JP2000090207A - Device and method for checking non-contact ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the production of a defective card, to decrease the useless consumption of materials, to suppress production cost-up as well, further, also to decrease the danger of defective article mixture after the completion of cards and to improve quality by enabling the confirmation of operation/function in the card substrate sheet state of aligning and arranging plural inlets before making into card even when there is a connection defect between an IC module and an antenna connecting part or a defective IC module is mixed in the production of the card. SOLUTION: This checking device is provided with a communication means for check for performing communicating operation to the card substrate sheet aligning and arranging the plural inlets for non-contact IC card, which is constituted by integrating IC modules 1 and non-contact transmission elements, on the substrate sheet in contact with a connecting terminal part 6 of an antenna and a read/write discriminating processing means for check for performing read/write through the communication means for check and discriminating whether the IC module 1 or the like is normal or defective from the result.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a non-contact type information medium,
For details, see, for example, Office Automation (Off
ice Automation; so-called OA) and factory automation (Factory Out)
operation, a so-called FA) or a technology related to the manufacture of a non-contact IC card used in various fields related to other security (Security) problems. Related to effective countermeasures against various troubles.

[0002]

2. Description of the Related Art In recent years, with the advent of a non-contact IC card incorporating a semiconductor memory or the like, the storage capacity has been dramatically increased as compared with a conventional magnetic card, and the card can be inserted into a slot of a read / write device. It became unnecessary and convenience was improved. A non-contact IC card is provided with a field of vibration energy such as a high-frequency electromagnetic field, ultrasonic waves, and light in a space, and absorbs and rectifies the energy to form a DC power source for driving an electronic circuit built in the card. Use the frequency of the AC component of the field as it is, or multiply or divide it as an identification signal, and transmit this identification signal to an information processing circuit of a semiconductor element via an antenna or a coupler such as a coil or a capacitor. It is.

In particular, many non-contact IC cards for the purpose of authentication and simple counting data processing often use a battery and a CPU (CeC).
Central Processing Unit (Radio Frequency-Encryption IDenti)
fiction. In the following, this is simply referred to as RFID. ). With the advent of this non-contact IC card, the security against forgery and tampering is improved as compared with the case of the conventional magnetic card, and at the time of passing through the gate, the person carrying the card can use the antenna unit of the read / write device attached to the gate device. Or simply touch the card carried by the user to the antenna section of the read / write device, and the complexity for data communication of removing the card from the case and inserting the card into the slot of the read / write device has been reduced.

A non-contact IC card is a so-called ISO card.
(International Organization)
n for Standardization), and IC cards are generally
An IC module such as a semiconductor memory and an antenna which is a non-contact transmission element are built in a card body made of plastic or the like. Then, an AC magnetic field radiated from the antenna unit of the read / write device is detected by the antenna inside the card, and is coupled to each other to exchange data with the read / write device.

[0005] In general, a non-contact IC card is manufactured as follows. An antenna or coil of metal foil for non-contact transmission is formed by etching on the sheet,
Further, a pattern portion for connecting to the IC module is provided at the terminal of the antenna or the coil. Then, the antenna connection portion of the IC module is connected to this pattern portion by soldering or using a conductive adhesive, and becomes an internal sheet to be accommodated inside the card. After that, IC
The internal sheet on which the module is mounted is sandwiched between card substrates and laminated to produce a card body. There is also a method of manufacturing the card body by sealing the inner sheet by injection molding.
The non-contact transmission antenna or coil may be formed by a conductive wire provided with an insulating film, in addition to the antenna or coil made of metal foil.

[0006] The non-contact IC card manufactured in this way utilizes a non-contact IC card read / write device for confirming the operation and function after completion, for example, as disclosed in Japanese Patent Application Laid-Open No. 9-102221. The inspection device using such a communication device performs a final inspection in the non-contact IC card manufacturing process, and detects a malfunctioning or malfunctioning card.

[0007]

However, in such an inspection apparatus, since the inspection is performed after the completion of the card in the non-contact IC card manufacturing process, the card is normally manufactured even if a defective IC module is mixed. I,
Only after the completion of the card is the result that the defective IC module is found. Therefore, non-contact IC
The members constituting the card, for example, the inner sheet forming the antenna or the coil, the card base material sandwiching the inner sheet, and the like are wasted and affect the manufacturing cost. In addition, the sorting operation after the completion of the card increases, and there is a risk that defective products are mixed due to a sorting error. Therefore, it is not preferable from the viewpoint of quality control.

Therefore, it is necessary to confirm the operation and the function before making the card, that is, the IC module alone.
As such a method, an apparatus as shown in FIG. 5 can be considered.
This is because a pseudo antenna or a coil 8 having the same performance as an antenna or a coil provided inside the non-contact IC card is arranged near the communication antenna section 7 in the non-contact IC card read / write device 5, and a terminal portion of the coil is provided. Is connected to the antenna connection terminal section 6 of the IC module 1 to check the operation of the IC module 1.

However, the means according to FIG. 5 requires a large installation space for the communication antenna section 7 of the read / write device 5, and the positional relationship in the arrangement of the pseudo antenna or coil 8 and the read / write device communication antenna section 7 is also fixed. And the configuration becomes complicated. Furthermore, the influence of the peripheral portion of the pseudo antenna or the coil, for example, the presence of a metal body in the vicinity, is affected by the influence, which hinders the inspection, and the operation and function cannot be normally confirmed.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is intended to solve the problem when there is a connection failure in a connection between an IC module and an antenna or a coil in a card manufacturing process. Even if there is a mixture, the operation and function can be checked in the state of a card base sheet in which a plurality of inlets before the carding process are arranged and aligned, preventing the production of defective cards and consuming unnecessary card members. It is an object of the present invention to provide an inspection apparatus and an inspection method that can reduce the risk of mixing in defective products after completion of the card and improve the quality, and can satisfy these requirements. And

[0011]

Means provided by the present invention for solving the above-mentioned problems are:
As shown in the figure, an IC module equipped with a semiconductor IC chip, an antenna or a coil as a non-contact transmission element, a non-contact IC card inlet in which these are integrated,
An inspection communication means for performing a read / write communication operation by directly contacting a connection terminal portion of the antenna or the coil to the IC module via a transmission line when provided on the base sheet; Read / write determination processing means for determining whether the IC module or the like is a normal product or a defective product based on the result of the read / write performed by the communication device for non-contact. This is an IC card inspection device. ADVANTAGE OF THE INVENTION According to this invention, in the manufacturing process of a non-contact IC card, the test | inspection apparatus of a simple structure can be utilized, and also a semiconductor IC chip itself can be highly reliably inspected before converting into an IC card. Further, the present invention is suitable even if the IC module is provided on a base sheet except for the whole or a part of the non-contact transmission element, not the non-contact IC card inlet.

According to a second aspect of the present invention, the apparatus according to the first aspect has a basic configuration. In particular, an attenuator having an impedance equivalent to a characteristic impedance of the transmission line is provided in the read / write device of the inspection communication means. And the connection terminal portion. According to this, the signal level input to the IC module can be set to the optimum value without modifying the read / write device or adjusting the output level by the function of the attenuator, and the IC module can be set to an excessive input level. Destruction can be prevented. Further, it is very preferable because it is possible to avoid the level fluctuation and unstable operation of the read / write device output portion caused by changing the transmission line length and by the presence or absence of the connection of the IC module.

According to a third aspect of the present invention, there is provided the device according to any one of the first and second aspects, and in particular, an equilibrium circuit is provided at a portion in contact with a connection terminal of the IC module and / or in the vicinity thereof. An unbalanced converter is provided to obtain matching between the IC module and the transmission line. According to this, loss of a transmission signal which occurs when the input mode of the IC module and the mode of transmitting a signal on the transmission line can be prevented is very preferable.

According to a fourth aspect of the present invention, there is provided an apparatus according to any one of the first to third aspects. In particular, the inspection communication means includes a transmission line at least in a connection terminal portion to the IC module. A test head that performs communication by contacting the IC module through the IC module. Whenever an IC module or the like to be inspected changes, the test head is moved to a place where a new IC module or the like to be inspected can be inspected. And a test head moving device capable of directly bringing the transmission line into contact with the connection terminal portion. According to this, it is suitable for the case where the automation of the inspection is realized.

According to a fifth aspect of the present invention, there is provided an apparatus as set forth in any one of the first to third aspects. In particular, the communication means for inspection includes a transmission line at least in a connection terminal portion to the IC module. A plurality of test heads that communicate with each other via communication are provided, and even when a plurality of IC modules are prepared, each of the IC modules is provided with the test heads in a one-to-one correspondence within a range allowed by the number. In response to this, each time the head placement device for arranging each inspection head and the IC module to be inspected change, the inspection head in which the new IC module or the like to be inspected is inspected is actually inspected. According to this, an inspection head switching device capable of designating a head to be inspected and executing an inspection is provided. It is suitable for a case to be.

According to a sixth aspect of the present invention, there is provided the apparatus according to any one of the first to third aspects. In particular, the inspection communication means includes a transmission line at least in a connection terminal portion to the IC module. A plurality of test heads that communicate with each other via communication are provided, and even when a plurality of IC modules are prepared, each of the IC modules is provided with the test heads in a one-to-one correspondence within a range allowed by the number. In correspondence therewith, there is provided a head arranging device for arranging each of the inspection heads, and the communication means for inspection is provided with a communication device and a determination device capable of simultaneously and / or almost simultaneously inspecting a plurality of IC modules and the like. It is characterized by having. According to this, it is suitable for the case where the automation of the inspection is realized.

The invention according to claim 7 is based on the device according to any one of claims 1 to 6, and in particular, the card base sheet has a non-contact IC card inlet on the base sheet. It is characterized in that a plurality are arranged and arranged. According to this, the present invention is also suitable for an aggregate in which a plurality of non-contact IC card inlets are arranged. The present invention is not limited to a non-contact IC card inlet, but also to an assembly in which a plurality of IC modules except for all or part of a non-contact transmission element are mainly arranged on a base sheet. Is preferred.

The invention according to claim 8 is based on the device according to any one of claims 1 to 7, and the semiconductor IC chip is particularly suitable for both a non-contact IC card and a contact IC card. Semiconductor IC with compatible functions
It is a chip. IC cards can be broadly classified into non-contact IC cards and contact IC cards, and some IC cards have both functions.
In addition, there is a semiconductor IC chip itself having both of these functions to be used for it. The present invention provides a semiconductor IC having both functions.
It is also suitable for those having a chip.

According to a ninth aspect of the present invention, there is provided an IC module having a semiconductor IC chip, an antenna or a coil as a non-contact transmission element, and a non-contact IC card inlet in which these elements are integrated. Assuming that it is provided above, before entering the card forming step of covering the front and back surfaces of the card base sheet with the sheet, at least the IC module inlet of each non-contact IC card inlet in the state of the card base sheet is provided. A noncontact IC card inspection method characterized by inspecting whether an IC module or the like is a normal product or a defective product by making contact with a connection terminal portion and performing a communication operation via a transmission line. . According to the present invention, an inspection apparatus having a simple structure can be used in the process of manufacturing a non-contact IC card,
The C chip itself can be inspected with high reliability before making it into an IC card. Further, the present invention is suitable even if the IC module is provided on a base sheet except for the whole or a part of the non-contact transmission element, not the non-contact IC card inlet.

According to a tenth aspect of the present invention, the method according to the ninth aspect has a basic configuration. In particular, at the time of the inspection, at least a connection terminal portion to the IC module is contacted via a transmission line. Each time the IC module or the like to be inspected is changed using the inspection head that performs communication, the inspection head is moved to a place where the new IC module or the like to be inspected can be inspected, and the inspection is performed. Thus, a feature is to sequentially inspect a plurality of IC modules and the like. According to this, it is suitable for the case where the automation of the inspection is realized.

The invention according to claim 11 is based on the method according to claim 9, and in particular, at the time of the inspection, contacts at least a connection terminal portion to the IC module via a transmission line for communication. And a plurality of the test heads are set at positions where each of the plurality of IC modules can be tested within a range allowed by the number of test heads.
A test head in which a new IC module or the like to be inspected is arranged so that it can be inspected every time the IC module or the like to be inspected changes is arranged so as to correspond to one to one.
The inspection is performed by designating the head as an actual inspection. According to this, it is suitable for the case where the automation of the inspection is realized.

According to a twelfth aspect of the present invention, the method according to the ninth aspect has a basic configuration. In particular, at the time of the inspection, communication is performed by contacting at least a connection terminal portion to the IC module via a transmission line. And a plurality of the test heads are set at positions where each of the plurality of IC modules can be tested within a range allowed by the number of test heads.
According to this feature, a plurality of IC modules and the like are arranged in a one-to-one correspondence, and a plurality of IC modules and the like are inspected in parallel and / or almost simultaneously. This is suitable for realizing automated inspection. is there.

The invention according to claim 13 is based on the method according to any one of claims 9 to 12, and particularly,
The card base sheet is characterized in that a plurality of non-contact IC card inlets are arranged and arranged on the base sheet. According to this, the present invention is also suitable for an aggregate in which a plurality of non-contact IC card inlets are arranged. The present invention is not limited to a non-contact IC card inlet, but also to an assembly in which a plurality of IC modules except for all or part of a non-contact transmission element are mainly arranged on a base sheet. Is preferred.

The invention according to claim 14 is based on the method according to any one of claims 9 to 13, and in particular,
The semiconductor IC chip comprises a contactless IC card and a contact type IC card.
It is a semiconductor IC chip having a function compatible with any of the C card. IC cards can be broadly classified into non-contact IC cards and contact IC cards, and some IC cards have both functions. In addition, there is a semiconductor IC chip itself having both of these functions to be used for it.
The present invention is also suitable for a device having a semiconductor IC chip having both functions.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic configuration diagram of an IC module inspection apparatus for a non-contact IC card according to the present invention.
Here, 1 is an IC module for a non-contact card having an antenna connection terminal 6, 2 is a balanced-unbalanced converter, 3 is an attenuator, 4 is a transmission line, and 5 is a read / write device.

First, an outline of the operation / function confirmation of the IC module 1 alone according to the present invention will be described. In the IC module 1 before being put into the non-contact IC card manufacturing process, the contact of the balanced-unbalanced converter 2 is connected to the antenna connection terminal 6. If the balanced-unbalanced converter 2 is used when the input form on the IC module side and the form for sending the signal on the transmission line 4 are different, matching between the two is obtained and the signal can be transmitted efficiently. It is not necessary to use the input form of the IC module 1 and the signal transmission form of the transmission line 4 when matching is obtained. An attenuator 3 is connected after the balanced-unbalanced converter 2, and further connected to a read / write device 5 via a transmission line 4. The attenuator 3 can be inserted between the transmission line 4 and the read / write device 5.

When confirming the operation and function of the IC module 1, a command (a command for reading information or a command for writing information in the IC module, etc.) is sent from a control unit (not shown) to the read / write device 5. A signal according to the command is transmitted to the IC module 1 via the transmission line 4. The IC module 1 receives the signal and rectifies the signal to obtain DC power for driving the internal circuit. At the same time, the IC module 1 operates according to the command in the signal to generate a response signal. Reply to
The read / write device 5 receives the response signal, extracts information of the IC module 1 included in the response signal, and transmits the information to the control unit (not shown). By performing the above operation once or several times, the operation and function of the IC module 1 can be confirmed.

At this time, the attenuator 3 existing in the middle has two important functions as described below.

The first function is to send a signal to the IC module 1 at an optimum input level. Normally, the output of the read / write device 5 uses the communication antenna unit 7 shown in FIG. 5 to generate a vibration energy field of a high-frequency electromagnetic field in space, and the non-contact IC card generates a part of the energy of this field. And is used as a drive power source for the internal IC module. Therefore, since the loss in space is large,
The output level of the read / write device 5 is a relatively large level. If this output is directly input to the IC module 1 via the transmission line 4, an excessive input state occurs and the IC module 1 is broken. In order to avoid this phenomenon, it is necessary to take measures such as modifying the read / write device 5.

Therefore, in the present invention, by using the attenuator 3, it is possible to attenuate the large output of the read / write device 5 to the optimum input level of the IC module 1 without requiring modification of the read / write device 5, etc. And module destruction can be prevented.

Next, the second function is as follows.
When the length of the transmission line 4 is changed due to a mismatch between the input impedance of the transmission line 4 and the characteristic impedance of the transmission line 4,
The point is that it is possible to avoid level fluctuation and unstable operation of the read / write device output unit caused by the presence or absence of the connection of the C module 1.

Normally, the IC module 1 has a relatively high input impedance (for example, about several kΩ), and the transmission line 4 has a low characteristic impedance (for example, about 50Ω). Accordingly, impedance mismatch occurs at the connection point between the IC module 1 and the transmission line 4 and the read / write device 5
A part of the signal wave traveling from is reflected and returns to the read / write device 5 as a reflected wave. Due to the influence of the reflected wave, waveform distortion, level fluctuation, unstable operation of the circuit, and the like occur at the read / write device output unit. This unstable state differs depending on the state, such as when the length of the transmission line 4 is changed or when the IC module 1 is in a high impedance state in a non-connected state.

Therefore, the IC module 1 according to the present invention
By inserting the attenuator 3 between the transmission line 4 and the read / write device 5, the reflected wave level due to the mismatch is attenuated,
Apparently, the matching condition is improved, and acts so as not to adversely affect the read / write device output section.

[0034]

FIG. 2 is a block diagram showing an embodiment of a non-contact IC card module inspection apparatus according to the present invention. FIG. 3 is a diagram showing the effect of the embodiment according to the present invention. FIG. 4 is a diagram showing the effect of another embodiment according to the present invention.

In FIG. 2, reference numeral 1 denotes an antenna connection terminal 6
2 is a balanced-unbalanced converter, 3 is an attenuator, 4 is a transmission line, and 5 is a read / write device. The voltage generated at the antenna connection terminal portion 6 of the IC module 1 is Vm, and the read / write device 5
Are represented as Vout, and the length of the transmission line 4 is represented as L. Here, the balance-unbalance conversion unit 2 is an IC
This can be omitted if the input form of the module 1 and the signal transmission form of the transmission line 4 are compatible.

Next, the effect of inserting the attenuator 3 between the IC module 1, the transmission line 4, and the read / write device 5 according to the present invention will be described. In FIG. 3 (without attenuation), FIG.
In FIG. 5, the voltage Vm of the antenna connection terminal 6 of the IC module 1 is measured without the attenuator 3, and the voltage Vm when the length L of the transmission line 4 is further changed is shown. Also,
3 shows the characteristics of the voltage Vm in the same manner except that the attenuator 3 having the value of the amount of attenuation A is inserted. Then, (Attenuation B) in FIG.
The characteristics of the voltage Vm in that case are shown in a similar manner except that the attenuator 3 having a larger attenuation B is inserted.

And what can be seen from the results shown in FIG.
That is, the voltage Vm generated at the antenna connection terminal 6 of the IC module 1 decreases with the increase of the attenuation of the attenuator 3. Further, in a state where the attenuator 3 is not provided, the voltage Vm periodically changes in magnitude with a change in the transmission line length L. This repetition period is related to the frequency used by the read / write device 5, The higher the frequency, the narrower the pitch. Also, it can be seen that the insertion of the attenuator 3 reduces the amplitude difference. Therefore,
By setting the amount of attenuation of the attenuator 3 so that the IC module 1 operates and has an appropriate voltage Vm that is not destroyed by an excessive input, the length L of the transmission line 4 is reduced.
, A stable operation is always obtained.

Next, another effect of inserting the attenuator 3 between the IC module 1, the transmission line 4, and the read / write device 5 will be described with reference to FIG. In FIG. 4 (without attenuator), the output voltage Vout of the read / write device 5 is measured without the attenuator 3 and the length L of the transmission line 4 is changed. Is shown.
FIG. 4 (with attenuator) shows the characteristics of the voltage Vout when the attenuator 3 having the optimum attenuation for the IC module 1 is inserted in the same manner as described above.

It can be seen from FIG. 4 that, when the attenuator 3 is not provided, the output voltage Vout of the read / write device 5 periodically changes in magnitude with a change in the transmission line length L. This period is related to the frequency of the signal output from the read / write device 5, and the higher the frequency, the narrower the pitch. This is caused by the influence of a reflected wave caused by impedance mismatch at the connection point where the IC module 1 having a different impedance is connected to the tip of the transmission line 4 connected to the read / write device 5. is there. Therefore, depending on the length of the transmission line, an unstable operation such as a waveform distortion or a circuit oscillation phenomenon may occur at the output unit of the read / write device 5. Further, in the non-connected state of the IC module 1, although not shown, the positional relationship of the cycle and the amplitude value with (without attenuator) in FIG. 4 are different. The status of the output section has changed, causing unstable operation.

However, even when the transmission line length L is changed, the voltage Vout (with the attenuator) when the attenuator 3 having the optimal amount of attenuation is inserted has a small amplitude difference and is almost constant.
Although not shown, the voltage Vout is constant even when the IC module 1 is not connected. Therefore, even if the length L of the transmission line 4 changes, and whether or not the IC module 1 is connected, the output section of the read / write device 5 is not affected at all, and stable operation can always be performed.

[0041]

As described in detail above, according to the present invention, an IC module using a semiconductor IC chip, an antenna as a non-contact transmission element, the IC module and a card base holding the antenna are provided. In the manufacturing process of the non-contact IC card used in the non-contact IC card system including the non-contact IC card and the read / write device, the non-contact IC card inspection device according to the present invention includes a defective IC module mixed during card manufacturing. Even if there is, the operation and function can be checked in advance, so that useless use of card members can be reduced, and increase in manufacturing cost can be suppressed.

In the inspection apparatus for a non-contact IC card according to the present invention, the structure of the inspection apparatus can be simplified, which contributes to space saving and improvement of inspection reliability.
Furthermore, by inserting an attenuator between the connection terminal portion of the antenna or the coil and the read / write device according to the present invention,
The signal level input to the IC module can be set to an optimum value without modifying the read / write device or adjusting the output level, thereby preventing damage to the IC module due to excessive input. (By the way, the signal input to the IC module here is the semiconductor I in the IC module.
Sent to C chip. In addition, when the transmission line length is changed and when the IC module is connected or not, level fluctuation and unstable operation of the read / write device output section can be avoided, and stable operation can always be obtained. Can easily respond to

The present invention relates to a composite IC having both a contact IC card function having a conventional external terminal and a non-contact IC card function of communicating data by wireless communication.
In a card, usually, a semiconductor IC chip is arranged on a surface of a module substrate opposite to a surface on which external terminals are formed,
Further, an IC for a composite IC card having an antenna connection terminal for connecting an antenna as a non-contact transmission element
Although a module is used, in this case, an effect can be exerted also in the inspection of the semiconductor IC chip before the IC card is formed.

In general, according to the present invention, a defective IC module, a defective antenna or a coil, a defective connecting portion between an IC module and an antenna or a coil, etc. can be found before the card is formed. Material consumption can be suppressed. In addition, the work of selecting defective cards after completion of the card is not required, and the risk of defective products being mixed due to an operation error is reduced, and troubles can be prevented.

The operation and function of each of the inlets can be surely confirmed by mechanically sequentially moving the head part to be inspected by direct contact and inspecting the card base sheet. In this state, the reliability of inspection and the productivity can be improved.

After all, according to the present invention, the inlet before the carding step is formed even when the connection between the IC module and the antenna or the coil is defective in the card manufacturing process, or when the defective IC module is mixed. Operation and operation in the state of multiple card base sheet
The function can be checked, preventing the production of defective cards, reducing the consumption of wasteful card members, suppressing the increase in production cost, and reducing the risk of defective products after card completion. It is possible to provide an inspection apparatus and an inspection method that can reduce the quality and improve the quality and satisfy the above requirements.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of an IC module inspection apparatus for a non-contact IC card according to the present invention.

FIG. 2 is a block diagram showing an embodiment of an IC module inspection apparatus for a non-contact IC card according to the present invention.

FIG. 3 is a diagram showing an example of the effect of the present invention.

FIG. 4 is a diagram showing still another example of the effect of the present invention.

FIG. 5 is a diagram showing a schematic configuration of a conventional IC module inspection device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... IC module 2 ... Balance-unbalance conversion part 3 ... Attenuator 4 ... Transmission line 5 ... Read / write device 6 ... Antenna connection terminal part 7 ... Communication antenna part 8 ... Pseudo antenna or coil

 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Kazuo Kobayashi F-term (reference), 1-5-1, Taito, Taito-ku, Tokyo 2C005 MA10 MA21 NA09 QA15 TA22 5B035 BB09 CA01 CA25 5B058 CA13 CA17 KA01 KA22 YA20

Claims (14)

[Claims] An IC module provided with a semiconductor IC chip, an antenna or a coil as a non-contact transmission element, and a non-contact IC card inlet in which these are integrated are provided on a base sheet. An inspection communication means for performing a read / write communication operation by directly contacting a connection terminal portion of the antenna or the coil to the IC module via a transmission line; and a reading / writing result performed by the inspection communication means. A read / write determination processing means for determining whether the IC module or the like is a normal product or a defective product. 2. An attenuator having an impedance equivalent to a characteristic impedance of the transmission line is provided between the read / write device of the test communication means and the connection terminal. 2. The inspection device for a non-contact IC card according to 1. 3. A balanced-unbalanced converter is provided at and / or near a portion of the IC module that contacts the connection terminal, and a matching between the IC module and the transmission line is provided. The inspection device for a non-contact IC card according to claim 1 or 2, wherein: 4. The communication means for inspection, wherein at least the I
An inspection head that performs communication by contacting the connection terminal of the C module via a transmission line with the connection terminal, and where the IC module to be inspected changes every time a new IC module to be inspected can be inspected And a test head moving device capable of moving the test head and bringing a transmission line into direct contact with the connection terminal of the IC module.
The inspection device for a non-contact IC card according to any one of the above. 5. The test communication means according to claim 1, wherein:
A plurality of test heads are provided for contacting and communicating with a connection terminal portion of the C module via a transmission line, and even when a plurality of the IC modules are prepared,
Each time the number of test heads is made to correspond to each of the IC modules within a range allowed by the number of heads, a head placement device for arranging each test head and a new test every time the IC module to be tested changes. An inspection head switching device capable of designating an inspection head on which a target IC module or the like is arranged so as to be inspectable as a head for actually inspecting and executing the inspection; The non-contact IC card inspection device according to claim 1. 6. The test communication means includes at least the I
A plurality of test heads are provided for contacting and communicating with a connection terminal portion of the C module via a transmission line, and even when a plurality of the IC modules are prepared,
Each of the IC modules is provided with a head arranging device for arranging each of the inspection heads in a one-to-one correspondence within a range allowed by the number of the inspection heads. The inspection device for a non-contact IC card according to any one of claims 1 to 3, further comprising an inspection processing device capable of simultaneously and / or almost simultaneously inspecting modules and the like. 7. The non-contact IC card according to claim 1, wherein the card base sheet has a plurality of non-contact IC card inlets aligned on the base sheet. Inspection device for contact IC card. 8. The semiconductor IC chip according to claim 1, wherein said semiconductor IC chip is a semiconductor IC chip having a function capable of supporting both a non-contact IC card and a contact IC card. Inspection apparatus for non-contact IC card according to the above. 9. An IC module provided with a semiconductor IC chip, an antenna or a coil as a non-contact transmission element, and a non-contact IC card inlet in which these are integrated are provided on a base sheet. Before entering the card forming step of covering the front and back surfaces of the card base sheet with the sheets, each non-contact I
Inspecting whether the IC module or the like is normal or defective by contacting at least a connection terminal portion of the C card inlet to the IC module and performing a communication operation via a transmission line; Inspection method for non-contact IC cards. 10. In the inspection, an inspection head that performs communication by contacting at least a connection terminal portion to the IC module via a transmission line is used, and each time the IC module or the like to be inspected changes. Moving the inspection head to a place where the new IC module or the like to be inspected can be inspected and inspecting the plurality of IC modules or the like by switching back the inspection head; 10. The inspection method for a non-contact IC card according to item 9. 11. In the inspection, a plurality of inspection heads can be used to communicate by contacting at least a connection terminal portion to the IC module via a transmission line, and each of the plurality of IC modules can be inspected. In one position within the range of the number of test heads
Each time the IC module, etc. to be inspected changes, the inspection head in which the new IC module, etc. to be inspected is arranged to be inspectable is designated as the head for actually inspecting. The inspection method for a non-contact IC card according to claim 9, wherein the inspection is performed. 12. At the time of the inspection, a plurality of inspection heads can be used for performing communication by contacting at least a connection terminal portion to the IC module via a transmission line, and each of the plurality of IC modules can be inspected. In one position within the range of the number of test heads
The inspection method for a non-contact IC card according to claim 9, wherein a plurality of IC modules and the like are inspected in parallel and / or almost simultaneously at the same time. 13. The non-contact IC card according to claim 9, wherein a plurality of non-contact IC card inlets are arranged and arranged on the substrate sheet. Inspection method for contact IC card. 14. The semiconductor IC chip according to claim 9, wherein said semiconductor IC chip is a semiconductor IC chip having a function of supporting both a non-contact IC card and a contact IC card. Inspection method for non-contact IC card according to any of the above.