a case where the fusion inhibiting layer 14 is printed on the IC module 12 side of the IC carrier 11, and FIG. 8B shows a case where the fusion inhibiting layer 14 is printed on the back surface. It can be formed similarly. 8A and 8B, a halftone dot 1 with a large halftone dot area ratio with a large fusion-inhibiting effect provided on the periphery of the IC carrier 11 is included in the circle enlarged in FIG.
4a and a halftone dot 14b provided at the center of the IC carrier 11 and having a small area ratio.

In this case, the IC carrier 11 shown in FIG. 8A is held by the oversheet 22 (FIG. 1).
(B), and the IC carrier 11 shown in FIG. 8B is held by the oversheet 23 (see FIG. 2B).

As shown in FIG. 8C, the surface of the IC carrier 11 on the IC module 12 side is divided into two regions, and the fusion inhibiting layer 14 is formed on one region 33 on the IC module 12 side. Without providing at all, the fusion inhibiting layer 14 may be provided only in the other region 34. The IC carrier 11 shown in FIG. 8C is the same as the IC carrier 1 shown in FIG.
This roughly corresponds to 1. In the IC carrier 11 shown in FIG. 8C, by providing the fusion inhibiting layer 14 only in the other region 34, the IC carrier 1 is removed from the other region 34.
1 can be easily separated from the plate-shaped frame 13.

Next, as shown in FIG. 7, in order to laminate and fuse the upper core sheet 21a, the lower core sheet 21b, and the oversheets 22, 23, each of the sheets 21a is sandwiched between mirror plates. , 21b, 22, 23 are introduced into a press machine, and the sheets 21a, 21b, 22, 23 are fused together (S6). In this case, the fusing press is applied to each sheet 2
When 1a, 21b, 22, and 23 are made of a vinyl chloride resin, the heating is performed at 150 ° C. for about 15 minutes.

Thereafter, the fused sheets 21a, 21
The b, 22, and 23 are punched into a card size (S7), and a transfer foil for the sign panel 19 is transferred to a predetermined portion of the card (S8). The sign panel 19 is a panel for a card user to make his / her signature, and is well known in the form of a transfer foil made of a material layer having good writability. Then
The indications 18a and 18b such as the manufacturing number, the issuing company information, and the necessary barcode are thermally transferred using a thermal transfer ribbon or the like (S9). In the process of forming the indications 18a and 18b, printing can be performed by laser marking.

Next, a recess 17 for mounting the IC module 12 is formed on the card by a counterbore (S1).
0). At this time, in the embodiment shown in FIG. 3, the concave portion 17 is cut deeper by the thickness of the oversheet 22 on the surface than in the embodiment shown in FIG.
Is adjusted so that the external terminal 12c does not protrude from the surface of the IC carrier 11. After the recess 17 is formed by spot facing, a peripheral slit 13 a that forms the peripheral edge of the IC carrier 11 is formed on the outer periphery of the IC module 12. In this case, in the first and third embodiments shown in FIGS.
The spot facing is performed from the side opposite to the C module 12, and in the second and fourth embodiments shown in FIGS. 2 and 4, the spot facing is performed from the IC module 12 side.

Such a counterbore is adjusted so that the core sheet 21 is completely cut and the oversheets 22 and 23 are not cut (a part of the thickness of the oversheets 22 and 23 may be cut). (S11). This counterbore process is performed by punching with a core sheet 2
1 can be completely cut and the oversheets 22 and 23 can be prevented from being cut by a so-called half-punching method.

Next, a thermosetting adhesive 31 is injected into the mounting recess 17 of the IC module 12 and the IC module 1
Then, a module sealing step of mounting the module 2 and pressing it with a hot plate is performed (S12). Thus, the sheet 21 for the IC carrier 11 punched into a card size by fusion pressing.
The IC module 12 is mounted on a, 21b, 22, and 23. The bonding of the IC module 12 may be performed by using a double-sided adhesive seal or some of them together with other adhesives. Next, I
An IC inspection such as C characteristics is performed (S13). Then, an issuance processing step of writing data is performed according to the use of the IC carrier (S14). The issuance process specifically refers to an operation of inputting a subscriber's telephone number, subscriber's ID number, secret number, and the like into a memory. After that, the IC carrier with the frame is inserted into the backing with the slit, and a packing and shipping process of enclosing and sealing in an envelope is performed (S15).

In the above steps, the printing of the number or the like (S9) may be performed after the module seal (S12), and the IC module counterbore (S10) and the IC carrier shape counterbore (S11) may be printed in order. May change.

The method of manufacturing the IC carrier 10 with a plate-shaped frame according to the present invention is the same as that of the conventional IC card except for printing of the fusion inhibiting layer 14 and counterbore of the peripheral slit 13a which forms the peripheral edge of the IC carrier 11. Are the same as those in the manufacturing process. In addition, since the printing process of the fusion-inhibiting layer 14 and the counterboring process of the peripheral slit 13a can be performed by conventional IC card manufacturing equipment, various inspection processes for the IC carrier 11 and packing such as enclosing work in an envelope are performed. The shipping process can be performed using the IC card manufacturing process as it is, and the processing accuracy can be sufficiently ensured.

Generally, the thickness of cards such as the plate-shaped frame 13 is specified to be 0.76 mm ± 0.08 mm.
With respect to the plate-like frame 13 having such a thickness, the peripheral slit 1
The width of 3a is preferably from 0.1 to 3.0 mm.
If the peripheral edge slit 13a is 3.0 mm or more, unexpected peeling may occur, and there is a problem in appearance. If the peripheral edge slit 13a is 0.1 mm or less, the counterbore drill becomes too thin and the counterbore process becomes difficult.
When the width of the peripheral slit 13a is 0.5 mm or less, it is desirable to perform punching by pressing, which is more efficient than performing counterbore.

Next, a method of using the IC carrier with a plate-shaped frame will be described with reference to FIGS.

FIGS. 9A and 9B show the overseat 22.
FIG. 5 is a diagram showing a state in which the IC carrier 11 held in the frame is peeled off from the plate-shaped frame 13. In this case, the fusion inhibiting layer 14 is formed on the IC module 12 side of the IC carrier 11, and the oversheet 22 remains on the plate frame 13 side, and
The oversheet 22 does not remain on the surface of the C carrier 11. Therefore, when printing the display 18b of a number or the like, it is necessary to perform printing on the surface of the IC carrier 11 opposite to the IC module 12.

FIGS. 10A and 10B show the oversheet 2
FIG. 3 is a diagram showing a situation in which the IC carrier 11 held by a third member 3 is peeled off from a plate-shaped frame 13. In this case, the fusion inhibiting layer 14
Is formed on the side of the IC carrier 11 opposite to the IC module 12, the oversheet 23 remains on the plate-like frame 13 side, and the oversheet 23 is formed on the back surface of the IC carrier 11.
Does not remain. Therefore, a display 18b such as a number can be displayed on the surface of the IC carrier 11 on the IC module 12 side.

As is apparent from FIGS. 9 and 10, in each case, the IC carrier 11 is removed from the plate-shaped frame 13.
Is removed, the base 11 of the IC carrier 11 is removed.
a and the external terminals 12c of the IC module 12 are flush with each other.

[0058]

EXAMPLES Next, specific examples of the present invention will be described. Example 1 An IC carrier 10 with a plate-shaped frame shown in FIG. 3 was manufactured based on the manufacturing process of FIG. Hereinafter, description will be made with reference to FIG.

First, a titanium alloy (5 wt.%) Was added to a polymer alloy (heat resistant temperature: 120 ° C.) obtained by mixing an acrylonitrile-butadiene-styrene copolymer (ABS) resin (50 wt. Parts) and a polycarbonate resin (50 wt. Parts). Part), and the mixture is blended with T.D.
A core sheet 21 composed of a 35 mm thick white upper core sheet 21a and a lower core sheet 21b was formed. The core sheet 21 is formed from such a polymer alloy of a resin because the cutability at the time of spot facing is improved, and the sheet formability and various physical properties required for the plate-shaped frame 13 are ensured. This is because the heat resistance is particularly improved on the assumption that 11 is exposed to a severe environment such as being left in a car under the hot summer sun.

On the core sheet 21, six color printing layers 15 were formed on required portions of the upper core sheet 21a by silk screen printing (S2). Further, a one-color printing layer 15 was formed on a required portion of the lower core sheet 21b by silk screen printing (S1). Next, only the portion corresponding to the IC carrier 11 of the upper core sheet 21a was subjected to transparent offset printing using a UV curable ink ("Carton MOP Varnish" manufactured by The Inktech Co., Ltd.) (S5). . This offset printing part is
It becomes the fusion inhibiting layer 14 of the IC carrier 11. At this time, the fusion inhibition layer 14 has a dot area ratio of 40% in another region, for example, a central portion of the IC carrier 11 such that the dot area ratio is 70% in a region having a width of 2 mm around the IC carrier 11. %.

On the other hand, as the oversheets 22 and 23, polycarbonate resin films having a thickness of 50 μm were used. The oversheets 22 and 23 are also cut into the same size as the core sheet 21, and then inserted into a fusing press between the mirror plates, and fusion-pressed at 160 ° C., 20 kgf / cm ² , and 10 minutes (S6). ), Each sheet 21a, 21
b, 22, 23 were fused. In addition, since the resin mainly composed of polycarbonate has a high melting point, the temperature of the fusing press was set to be higher than the usual press temperature of 150 ° C. for hard PVC.

Next, the fused sheets 21a, 21b, 2
After stamping the cards 2 and 23 into a card size, the transfer foil for the sign panel 19 was transferred to a predetermined portion of each card (S
8). This is a panel for card users to sign their own. Next, information (display) 18a and 18b such as a manufacturing number and a necessary barcode were printed by thermal transfer (S9).

Next, a counterbore recess 17 for mounting the IC module 12 on the card was formed by a counterbore method (S10). In this case, since the thickness of the IC module 12 was 0.6 mm, the depth of the concave portion 17 was set to 0.65 mm from the surface of the oversheet. Also,
The cross-sectional shape of the concave portion 17 to be spotted was such that a half-cut hollow portion 17a was formed around the concave portion 17 that was spotted as shown in the cross section of FIG. In this way, bending stress from the outside can be reduced.

After forming the concave portion 17 by spot facing, the IC
In order to form the shape of the carrier 11, the back face of the card (surface opposite to the mounting surface of the IC module 12) is adjusted to a depth such that the oversheet 22 is not cut, and the plate-shaped frame 13 is formed. And the IC carrier 11 (S11).

Next, the thermosetting adhesive was dropped into the concave portion 17, the IC module 12 was mounted, the module was sealed (S12), and the IC inspection of the function and the like of the IC module 12 (S13) was performed. In addition, the telephone number and ID of the subscriber
The number and the like were input to the memory and issued (S14).

The IC carrier 11 is pressed from the surface of the plate-shaped frame 13 to the IC carrier 11 by a finger.
Was easily peeled off from the plate-shaped frame 13. Example 2 An IC carrier 10 with a plate-like frame shown in FIG. 4 was manufactured based on the manufacturing process of FIG. Using the same base material as in Example 1, color printing of six colors was performed on a required portion of the upper core sheet 21a by silk screen printing. One-color printing was performed on a required portion of the lower core sheet 21b by silk screen printing. Next, the lower core sheet 2
1b, only the portion corresponding to the IC carrier 11 is a UV curable ink (“Calton M” manufactured by The Inc.
OP varnish ") to perform transparent offset printing,
The fusion inhibiting layer 14 was provided (S4). At this time, the fusion inhibiting layer 14 is formed in the other areas such that the halftone dot area ratio is 70% in the area of 3 mm width around the IC carrier 11.
For example, plate making was performed so that the dot area ratio was 40% in the central portion of the IC carrier 11.

Thereafter, as in the case of the first embodiment, the steps up to the IC module counterbore (S10) were performed. After forming the counter recess 17 for mounting the IC module, the fusing sheets 21a, 21b,
The surface slits 13a are adjusted to a depth such that the oversheet 23 is not cut from the surfaces of the surfaces 22 and 23 (the mounting surface of the IC module 12), and the plate-like frame 13 is formed.
And the IC carrier 11 (S11). Recess 17
The IC module 12 was mounted by dropping a thermosetting adhesive to the module, the module was sealed (S12), and an IC inspection (S13) of the function and the like of the IC module 12 was performed to issue (S14).

The IC carrier 11 could be easily separated from the frame by pressing the IC carrier 11 from the plate-like frame 13 from the back with a finger.

[0069]

As described above, according to the present invention, an IC carrier can be held on a plate-like frame without providing a bridge or a backing film.

[Brief description of the drawings]

FIG. 1 shows a first embodiment of an IC carrier with a plate-shaped frame according to the present invention.
FIG.

FIG. 2 shows a second embodiment of the IC carrier with a plate-shaped frame according to the present invention.
FIG.

FIG. 3 is a third view of an IC carrier with a plate-shaped frame according to the present invention;
Sectional side view which shows embodiment of FIG.

FIG. 4 shows a fourth embodiment of the IC carrier with a plate-shaped frame according to the present invention.
Sectional side view which shows embodiment of FIG.

FIG. 5 illustrates an IC carrier.

FIG. 6 is a plan view showing details of an IC carrier.

FIG. 7 is a view showing a manufacturing process of the IC carrier with a plate-shaped frame of the present invention.

FIG. 8 is an explanatory diagram of a fusion inhibiting layer provided on an IC carrier.

FIG. 9 is a diagram showing a state in which an IC carrier held on an upper oversheet is peeled off.

FIG. 10 is a diagram showing a state in which an IC carrier held on a lower oversheet is peeled off.

FIG. 11 is a diagram illustrating a conventional IC carrier and a method of using the same.

FIG. 12 is a plan view illustrating another example of a conventional IC carrier.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 IC carrier with plate-shaped frame 11 IC carrier 12 IC module 13 Plate-shaped frame 13a Peripheral slit 14 Fusion prevention layer 21 Core sheet 22, 23 Over-sheet 30 Opening

Claims (15)

[Claims] 1. A plate-like frame having a core sheet, an oversheet provided on at least one surface of the core sheet, and having an opening formed by leaving the oversheet, and a plate-like frame. I having an IC module, which is mounted in the opening and is held by the oversheet remaining in the opening.
An IC carrier with a plate-shaped frame, comprising: a C carrier. 2. The IC carrier with a plate-like frame according to claim 1, wherein a fusion inhibiting layer is provided on the surface of the IC carrier to be bonded to the oversheet. 3. The IC carrier with a plate-like frame according to claim 2, wherein the fusion inhibiting layer is formed on a surface of the IC carrier on the IC module side. 4. The IC carrier with a plate-shaped frame according to claim 2, wherein the fusion inhibiting layer is formed on the surface of the IC carrier on the side opposite to the IC module. 5. The IC carrier with a plate-shaped frame according to claim 2, wherein the fusion inhibiting layer comprises a print coating layer made of a solventless photo-curing or thermosetting ink. 6. The fusion inhibiting layer comprises a plurality of mesh points, wherein the fusion inhibiting layer is divided into a plurality of regions, and the area ratio of the mesh points in each region is different. IC carrier with a plate-shaped frame. 7. The IC carrier has a core sheet and an oversheet provided on at least one surface of the core sheet. The core sheet and the oversheet of the plate-shaped frame and the IC carrier are made of the same material. The IC with a plate-like frame according to claim 1, wherein the IC is formed in a configuration.
Career. 8. The IC carrier with a plate-shaped frame according to claim 7, wherein the core sheet and the oversheet of the plate-shaped frame and the IC carrier are made of vinyl chloride resin. 9. The core sheet or the oversheet is made of a polycarbonate resin, a mixture of a polycarbonate resin and an ABS resin, a mixture of a polycarbonate resin and a PET resin, or a mixture of a polycarbonate resin and a PBT resin. Item 2. An IC carrier with a plate-shaped frame according to Item 1. 10. A plate-shaped frame having a core sheet, an oversheet provided on at least one surface of the core sheet, and having an opening formed by leaving the oversheet, and a plate-shaped frame. And an IC carrier having an IC module mounted in the opening and having an IC module held by the oversheet remaining in the opening, wherein at least one surface of the core sheet is Laminating the sheets and fusing and pressing the core sheet and the oversheet; forming the counterbore recess by forming the counterbore of the core sheet; forming a peripheral slit forming the peripheral edge of the IC carrier in the core sheet; And a step of mounting an IC module in the counterbore recess. A method for manufacturing an IC carrier with a plate-shaped frame, comprising: 11. The manufacturing method of an IC carrier with a plate-like frame according to claim 10, further comprising a step of applying a necessary printing layer to the core sheet before laminating the oversheet on the core sheet. Method. 12. The method according to claim 10, further comprising, before laminating the oversheet on the core sheet, forming a fusion-inhibition layer on a portion of the core sheet corresponding to the IC carrier. A method for manufacturing an IC carrier with a plate-like frame. 13. The method for manufacturing an IC carrier with a plate-like frame according to claim 12, wherein the fusion-inhibition layer is formed on the surface of the core sheet on the IC module side. 14. The method for manufacturing an IC carrier with a plate-like frame according to claim 12, wherein the fusion-inhibition layer is formed on the surface of the core sheet opposite to the IC module side. 15. The method for producing an IC carrier with a plate-like frame according to claim 12, wherein the fusion-inhibition layer is formed of a solventless photo-curing or thermosetting ink.