JP2000068336A - Bonding of film piece - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a method for bonding a film piece, such as TAB(tape automated bonding) which can dispense with high manufacturing technique and an expensive manufacturing apparatus and also can positively prevent generation of warpages of the film piece. SOLUTION: A laminate film 6 consisting of a TAB tape and adhesive is placed on a cutting die 14 of a punching press 9 at a punching position, a substrate 7 is placed on a heat block 12, and the laminate film 6 is punched by a puncher 10 of the press 9. The puncher 10 pushes the heated substrate 7 against the punched film piece 11 during punching operation thereof, to cause a part of the film piece 11 to be attached temporarily to the substrate 7 by a projection 15 at a tip end of the puncher. Next, the temporarily/attached substrate 7 and film piece 11 are fed to a pressure roller, to bond the entire surface of the film piece onto the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for sticking a film piece, and more particularly to a method for sticking a film piece with high accuracy without trapping air bubbles.

[0002]

2. Description of the Related Art For example, TAB (Tape Auto)
In some semiconductor package manufacturing techniques using a mated bonding (tape) tape, a TAB tape (hereinafter simply referred to as TAB) may need to be attached to a substrate such as a lead frame. Conventionally, as a method of attaching a substrate and TAB, a method using a press and a method using a pressure roll are known.

FIG. 6 shows a method by pressing, in which a substrate 7, a film-like adhesive 2,
And the TAB 1 are placed in this order, and in this state, the upper heating plate 23 is lowered to apply heat and pressure to bond the substrate 7 and the TAB 1 via the adhesive 2.

FIG. 7 shows a method of sticking using a pressure roll. The substrate 7, the film adhesive 2 and the TAB 1 are fed to heated pressure rolls 20 a and 20 b,
a, which are stuck together by the pressing force from 20b,
The clearance between the rolls 20a, 20b is determined according to the thickness of the material fed into the rolls. The adhesive 2 in both of these methods is usually laminated on either the TAB 1 or the substrate 7 in advance.

[0005] However, according to these methods, for example, in the former case, air bubbles are easily entrapped between the substrate 7 and the TAB 1, and therefore, when the pasted product is exposed to a high temperature, swelling occurs. Also, when high humidity is applied to this, delamination may occur. Bubbles are also a factor that has an adverse effect when solder balls are attached in the subsequent semiconductor package manufacturing process or when wire bonding is performed after mounting the semiconductor chip,
Therefore, its occurrence must be avoided as much as possible.

The method shown in FIG. 7 is a method developed to prevent air bubbles from being trapped.
Since the material is excluded on the material introduction side by the arc shapes of 0a and 20b, the generation of bubbles is significantly less than in the press method. However, according to this method, the substrate 7 and the TAB
If it is difficult to adjust the position between the substrates 7 and TAB1, the gap between the substrate 7 and the TAB 1 in the bonded product 21 will grow significantly if the two are slightly shifted when they are sent to the pressure roll 20.

As a method of solving the difficulty of the alignment in the pressure roll method, for example, Japanese Patent Publication No. Hei 8-3
A method of attaching a film piece disclosed in No. 1503 is known. In this method of attaching the film pieces, the substrate and the TAB are temporarily attached before performing the attachment by the roll method, and the two are fixed to each other and introduced into a pressure bonding roll. The TABs do not shift with each other until the application by the rolls is completed, and have a high-accuracy attachment relationship.

In this method for attaching a film piece, TAB having a predetermined dimensional accuracy is prepared in advance and laminated on a magazine, and is transported one by one onto a substrate. After placing them in the relationship, they are tacked.

[0009]

However, according to the conventional method of attaching a film piece, a TA having a predetermined dimensional accuracy is required.
Since B must be prepared in advance and arranged one by one on a substrate so as to have a predetermined positional accuracy, a high manufacturing technique and a high-grade manufacturing apparatus are required, which causes an increase in cost. In particular, when warpage occurs in the stacked TABs, alignment with the substrate becomes more difficult.

Accordingly, an object of the present invention is to provide a method of attaching a film piece which does not require a high manufacturing technique and a high-grade manufacturing apparatus and has no room for warpage of a film piece such as TAB. .

[0011]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is to temporarily attach a part of a film piece such as TAB to a predetermined portion of a substrate such as a lead frame, And the film piece is sent to a pressure roll, and in the method of attaching a film piece to which the substrate and the film piece are bonded by the pressure roll, a film is arranged at a punching location of a punching press, and a film immediately below the punching location. Disposing the substrate at a predetermined location, punching out a film piece from the film by a punching puncher of the punching press, during the punching operation of the punching puncher, the punched out film piece at a predetermined location of the substrate A part of the film piece is temporarily attached to the substrate by pressing on the substrate, and the temporarily attached substrate and the film piece are sent to a pressure roll, and the substrate is There is provided a sticking method of film pieces, wherein the pasting the film piece by the press roll.

The above-mentioned film piece is, for example, TAB
The above film corresponds to, for example, a long TAB in which a number of wiring units are continuously formed. Therefore, in this case, the portion punched by the punching press is a wiring portion excluding a space between the sprocket holes on both sides of the tape and the wiring unit.

[0013] A long TAB wound on a reel is prepared on one side of a punching press, and is sent to the other side for each wiring unit. It is preferable to form the lines so that the tacking can be efficiently performed. As another embodiment, a form in which TAB is cut in advance for each wiring unit and is sequentially supplied to a punching press is possible.

It is convenient to use heat to temporarily attach the film piece to the substrate. For this purpose, the substrate placed directly below the punching point of the punching press is set, for example, on a heat block, whereby the film is heated at a predetermined temperature for a predetermined time before the film piece is punched. Should be configured so that:

As the film, a film in which an adhesive is previously formed on the surface is used in many cases.
A material that is melted by heating and thermally adheres to a substrate and a film is used. Specifically, when the film is polyimide and the substrate is copper, an epoxy resin is used. Instead of forming the adhesive on the film side in advance, it is possible to form the adhesive on the substrate side.

The constituent material of the film has an adhesive property,
When a piece of film punched by a punching press is pressed against a substrate by a punching puncher, a form in which the film piece itself adheres to form a temporary attachment is conceivable.

As a specific means for temporarily attaching only a part of the film piece to the substrate, one of the following methods is reliable. One is to form a protrusion at the tip of a puncher for punching a film, and the other is to form a protrusion on the surface of a heat block or the like on which a substrate is placed. .

The presence of these projections prevents adhesion of portions other than the projections when pressing a film piece against a substrate by a punching puncher, thereby enabling reliable temporary attachment. The shape of the projection is usually a point or a line. The protrusion length of the protrusion should be set to 以下 or less of the film thickness,
The minimum protrusion length is desirably set to 5 μm.

As the pressure roll, a metal roll or a metal roll having a surface lined with an elastic rubber layer is used. In many cases, a rubber lining roll is appropriate from the viewpoints of deaeration effect and uniform pressurization over the entire surface.

The air between the substrate and the film piece is removed by the pressure roll, but in order to make the air more reliable, it is conceivable that the bonding operation by the pressure roll is performed under vacuum. The degree of vacuum in that case, for example,
Although effective at about several hundred torr, the degassing effect increases as the degree of vacuum increases. Processing under this vacuum,
It is particularly effective in a roll application operation with a large application area, but is also effective when applied to a temporary application with a small application area.

The film piece in the present invention is not limited to TAB, and the substrate is not limited to a lead frame. If the application is to stick a film on a rigid substrate,
The application of the present invention is possible.

[0022]

Next, an embodiment of a method for attaching a film according to the present invention will be described. Figure 1 shows TAB
1 shows a process of attaching the adhesive 2 to a feed reel 1. A delivery reel 3 around which a long TAB 1 is wound is installed on one side, and a take-up reel 4 is installed on the other side. In which the heated pressure roll 5 is disposed.

The adhesive 2 is formed in a film shape having a width smaller than the width between the sprocket holes formed on both sides of the TAB 1, and together with the TAB 1, a pressure roll 5 is formed.
Is supplied to the device and is continuously attached. This is a roll-type attachment, and therefore, no air bubbles are trapped between the TAB 1 and the adhesive 2 during this time.

FIG. 2 shows a process of punching out a piece of film for each TAB wiring unit from the laminated film 6 of TAB 1 and adhesive 2 obtained in FIG. FIG. 2 is a schematic view of a step of attaching.

The take-up reel 4 in FIG.
The laminated film 6 is sent out from here, and is sent into the punching press 9. In this case, the adhesive 2 is attached to the lower side of the fed laminate film 6. The laminating film 6 is fed into the punching press 9 by dimensional feeding for each wiring unit of the TAB.
Are punched out for each TAB wiring unit.

In the punching operation, the punching puncher 10 presses the punched film piece 11 against the substrate 7 and temporarily attaches it. The substrate 7 is pre-heated to a predetermined temperature at a predetermined location on the heat block 12, so that when the punching puncher 10 presses the film piece 11 against the substrate 7, the adhesive 2 melts and the film piece 11 and the substrate 7 are temporarily attached by the molten adhesive 2. The remaining material 6 ′ of the laminated film 6 from which the film piece 11 has been punched is taken up on a take-up reel 13.

FIG. 3 is an enlarged view of a portion of the punching press 9. The laminated film 6 is fed onto a punching die (die) 14, which is a punching point, and the punching puncher 10 punches the laminate film 6 at the same time. During the punching operation, the punched film piece 11 is pressed against the substrate 7 immediately.

At the tip of the punching puncher 10, a projection 15 having a projection length A that is １ ／ or less of the thickness of the film piece 11 is provided.
Therefore, only the projection 15 of the film piece 11 is temporarily attached to the substrate 7. 6a shows a stamping mark of the film piece 11 from the laminated film 6.

The laminated film 6 is guided by its own sprocket holes and fed into the punching press 9 under precise dimensional feed, while the rectangular substrate 7 is formed on the heat block 12. Protrusion 1
The front, rear, left, and right are regulated by 6, and thereby the mutual positional relationship is determined.

The film piece 11 is temporarily attached to the substrate 7 during the operation of punching the film piece 11 by the punching puncher 10.
The film piece 11 can be repeatedly attached to the substrate 7 with high accuracy and with stable reproducibility.

The time from when the punching puncher 10 punches out the film piece 11 to when it is temporarily attached is instantaneous, so there is no room for displacement during this time.
There is no room to warp the film piece 11 from being punched to being temporarily attached. This makes the film piece 1
1 is temporarily attached to the substrate 7 with high accuracy.

Further, even if a warped film is supplied as the laminate film 6, since the alignment is not based on the edge detection of the film piece as in the conventional image processing camera, the influence of the warp on the accuracy is not provided. Nor. In the drawing, reference numeral 17 denotes a jig for supporting the heat block 12.

FIG. 4 shows another embodiment of the punching press 9. Projection 1 on part of heat block 12
8 are formed, while the tip of the puncher 10 is flat and has no protrusion. The temporary attachment function in this structure is the same, and only the portion pressed by the projection 18 is adhered and the film piece 11 and the substrate 7 are temporarily attached.

FIG. 5 shows a roll bonding step for bonding the entire surface of the temporarily attached substrate 7 and film piece 11. The provisional article 19 is fed to a heated pressure-bonding roll 20, which is rubber-lined, and the adhesive 2 is melted while passing through the pressure-bonding roll 20, whereby the film piece 11 and the substrate 7 are bonded to each other. Glued through.

During this time, since the temporarily attached substrate 7 and the film piece 11 do not shift from each other, the film piece 11 is attached with high accuracy.
The air existing between the adhesive 1 and the adhesive 2 and between the adhesive 2 and the substrate 7 is removed rearward as the pressure roll 20 rotates. As a result, the pasted product 21 is discharged from the pressure roll 20 as a laminated body having no embracing bubbles.

[0036]

As described above, according to the method for attaching a film piece according to the present invention, a film is disposed at a punching point of a press die, and a substrate is disposed at a predetermined point immediately below the punching point. The punching of a predetermined film piece from the film by a punching puncher of a press type, and since the punched film piece is temporarily attached to a substrate immediately below in a punching operation of the punching puncher, the substrate and the film are There is no room for deviation between the pieces or warping of the punched film piece, and therefore, the substrate and the film piece can be temporarily attached with high precision.

Since the bonding of the substrate and the film piece performed after the temporary bonding is performed by a pressure roll, it is possible to obtain a high-precision, bubble-free bonded product without enclosing bubbles between the two. Can be. Therefore, there is no need for high manufacturing technology and high-grade manufacturing equipment, and there is no room for warpage of the film pieces.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a step of attaching a TAB tape and an adhesive in an embodiment of the method for attaching a film piece according to the present invention.

FIG. 2 is an explanatory view of a step of punching out a film piece from the laminate film obtained in FIG. 1 and temporarily attaching the film piece to a substrate.

FIG. 3 is an explanatory view in which a portion of the punching press in FIG. 2 is enlarged.

FIG. 4 is an explanatory view showing another embodiment of the punching press.

FIG. 5 is an explanatory view of a step of attaching a temporary attachment of the substrate and the film piece obtained in FIG. 2 using a pressure roll.

FIG. 6 is an explanatory view showing a conventional method of attaching a film piece.

FIG. 7 is an explanatory view showing another conventional method for attaching a film piece.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 TAB 2 Adhesive 5 Pressure roll 6 Laminate film 7 Substrate 9 Punching press 10 Punching puncher 11 Film piece 12 Heat block 14 Punching die 15, 18 Projection 19 Temporary product 20 Crimping roll 21 Attached product

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Noboru 3-1-1, Sukekawacho, Hitachi City, Ibaraki Prefecture Inside the cable plant of Hitachi Cable, Ltd. (72) Inventor Mamoru Mita 3-1-1, Sukekawacho, Hitachi City, Ibaraki Prefecture No. 1 F term in Hitachi Cable, Ltd. Wire Plant 4F100 AB17 AK46 AK53G AT00A AT00B BA02 CB00 EH012 EJ192 EJ421 GB41 JL04 4M105 AA05 DD14 DD22 DD24 EE12 EE13 5F047 AA02 AA11 BA21 BB03 FA52

Claims (8)

[Claims] 1. A T-shaped connector is provided at a predetermined position on a substrate such as a lead frame.
In the method of attaching a piece of film such as AB, the temporarily attached substrate and the film piece are sent to a pressure roll, and the substrate and the film piece are attached by the pressure roll. Disposing a film at a punching location of a punching press, disposing the substrate at a predetermined location immediately below the punching location, punching out a film piece from the film with a punching puncher of the punching press, During the punching operation, a part of the film piece is temporarily attached to the substrate by pressing the punched film piece against a predetermined portion of the substrate, and the temporarily attached substrate and the film piece are pressed and rolled. And bonding the substrate and the film piece by the pressure roll. 2. The method according to claim 1, wherein the substrate is heated to a predetermined temperature on a heat block provided immediately below the punching point before the film piece is temporarily attached. 2. A method for attaching a film piece according to claim 1. 3. The method according to claim 2, wherein the heat block has a projection on a surface thereof for positioning the substrate. 4. The film piece according to claim 2, wherein the heat block has a projection on a surface thereof for temporarily attaching a part of the film piece to the substrate. How to paste. 5. The punching puncher according to claim 1, wherein said punching puncher has a projection for temporarily attaching a part of said film piece to said substrate. How to stick film pieces. 6. The film according to claim 1, wherein the protrusion is one-third of a thickness of the film piece.
6. The method according to claim 4, wherein the film has a protrusion length of 2 or less. 7. The method according to claim 1, wherein an adhesive is previously formed on the surface of the film. 8. A method according to claim 1, wherein said pressure roller applies said substrate and said film piece under vacuum.