JP2000084806A - Polishing method and polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To polish a magnetic disk board with high accuracy and efficiently polish a magnetic disk board and dress a polishing tool with high accuracy. SOLUTION: A magnetic disk board S or a dresser is held on rotation tables 18a and 18b. Grinding wheels 16 as a polishing tool for polishing the magnetic disk board S are mounted on polishing wheels 17 of polishing heads 15a and 15b. Rotation axes of the polishing wheel 17 and rotatary tables 18a and 18b are different from each other. A surface of the magnetic disk board S is polished by rotation of the grinding wheel 16 and the magnetic disk board S in a state where the grinding wheel 16 is made contact with a part of the magnetic disk board S. When the dresser is held on the rotation tables 18a and 18b, the grinding wheel 16 is dressed by the dresser.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a polishing technique for polishing the surface of a magnetic disk substrate.

[0002]

2. Description of the Related Art A magnetic disk, also called a hard disk, is used as an auxiliary storage device for an electronic device such as a computer. The magnetic disk is formed by forming a magnetic film on a disk substrate made of aluminum or glass, that is, a surface of a substrate. It is manufactured by. A disk-shaped magnetic disk substrate having a through hole in the center is ground to adjust the surface roughness to a predetermined roughness and to adjust the thickness, and finishes the surface after the grinding. And polished to mirror-finish the surface. The lapping process and the polishing process are also called polishing processes, and the polishing process and the grinding process are collectively referred to as polishing processes.

[0003]

Conventionally, such a magnetic disk substrate is disclosed in, for example, Japanese Patent No. 2556605.
As disclosed in Japanese Unexamined Patent Publication, a large number of magnetic disk substrates are polished at the same time. However, when such a batch processing is performed, a large number of magnetic disk substrates processed at the same time are processed. Due to variations in precision, it is difficult to process all magnetic disk substrates with a processing accuracy of a certain level or higher.

An object of the present invention is to enable a magnetic disk substrate to be polished with high precision.

Another object of the present invention is to enable efficient polishing of a magnetic disk substrate and dressing of a polishing tool with high precision.

[0006]

According to a polishing method of the present invention, a magnetic disk substrate is held on a rotary table and variably rotates within a predetermined rotation speed range. A polishing wheel provided with a polishing tool for polishing a substrate is variably rotated around a rotation center axis different from the rotation center axis of the rotary table within a predetermined rotation speed range, and the magnetic disk substrate is polished. It is characterized by polishing with a tool.

According to the polishing method of the present invention, a magnetic disk substrate or a dresser is held on a rotary table, variably rotated within a predetermined rotation speed range, and comes into contact with the magnetic disk substrate to polish the magnetic disk substrate. Or, a polishing wheel provided with a polishing tool to be dressed by the dresser in contact with the dresser can be changed within a predetermined rotation speed range around a rotation center axis different from the rotation center axis of the rotary table. Rotate, when polishing the magnetic disk substrate, holding the magnetic disk substrate on the rotating table and polishing by the polishing tool,
When the polishing tool is clogged, the dresser is held on the rotary table to dress the polishing tool. When the magnetic disk substrate is polished by the polishing tool, the rotating table that holds the magnetic disk substrate is rotated at a low speed, and the polishing wheel provided with the polishing tool is rotated at a high speed to dress the polishing tool. To do so, the rotary table holding the dresser is rotated at a high speed, and the polishing wheel provided with the polishing tool is rotated at a low speed.

The polishing apparatus of the present invention comprises: a rotary table for holding and rotating a magnetic disk substrate; table rotating means for variably rotating the rotary table within a predetermined rotation speed range; A polishing wheel provided with a polishing tool for polishing the magnetic disk substrate in contact with the polishing table; and variably rotating the polishing wheel around a rotation center axis different from the rotation center axis of the rotary table within a predetermined rotation speed range. Polishing tool rotating means to be driven,
The magnetic disk substrate is polished by the polishing tool.

The polishing apparatus according to the present invention comprises: a rotary table for holding and rotating a magnetic disk substrate or a dresser; table rotating means for variably driving the rotary table within a predetermined rotation speed range; A polishing wheel provided with a polishing tool that is in contact with a substrate to polish the magnetic disk substrate or is dressed by the dresser in contact with the dresser; and rotating the polishing wheel differently from the rotation center axis of the turntable. A polishing tool rotating means for variably rotating and driving the magnetic disk substrate around a central axis within a predetermined number of rotations, and when polishing the magnetic disk substrate, holding the magnetic disk substrate on the rotating table to perform the polishing. Polishing machine, and when the polishing tool is clogged, hold the dresser on the rotary table Characterized by dressing the polishing tool Te. The table rotating means rotates the rotary table holding the magnetic disk substrate at a low speed when the polishing tool grinds the magnetic disk substrate, and rotates the rotary table holding the polishing tool when dressing the polishing tool. Rotate the table at high speed,
The polishing tool rotating means drives the polishing wheel to rotate at a high speed when the polishing tool grinds the magnetic disk substrate, and rotates the polishing wheel at a low speed to dress the polishing tool.

[0010] When polishing, the center of rotation of the polishing wheel may be moved in the radial direction so as to be shifted with respect to the center axis of rotation of the rotary table. The magnetic disk substrate, which is arranged adjacent to each other and held on one of the rotary tables and has one surface polished, is turned upside down, held on the other rotary table and polished on the other surface. You may do it.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a front view of the polishing apparatus, and FIG. 2 is a left side view of FIG. As shown in the figure, this polishing apparatus has an apparatus main body including a base portion 11, a column portion 12 provided on the upper portion, and a column top portion 13 provided on the upper portion. The column portion 12 is provided with a guide block 14 extending in the horizontal direction along the front side thereof, and the guide block 14 includes two polishing heads 1.
5a and 15b are mounted movably in the left-right direction, that is, in the X direction. Each polishing head 15a,
Reference numeral 15b has a polishing wheel 17 to which a grindstone 16 as a polishing tool is attached, and each of the polishing wheels 17 is driven to rotate about rotation center axes _OG1 and _OG2 .

The base 11 has two turntables 18a, 1 corresponding to the two polishing heads 15a, 15b.
A rotary table 8b is rotatably provided, and the rotary tables 18a and 18b are driven to rotate about rotation axes O _T1 and O _T2 . Each of the rotary tables 18a and 18b incorporates a chuck unit 19 for vacuum-sucking the magnetic disk substrate S or the dresser D. FIGS. 1 and 2 show that the magnetic disk substrate S is held by both rotary tables. It shows the state that it was turned on.

FIG. 3 is a schematic view showing one polishing head 15a and a driving mechanism for driving the rotary table 18a corresponding to the polishing head 15a. In order to rotationally drive the rotary table 18a, a table rotation is provided in the base portion 11. A motor 21 is incorporated, and a wheel rotation motor 22 is incorporated in the column top 13 to rotationally drive the polishing wheel 17. A wheel feed motor 23 is incorporated in the base portion 11 or the column portion 12 in order to move the polishing head 15a up and down and apply a pressing force to the grindstone 16 against the magnetic disk substrate S. Further, as shown in FIG. 1, each polishing head 15a, 15b
The guide block 14 is provided with a horizontal movement motor 24 in order to move the horizontal direction.

The rotation of the table rotation motor 21 is controlled by a pulley 25 fixed to a motor shaft and a rotation table 18.
The power is transmitted to the rotary table 18a via a V-belt 27 stretched over a pulley 26 fixed to the table shaft a. Similarly, the rotation of the wheel rotation motor 22 is controlled by the pulley 3 fixed to the motor shaft.
1 and a V-belt 33 stretched over a pulley 32 fixed to the grinding wheel 17. The rotation of the wheel feed motor 23 is controlled by the polishing head 15.
A ball screw 34 connected to the motor shaft is screw-coupled to a ball nut 35 attached to the guide block 14 so as to transmit the vertical movement of a. The polishing head 15a moves up and down via the guide block 14. It has become. However, the polishing head 15a may be directly moved up and down by the wheel feed motor 23.
The rotation of the horizontal motion motor 24 is controlled by the X of the polishing head 15a.
As shown in FIG. 1, a ball screw 36 connected to the shaft of the
Is a ball nut 37 attached to the polishing head 15a.
Is screwed to.

A driving mechanism for driving the other polishing head 15b and the corresponding rotary table 18b has the same structure as that shown in FIG.

FIG. 4A is a view showing a state in which the magnetic disk substrate S held by the chuck portion 19 of one of the rotary tables is ground by a grindstone 16 provided on a polishing wheel 17. The chuck portion 19 of the rotary table is driven to rotate at a rotation speed N _T1 around a rotation center axis O _T1 , and the polishing wheel 17 is rotated at a rotation speed N _G1 around the rotation center axis O _G1 and is the same as or opposite to the rotation table. The rotation speed of each motor is, for example, in the range of 1 to 10000 rpm.
It can be changed by 1 and 22. When grinding the magnetic disk substrate S for manufacturing a 3.5-inch (about 95 mm) hard disk, a grindstone 16 having an outer diameter of, for example, about 90 to 150 mm is used. Grindstone 16 is formed in an annular shape as shown in FIG. 4, it has a flat ground surface of a direction perpendicular to the rotation center axis O _G1. The grindstone 16 may be formed by arranging a number of cylindrical grindstone pieces on a grinding wheel 17 in a ring shape.

In this polishing apparatus, the rotating table and the polishing wheel can be arbitrarily varied within the range of the above-mentioned rotation speed, that is, the rotation speed, and the rotation ratio between the rotation speed of the rotation table and the rotation speed of the polishing wheel is adjusted. Grinding is performed by controlling it to be constant. When the number of rotations is controlled so as to have a constant rotation ratio in this manner, each part of the grindstone 16 and each part of the magnetic disk substrate S can be in a certain correspondence relationship, and high precision grinding can be performed. Can be. When performing the grinding process, the grindstone 16 is pressed against the magnetic disk substrate S with a predetermined pressing force, and the load is applied to the rotary table and the polishing wheel.
As a result, each rotation speed changes, and the rotation ratio cannot be kept constant.

When the rotation speed of the rotary table changes, the rotation speed of the table rotation motor 21 changes, and when the rotation speed of the polishing wheel changes, the rotation speed of the wheel rotation motor 22 also changes. Are provided with rotation speed detectors 41 and 42 including a pulse generator and the like for detecting the rotation speed.
By detecting the number of revolutions 22, the number of revolutions of the turntable and the polishing wheel is detected. In order to detect the rotation speed of the wheel feed motor 23 to detect the feed speed and feed amount of the polishing wheel, the wheel feed motor 23 is provided with a rotation speed detector 43 composed of a pulse generator or the like. However, the rotation speed of the rotating table and the polishing wheel may be directly detected by a rotary encoder, or the feed speed and the feed amount of the polishing wheel may be detected by a linear encoder.

FIG. 4B shows the chuck 1 of the rotary table.
9 shows a state in which the dresser D is held at 9 and the dresser D is brought into contact with the clogged grindstone 16 to dress, that is, shape the grindstone 16. Dresser D is magnetic disk substrate S
It has a disk shape having substantially the same outer diameter as that of, and when dressing, the respective rotation speeds are controlled so that the rotation ratio between the turntable and the polishing wheel is constant.

As shown in FIG. 4A, when the surface of the magnetic disk substrate S is ground by the grindstone 16, the rotary tables 18a and 18b are driven at a low speed in the range of about 10 to 1000 rpm, and the grinding wheel is rotated. 17 is
100 ~ 10000rpm which is faster than rotary table
It is driven at a high speed of about m. On the contrary,
The dresser D is brought into contact with the clogged grindstone 16 to grind the grindstone 1.
When the dressing 6 is performed, the rotating table 18
The polishing wheels 17a and 18b are driven at a high speed in the range of about 20 to 200 rpm, and the polishing wheel 17 is driven at a low speed in the range of about 1 to 20 rpm, which is lower than the rotation table.

FIG. 5 is a block diagram showing a control circuit for controlling the operation of the polishing apparatus. The table rotation motor 21, the wheel rotation motor 22, and the wheel feed are controlled by signals from a control unit 40 having an arithmetic processing unit (CPU). The motor 23 and the horizontal motion motor 24 are each driven to rotate at a predetermined rotation speed. The rotation speeds of these motors 21 to 24 are controlled by rotation speed detectors 41 to 41 including a pulse generator or the like.
The respective detection signals are detected by the control unit 40.
To be sent to An operation panel, that is, an operation board 45 is connected to the control unit 40, and by operating a key provided on the operation board 45, a start signal of the polishing apparatus and a signal indicating which of a grinding operation and a dressing operation is to be performed. A command signal is sent to the control unit 40.

When the signal from the rotation speed detector or the like input to the control unit 40 is an analog signal, the signal is sent to an A / D converter for converting the signal into a digital signal and to each motor as an analog signal. A D / A converter for converting a digital signal from the control unit 40 into an analog signal and the like are omitted in FIG.

A ROM 46 and a RAM 47 are connected to the control unit 40 via a bus bar. The ROM 46 rotates when the magnetic disk substrate S is ground by the grindstone 16 and when the grindstone 16 is dressed by the dresser D. A data table or an arithmetic expression of a range of a predetermined number of rotations of the table and the polishing wheel and a rotation ratio in the range is stored.

Therefore, when the grindstone 16 grinds the magnetic disk substrate S, the table rotating motor 21 as the rotating table rotating means rotates the rotating table 18a, 1
When the wheel 8b is rotated at the above-described low speed and the grindstone 16 is dressed, the rotation table is rotated at a high speed and controlled by a control signal from the control unit 40. Further, the wheel rotation motor 22 as a polishing tool rotating means includes the grinding wheel 1
6 is controlled by a control signal from the control unit 40 so that the grinding wheel 17 rotates at the above-described high speed when the magnetic disk substrate S is ground, and the polishing myle 17 rotates at a low speed when the grinding wheel 16 is dressed. .

As described above, the rotary tables 18a, 18b
The grinding process can be performed with the grindstone 16 while holding the magnetic disk substrate S, and the dressing of the grindstone 16 can also be performed by holding the dresser D on the same rotary table. Moreover, the polishing wheel 17
In addition, since the rotation speeds of the rotary tables 18a and 18b can be different between the time of grinding and the time of dressing, the grinding and the dressing can be performed under the same conditions with the same polishing apparatus.

Next, a procedure for grinding the magnetic disk substrate S with the grindstone 16 using the above-described polishing apparatus and a procedure for dressing the grindstone 16 with the dresser D will be described.

The magnetic disk substrate S, which is a work, is moved by a transfer device (not shown) in FIG. 1 in a state in which the respective polishing heads 15a and 15b are horizontally moved and retracted from right above the rotary tables 18a and 18b. For example, it is first placed on the left turntable 18a, and is held by vacuum suction by the chuck unit 19. At this time, the polishing head 15a is held by the rotary table 18a.
The surface of the magnetic disk substrate S that has been subjected to the grinding process is turned upside down and placed on the turntable 18b.

Each of the polishing heads 15a, 15b
Each of the polishing heads is horizontally moved to a position above the rotation tables 18a and 18b so that the respective rotation center axes are displaced from the rotation center axes of the rotation tables 18a and 18b by a predetermined distance, and then, is moved downward and the respective polishing heads The grinding wheel 16 contacts the magnetic disk substrate S, and the rotating table and the polishing wheel rotate at a predetermined number of rotations in the same or opposite directions, whereby the two magnetic disk substrates S are simultaneously ground. At the time of this grinding, the polishing head 15
a, 15b and rotary tables 18a, 18b
The position of the rotation center axis may not be changed,
The polishing heads 15a and 15b may be moved radially in the X direction.

Since the magnetic disk substrate S held by the rotary table 18b and ground has already been ground on the lower surface, the magnetic disk substrate S is carried out by a transfer device (not shown) to the outside. The magnetic disk substrate S held by the rotary table 18a and ground is turned upside down, and
b.

However, both rotary tables 18a, 18
In either case, the magnetic disk substrate S whose lower side is not ground or which has been ground is carried in, and the upper surface is simultaneously ground by the respective polishing heads 15a and 15b. The magnetic disk substrate S may be carried out to the outside. In that case, another surface is ground by another similar polishing apparatus.

When the magnetic disk substrate S is ground by the grindstone 16, there is a possibility that a difference occurs between the rotational speeds of the rotary table and the polishing wheel due to frictional resistance between the grindstone 16 and the magnetic disk substrate S. Is detected, and is controlled by a signal from the control unit 40 so that the rotation ratio becomes constant. As a result, the correspondence between the abrasive grains constituting the grindstone 16 and each part of the magnetic disk substrate becomes an optimal regular pattern, and the magnetic disk substrate is ground to a smooth surface by the optimal grindstone trajectory.

FIGS. 6 and 7 are views showing a modification of the apparatus main body of the polishing apparatus. FIG. 6 shows the front of the apparatus main body corresponding to FIG. 1, and FIG. 7 shows the apparatus main body corresponding to FIG. The left side of is shown. 6 and FIG. 7, FIG. 1 and FIG.
The same reference numerals are given to members common to those shown in FIG.

The guide block 14 provided in the apparatus main body is provided in the column portion 12 so as to guide the respective polishing heads 15a and 15b reciprocally in the front-rear direction when viewed from the front, that is, in the Y direction. . Therefore, as shown by the two-dot chain line in FIG. 7, the respective polishing heads are conveyed to the respective rotary tables 18a, 18b by the arm 50 of the conveying device in a state of being retracted and moved so as to approach the column portion 12 side. It has become. The magnetic disk substrate S having one surface ground by one polishing head 15a is turned upside down at an intermediate position between the two polishing heads, and is conveyed to the other rotary table 18b to be ground by the polishing head 15b. Will be done. In the case of this device, the grinding wheel 1
It is possible to grind the surface of the magnetic disk substrate S while shifting the rotation center axis 7. Similarly, when dressing the grindstone 16 with the dresser D, the grindstone 16 may be shifted in the radial direction.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the invention.

For example, in the illustrated embodiment, a grindstone is used as a polishing tool and the magnetic disk substrate S
Although the case where the grinding process is performed on the surface is described, lapping and polishing can also be performed. In that case, a buff, a polishing pad, or the like is used as the polishing tool. In addition, a process of shaving the surface of the magnetic disk substrate using a polishing tool having a cutter instead of the grindstone can be performed.

[0037]

According to the present invention, the number of rotations of the magnetic disk substrate held by the rotary table and the polishing tool in contact with the magnetic disk substrate can be changed, so that the magnetic disk substrate can be polished under optimum polishing conditions, and the surface of the magnetic disk substrate can be polished. High-precision polishing with improved polishing accuracy can be performed. The same polishing apparatus can be used to hold the magnetic disk substrate on the turntable and perform the polishing process, and to hold the dresser on the turntable to perform the dressing process on the polishing tool using the same polishing apparatus. At this time, by setting the number of rotations of the rotary table and the polishing wheel to an arbitrary value, polishing and dressing can be efficiently performed under optimum conditions. By shifting the polishing tool in the radial direction during polishing, the surface of the magnetic disk substrate can be polished more accurately. By providing two rotary tables and two polishing heads, one surface of the magnetic disk substrate can be polished by one polishing head and the other surface can be polished by the other polishing head. The disk substrate can be polished.

[Brief description of the drawings]

FIG. 1 is a front view showing a polishing apparatus according to an embodiment of the present invention.

FIG. 2 is a left side view of FIG.

FIG. 3 is a schematic view showing a rotary table and a driving unit of a polishing head.

FIG. 4A is a schematic perspective view showing a state in which a magnetic disk substrate is held on a rotary table and the magnetic disk substrate is ground by a grindstone, and FIG. It is a schematic perspective view which shows the state which is dressing.

FIG. 5 is a block diagram showing a control circuit of the polishing apparatus.

FIG. 6 is a front view showing a modification of the polishing apparatus.

FIG. 7 is a left side view of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Base part 12 Column part 13 Column top part 14 Guide block 15a, 15b Polishing head 16 Grinding stone 17 Polishing wheel 18a, 18b Rotary table 19 Chuck part 21 Table rotation motor 22 Wheel rotation motor 23 Wheel feed motor 24 Horizontal movement motor 25, 26 Pulley 27 V belt 31, 32 Pulley 33 V belt S Magnetic disk substrate D Dresser

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[Procedure amendment]

[Submission date] July 26, 1999 (1999.7.2)
6)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

According to the present invention, there is provided a polishing method comprising: a rotary table for holding a magnetic disk substrate or a dresser; and a polishing tool which rotates about a rotation center axis different from the rotation center axis of the rotation table. A polishing method comprising: polishing the magnetic disk substrate held by the rotating table by the polishing tool, and dressing the polishing tool by a dresser held by the rotating table. When the magnetic disk substrate is polished by the polishing tool, the rotating table holding the magnetic disk substrate is rotated at a lower speed than a polishing wheel provided with the polishing tool, and when the polishing tool is dressed, The rotating table in which the dresser is held is more than the polishing wheel provided with the polishing tool. It characterized in that for rotating at a speed. In the polishing method of the present invention, the number of rotations of the rotary table and the polishing wheel is controlled so that the rotation ratio between the rotary table and the polishing wheel is constant.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

[0007] A polishing apparatus according to the present invention comprises: a rotating table that holds and rotates a magnetic disk substrate or a dresser; and a polishing table that polishes the magnetic disk substrate by contacting the magnetic disk substrate or that contacts the dresser. A polishing tool that is provided with a polishing tool that is dressed by the polishing table, and a polishing wheel that rotates about a rotation center axis different from the rotation center axis of the rotary table. When rotating, the rotary table holding the magnetic disk substrate is driven to rotate at a lower speed than a polishing wheel provided with the polishing tool, and when dressing the polishing tool, the rotary table holding the dresser is Control means for rotationally driving at a higher speed than the polishing wheel provided with a polishing tool; Polishing apparatus characterized by.
In the polishing apparatus of the present invention, the number of rotations of the rotary table and the polishing wheel is controlled so that the rotation ratio between the rotary table and the polishing wheel is constant.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Deleted

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction contents]

In the present invention, when the magnetic disk substrate is polished by the polishing tool, the rotary table is driven to rotate in a range of 10 to 1000 rpm, and the polishing wheel is driven to rotate in a range of 100 to 10000 rpm. When dressing the polishing tool, the rotary table is driven to rotate at 20 to 200 rpm, and the polishing wheel is driven to rotate at 1 to 20 rpm.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0021

[Correction method] Change

[Correction contents]

As shown in FIG. 4A, when the surface of the magnetic disk substrate S is ground by the grindstone 16, the rotary tables 18a and 18b are driven at a low speed in the table side polishing speed range of about 10 to 1000 rpm. The polishing wheel 17 has a wheel side polishing speed range of about 100 to 10000 rpm and is driven to rotate at a higher speed than the rotary table. On the other hand, when the dresser D is brought into contact with the clogged grindstone 16 to dress the grindstone 16, the turntables 18a and 18b are set to 20 to 20.
The polishing wheel 17 is driven at a high speed in a table-side dress speed range of about 0 rpm, and is rotationally driven at a lower speed than the rotary table in a wheel-side dress speed range of about 1 to 20 rpm. ────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission Date] November 5, 1999 (1999.11.
5)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 1

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claim 4

[Correction method] Change

[Correction contents]

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0006

[Correction method] Change

[Correction contents]

[0006]

According to the present invention, there is provided a polishing method comprising: a rotary table for holding a magnetic disk substrate or a dresser; and a flat polishing surface rotated about a rotation center axis different from the rotation center axis of the rotation table. A polishing wheel provided with a polishing tool having a polishing tool, wherein the magnetic disk substrate held on the rotary table is polished by the polishing tool, and the polishing tool is dressed by a dresser held on the rotary table. In the polishing method, when the magnetic disk substrate is polished by the polishing tool, the rotating table that holds the magnetic disk substrate is rotated at a lower speed than a polishing wheel provided with the polishing tool, and the polishing is performed. When dressing utensils,
The rotary table on which the dresser is held is rotated at a higher speed than the polishing wheel provided with the polishing tool. In the present invention, the number of rotations of the rotary table and the polishing wheel is controlled such that the rotation ratio between the rotary table and the polishing wheel is constant.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction contents]

[0007] A polishing apparatus according to the present invention comprises: a rotating table that holds and rotates a magnetic disk substrate or a dresser; and a polishing table that polishes the magnetic disk substrate by contacting the magnetic disk substrate or that contacts the dresser. A polishing tool having a flat polishing surface that is dressed by a polishing tool having a polishing wheel that rotates about a rotation center axis different from the rotation center axis of the turntable; and When polishing the magnetic disk substrate, the rotary table holding the magnetic disk substrate is rotated at a lower speed than the polishing wheel provided with the polishing tool, and when dressing the polishing tool, the dresser is held. The rotating table is rotated at a higher speed than the polishing wheel provided with the polishing tool. Characterized in that it has a control means for driving. In the polishing apparatus of the present invention, the number of rotations of the rotary table and the polishing wheel is controlled so that the rotation ratio between the rotary table and the polishing wheel is constant.

Continued on the front page F term (reference)

Claims (8)

[Claims] 1. A polishing tool provided with a polishing tool for holding a magnetic disk substrate on a turntable and variably rotating within a predetermined rotational speed range, and for polishing the magnetic disk substrate by contacting the magnetic disk substrate. Polishing the wheel by variably rotating the wheel about a rotation center axis different from the rotation center axis of the turntable within a predetermined rotation range, and polishing the magnetic disk substrate by the polishing tool. Method. 2. A magnetic disk substrate or a dresser is held on a rotary table and variably rotates within a predetermined rotation speed range. The magnetic disk substrate or the dresser is brought into contact with the magnetic disk substrate to polish the magnetic disk substrate. A polishing wheel provided with a polishing tool that is contacted and dressed by the dresser is variably rotated within a predetermined rotation range around a rotation center axis different from the rotation center axis of the rotary table, When the disk substrate is polished, the magnetic disk substrate is held on the rotary table and polished by the polishing tool. When the polishing tool is clogged, the dresser is held on the rotary table and the polishing tool is dressed. Polishing method characterized by performing. 3. The polishing method according to claim 2, wherein when the magnetic disk substrate is polished by the polishing tool, the rotary table holding the magnetic disk substrate is rotated at a low speed, and the polishing tool is provided. Rotating the polishing wheel at high speed, when dressing the polishing tool, rotates the rotary table at which the dresser is held at high speed, and rotates the polishing wheel provided with the polishing tool at low speed. Polishing method. 4. A rotary table for holding and rotating a magnetic disk substrate, table rotating means for variably driving the rotary table within a range of a predetermined number of rotations, and a magnetic table in contact with the magnetic disk substrate. A polishing wheel provided with a polishing tool for polishing a disk substrate, and a polishing tool rotation variably driving the polishing wheel variably within a predetermined rotation range around a rotation center axis different from the rotation center axis of the rotary table. Means for polishing the magnetic disk substrate with the polishing tool. 5. A rotary table for holding and rotating a magnetic disk substrate or a dresser, table rotating means for variably driving the rotary table within a predetermined number of rotations, and contacting the magnetic disk substrate. A polishing wheel provided with a polishing tool for polishing the magnetic disk substrate or being dressed by the dresser in contact with the dresser, wherein the polishing wheel is centered on a rotation center axis different from the rotation center axis of the rotary table. Polishing tool rotating means variably driving within a range of a predetermined number of rotations, and when polishing the magnetic disk substrate, holding the magnetic disk substrate on the rotating table and performing polishing with the polishing tool. When the polishing tool is clogged, the dresser is held on the rotary table to remove the polishing tool. Polishing apparatus characterized by Lessing. 6. The polishing apparatus according to claim 5, wherein said table rotating means rotates said rotary table holding said magnetic disk substrate at a low speed when said polishing tool grinds said magnetic disk substrate. When dressing a polishing tool, the rotary table holding the polishing tool is driven to rotate at a high speed, and the polishing tool rotating means drives the polishing wheel to rotate at a high speed when the polishing tool grinds the magnetic disk substrate. A polishing apparatus for rotating the polishing wheel at a low speed when dressing the polishing tool. 7. The polishing apparatus according to claim 4, wherein a center of rotation of the polishing wheel is shifted with respect to a center axis of rotation of the rotary table when performing polishing. A polishing apparatus characterized in that the polishing apparatus is moved to a surface. 8. One of claims 4, 5, 6 and 7
In the polishing apparatus according to the above paragraph, the rotating table and the polishing wheel are arranged two by two adjacent to each other, and the magnetic disk substrate having one surface polished while being held on one of the rotating tables is a front and a back. A polishing apparatus characterized in that the polishing apparatus is turned upside down and held on the other rotary table to polish the other surface.