JP2001357376A - Manufacturing method of ic carrier - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a conventional method is not suitable from the view point of saving resources or environmental maintenance, where the information recording processing of an SIM card (IC carrier) is performed with a frame card and the frame card is thrown away to use only the IC carrier when the IC carrier is used. SOLUTION: A method for producing the IC carrier is characterized by that the base body of the IC carrier is detachably fixed in the opening part of a planar frame body having an opening part by an adhesive, a series of works concerning mounting an IC module is performed in a fixed state, the IC carrier is removed together with the adhesive from the planar frame body after performing an information processing concerning the IC chip of the IC module and the planar frame body is recycled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a small card size IC carrier on which an IC module is mounted. More specifically, the present invention relates to a method for manufacturing a standard size card having an opening (hereinafter referred to as a frame card). After performing a series of IC carrier manufacturing and IC chip information processing with the IC carrier base loaded, the IC carrier after the series of processing is removed from the frame card, and the frame card is replaced with another IC. The present invention relates to a method for manufacturing an IC carrier that is integrated with a carrier base and reused.

[0002]

2. Description of the Related Art In recent years, a so-called IC card called a microcomputer card, a smart card or an electronic card, which has a larger storage capacity and higher security than a magnetic card, has been used in many fields. Also, IC
The external specifications of the card are the same as those of conventional cash cards with magnetic stripes and credit cards, and are globally common.Therefore, embossing devices and magnetic encoding cards that have been used for embossed cards and magnetic stripe cards have been used. The device is used as it is for an IC card. That is, in order for these devices to write information to the IC portion, an IC card compatible unit is added to the embossing device or the encoding device, and the embossing encoding process and the recording process of the IC information are performed inline. I have.

[0003] In addition, as the size of computers and the digitization of home appliances continue to advance, cellular phones have become more and more multifunctional, and the range of functions has been expanded to include not only e-mail but also commercial transactions via the Internet. However, as the functions of mobile phones have been improved and the fields of use have expanded, the security of transmitted data has begun to be questioned. For example, when a credit card is used in Internet transactions using a mobile phone, issues such as measures for preventing abuse of a credit member number and how to authenticate a user have emerged.

[0004] On the other hand, in France, which is an advanced country of IC cards, a system has been put into practical use in which a call charge using a mobile phone is paid from a telephone charge withdrawal account used in a user's home. This system uses a SIM (Subscriber I) to identify a mobile phone user.
By mounting a small-sized IC card called a "dentify module" card on a mobile phone, the mobile phone can be linked to a home telephone payment account.

[0005] This SIM-sized IC card has approximately 25
A miniature size card of about mm × 15 mm × 0.8 mm, in which an IC module is mounted. As described above, a SIM-sized IC card (hereinafter referred to as a SIM card) is small in size, and its surface is occupied exclusively by external terminals of the IC module. Therefore, designing and displaying individual data on an IC carrier are required. Can not. Further, a high-speed processing device for writing information on an IC chip of a SIM type card or performing an inspection has not yet been marketed. For this reason, many IC card manufacturers currently use the SIM card as a structure with the frame card of the standard card specification, print designs and notes on the frame card side, and perform information processing on the completed SIM card with the frame card. After that, they are shipped with the SIM card fixed to the frame card. On the other hand, in terms of quantity, this SIM
Although the type card is attached to a CP card of a notebook personal computer in addition to a mobile phone and is used in part, the spread amount is insignificant, and the ISO size card is still overwhelming. Therefore, for the time being, the information recording operation of the SIM type card is performed with the ISO standard size frame card.

[0006] In order to process the SIM type card with the frame card into an ISO standard size card, as described above, first, an IC module is mounted on an ISO standard specification card, and then a SIM type card size is cut around the module. Conventionally, a manufacturing method (see FIG. 9) for processing and fixing a SIM type card by providing a bridge on a frame card has been proposed. (See Japanese Patent Application Laid-Open No. 6-24188)

In addition to the above-described method of providing the bridge, an adhesive sheet is attached so as to cover the entire surface of one side of the frame card or a part of the opening, and the SIM type is attached to the adhesive surface viewed from the opening of the frame card. A method of attaching a card (see FIG. 8) has been proposed (see JP-A-7-276870 and JP-A-6-199082). In each of the two methods, the information recording process of the SIM card is performed with the frame card, and when the SIM card is used, the SIM card is discarded and the SIM card is discarded.
This is a method using only the IM type card.

[0008]

In recent years, with increasing criticism of waste of resources, it is difficult to simply discard more than 10 times the material used in the above two inventions.
This is not a good thing in terms of resource saving and environmental conservation. Therefore, the present invention provides a method of manufacturing a SIM card with a frame card, after removing the SIM card from the frame card, and using the remaining SIM card repeatedly. .

[0009]

According to the present invention, there is provided a method of manufacturing an IC carrier, comprising the steps of:
After the base of the C carrier is removably fixed, a series of operations related to the mounting of the IC module are performed in the fixed state, and further information processing is performed on the IC chip of the IC module. The material is removed from the plate-shaped frame together, and the plate-shaped frame is reused, and the plate-shaped frame is provided with an information recording section that can be rewritten on any of its front and back surfaces. It is characterized by having.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of a plate-shaped frame (hereinafter, referred to as a frame card) with an IC carrier (hereinafter, referred to as a SIM type card) for explaining a method of manufacturing an IC carrier according to the present invention. FIG. 3 is a plan view of the frame card before the SIM card of FIG. 1 is inserted into the opening, FIG. 3 is a sectional view taken along the line AA of FIG. 2, and FIG. FIG. 5 is a plan view in which individual information of the type card is printed on a card mounting sheet, FIG. 5 is a plan view in which the card mounting sheet is mounted on a mailing sheet, and FIG. FIG. 7 is a diagram for explaining a schematic procedure for manufacturing a SIM card, and FIG. 8 is a diagram for explaining an example of a conventional SIM card with a frame card. FIG. 9 is a plan view of a conventional frame. Plan view for explaining another embodiment of a SIM-type card with de a.

In FIG. 1, an opening (not shown) is formed in a frame card 2 laminated with plastic or molded with plastic (not shown), and a SIM in which an IC module 4 is mounted is provided.
The mold card 1 is loaded. Further, information that can be viewed under visible light is recorded in the information recording unit 5,
The material used for the recording unit is a rewritable material described later. That is, the information recording unit 5 stores the SI
If the M-type card 1 changes, this is an area where the recorded information content can be rewritten according to the SIM-type card. In FIG. 1, a bar code and alphanumeric characters are printed as individual management information. However, as will be described later, the bar code may be a serial number assigned to the product, or may be an individual number when the production quantity is small. The alphabet and the number may be the telephone number itself in the case of a mobile phone, for example, or may be the member number if a membership system is adopted.
In any case, the content is linked to the content written in the IC chip in the IC module 5 mounted on the SIM type card. When the machine-readable code is displayed on the display unit, it is remotely read with light for collation, and is used for collation when affixing to a mount described later. On the back side of the opening (the side opposite to the surface on which the information recording section is formed), an adhesive is adhered as a fixing member for the SIM type card. The adhesive will be described in detail with reference to FIG.

FIG. 2 shows a frame card in which no SIM type card is loaded in the opening 6 of the frame card 2, and no information is written in the information recording section 3.

In FIG. 3, (a) is a cross section taken along line AA in FIG. 2. When a frame card 2 is used, a SIM type card 1 (shown by a dotted line) is provided between the left and right frame cards 2. (Described). SIM card 1 is frame card 2
Is fixed by the fixing member 3 attached to the
Is composed of an adhesive material 31 on the frame card side and a covering paper 32. After a series of operations, the covering paper 32 is peeled off (as described later, the covering paper is affixed to the card attaching board as it is). 4), and together with the frame card, the adhesive material 31 is pressed against
Move to the card mount with the IM card.

The point of the present invention lies in how the characteristics of the adhesive 31 are set. That is, the fixing member 3, ie,
The point is how to set the area of the adhesive in contact with the frame card and the adhesive strength of the adhesive. First of all, it is important that the SIM card is firmly fixed to the frame card until a series of related operations are completed. Next, when removing the covering paper and attaching the SIM card to the card attaching board, the adhesive force to the card attaching board exceeds the adhesive strength to the frame card, and the SIM card must be transferred to the card attaching board. For this reason, in FIG. 3B, the bond strength balance between the portion 35 bonded to the frame card 2 shown by the fine diagonal line and the portion 36 shown by the wide diagonal line to the 35 portion is well balanced. What to set, and furthermore, the part 35 of FIG. 3 (b) of the SIM type card transferred to the card mounting board becomes the part exposed in the envelope when stacked or mailed. It is required to be narrow. When a SIM card is used,
Since the user will use the SIM-type card attached to the card attachment board after peeling it off from the adhesive, the adhesive will remain on the back side of the SIM-type card, or the SIM-type card will have too strong an adhesive force. Don't destroy it.

There is also a method in which the coated paper 31 is stuck on a card-attaching board without peeling. That is, when sticking to the card attaching board, a method of applying an adhesive or an adhesive to the card attaching board to adhere and fix the SIM type card together with the covering paper. The conditions are determined by focusing on the setting of the portion 35 to be fixed to the frame card by a method of bonding and fixing the SIM card together with the covering paper, and the ease of peeling when the SIM card is peeled from the adhesive material 31. Just do it. The bonding strength between the SIM card and the adhesive material can be set to be substantially the same as the outer shape of the SIM card and the size of the inside of the opening, so that the SIM card does not fall off from the frame card during a series of working steps. Because you do n’t have to think much about it,
The adhesive strength can be set low, and the area of the portion 35 attached to the frame card on the same surface may be set as wide as possible.

The pressure-sensitive adhesive as the fixing member may be selected from commercially available pressure-sensitive adhesive sheets and selected from those which meet the above-mentioned conditions. If an appropriate material is not available, the pressure-sensitive adhesive is prepared by the following method. Acrylic pressure-sensitive adhesives with little deterioration include those obtained by polymerizing acrylates in organic solvents such as toluene and ethyl acetate, and monomers with low glass transition points such as butyl acrylate and 2-ethylhexyl acrylate. Can be arbitrarily selected from copolymers of monomers such as vinyl acetate, a hydroxyl group monomer, styrene, and unsaturated carboxylic acid having a high level. On the other hand, if it is necessary to use a natural rubber-based pressure-sensitive adhesive with a balance of the pressure-sensitive adhesive strength, the following may be selected.
That is, a latex containing natural rubber as a main component, a modified version thereof, for example, an acidic latex, a depolymerized latex,
There are vulcanized latex or grafted natural rubber latex, etc., and especially in terms of blocking resistance, heat resistance, abrasion resistance, etc., especially natural rubber obtained by graft copolymerizing styrene and methyl methacrylate to natural rubber. Rubber latex is preferred. As a synthetic rubber emulsion used by mixing with a base for a natural rubber-based pressure-sensitive adhesive, synthetic rubber latex generally used as a component of an adhesive, for example, polyisoprene rubber, polybutadiene rubber, styrene-
Butadiene rubber, acrylonitrile-butadiene rubber,
Synthetic rubbers such as methyl methacrylate-butadiene rubber, chloroprene rubber, butyl rubber, polyurethane rubber, thiocol rubber and acrylic rubber are dispersed in an aqueous solvent together with an emulsifier, and can be arbitrarily selected from among these emulsion base materials.

FIGS. 4 and 5 show a state in which a SIM type card is attached to a mount for mailing. In FIG. 4, the SIM type card 1 is removed from the frame card, and the SIM 31 is attached together with an adhesive material 31 or a cover paper (not shown).
The figure shows a state in which the management code 51 of the pattern card is attached to the card attachment board 7 made of paper in the form of a frame card on which printing is performed. Individual management code 5 printed on card pasteboard 7
1 may be a serial number or the same as the code printed on the information recording section 5 of the frame card, and the destination information printed on the window-enclosed envelope 8 for mailing shown in FIG. It suffices if the contents recorded in the IC module of the SIM type card 1 and 81 match. If this card-attached backing paper 7 of the standard card size is used, an enclosing machine (card inserter) for enclosing a standard-sized plastic card in an open window envelope can be used as it is.

FIG. 5 shows a state in which a card-attached mount 7 made of a frame card size paper is fixed to the mount 8 for enclosing an open window envelope for mailing by using the card inserter. The postal code,
Address information 81 such as address, name, member code is printed,
A card attachment board 7 to which a SIM type card on which information corresponding to a destination is recorded is attached on the right side thereof.

Referring to FIGS. 6 and 7, a method of manufacturing a SIM card will be schematically described. SIM as shown in FIG.
After the design of the mold card base is printed on the milky white printing sheet 102 in a multi-faced state, it is laminated by heat and pressure,
A concave counterboring process is performed, the IC module is mounted in the concave portion, and is cut out to a SIM type card size and fixed to the opening of the already completed frame card with an adhesive material,
It is sent to the information processing step. If another manufacturing process is selected, the laminated and die-cut SIM type card base 1
No. 0 is fixed to the opening of the already completed frame card with an adhesive, is subjected to a concave counterboring process, the IC module is mounted in the concave portion, and is sent to an information processing step. Which of the above steps is selected depends on the contents of the equipment of the card maker.

A method of manufacturing a laminated card will be described in detail with reference to FIG. First, the front and back designs are printed on the opal white sheet (print sheet) 102, which is separated from the front and back sides in FIG. Depending on the design, the printing method is used properly, but most of the methods are based on offset printing, and fine lines and photographs are printed using UV (ultraviolet) curable ink, or rarely, oxidation polymerization type ink. The UV ink is dried instantly by irradiating ultraviolet rays, and the oxidation polymerization type ink is dried by exposing the printing surface to air and leaving it to stand for a certain period of time.
In addition, heavy designs and deep designs are printed by a (silk) screen printing method. The ink for screen printing is dried by removing the solvent.

When the printing ink has dried, the milky sheet 1 serving as a core is formed between the front and back milky sheets 102 as shown in FIG.
The transparent sheet 101 is stacked on the printing ink surfaces on the front and back sides with the sheet No. 03 interposed therebetween. When a magnetic stripe is required, it is magnetically transferred to a transparent sheet in advance and laminated. Lamination is usually performed by heat and pressure. When an adhesive is used, both sides of the printing sheet 102 or the milky white (core) sheet 103
Coated on both sides and on the printing ink side of the transparent sheet with a heat-reactive adhesive. When the material is vinyl chloride, the heat for lamination is 110 ° C. to 150 ° C., the pressure is 30 kg / cm, the pressurizing and heating time is 20 to 30 minutes, and the cooling time is 20 to 30 minutes.

After the laminating step, the multi-faced sheet 100 is sent to a die-cutting step, where it is die-cut and the SIM card base 1
It becomes 0. As an additional process, a concave portion (hatched portion) for mounting the IC module 4 is formed by a counterbore.
An adhesive is applied to the adhesion allowance of the facing portion, and the adhesion allowance of the IC module and the adhesion allowance of the recess are pressure-bonded by heat and pressure. FIG. 7 shows only the SIM card base having the SIM card size, but the frame card is also manufactured in the same process. SIM type card size
Since the area of the frame card is about 1/10 of the size, if the imposition of the frame card is 20 sheets, printing is performed at 160 sheets / sheet, which is about 8 times in consideration of the blanking allowance. It is only necessary to secure a certain number of frame cards for repeated use. In the frame card, as shown in FIG. 2, an opening 6 is provided by stamping, and a fixing member 3 prepared in advance is attached to the back of the opening. Furthermore, as for the information recording unit 5, a relatively popular recording material, for example,
A reversible thermosensitive recording material made of a polymer composition or a magnetic recording material made of a magnetic capsule is made into a sheet shape and affixed to a frame card.

FIG. 8 illustrates one embodiment of the conventional method, as described above in the background section.
An opening is provided in the frame card 20 provided with the magnetic stripe 90, and an adhesive film 33 having substantially the same size as the frame card or an adhesive film 30 slightly larger than the opening is attached to the back side of the frame card 20. As a result, the SIM card 11 is fixed to the frame card.

FIG. 9 shows another embodiment of the conventional method similar to FIG. 8, as described in the above-mentioned prior art part.
02, and a pair of bridges 201 connecting the frame card 200 and the SIM type card 12 on which the IC module is mounted.
2 shows a state in which the SIM type card 12 is fixed to the frame card 200.

Here, the display material 5 will be briefly described. First, a reversible thermosensitive recording material made of a polymer composition is a material capable of recording information on a recording material or erasing the recorded information by changing the temperature of a thermal head. In other words, when the resin is transparent, the particles of the organic low-molecular substance dispersed in the resin base material are composed of large particles of the organic low-molecular substance, and light incident from one side is not scattered. It looks transparent because it penetrates to the opposite side. In the case of cloudiness, the particles of the organic low-molecular-weight substance are composed of polycrystals in which fine crystals of the organic low-molecular-weight substance are aggregated, and since the crystal axes of the individual crystals are oriented in various directions, they are incident from one side. The light looks white because it is refracted and scattered many times at the crystal interface of the organic low-molecular substance particles.

Next, a display method by magnetic recording will be briefly described. A microcapsule layer is formed on the colored base film, and a magnetic powder having a gray flat surface floating on a surface responsive to a magnetic field is floating therein, and the flat magnetic powder emits light. Information is displayed by forming a blocking part and a passing part.

[0028]

(Embodiment) As shown in FIG. 1, an opening having a size 0.3 mm larger on both the short side and the long side than the SIM type card was formed in a frame card having a five-layer laminated structure of vinyl chloride as shown in FIG. Next, the reversible thermosensitive recording material film made of the polymer composition was cut into a rectangular shape, an adhesive was applied to the back side, and the film was attached to the emboss area of the frame card. The number was 500 parts. A SIM card on which an IC module was mounted was fixed to the opening with a removable adhesive sheet. The non-adhesive material side of the adhesive sheet is coated paper, and the total thickness of the adhesive sheet is 0.1 mm
And The amount of adhesion to the frame card was set to 1.5 mm, and the outer shape of the pressure-sensitive adhesive sheet was set to 18 mm × 28 mm. The adhesive strength of the adhesive is 180-degree peel strength of 1.2 to 1.6 N / c.
m. A 6-digit barcode is printed in a serial number format on the information recording section in advance, and the barcode number read by the remote-reading barcode reader attached to the information processing device is recorded on the IC chip. Was recorded in connection with some of the data. The management bar code printed in advance on the card mounting board is linked to the management number read from the IC module, the card mounting boards are stacked in the order in which they were affixed, and the customer module code number of the IC module is edited in the stacking order and the address is edited. The name was printed on the window mount envelope mount. The above card-attached mount was attached to the window mount envelope mounting paper on which the address name, the collation barcode, etc. were printed, while collating, and the enclosing and sealing work in the window empty envelope could be performed without any problem.

[0029]

The above embodiment is a case where an IC module is mounted in the size of a SIM type card and then fixed to a frame card. However, it has been confirmed that the IC module can be reused up to 100 times repeatedly. , Saving resources, confirming environmental conservation, and reducing manufacturing costs.

[Brief description of the drawings]

FIG. 1 is a plan view of a plate-shaped frame (hereinafter, referred to as a frame card) with an IC carrier (hereinafter, referred to as a SIM card) for explaining a method for manufacturing an IC carrier of the present invention.

FIG. 2 is a plan view of the frame card before the SIM type card of FIG. 1 is inserted into an opening;

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a plan view in which a SIM card removed from a frame card is attached to a card attachment board on which individual information of the SIM card is printed.

FIG. 5 is a plan view in which the card-attached cardboard is attached to a mailing cardboard (enclosed cardboard for an open window envelope).

FIG. 6 is a view for explaining a layout of a plurality of imprinted printing sheets when printing a SIM type card;

FIG. 7 is a view for explaining a schematic procedure for manufacturing a SIM type card;

FIG. 8 is a plan view for explaining an embodiment of a conventional SIM type card with a frame card.

FIG. 9 is a plan view for explaining another embodiment of the conventional SIM type card with a frame card.

[Description of Signs] 1, 11, 12 IC carrier (SIM-type card) 2, 20, 200 Plate-shaped frame (frame card) 3, 30, 33 Fixing member 31 Adhesive material 32 Coated paper 35 Adhesive allowance for frame card 36 Adhesive allowance for card pasting mount 4 IC module 5 Information recording unit 51, 52 Management code 53 Verification code 6 Opening 7 Card pasting mount 8 Envelope mount for open window envelope 81 Address information 10 SIM card base 90 Magnetic recording unit 100 5 Layer laminated sheet 101 Transparent sheet 102 Milky white (for printing) sheet 103 Milky white (core) sheet 201 Bridge 202 Slit

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[Procedure amendment]

[Submission date] July 28, 2000 (2007.2
8)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 1

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

[0009]

According to the present invention, there is provided a method of manufacturing an IC carrier, comprising the steps of:
After the base of the C carrier is detachably fixed with an adhesive , a series of operations relating to the mounting of the IC module are performed in the fixed state, and further information processing is performed on the IC chip of the IC module. And the adhesive material are removed together from the plate-shaped frame, and the plate-shaped frame is reused, and the plate-shaped frame can be rewritten on any of its front and back surfaces. It has an information recording section. ────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] July 31, 2000 (2007.3.
1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 1

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

[0009]

According to the present invention, there is provided a method of manufacturing an IC carrier, comprising the steps of:
After the base of the C carrier is detachably fixed with an adhesive , a series of operations relating to the mounting of the IC module are performed in the fixed state, and further information processing is performed on the IC chip of the IC module. And the adhesive material are removed together from the plate-shaped frame, and the plate-shaped frame is reused, and the plate-shaped frame can be rewritten on any of its front and back surfaces. It has an information recording section.

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) G06K 7/00 B65D 85 / 38K F term (reference) 2C005 MA21 MA28 PA03 PA14 PA18 PA21 RA03 RA04 RA06 RA09 RA10 RA15 RA16 RA22 TB01 3E096 AA01 BA08 BB05 CA11 CB02 FA16 GA01 5B035 AA04 BB09 CA01 CA06 5B072 BB00 CC24 DD02

Claims (2)

[Claims] 1. An opening in a plate-like frame having an opening.
After the base of the C carrier is removably fixed, a series of operations related to the mounting of the IC module are performed in the fixed state, and further information processing is performed on the IC chip of the IC module. A method for manufacturing an IC carrier, wherein materials are removed from the plate-like frame together, and the plate-like frame is reused. 2. The method for manufacturing an IC carrier according to claim 1, wherein said plate-shaped frame has a rewritable information recording portion on one of its front and back surfaces.