JP2000076645A - Precision substrate for optical and magnetic medium and its production - Google Patents

Precision substrate for optical and magnetic medium and its production

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Publication number
JP2000076645A
JP2000076645A JP24148998A JP24148998A JP2000076645A JP 2000076645 A JP2000076645 A JP 2000076645A JP 24148998 A JP24148998 A JP 24148998A JP 24148998 A JP24148998 A JP 24148998A JP 2000076645 A JP2000076645 A JP 2000076645A
Authority
JP
Japan
Prior art keywords
substrate
less
mmφ
quartz glass
synthetic quartz
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24148998A
Other languages
Japanese (ja)
Inventor
Fukushichi Fukuzaki
福七 福崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
O P C KK
Original Assignee
O P C KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by O P C KK filed Critical O P C KK
Priority to JP24148998A priority Critical patent/JP2000076645A/en
Publication of JP2000076645A publication Critical patent/JP2000076645A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To produce a precision substrate for optical and magnetic medium consisting of synthetic quartz glass and having <=10 Å surface roughness (Ra), <=0.03 μm/500μm× 500 μm surface waviness by PV value, <=1 μm/100 mmϕ parallel degree, and <=2 μm/100 mmϕ flatness degree. SOLUTION: This method includes a process to polish a substrate material consisting of synthetic quartz glass by using a double-face plane polishing machine equipped with an elastic deforming means. The elastic deforming means is interposed between an upper surface plate and a doughnut plate suspended from the upper surface plate and elastically deforming the substrate material by gravity. Thus, the objective precision substrate consisting of synthetic quartz glass having <=10 Å surface roughness (Ra), <=0.03 μm/500 μm ×500μm surface waviness by PV value, <=1 μm/100 mmϕparallel degree and <=2 μm/100 mmϕ flatness degree is obtained.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、超音波磁性材によ
る弾性波を利用する弾性波素子用基板、光磁気記録用基
板等の光および磁気媒体用精密基板とその製造方法に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a precision substrate for optical and magnetic media, such as a substrate for an elastic wave element and a substrate for magneto-optical recording, utilizing an elastic wave generated by an ultrasonic magnetic material, and a method of manufacturing the same.

【0002】[0002]

【従来の技術】光および磁気媒体に於いてその集積度が
益々高度化するに従って光および磁気媒体用基板材質の
固有の物性および加工精度が集積度の高度化の成否を左
右することが明らかになって来ている。
2. Description of the Related Art As the degree of integration of optical and magnetic media increases, it is clear that the inherent physical properties and processing accuracy of substrate materials for optical and magnetic media will determine the success or failure of the degree of integration. It is becoming.

【0003】例えば、磁気ディスクにおいては近年記録
媒体として急速に需要が拡大するにつれてアルミ合金、
化学強化ガラス、結晶化ガラス等各種基板材が開発され
て来た。
[0003] For example, in the case of magnetic disks, aluminum alloys,
Various substrate materials such as chemically strengthened glass and crystallized glass have been developed.

【0004】この材質の変遷は記録密度の向上を目的と
しており、必然的に使用条件が変わって来ている。それ
に伴って基板の要求特性も変わってきた。すなわち、光
および磁気媒体用精密基板の新仕様に対応する材料特性
とその加工方法は従来技術の延長線上でなく、基板材質
の持つ特性とその材質に合った加工方法を新規に創設す
ることが課題となっている。
[0004] This change in material is aimed at improving the recording density, and the use conditions are inevitably changing. Accordingly, the required characteristics of the substrate have changed. In other words, the material properties and the processing method corresponding to the new specification of the precision substrate for optical and magnetic media are not an extension of the conventional technology, but the characteristics of the substrate material and the processing method that matches the material must be newly created. It has become a challenge.

【0005】[0005]

【発明が解決しようとする課題】上記の事情から今後開
発されるべき光および磁気媒体用基板に要求される諸条
件を列挙すると次のとおりである。
From the above situation, various conditions required for a substrate for optical and magnetic media to be developed in the future are listed as follows.

【0006】(1)回転を必要とする記録媒体用基板に
おいては、トライポロジーの観点から基板の平面度(平
坦度)を2μm/100mmφ以下にすることが必要と
なって来る。
(1) In the case of a recording medium substrate that requires rotation, it is necessary to reduce the flatness (flatness) of the substrate to 2 μm / 100 mmφ or less from the viewpoint of tribology.

【0007】(2)垂直磁気記録の分野においては、今
後磁性膜の厚さを0.02〜0.05μmにする必要が
生じている。この磁性膜のアンダーコートは0.1〜
0.5μmであり、磁性膜蒸着時の基板加熱温度は50
0℃以上が必要とされている。基板の平面度(平坦度)
は少くとも膜厚の2〜3倍以内であることが必要とされ
ていることおよび上記温度での加熱による基板の反りを
考慮すると、基板の平面度は2μm/100mmφ以
下、表面うねりは0.03μm/500μm×500μ
m以下にする必要がある。また記録再生ヘッドの低浮上
化に伴い基板の表面粗さ(Ra)を10Å以下にする必
要がある。
(2) In the field of perpendicular magnetic recording, it is necessary to reduce the thickness of the magnetic film to 0.02 to 0.05 μm in the future. The undercoat of this magnetic film is 0.1 ~
0.5 μm, and the substrate heating temperature during magnetic film deposition was 50 μm.
0 ° C. or higher is required. Substrate flatness (flatness)
In consideration of the fact that the thickness of the substrate is required to be at least 2 to 3 times the film thickness and the warpage of the substrate caused by heating at the above temperature, the flatness of the substrate is 2 μm / 100 mmφ or less, and the surface waviness is 0. 03μm / 500μm × 500μ
m or less. In addition, the surface roughness (Ra) of the substrate must be reduced to 10 ° or less as the flying height of the recording / reproducing head decreases.

【0008】(3)磁気媒体用基板の一種として、超音
波磁性材(例:パーマロイ)による弾性波を利用する表
面弾性波素子用基板が、たとえば特開平5−14115
号公報および特開平6−350368号公報等に開示さ
れた超音波遅延媒体(基板)等で知られている。これら
の弾性波素子用基板および光磁気記録用基板において
は、基板の厚さ方向に対する超音波および光の正確な伝
播のために、基板の平行度は伝播の方向性を支配する決
定的因子である。また弾性波素子を極小化して装置をコ
ンパクトにする等の目的で厚さ0.5〜1.0mm程度
の極めて薄い弾性波素子用基板の表面と裏面の間で超音
波の反射を正確に行わせるためには基板の平行度に加え
てその表面と裏面の間の平面度が極めて重要になって来
る。このため、今後開発される超音波遅延媒体等の弾性
波素子用基板においては、1μm/100mmφ以下の
平行度および2μm/100mmφ以下の平面度が必要
になって来る。このような基板の条件は回転を必要とす
る場合も必要としない場合も同様である。
(3) As one type of a substrate for a magnetic medium, a substrate for a surface acoustic wave element utilizing an elastic wave of an ultrasonic magnetic material (eg, permalloy) is disclosed in, for example, Japanese Patent Application Laid-Open No. 5-111515.
And an ultrasonic delay medium (substrate) disclosed in JP-A-6-350368 and the like. In these elastic wave element substrates and magneto-optical recording substrates, the parallelism of the substrate is a decisive factor that governs the direction of propagation for accurate propagation of ultrasonic waves and light in the thickness direction of the substrate. is there. Also, for the purpose of minimizing the acoustic wave device and making the device compact, the ultrasonic wave is accurately reflected between the front surface and the back surface of the extremely thin acoustic wave device substrate having a thickness of about 0.5 to 1.0 mm. To achieve this, the flatness between the front surface and the back surface becomes extremely important in addition to the parallelism of the substrate. Therefore, a substrate for an elastic wave element such as an ultrasonic delay medium to be developed in the future will require a parallelism of 1 μm / 100 mmφ or less and a flatness of 2 μm / 100 mmφ or less. Such substrate conditions are the same whether rotation is required or not.

【0009】(4)記録密度向上に垂直磁性膜の特性を
発揮するには、磁性材の固有物性の極限まで求められる
に至り、基板材の化学成分中に磁性膜特性の劣化成分を
含まないこと、また不純物として劣化成分を含有しない
ことが望まれている。
(4) In order to exhibit the characteristics of a perpendicular magnetic film for improving the recording density, it is required to reach the limit of the intrinsic physical properties of the magnetic material, and the chemical component of the substrate material does not include a component deteriorating the characteristics of the magnetic film. In addition, it is desired that a deteriorating component is not contained as an impurity.

【0010】(5)基板材料の化学成分のみならず、成
分の均質性が求められ、偏在および粒界等のないアモー
ファスな材料が望まれるに至っている。
(5) In addition to the chemical components of the substrate material, homogeneity of the components is required, and an amorphous material free from uneven distribution and grain boundaries has been desired.

【0011】(6)回転を必要とする基板材質は、高速
回転に耐えうる機械特性を有することが望まれている。
(6) It is desired that a substrate material requiring rotation has mechanical properties that can withstand high-speed rotation.

【0012】(7)基板材質は、高密度化に伴って洗
浄、エッチング等に耐えうる化学的耐久性を有すること
が望まれている。
(7) It is desired that the substrate material has chemical durability that can withstand cleaning, etching, and the like as the density increases.

【0013】上記(1)〜(7)の条件に対応可能な基
板材料を検討した場合、合成石英ガラスはSiO2 の単
一成分からなり、磁性膜特性を劣化させる組成成分また
は不純物を実質的に含有せず、均質で偏在および粒界等
がないアモーファスな材料であり、化学的耐久性にもす
ぐれている点で上記条件の中(4),(5),(7)を
充足する有望な材料である。しかしながら、その他の条
件の中(1)〜(3)について見ると、基板の表面粗さ
(Ra)は現在の研磨技術によって10Å以下とするこ
とが可能であるが、その他の必要条件であるPV値によ
る表面うねり0.03μm/500μm×500μm以
下、平行度1μm/100mmφ以下、平面度2μm/
100mmφ以下の超精密表面特性を有する合成石英ガ
ラス基板を得ることは従来の研磨技術によってはまった
く不可能であり、現状においてこれらの条件(1)〜
(3)を満すことはできない。また合成石英ガラスは剛
性比率(剛性率÷比重)が32.7でありこの程度の剛
性比率では6,000rpmを超える高速で回転された
場合基板に振動を生じ使用に耐えないので上記条件
(6)を満すことができない。
When examining a substrate material that can satisfy the above conditions (1) to (7), the synthetic quartz glass is composed of a single component of SiO 2 , and substantially contains a composition component or an impurity that deteriorates the magnetic film characteristics. Amorphous material that is homogeneous, free from uneven distribution and without grain boundaries, etc., and has excellent chemical durability. Promising to satisfy the above conditions (4), (5), (7) Material. However, looking at (1) to (3) among other conditions, the surface roughness (Ra) of the substrate can be reduced to 10 ° or less by the current polishing technology, but the other necessary condition, PV Surface undulation 0.03 μm / 500 μm × 500 μm or less, parallelism 1 μm / 100 mmφ or less, flatness 2 μm /
It is impossible to obtain a synthetic quartz glass substrate having an ultra-precision surface characteristic of 100 mmφ or less by a conventional polishing technique, and at present these conditions (1) to
(3) cannot be satisfied. Further, the synthetic quartz glass has a rigidity ratio (rigidity / specific gravity) of 32.7. At such a rigidity ratio, when the substrate is rotated at a high speed exceeding 6,000 rpm, the substrate vibrates and cannot be used. ) Can not be satisfied.

【0014】本発明は、上記の事情にかんがみてなされ
たものであって、上記条件(1)〜(3)および(6)
を充足することができる新規な光および磁気媒体用合成
石英ガラス基板およびその製造方法を提供しようとする
ものである。
The present invention has been made in view of the above circumstances, and has the above-mentioned conditions (1) to (3) and (6).
It is an object of the present invention to provide a novel synthetic quartz glass substrate for optical and magnetic media which can satisfy the above, and a method for producing the same.

【0015】[0015]

【課題を解決するための手段】本発明者は、従来この種
の基板の研磨に使用されて来た両面平面研磨機に新規な
構成を加えた研磨機による研磨工程を含む新規な製造方
法を使用することにより従来の研磨技術によっては不可
能であった表面うねり、平行度および平面度を有する新
規な合成石英ガラス基板を得ることに成功した。
The present inventor has developed a novel manufacturing method including a polishing step using a polishing machine in which a new structure is added to a double-sided plane polishing machine conventionally used for polishing such a substrate. By using this, a new synthetic quartz glass substrate having surface waviness, parallelism and flatness, which was impossible with conventional polishing techniques, was successfully obtained.

【0016】すなわち、本発明にかかる合成石英ガラス
からなる光および磁気媒体用精密基板は、表面粗さ(R
a)10Å以下、PV値による表面うねり0.03μm
/500μm×500μm以下、平行度1μm/100
mmφ以下、平面度2μm/100mmφ以下であるこ
とを特徴とするものである。
That is, the precision substrate for optical and magnetic media made of synthetic quartz glass according to the present invention has a surface roughness (R).
a) 10 ° or less, surface waviness due to PV value 0.03 μm
/ 500μm × 500μm or less, parallelism 1μm / 100
mmφ or less and a flatness of 2 μm / 100 mmφ or less.

【0017】また、本発明にかかる合成石英ガラスから
なる光および磁気媒体用精密基板の製造方法は、従来上
定盤と上定盤吊りドーナツ盤との間に上定盤の自重によ
る撓みで生じる弾性変形が締め付けボルト10の支点P
(図4)より急激に生じていたものを上定盤吊りドーナツ
盤と上定盤との間に領域を支点Pより上定盤の内周側に
広げる弾性変形手段を介装した両面平面研磨機によっ
て、合成石英ガラスからなる基板機を研磨することによ
り、表面粗さ(Ra)10Å以下、PV値による表面う
ねり0.03μm/500μm×500μm以下、平行
度1μm/100mmφ以下、平面度2μm/100m
mφ以下の特性を得ることのできる合成石英ガラスから
なる光および磁気媒体用精密基板の製造方法である。
Further, the method of manufacturing a precision substrate for optical and magnetic media made of synthetic quartz glass according to the present invention is conventionally caused between the upper platen and the upper platen hanging donut plate due to bending of the upper platen due to its own weight. Elastic deformation is the fulcrum P of the tightening bolt 10
(FIG. 4) Double-sided surface polishing with elastic deformation means interposed between the upper platen and the donut plate and the upper platen, the elastic deformation means for expanding the area from the fulcrum P to the inner peripheral side of the upper platen. By polishing a substrate machine made of synthetic quartz glass with a machine, the surface roughness (Ra) is 10 ° or less, the surface undulation by PV value is 0.03 μm / 500 μm × 500 μm or less, the parallelism is 1 μm / 100 mmφ or less, and the flatness is 2 μm / 100m
This is a method for manufacturing a precision substrate for optical and magnetic media made of synthetic quartz glass capable of obtaining characteristics of mφ or less.

【0018】[0018]

【作用】本発明にかかる基板は、PV値による表面うね
りが0.03μm/500μm×500μm以下、平行
度が1μm/100mmφ以下、平面度が2μm/10
0mmφ以下であることにより、回転を必要とする記録
媒体用基板として使用される場合はトライポロジーが少
く、垂直磁気記録用基板としても優れた性能を発揮する
ことができる。また弾性波素子用基板として使用される
場合は厚さ0.5〜1.0mm程度の極めて薄い基板と
して使用することが可能となり、装置の小型化等に寄与
することができる。さらに、本発明にかかる基板は、上
記の表面特性を有することにより、剛性比率が小さいに
もかかわらず、7,000rpmで回転しても振動が発
生せず高速回転に対処することができる。したがって、
本発明によれば、次世代の光および磁気媒体用基板に要
求される諸条件のすべてを充足する優れた合成石英製光
および磁気媒体用基板が提供される。
The substrate according to the present invention has a surface undulation of 0.03 μm / 500 μm × 500 μm or less, a parallelism of 1 μm / 100 mmφ or less, and a flatness of 2 μm / 10 or less.
When the thickness is 0 mmφ or less, when used as a substrate for a recording medium that requires rotation, tribology is small, and excellent performance can be exhibited as a substrate for perpendicular magnetic recording. When used as a substrate for an elastic wave element, it can be used as an extremely thin substrate having a thickness of about 0.5 to 1.0 mm, which can contribute to miniaturization of the apparatus. Further, since the substrate according to the present invention has the above-mentioned surface characteristics, it can cope with high-speed rotation without generating vibration even when rotated at 7,000 rpm, despite its low rigidity ratio. Therefore,
According to the present invention, there is provided an excellent synthetic quartz optical and magnetic medium substrate that satisfies all of the conditions required for a next-generation optical and magnetic medium substrate.

【0019】また本発明にかかる基板の製造方法によれ
ば、従来実現することが不可能であった上記表面特性を
備えた合成石英ガラスからなる光および磁気媒体用精密
基板を製造することができる。
Further, according to the method of manufacturing a substrate according to the present invention, it is possible to manufacture a precision substrate for optical and magnetic media made of synthetic quartz glass having the above-mentioned surface characteristics, which has been impossible to realize conventionally. .

【0020】[0020]

【発明の実施の形態】以下添付図面を参照して本発明の
実施の形態について説明する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.

【0021】本発明の合成石英ガラス基板は新規な両面
平面研磨機による研磨工程を含む製造方法によってはじ
めて実現されたものであるので、この新規な両面平面研
磨機について説明する。まず理解の便のため、従来の両
面平面研磨機について図5〜図7を参照して説明する。
Since the synthetic quartz glass substrate of the present invention has been realized for the first time by a manufacturing method including a polishing step using a novel double-sided plane polishing machine, this novel double-sided plane polishing machine will be described. First, for convenience of understanding, a conventional double-sided surface polishing machine will be described with reference to FIGS.

【0022】従来の両面平面研磨機は、その要部を図5
の断面図および図7の部分斜視図に示すように、上定盤
2、下定盤3、上定盤駆動部4、上定盤駆動部4に回転
自在に嵌合したサンギヤ5、下定盤3の外周側に設けら
れたインターナルギヤ6、サンギヤ5およびインターナ
ルギヤ6とそれぞれ噛合する歯車として形成され被加工
物7が収容される孔8a(図7)を有するキャリヤ8を
備えている。キャリヤ8は通常4ないし6個配置される
が図7においては簡略化のため1個のキャリヤのみが示
されている。被加工物7はキャリヤ8の孔8a内に収容
され、キャリヤ8より厚いため、キャリヤ8の上面から
上方に突出して配置される。研磨作業の際、被加工物7
の上面および下面は上定盤2の下面および下定盤3の上
面に密着する。上定盤2の下面および下定盤3の上面に
はそれぞれ研摩布が貼着けられている。
FIG. 5 shows a main part of a conventional double-sided surface polishing machine.
7 and a partial perspective view of FIG. 7, an upper surface plate 2, a lower surface plate 3, an upper surface plate drive unit 4, a sun gear 5 rotatably fitted to the upper surface plate drive unit 4, and a lower surface plate 3. And a carrier 8 having holes 8a (FIG. 7) formed as gears meshing with the internal gear 6, the sun gear 5 and the internal gear 6, respectively, provided on the outer peripheral side of the gear 8 and accommodating the workpiece 7. Usually, four to six carriers 8 are arranged, but in FIG. 7, only one carrier is shown for simplification. The workpiece 7 is accommodated in the hole 8a of the carrier 8 and is thicker than the carrier 8, so that the workpiece 7 is arranged to protrude upward from the upper surface of the carrier 8. During the polishing operation, the workpiece 7
Are in close contact with the lower surface of the upper surface plate 2 and the upper surface of the lower surface plate 3. A polishing cloth is attached to the lower surface of the upper stool 2 and the upper surface of the lower stool 3, respectively.

【0023】図6は上記従来の両面研磨機1の上定盤2
および上定盤吊りドーナツ盤9の部分のみを示す平面図
である。上定盤2は中心に上定盤駆動部4よりも僅かに
大径の中心孔2aを有し、該駆動部4に嵌合する。この
中心孔2aの周方向に所定の間隔をおいて複数(図示の
例では4)の高さ方向に延長する爪2bを備えている。
一方上定盤駆動部4の周囲には、図7に示すように爪2
bに対応する溝4aが形成されており、上定盤2の爪2
bが溝4aに嵌合することにより、上定盤2は上定盤駆
動部4の回転により上定盤駆動部4と一体的に回転す
る。
FIG. 6 shows an upper surface plate 2 of the conventional double-side polishing machine 1.
FIG. 3 is a plan view showing only a part of the upper platen hanging donut board 9. The upper stool 2 has a center hole 2a slightly larger in diameter than the upper stool drive unit 4 at the center, and is fitted to the drive unit 4. A plurality (four in the illustrated example) of claws 2b are provided at predetermined intervals in the circumferential direction of the center hole 2a and extend in the height direction.
On the other hand, as shown in FIG.
b is formed, and the claw 2 of the upper surface plate 2 is formed.
The upper platen 2 rotates integrally with the upper platen drive unit 4 by the rotation of the upper platen drive unit 4 by fitting the b into the groove 4 a.

【0024】上定盤2の上面には上定盤2よりも小径
(例えば上定盤の約60%の径)の金属製ドーナツ状円
板からなる上定盤吊りドーナツ盤9が密着して同心に配
置され、周方向に適宜に間隔(図示の例では90度間
隔)でボルト10により上定盤2に締着されている。こ
の上定盤吊りドーナツ盤9には複数(図示の例では4
本)の上定盤吊り支柱11の下端部が固定されており、
これら上定盤吊り支柱11の上端部は被加工物に研磨液
を供給するパウダーリング12の下面に固定されてい
る。上定盤2の外周部には複数の貫通孔2cが穿設さ
れ、これら貫通孔2cはパウダーリングに内部とホース
13によって接続されており、パウダーリング12内部
の研磨液はホース13、貫通孔2cを介して被加工物7
に供給される。
On the upper surface of the upper surface plate 2, an upper surface plate hanging donut plate 9 made of a metal donut-shaped disk having a smaller diameter than the upper surface plate 2 (for example, a diameter of about 60% of the upper surface plate) is in close contact. They are arranged concentrically and fastened to the upper surface plate 2 by bolts 10 at appropriate intervals in the circumferential direction (90 ° intervals in the illustrated example). The upper surface plate hanging donut board 9 has a plurality (4 in the illustrated example).
The lower end of the upper platen hanging column 11 is fixed,
The upper ends of the upper platen suspension columns 11 are fixed to the lower surface of a powder ring 12 for supplying a polishing liquid to the workpiece. A plurality of through-holes 2c are formed in the outer peripheral portion of the upper platen 2. These through-holes 2c are connected to the inside of the powder ring by a hose 13, and the polishing liquid inside the powder ring 12 passes through the hose 13, the through-hole. Workpiece 7 via 2c
Supplied to

【0025】パウダーリング12にはその上方に配設さ
れたエアシリンダ16のピストンロッド14が固定され
ており、エアシリンダ16の操作により上定盤2が昇降
されるように構成されている。エアシリンダ16は研磨
作業中被加工物7を所定の研磨圧力で研磨できるように
上定盤2を上定盤吊りドーナツ盤9を介して吊り下げ、
総荷重を調整できるようになっている。
A piston rod 14 of an air cylinder 16 disposed above the powder ring 12 is fixed, and the upper platen 2 is raised and lowered by operating the air cylinder 16. The air cylinder 16 suspends the upper stool 2 via the upper stool donut board 9 so that the workpiece 7 can be polished at a predetermined polishing pressure during the polishing operation.
The total load can be adjusted.

【0026】上定盤駆動部4、下定盤3、サンギヤ5、
インターナルギヤ6の4者はそれぞれの駆動機構により
回転駆動され、上定盤2は下定盤3と反対方向に駆動さ
れ、インターナルギヤ6は上定盤2と反対方向に駆動さ
れ、キャリヤ8はサンギヤ5とインターナルギヤ6の回
転比によって下定盤3の同一方向に移動しながら時計方
向または反時計方向の自転をするように構成されてい
る。
The upper platen driving unit 4, the lower platen 3, the sun gear 5,
The four internal gears 6 are rotationally driven by respective drive mechanisms, the upper stool 2 is driven in the opposite direction to the lower stool 3, the internal gear 6 is driven in the opposite direction to the upper stool 2, and the carrier 8 Is configured to rotate clockwise or counterclockwise while moving in the same direction of the lower platen 3 depending on the rotation ratio of the sun gear 5 and the internal gear 6.

【0027】次に、図1〜図4を参照して本発明の製造
方法に使用される新規な両面平面研磨機について説明す
る。
Next, a new double-sided plane polishing machine used in the manufacturing method of the present invention will be described with reference to FIGS.

【0028】図1は本発明の製造方法に使用される研磨
機の要部を示す図5と同様の断面図、図2は上定盤と上
定盤吊りドーナツ盤の平面図、図4は上定盤と上定盤吊
りドーナツ盤の一部を拡大して示す断面図、図3は図4
との対比のため図5に示す従来の研磨機の上定盤と上定
盤吊りドーナツ盤の一部を拡大して示す断面図である。
FIG. 1 is a sectional view similar to FIG. 5 showing a main part of a polishing machine used in the manufacturing method of the present invention, FIG. 2 is a plan view of an upper platen and an upper platen hanging donut plate, and FIG. FIG. 3 is an enlarged sectional view showing an upper surface plate and a part of the upper surface plate hanging donut plate, and FIG.
FIG. 6 is an enlarged cross-sectional view showing a part of the upper platen and the upper platen hanging donut plate of the conventional polishing machine shown in FIG. 5 for comparison with FIG.

【0029】図1、図2、図4に示す研磨機において、
図5の従来の研磨機と同一の構成要素は同一符号で示し
説明を省略する。
In the polishing machine shown in FIGS. 1, 2 and 4,
The same components as those of the conventional polishing machine of FIG. 5 are denoted by the same reference numerals, and description thereof will be omitted.

【0030】本研磨機においては、弾性変形手段として
ネオプレンゴム等のゴムや合成樹脂等の弾性材料からな
る所定の厚みを有する弾性材ドーナツ盤15を使用して
いる。弾性材ドーナツ盤15は上定盤吊りドーナツ盤9
とほぼ同径に形成されており、該ドーナツ盤9と上定盤
2との間にドーナツ盤9と同心に配置される。弾性材
は、上定盤2の剛性による弾力および種々の研摩布の研
磨時圧力によって生じる弾力と対応する弾力を持つ材質
のものを選択する。
In this polishing machine, an elastic donut disk 15 having a predetermined thickness made of an elastic material such as rubber such as neoprene rubber or a synthetic resin is used as an elastic deformation means. The elastic material donut board 15 is an upper surface plate hanging donut board 9
, And is arranged concentrically with the donut board 9 between the donut board 9 and the upper surface plate 2. As the elastic material, a material having an elasticity corresponding to the elasticity caused by the rigidity of the upper stool 2 and the elasticity generated by the polishing pressure of various polishing cloths is selected.

【0031】上定盤吊りドーナツ盤9の周方向には適宜
の間隔(図示の例では90度間隔)で厚み方向にボルト
挿通孔9a(図4)が穿設されており、弾性材ドーナツ
盤15にもボルト挿通孔9aと連通するボルト挿通孔1
5aが穿設されている。また上定盤2の上面のボルト挿
通孔9a,15aに対応する位置にはねじ穴2dが形成
されている。各挿通孔9a,15aにはボルト20が挿
通され、ボルト20の先端部20aは上定盤2のねじ穴
2dに螺合している。またボルトヘッド20bと上定盤
吊りドーナツ盤9の上面との間には板ばねからなる公知
の弾性ワッシャ21が装着されており、ボルト20を締
め込むことにより上定盤吊りドーナツ盤9は弾性材ドー
ナツ盤15を介して上定盤2に締着されている。弾性ワ
ッシャ21ばボルト20の締付力を調整することにより
弾性材ドーナツ盤15の圧縮度を調節する機能を有する
とともに、上定盤吊りドーナツ盤9の回転運動に伴う機
械的振動によるボルト20の緩みを防止する機能を有す
る。なお弾性ワッシャとしては上記の板ばねからなるも
のに限らず、ゴムリング等他の弾性ワッシャを用いても
よい。
A bolt insertion hole 9a (FIG. 4) is formed in the thickness direction at an appropriate interval (in the illustrated example, at an interval of 90 degrees) in the circumferential direction of the upper surface plate hanging donut board 9. 15 also has a bolt insertion hole 1 communicating with the bolt insertion hole 9a.
5a is drilled. A screw hole 2d is formed at a position on the upper surface of the upper surface plate 2 corresponding to the bolt insertion holes 9a and 15a. A bolt 20 is inserted into each of the insertion holes 9a and 15a, and a tip portion 20a of the bolt 20 is screwed into a screw hole 2d of the upper surface plate 2. A well-known elastic washer 21 made of a leaf spring is mounted between the bolt head 20b and the upper surface of the upper platen hanging donut plate 9. When the bolt 20 is tightened, the upper platen hanging donut plate 9 becomes elastic. It is fastened to the upper platen 2 via a material donut plate 15. The elastic washer 21 has a function of adjusting the compression degree of the elastic material donut board 15 by adjusting the tightening force of the bolt 20, and has a function of adjusting the compression degree of the elastic material donut board 15, and the mechanical vibration of the upper platen hanging donut board 9 due to the rotational motion of the bolt 20. Has a function to prevent loosening. The elastic washer is not limited to the one made of the above-described leaf spring, and another elastic washer such as a rubber ring may be used.

【0032】次に本発明の製造方法に使用される新規な
研磨機の作用を図3に示す従来の研磨機の作用と対比し
て説明する。
Next, the operation of the novel polishing machine used in the manufacturing method of the present invention will be described in comparison with the operation of the conventional polishing machine shown in FIG.

【0033】本発明者は、従来の研磨機では被加工物を
1μm/100mmφ以下の平行度、2μm/100m
mφ以下の平面度および0.03μm/500μm×5
00μm以下の表面うねりに研磨することができない理
由を考究した結果、従来の研磨機においては、上定盤2
が上定盤吊りドーナツ盤9にボルト10により締結され
る点Pよりも外周側の上定盤2の部分2eが自重により
P点を始点として下方(矢印A方向)にたわみ、このた
め上定盤の外周側(インターナルギヤ6に最も近い側)
に位置する被加工物7に加わる研磨圧力が外周側に向け
て漸増するようになり、P点の内周側と外周側との研磨
圧力の均等性が損なわれる。その結果、上記所望の平行
度、平面度および表面うねりが得られなくなることを見
出した。この発見にもとずき、本発明の製造方法におい
ては、上定盤吊りドーナツ盤9と上定盤2との間に上定
盤2の自重によるたわみによって弾性変形する弾性変形
手段を介装することによって問題を解決することに成功
したものである。
The inventor of the present invention has found that, with the conventional polishing machine, the parallelism of not more than 1 μm / 100 mmφ is 2 μm / 100 m.
Flatness less than mφ and 0.03 μm / 500 μm × 5
As a result of studying the reason why the surface cannot be polished to a surface undulation of 00 μm or less, in the conventional polishing machine, the upper platen 2
Is bent downward (in the direction of arrow A) from the point P as a starting point due to its own weight, due to its own weight, the portion 2e of the upper platen 2 on the outer peripheral side of the point P fastened to the upper platen hanging donut plate 9 by the bolts 10. Outer side of panel (side closest to internal gear 6)
The polishing pressure applied to the workpiece 7 located at the point P gradually increases toward the outer peripheral side, and the uniformity of the polishing pressure between the inner peripheral side and the outer peripheral side at the point P is impaired. As a result, it has been found that the desired parallelism, flatness and surface undulation cannot be obtained. Based on this discovery, in the manufacturing method of the present invention, an elastic deformation means that is elastically deformed by the deflection of the upper surface plate 2 due to its own weight is interposed between the upper surface plate hanging donut plate 9 and the upper surface plate 2. And succeeded in solving the problem.

【0034】すなわち、図4に示す本発明の製造方法に
使用する研磨機においては、上定盤2は、図3の場合と
異り、弾性変形手段を構成する弾性材ドーナツ盤15の
ボルト20よりも内周側の部分が上定盤2の下方へのた
わみによって図中点線Bで示すように内周側に向けて圧
縮量を漸増するようにして圧縮されることにより、上定
盤2の下方へのたわみの始点はP点から上定盤2の内周
側のQ点に向ってシフトし、上定盤2は図3の場合に比
べて全体としてなだらかにたわむことになり、また上定
盤2は外周側の被加工物7の反力により弾性材ドーナツ
盤15を圧縮するようにして上動することができ、その
結果上定盤2の外周側に位置する被加工物7に加わる過
大な研磨圧力を全周にわたって緩和することができる。
That is, in the polishing machine used in the manufacturing method of the present invention shown in FIG. 4, the upper platen 2 is different from the case of FIG. 3 in that the bolt 20 of the elastic donut disk 15 constituting the elastic deformation means is provided. The lower part of the upper surface plate 2 is compressed by the downward bending of the upper surface plate 2 so as to gradually increase the amount of compression toward the inner surface side as shown by a dotted line B in the figure. The starting point of the downward bending of the upper platen shifts from the point P toward the point Q on the inner peripheral side of the upper platen 2, and the upper platen 2 bends more smoothly than the case of FIG. The upper platen 2 can move upward by compressing the elastic donut disk 15 by the reaction force of the workpiece 7 on the outer peripheral side. As a result, the workpiece 7 located on the outer peripheral side of the upper platen 2 can be moved. Excessive polishing pressure applied to the substrate can be reduced over the entire circumference.

【0035】またこの弾性材ドーナツ盤15を介在させ
ることにより、エアシリンダ16の微細な上下方向の位
置変化や上下定盤2,3、サンギヤ5、インターナルギ
ヤ6等の各回転部の回転に伴い発生する振動を吸収する
ことができる。換言すれば、これらの諸原因によって生
じた駆動時の被加工物7への圧力の変動を平均化するた
めに力学的に一種のダッシュポット機構を想定した場合
と同様の効果を得ることができる弾性変形手段を上定盤
吊りドーナツ盤9と上定盤2との間に介装することによ
り、その複合的効果として被加工物を1μm/100m
mφ以下の平行度、2μm/100mmφ以下の平面度
および0.03μm/500μm×500μm以下の表
面うねりに研磨することができるのである。
Further, by interposing the elastic material donut disk 15, it is possible to control the fine vertical position change of the air cylinder 16 and the rotation of each rotating part such as the upper and lower plates 2 and 3, the sun gear 5, and the internal gear 6. The accompanying vibration can be absorbed. In other words, it is possible to obtain the same effect as when a kind of dashpot mechanism is mechanically assumed in order to equalize the fluctuation of the pressure applied to the workpiece 7 during driving caused by these various causes. By interposing an elastic deformation means between the upper surface plate hanging donut wheel 9 and the upper surface plate 2, the work to be processed is 1 μm / 100 m as a combined effect.
It can be polished to a parallelism of mφ or less, a flatness of 2 μm / 100 mmφ or less, and a surface waviness of 0.03 μm / 500 μm × 500 μm or less.

【0036】ボルト20の配設位置(上定盤2の吊り位
置)は実験の結果上定盤2の半径の55〜57%の半径
を有する上定盤2と同心の円の円周上にある時最良の平
行度と平面度が得られることが判明した。
The positions of the bolts 20 (hanging positions of the upper stool 2) are determined on the circumference of a circle concentric with the upper stool 2 having a radius of 55 to 57% of the radius of the upper stool 2 as a result of the experiment. At one time it was found that the best parallelism and flatness were obtained.

【0037】次に上記研磨機を使用して本発明の合成石
英ガラス基板を研磨する1実施例について説明する。
Next, one embodiment of polishing the synthetic quartz glass substrate of the present invention using the above-mentioned polishing machine will be described.

【0038】12B両面平面研磨機のFCD45製上定
盤(半径435mm)を上記弾性材ドーナツ盤(半径2
74mm、厚さ2mm、ネオプレンゴム製)を介して上
定盤(吊りドーナツ盤(半径274mm)に4本のボル
トで締結した両面平面研磨機を使用する本発明の製造方
法の実施例と弾性材ドーナツ盤を使用せず上記と同一の
上定盤を直接上記と同一の上定盤吊りドーナツ盤に4本
のボルトで締結した比較例を用意した。ボルトの取付位
置はいずれも上定盤半径の55%の半径を有する円の円
周上であった。二次研磨剤として平均粒径0.4〜0.
6μmの酸化セリウム研磨剤を使用し、最終研磨剤とし
てコロイダルシリカを使用し、凝集防止剤としてグリセ
リンを併用した。研摩布はシーガルMD−1800を使
用した。被加工物(研磨対象)として、VAD法により
製造した住金石英(株)製SK−1300の合成石英ガ
ラス基板(基板サイズ100mmφ×0.8t)を選
び、18枚/バッチ、研磨時間60分、研磨枚数180
枚の研磨条件で研磨を行った。二次研磨加工後における
平行度、平面度および表面うねりは次表に示すとおりで
ある。なお、表面うねりはPV値μm/500μm×5
00μmの値である。
An upper surface plate (radius 435 mm) made of FCD45 of a 12B double-sided surface polishing machine was replaced with the above-mentioned elastic material donut disk (radius 2).
Example of the manufacturing method of the present invention using a double-sided plane polishing machine fastened to an upper surface plate (suspending donut machine (radius: 274 mm)) with four bolts via 74 mm, thickness 2 mm, made of neoprene rubber and elastic material A comparative example was prepared in which the same upper platen as above was directly attached to the same upper platen hanging donut plate with four bolts without using a donut plate. Of the circle having a radius of 55% of the average particle size of 0.4 to 0.1 as a secondary abrasive.
A 6 μm cerium oxide abrasive was used, colloidal silica was used as the final abrasive, and glycerin was also used as an anti-agglomeration agent. The polishing cloth used was Seagull MD-1800. As a workpiece (polishing target), a synthetic quartz glass substrate (substrate size 100 mmφ × 0.8 t) of SK-1300 manufactured by Sumikin Quartz Co., Ltd. manufactured by the VAD method was selected, and 18 wafers / batch, polishing time 60 minutes, Polishing number 180
Polishing was performed under the polishing conditions of one sheet. The parallelism, flatness, and surface waviness after the secondary polishing are as shown in the following table. The surface undulation is PV value μm / 500 μm × 5
The value is 00 μm.

【0039】[0039]

【表1】 以上の結果から、本発明の製造方法によれば1μm/1
00mmφ以下の平行度、2μm/100mmφ以下の
平面度および0.03μm/500μm×500μm以
下の表面うねりを有する合成石英ガラス基板を得ること
ができることが判る。
[Table 1] From the above results, according to the manufacturing method of the present invention, 1 μm / 1
It can be seen that a synthetic quartz glass substrate having a parallelism of 00 mmφ or less, a flatness of 2 μm / 100 mmφ or less, and a surface waviness of 0.03 μm / 500 μm × 500 μm or less can be obtained.

【0040】こうして二次研磨を終えた合成石英ガラス
基板に対し、研磨剤としてコロイダルシリカを使用し凝
集防止剤としてグリセリンを併用して最終研磨を行っ
た。最終研磨後の合成石英ガラス基板の表面粗さ(R
a)は0.47Åであった。
The synthetic quartz glass substrate after the secondary polishing was subjected to final polishing using colloidal silica as an abrasive and glycerin as an anti-agglomeration agent. Surface roughness of synthetic quartz glass substrate after final polishing (R
a) was 0.47 °.

【0041】この合成石英ガラス基板は剛性比率が3
2.7であるにもかかわらず7,000rpmで回転し
ても振動を生じることがなく、高速回転に充分対処する
ことが判った。
This synthetic quartz glass substrate has a rigidity ratio of 3
Although it was 2.7, no vibration was generated even if it was rotated at 7,000 rpm, and it was found that high-speed rotation was adequately dealt with.

【0042】上記実施例においては、研磨機の弾性変形
手段としてゴム・合成樹脂等の弾性材からなる弾性材ド
ーナツ盤を使用した例について説明したが、弾性変形手
段としてはこれに限らず、たとえば複数のコイルばねの
上端部を、上定盤吊りドーナツ盤の下面に、下端部を上
定盤の上面にそれぞれ当接するように構成した弾性変形
手段を使用してもよい。また弾性変形手段として多数の
弾性ワッシャを使用してもよく、エアクッションまたは
複数の小型エアシリンダを用いてもよく、要するに被加
工物のたわみを受けて弾性変形する材料または装置であ
れば特に制限はない。
In the above embodiment, an example was described in which an elastic donut disk made of an elastic material such as rubber or synthetic resin was used as the elastic deformation means of the polishing machine. However, the elastic deformation means is not limited to this. Elastic deformation means may be used in which the upper ends of the plurality of coil springs are in contact with the lower surface of the upper platen, and the lower ends are in contact with the upper surface of the upper platen. Further, a large number of elastic washers may be used as the elastic deformation means, and an air cushion or a plurality of small air cylinders may be used. In other words, a material or a device which elastically deforms due to bending of a workpiece is particularly limited. There is no.

【0043】本発明の合成石英ガラスからなる光および
磁気媒体用精密基板は、超音波遅延媒体等の弾性波素子
用基板のほか、光磁気記録用基板、ハードディスク等の
磁気情報記憶媒体用基板等に使用することができる。
The precision substrate for optical and magnetic media made of synthetic quartz glass of the present invention is not only a substrate for an elastic wave element such as an ultrasonic delay medium, but also a substrate for a magneto-optical recording medium and a substrate for a magnetic information storage medium such as a hard disk. Can be used for

【0044】[0044]

【発明の効果】以上述べたように、本発明にかかる基板
は、PV値による表面うねりが0.03μm/500μ
m×500μm以下、平行度が1μm/100mmφ以
下、平面度が2μm/100mmφ以下であることによ
り、回転を必要とする記録媒体用基板として使用される
場合はトライポロジーが少く、垂直磁気記録用基板とし
ても優れた性能を発揮することができる。また弾性波素
子用基板として使用される場合は厚さ0.5〜1.0m
m程度の極めて薄い基板として使用することが可能とな
り、装置の小型化等に寄与することができる。さらに、
本発明にかかる基板は、上記の表面特性を有することに
より、剛性比率が小さいにもかかわらず、7,000r
pmで回転しても振動が発生せず高速回転に対処するこ
とができる。したがって、本発明によれば、次世代の光
および磁気媒体用基板に要求される諸条件のすべてを充
足する優れた合成石英ガラス光および磁気媒体用基板が
提供される。
As described above, the substrate according to the present invention has a surface waviness based on the PV value of 0.03 μm / 500 μm.
When the substrate is used as a substrate for a recording medium that requires rotation, it has a small tribology and has a parallelism of 1 μm / 100 mmφ or less and a flatness of 2 μm / 100 mmφ or less. Can also exhibit excellent performance. When used as a substrate for an elastic wave device, the thickness is 0.5 to 1.0 m.
m can be used as a very thin substrate, which can contribute to miniaturization of the device. further,
Since the substrate according to the present invention has the above-mentioned surface characteristics, the substrate has a rigidity ratio of 7,000 r.
Even when rotating at pm, vibration does not occur and high-speed rotation can be dealt with. Therefore, according to the present invention, there is provided an excellent synthetic quartz glass optical and magnetic medium substrate that satisfies all of the conditions required for a next-generation optical and magnetic medium substrate.

【0045】また本発明にかかる基板の製造方法によれ
ば、従来実現することが不可能であった上記表面特性を
備えた合成石英からなる光および磁気媒体用精密基板を
製造することができる。
Further, according to the method of manufacturing a substrate according to the present invention, it is possible to manufacture a precision substrate for optical and magnetic media made of synthetic quartz having the above-mentioned surface characteristics, which has been impossible to realize conventionally.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の製造方法に使用する研磨機の1例の断
面図である。
FIG. 1 is a cross-sectional view of one example of a polishing machine used in a manufacturing method of the present invention.

【図2】図1の実施態様中上定盤と上定盤吊りドーナツ
盤の平面図である。
FIG. 2 is a plan view of the upper platen and the upper platen hanging donut plate in the embodiment of FIG. 1;

【図3】従来の研磨機の図4に対応する部分拡大断面図
である。
FIG. 3 is a partially enlarged sectional view corresponding to FIG. 4 of a conventional polishing machine.

【図4】図1の研磨機の部分拡大断面図である。FIG. 4 is a partially enlarged cross-sectional view of the polishing machine of FIG.

【図5】従来の研磨機の要部の断面図である。FIG. 5 is a sectional view of a main part of a conventional polishing machine.

【図6】図5の研磨機の中上定盤と上定盤吊りドーナツ
盤の平面図である。
FIG. 6 is a plan view of a middle upper platen and an upper platen hanging donut plate of the polishing machine of FIG. 5;

【図7】図5の研磨機の一部を示す斜視図である。FIG. 7 is a perspective view showing a part of the polishing machine of FIG. 5;

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 表面粗さ(Ra)10Å以下、PV値に
よる表面うねり0.03μm/500μm×500μm
以下、平行度1μm/100mmφ以下、平面度2μm
/100mmφ以下である合成石英ガラスからなる光お
よび磁気媒体用精密基板。
1. Surface roughness (Ra) 10 ° or less, surface waviness based on PV value 0.03 μm / 500 μm × 500 μm
Below, parallelism 1μm / 100mmφ or less, flatness 2μm
/ Precision substrate for optical and magnetic media made of synthetic quartz glass having a diameter of 100 mmφ or less.
【請求項2】 合成石英ガラスからなる基板材を上定盤
吊りドーナツ盤と上定盤との間に上定盤の自重によるた
わみによって弾性変形する弾性変形手段を介装した両面
平面研磨機によって研磨する工程を含む表面粗さ(R
a)10Å以下、PV値による表面うねり0.03μm
/500μm×500μm以下、平行度1μm/100
mmφ以下、平面度2μm/100mmφ以下である合
成石英ガラスからなる光および磁気媒体用精密基板の製
造方法。
2. A double-sided plane polishing machine in which an elastic deformation means for elastically deforming a substrate material made of synthetic quartz glass between an upper platen and a donut plate and an upper platen by the deflection of the upper platen by its own weight is provided. Surface roughness including polishing step (R
a) 10 ° or less, surface waviness due to PV value 0.03 μm
/ 500μm × 500μm or less, parallelism 1μm / 100
A method for producing a precision substrate for optical and magnetic media made of synthetic quartz glass having a diameter of not more than mmφ and a flatness of not more than 2 μm / 100 mmφ.
JP24148998A 1998-08-27 1998-08-27 Precision substrate for optical and magnetic medium and its production Pending JP2000076645A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24148998A JP2000076645A (en) 1998-08-27 1998-08-27 Precision substrate for optical and magnetic medium and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24148998A JP2000076645A (en) 1998-08-27 1998-08-27 Precision substrate for optical and magnetic medium and its production

Publications (1)

Publication Number Publication Date
JP2000076645A true JP2000076645A (en) 2000-03-14

Family

ID=17075089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24148998A Pending JP2000076645A (en) 1998-08-27 1998-08-27 Precision substrate for optical and magnetic medium and its production

Country Status (1)

Country Link
JP (1) JP2000076645A (en)

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