JP2000082760A5 - - Google Patents

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Publication number
JP2000082760A5
JP2000082760A5 JP1999155704A JP15570499A JP2000082760A5 JP 2000082760 A5 JP2000082760 A5 JP 2000082760A5 JP 1999155704 A JP1999155704 A JP 1999155704A JP 15570499 A JP15570499 A JP 15570499A JP 2000082760 A5 JP2000082760 A5 JP 2000082760A5
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JP
Japan
Prior art keywords
semiconductor chip
back surface
pattern
circuit board
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999155704A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000082760A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11155704A priority Critical patent/JP2000082760A/ja
Priority claimed from JP11155704A external-priority patent/JP2000082760A/ja
Publication of JP2000082760A publication Critical patent/JP2000082760A/ja
Publication of JP2000082760A5 publication Critical patent/JP2000082760A5/ja
Pending legal-status Critical Current

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JP11155704A 1998-06-25 1999-06-02 半導体装置 Pending JP2000082760A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11155704A JP2000082760A (ja) 1998-06-25 1999-06-02 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-178513 1998-06-25
JP17851398 1998-06-25
JP11155704A JP2000082760A (ja) 1998-06-25 1999-06-02 半導体装置

Publications (2)

Publication Number Publication Date
JP2000082760A JP2000082760A (ja) 2000-03-21
JP2000082760A5 true JP2000082760A5 (enExample) 2006-03-09

Family

ID=26483632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11155704A Pending JP2000082760A (ja) 1998-06-25 1999-06-02 半導体装置

Country Status (1)

Country Link
JP (1) JP2000082760A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100386634B1 (ko) * 2000-12-29 2003-06-02 앰코 테크놀로지 코리아 주식회사 비지에이 패키지용 기판의 습기 배출공 형성방법
US7164192B2 (en) * 2003-02-10 2007-01-16 Skyworks Solutions, Inc. Semiconductor die package with reduced inductance and reduced die attach flow out
JP5071035B2 (ja) * 2007-10-19 2012-11-14 セイコーエプソン株式会社 圧電デバイス
JP2011044747A (ja) * 2010-11-29 2011-03-03 Renesas Electronics Corp 半導体装置の製造方法
JP2012124537A (ja) * 2012-03-26 2012-06-28 Renesas Electronics Corp 半導体装置

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