JP2000076447A - Pattern defect examining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently examine the presence/absence of defects generated continuously at the time of continuously patterning an object to be examined through the use of a mask pattern by the limited resolution, processing time and picture data size of an examining system. SOLUTION: During continuously patterning an object to be examined 12 by using the mask pattern 10, the examination objective area 12a of the patterned object 12 is divided into N-pieces and whenever the object 12 changes to next one, the divided areas 12b are examined in order to judge whether they are defective, can be defective, or are not defective. Thus the presence/ absence of the defects 20 continuously generated at the same places is examined in the pattern defect examining method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, the production of a shadow mask or the like, which continuously occurs due to a pattern defect (dust or dirt) in a process of continuously patterning using a mask pattern. The present invention relates to a pattern defect inspection method for inspecting a defect of an inspection object.

[0002]

2. Description of the Related Art Conventional pattern defect inspection methods include a method of inspecting the entire inspection target area, a method of inspecting only a predetermined area, and a method and apparatus for inspecting a plurality of samples by sampling. Continuous patterning (eg, exposure, development,
(Either of etching is applicable.) In order to efficiently inspect continuously occurring defects during so-called continuous manufacturing, the resolution must be insufficient, the processing time will not be enough, only defects in a certain area can be inspected, There were problems such as the inability to continuously inspect for defects at locations.

[0003]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a mask having a limited resolution, processing time and image data size of an inspection system. It is an object of the present invention to provide a method for efficiently inspecting for the presence or absence of continuously occurring defects during a step of continuously patterning an inspection object using a pattern.

[0004]

In order to achieve the above object, according to the present invention, there is provided a method for manufacturing a semiconductor device, comprising the steps of: Is divided into N pieces, and each time the object to be inspected is changed to the next one, the divided areas are inspected in order and determined to be defective or suspected to be defective or non-defective. This is a pattern defect inspection method characterized by inspecting for the presence or absence of a defect that occurs consecutively.

Further, in the invention according to the second aspect, when it is determined that the defective area is not defective, the divided areas are similarly re-inspected sequentially in the same manner. is there.

According to a third aspect of the present invention, there is provided the pattern defect inspection method according to the second aspect, wherein the re-inspection is a case where it is determined that the defect is defective or suspected to be defective.

In the invention of claim 4, the re-inspection is performed by another inspection system.
Or the pattern defect inspection method according to 3.

According to the invention of claim 5, during the continuous patterning of the inspection object from the mask pattern, the inspection object area of the patterned inspection object is divided into N regions, and one of the two inspection systems Each time the inspection object changes,
The divided areas are sequentially inspected, and if it is determined that the defect or defect is suspected, another inspection system having a high resolution inspects the defect or suspected portion in detail with another inspection system having a high resolution.
This is a pattern defect inspection method characterized by inspecting the presence or absence of a defect that continuously occurs in the same place.

Further, according to the present invention, during continuous patterning of the inspection object using the mask pattern, the inspection object area of the patterned inspection object is divided into N regions, and two inspection systems are formed. Inspection of different divided areas on the object to be inspected, and if it is determined to be defective or suspicious, a single inspection system inspects the defective or suspicious part in detail and uses the same location A pattern defect inspection method characterized by inspecting the presence or absence of defects that occur consecutively, and sequentially inspecting the divided areas each time the inspection object changes to the next one in another inspection system. It was done.

According to a seventh aspect of the present invention, there is provided the pattern defect inspection method according to any one of the first to sixth aspects, wherein the mask pattern is a plurality of mask patterns. is there.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the pattern defect inspection method of the present invention uses a mask pattern (10) while continuously patterning an inspection object (12) in a transport direction (P), that is, without interrupting continuous production. , For inspecting a defect (20) continuously occurring in the same place,
Examples of the object to be inspected include a shadow mask and a semiconductor lead frame, but are not limited thereto.

As described above, during the continuous production, by inspecting the presence or absence of the defect (20) continuously occurring at the same place on the inspection object (12), the cause of the defect (20) is determined during the production. It can be grasped, and in some cases, for example, in the case of dust on a mask pattern, it is possible to remove the cause of the defect without interrupting the production line.

Here, the pattern defect inspection method of the present invention is described as follows.
A description will be given using an example of the pattern defect inspection apparatus (1) according to the present invention shown in FIG. 3. First, an inspection object (1) which is continuously manufactured using a mask pattern (not shown) is used.
2) is imaged by a video camera (40). A mark indicating a reference position of the inspection object (12) is read by a mark detection unit (42), and the conveyance system control unit (60) and the conveyance system (46)
Determines the position of the inspection object (12) in the transport direction (P),
The position of the video camera (40) is determined by the stage control unit (70) and the automatic stage (44).
The region to be imaged in 0) is determined.

Subsequently, the image processing unit (9) uses the image data captured by the video camera (40) and the imaging control unit (80).
An inspection is performed at 0). Based on the result of this inspection, the imaging area of the inspection object (12) to be inspected next is determined by the stage control unit (70) and the transport system control unit (60). The relationship that determines the imaging region of each sample from the inspection result will be clarified in the following examples.

[0015]

Next, the present invention will be described more specifically with reference to examples. <Example 1> As shown in FIG. 1, a pattern defect inspection method was applied to a step of continuously exposing a strip-shaped steel plate for a shadow mask (18) using a mask pattern (10). That is, it is assumed that the object to be inspected (12) has been subjected to the pattern exposure for the shadow mask, and the inspection target area (12a) of the object to be inspected (12) is divided into nine, and the nine divided areas (12b) are obtained. did. During continuous patterning of the patterned shadow mask sample to be the inspection object (12), every time the sample changes to the next inspection object (12), 9
The divided area (12b) is inspected in order from the upper left side to the lower right side. In this inspection, when it was determined that the sample was defective or suspected to be defective, the same region was inspected also in some of the test objects (12) that came thereafter.

By inspecting whether or not a defect or a suspicion of a defect is continuously occurring in several inspection objects (12), a defect (20) continuously occurring in the same place is inspected. We were able to. In addition, when a defect does not occur continuously in the same place due to a defect of a mask pattern or the like but continuously occurs in the entire inspection target area or in a partial area, the defect continues in a certain specific area. Can be inspected.

<Embodiment 2> As shown in FIG.
The inspection target area (12a) of the sample of the shadow mask (inspection object (12)) is divided into nine areas to obtain nine divided areas (12b). The video camera (40) inspects one of the nine divided areas (12b) of the inspection target area (12a) every time the sample changes. If the region inspected by the video camera (40) is determined to be defective or suspected to be defective, the other video camera (4)
In 0a), even if the sample was changed, the area was continuously inspected. As a result, an inspection can be performed when a defect (20) continuously occurs in the same place or when a defect (20) continuously occurs in the entire inspection target region or a partial region.

<Embodiment 3> As shown in FIG.
The inspection target area (12a) of the sample of the shadow mask (inspection object (12)) is divided into nine areas to obtain nine divided areas (12b). One video camera (40) inspects one of the nine divided areas (12b) of the inspection target area (12a) every time the sample changes.
As a result, when it was determined that the sample was defective or suspected to be defective, the other video camera (40a) continuously inspected the area even if the sample changed. At this time, since the defect in the divided area (12b) or the part suspected to be defective is specified by the inspection with the first video camera (40), the other video camera (40a) The area to be imaged was small, and it was possible to image with high resolution.

<Embodiment 4> As shown in FIG.
The inspection target area (12a) of the sample of the shadow mask (inspection object (12)) is divided into nine areas to obtain nine divided areas (12b). The inspection target area (12a) is inspected by the two video cameras (40, 40a) in different divided areas (12b) each time the sample changes. As a result, if a defect or a suspicious defect is determined in an area inspected by one of the two video cameras, the other video camera (4)
The area is continuously inspected at 0a), and the first video camera (40) inspects one of the divided inspection areas each time the sample changes. This allows
If no defect has occurred, two video cameras (4
By inspecting different areas at 0 and 40a), it is possible to detect defects that occur consecutively at an early stage.

<Embodiment 5> As shown in FIG. 2, the present invention is applied to a step of simultaneously and continuously exposing a strip-shaped steel plate (18) for a shadow mask using three types of mask patterns (10a, 10b, 10c). Was applied. That is, three types of shadow mask patterns were exposed as the inspection object (12), and the inspection target area (12a) of each inspection object (12) was divided into nine.

Here, using a video camera (40), 3
The inspection object group (121) patterned with the kind of mask patterns (10a, 10b, 10c) is inspected independently, and each time the inspection object group (121) changes, nine divided areas are inspected in order. I went. As a result, each of the divided regions (12
In b1, 12b2, and 12b3), no defective or suspicious determination was made.

Next, the next inspection object group (122) was transported under the video camera (40), and each divided area (12b4, 12b5, 12b6) was inspected. At this time, a defect (28) is generated in the mask pattern (10b), and a defect (20) is continuously generated in the shadow mask patterned by using the mask pattern (10b). ) Was determined to be defective (20).

Next, the next inspection object group (123) was transported under the video camera (40), and each divided area (12b7, 12b8, 12b9) was inspected. Regarding the sample patterned using the mask pattern (10b), since the divided area (12b5) of this sample is determined to be defective, even if the sample is changed, the divided area (12b8) of the same area is changed. ) Was inspected. As described above, when a defect occurs, the region can be continuously inspected for each sample group manufactured with each pattern, and a defect that occurs continuously due to a mask pattern defect (28) can be inspected. Was.

<Embodiment 6> As shown in FIG.
Similarly, three types of mask patterns (10a, 10b, 1
0c), the inspection target area (12) of the shadow mask sample (inspection object group (121)) patterned using
a) was divided into 9 parts. The inspection target area (12a) was inspected using two video cameras (40, 40a) during the continuous patterning as described above. The imaging position of the first video camera (40) was moved every time the sample manufactured with each mask pattern was changed, and the nine divided areas were inspected in order.

Since it was determined that the region imaged by the video camera (40) was defective or suspected to be defective, the mask pattern from which the sample was manufactured was
The same area of several subsequent samples was examined sequentially. As described above, when a defect occurs, the region is continuously inspected for each of the three types of mask patterns (10a, 10b, 10c), and the defect (28) that continuously occurs due to a mask pattern defect (28) or the like. 20).

[0026]

According to the present invention, during continuous patterning of an object to be inspected using a mask pattern, when it is not possible to inspect all the objects to be inspected, mask pattern defects such as dust, scratches, etc. may occur. Continuously occurring defects can be inspected, and in some cases, defects can be removed without stopping the production line. In addition, since the number of processes required for one inspection is reduced, the production line can be stopped for a shorter time as compared with the conventional sampling inspection.

Further, when the sample is not determined to be defective, the divided areas are inspected in sequence each time the sample changes, and when the sample is determined to be defective, the areas are inspected continuously. Is a sampling inspection for the entire inspection target area with one cycle, and the latter inspection is a continuous inspection for an area where a defect is detected. in this way,
When the inspection target area that can be inspected by one inspection is limited, the inspection system can have the effects of the sampling inspection and the continuous inspection, and can inspect the defects that occur continuously.

Further, the pattern defect inspection method of the present invention comprises:
The inspection target area is divided into N, and in one inspection object, 1
Inspection of the two divided areas eliminates the need to inspect the entire inspection target area at one time unlike sampling inspection.
The processing required for one inspection can be reduced. For this reason, the time for stopping the production line can be reduced, and the apparatus can be simplified.

Further, inspection areas divided by one inspection system are sequentially inspected, and as a result, a region determined to be defective is inspected by another inspection system.
In the case of imaging with the latter inspection system, since the position of the defect is specified, the imaging region can be further limited, the size of the image data can be reduced, and the resolution can be increased.

In the case where the inspection object is continuously patterned using a plurality of mask patterns, the divided areas are inspected in order for each inspection object manufactured using each mask pattern, and it is determined that the inspection object is defective. In this case, similarly, by continuously inspecting the region for each inspection object manufactured with each pattern, it is possible to inspect for defects that occur continuously due to pattern defects or the like.

Therefore, according to the present invention, when it is impossible to inspect all the inspection areas during the manufacturing process for all the inspection objects such as shadow masks, a defect which continuously occurs due to a mask pattern defect or the like is eliminated. Inspection can be performed, and waste of raw materials can be suppressed.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram schematically showing an example of a pattern defect inspection method according to the present invention.

FIG. 2 is an explanatory view schematically showing another example of the pattern defect inspection method of the present invention.

FIG. 3 is a perspective view and a configuration diagram illustrating an embodiment of a pattern defect inspection apparatus according to the present invention.

[Explanation of symbols]

1 {pattern defect inspection apparatus 10} mask pattern 10a, 10b, 10c {three types of mask patterns 12} inspection object 12a {inspection target area 12b} divided areas 12b1, 12b2, 12b3, 12b4 , 12b5,
12b6, 12b7, 12b8, 12b9 {each divided region of inspection object group 121, 122, 123} inspection object group 18 {strip-shaped steel plate 20} inspection object defect 28} mask pattern defect 40 ‥‥ video camera 40a ‥‥ another video camera 44 ‥‥ automatic stage 46 ‥‥ transport system 60 ‥‥ transport system controller 70 ‥‥ stage controller 80 ‥‥ imaging controller 90 ‥‥ image processor P ‥‥ Inspection direction of inspection object

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference)

Claims (7)

[Claims] An object to be inspected is divided into N areas during continuous patterning of an object to be inspected using a mask pattern, and each time the object to be inspected is changed to the next one, the division is performed. A pattern defect inspection method characterized by sequentially inspecting the determined areas and determining whether there is a defect or a defect that is suspected of being defective or not, thereby inspecting for the presence or absence of a defect that continuously occurs at the same location. 2. The pattern defect inspection method according to claim 1, wherein when it is determined that the pattern is not defective, the divided areas are similarly inspected sequentially. 3. The pattern defect inspection method according to claim 2, wherein said re-inspection is a case where it is determined that the defect is defective or suspected to be defective. 4. The pattern defect inspection method according to claim 2, wherein the re-inspection is performed by another inspection system. 5. A method according to claim 1, wherein the inspected object is divided into N regions by patterning the inspected object during continuous patterning using the mask pattern. Each time the inspected object changes to the next one, the divided areas are inspected in order, and if it is determined to be defective or suspected, the defect or suspected defect is determined by another inspection system with high resolution. A pattern defect inspection method characterized by inspecting in detail and inspecting for the occurrence of consecutive defects at the same location. 6. While continuously inspecting an object to be inspected using a mask pattern, an inspection target area of the patterned object to be inspected is divided into N areas, and the object is inspected by using two inspection systems. On the other hand, different divided areas are inspected, and when it is determined that a defect or a defect is suspected, a single inspection system inspects the defect or the suspected defect in detail, and occurs continuously at the same position. Inspect for defects,
Each time the inspection object changes to the next one in the other inspection system,
A pattern defect inspection method characterized by sequentially inspecting divided areas. 7. The method according to claim 1, wherein said mask pattern is a plurality of mask patterns.
The pattern defect inspection method according to the above section.