JP2000068173A - Apparatus for separating sample, apparatus for supporting sample and method of separating sample - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stably and efficiently separate samples such as laminated substrates, etc. SOLUTION: A laminated substrate 101 sandwiched between substrate holders 120, 150 therebetween is pressed and held, and the laminated substrate 101 is separated by a jet applied from a nozzle 102 while rotating the laminated substrate 101. The substrate holders 120, 150 have first hold members 123, 153 for exactly regulating the position of the laminated substrate 101 in its thickness direction and second hold members 121, 151 for elastically pressing the laminated substrate 101. This constitution prevents the periphery of the laminated substrate 101 from vibrating, positional deviation in the surface direction, dropping, etc., and efficiently utilizes the pressure of water injected into the interior of the laminated substrate 101.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for separating and supporting a sample and a method for separating the sample, and more particularly to a separating apparatus suitable for separating a sample having a separating layer therein by the separating layer. And a support device for supporting a sample in the separation device and a separation method.

[0002]

2. Description of the Related Art As a substrate having a single crystal Si layer on an insulating layer, a substrate (SOI substrate) having an SOI (silicon on insulator) structure is known. Devices using this SOI substrate have a number of advantages that cannot be achieved with a normal Si substrate. The advantages include, for example, the following. (1) Dielectric separation is easy and suitable for high integration. (2) Excellent radiation resistance. (3) The stray capacitance is small, and the operation speed of the element can be increased. (4) No well step is required. (5) Latch-up can be prevented. (6) A complete depletion type field effect transistor can be formed by thinning.

[0003] Since the SOI structure has various advantages as described above, research on a forming method thereof has been advanced in recent decades.

As an SOI technique, SOS (silicon on s) is conventionally formed by forming Si on a single crystal sapphire substrate by heteroepitaxial growth by a CVD (chemical vapor deposition) method.
apphire) technology is known. Although this SOS technology has gained a reputation as the most mature SOI technology,
Practical due to large number of crystal defects due to lattice mismatch at the interface between the Si layer and the underlying sapphire substrate, mixing of aluminum constituting the sapphire substrate into the Si layer, cost of the substrate, delay in increasing the area, etc. Has not progressed.

[0005] Next to the SOS technology, various SOI technologies have appeared. With respect to this SOI technology, various methods have been attempted with the aim of reducing crystal defects and reducing manufacturing costs. As this method, a method of implanting oxygen ions into a substrate to form a buried oxide layer, bonding two wafers with an oxide film interposed therebetween, and polishing or etching one of the wafers to form a thin single-crystal Si layer A method of leaving on an oxide film, furthermore, hydrogen ions are implanted at a predetermined depth from the surface of the Si substrate on which the oxide film is formed, and after bonding with the other substrate, a thin film is formed on the oxide film by heat treatment or the like. A method of removing the bonded substrate (the other substrate) while leaving the single crystal Si layer, or the like can be given.

The present applicant has disclosed a new SOI technique in Japanese Patent Application Laid-Open No. Hei 5-21338. According to this technique, a first substrate in which a non-porous single crystal layer (including a single crystal Si layer) is formed on a single crystal semiconductor substrate in which a porous layer is formed is connected to a second substrate via an insulating layer. After bonding, the two substrates are separated by a porous layer, and the non-porous single crystal layer is transferred to a second substrate. This technology has an excellent thickness uniformity of the SOI layer, can reduce the crystal defect density of the SOI layer, has a good surface flatness of the SOI layer, and does not require an expensive special specification manufacturing apparatus. Is, several hundred dollars
It is excellent in that an SOI substrate having an SOI film in a range of about 10 μm to about 10 μm can be manufactured by the same manufacturing apparatus.

[0007] Further, the present applicant has disclosed in
In No. 9, after the first substrate and the second substrate are bonded to each other, the first substrate is separated from the second substrate without breaking, and then the separated surface of the first substrate is removed. A technique has been disclosed in which a porous layer is formed again after smoothing and reused. This technique has excellent advantages that the first substrate can be used without waste, so that the manufacturing cost can be greatly reduced and the manufacturing process is simple.

[0008]

In the above technique,
When a substrate in which two substrates are bonded to each other (hereinafter, a bonded substrate) is separated by a porous layer, it is desired that the separation be performed stably and efficiently without damaging the substrate.

The present invention has been made in view of the above background, and provides, for example, an apparatus and a method suitable for stably and efficiently separating a sample such as a substrate having a separation layer therein. The purpose is to provide.

[0010]

A separation apparatus according to a first aspect of the present invention is a separation apparatus for separating a sample having a separation layer therein by the separation layer. An ejection unit that ejects a fluid and a pair of holding units that hold the sample so as to sandwich the sample from both sides are provided, and at least one of the pair of holding units holds the sample while defining a position in the thickness direction of the sample. A first member and a second member that elastically presses and holds the sample, and in a state where the sample is not held, the tip of the second member is on the other side than the tip of the first member. Are projected to the holding portion side.

In the above separating apparatus, for example, it is preferable that the second member is arranged on the outer peripheral side of the first member.

In the above separating apparatus, for example, the second member preferably has an annular shape.

In the above separating apparatus, for example, it is preferable that the second member has an annular shape, and the diameter gradually increases toward the other holding portion.

In the above separating apparatus, for example, it is preferable that the thickness of the second member is gradually reduced toward the other holding portion.

In the above separating apparatus, for example, it is preferable that the second member has a cylindrical shape.

In the above separating apparatus, for example, the second member is preferably made of an elastic body.

In the above separating apparatus, for example, the first member is preferably made of a hard material.

In the above-mentioned separation apparatus, for example, it is preferable that the surface of the first member that contacts the sample is substantially circular.

In the above-described separation apparatus, for example, it is preferable that the pair of holding units hold the sample by pressing the sample.

In the above-described separation apparatus, for example, it is preferable that a drive source for rotating the pair of holders is further provided so that the sample rotates around an axis orthogonal to the separation layer.

In the above separation apparatus, for example, the sample is preferably a plate-like member having a layer having a fragile structure as the separation layer.

In the above separating apparatus, for example, the sample comprises a first plate-like member having a fragile layer therein and a second plate-like member.
And a plate-shaped member.

In the above separation apparatus, for example, the fragile layer is a porous layer.

In the above separating apparatus, for example, the first plate-like member is a semiconductor substrate.

In the above separating apparatus, for example, the first plate-like member is formed by forming a porous layer on one side of a semiconductor substrate and forming a non-porous layer on the porous layer.

In the above-described separation apparatus, for example, the non-porous layer includes a single-crystal semiconductor layer.

A supporting device according to a second aspect of the present invention supports a sample having a separation layer therein by jetting a fluid toward the separation layer to support the sample. A supporting device, comprising: a pair of holding portions that hold a sample so as to sandwich the sample from both sides, at least one of the pair of holding portions is a first member that holds the sample while defining a position in a thickness direction of the sample. And a second member that elastically presses and holds the sample, and in a state where the sample is not held, the tip of the second member is located on the other holding portion than the tip of the first member. It is characterized by protruding to the side.

In the above-mentioned support device, for example, it is preferable that the second member is arranged on the outer peripheral side of the first member.

In the above supporting device, for example, the second member preferably has an annular shape.

In the above-mentioned supporting device, for example, it is preferable that the second member has an annular shape, and the diameter gradually increases toward the other holding portion.

In the above-mentioned supporting device, for example, it is preferable that the thickness of the second member is gradually reduced toward the other holding portion.

In the above support device, for example, it is preferable that the second member has a cylindrical shape.

In the above support device, for example, the second member is preferably made of an elastic body.

In the above support device, for example, the first member is preferably made of a hard material.

In the above-mentioned support device, for example, it is preferable that the surface of the first member in contact with the sample is substantially circular.

In the above supporting device, for example, it is preferable that the pair of holding portions hold the sample by pressing the sample.

According to a third aspect of the present invention, there is provided a separation method comprising: bonding a non-porous layer side of a first substrate having a porous layer and a non-porous layer formed on one side in that order to a second substrate; A separation method for separating a substrate by the porous layer, wherein the separation is performed using a separation device.

The method for manufacturing a substrate according to the fourth aspect of the present invention is directed to the first method, wherein a porous layer and a non-porous layer are sequentially formed on one side.
A method of manufacturing a substrate, comprising: a step of bonding the non-porous layer side of the substrate to a second substrate; and a separation step of separating the bonded substrate by the porous layer. It is characterized by using the above separation device.

[0039]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a view for explaining a method of manufacturing an SOI substrate according to a preferred embodiment of the present invention in the order of steps.

In the step shown in FIG. 1A, a single-crystal Si substrate 11 is prepared, and a porous Si layer 12 is formed on the surface thereof by anodization or the like. Next, in a step shown in FIG. 1B, a non-porous single-crystal Si layer 13 is formed on the porous Si layer 12.
Is formed by an epitaxial growth method, and an insulating layer (for example, an SiO ₂ layer) 15 is formed thereon. This allows
A first substrate () is formed.

In the step shown in FIG. 1C, the second substrate 1
4 () is prepared, and the first layer is placed so that the insulating layer 15 faces.
The substrate () and the second substrate () are brought into close contact with each other at room temperature. After that, the first substrate () and the second substrate 14 () are bonded to each other by anodic bonding, pressing, heat treatment, or a combination thereof. By this processing, the insulating layer 15 and the second substrate 14 () are firmly bonded.
The insulating layer 15 is made of non-porous single-crystal Si as described above.
Although it may be formed on the layer 13, the second substrate 14 ()
1 and may be formed on both. As a result, when the first substrate and the second substrate are brought into close contact with each other, FIG.
The state shown in FIG.

In the step shown in FIG. 1D, the two bonded substrates are separated at the porous Si layer 12. Thereby, the second substrate side ("+") has a laminated structure of the porous Si layer 12 "/ the single-crystal Si layer 13 / the insulating layer 15 / the single-crystal Si substrate 14. On the other hand, on the first substrate side (')
Has a structure having a porous Si layer 12 ′ on a single-crystal Si substrate 11.

The substrate (') after separation is formed by removing the remaining porous Si layer 12' and, if necessary, flattening the surface to form the first substrate () again. Used as a single crystal Si substrate 11.

After separating the bonded substrates, FIG.
In the step shown in (e), the porous layer 12 '' on the surface of the second substrate side ("+") is selectively removed. This allows
A substrate having a stacked structure of single crystal Si layer 13 / insulating layer 15 / single crystal Si substrate 14, that is, a substrate having an SOI structure is obtained.

As the second substrate, for example, single crystal Si
In addition to the substrate, an insulating substrate (for example, a quartz substrate) and a light-transmitting substrate (for example, a quartz substrate) are suitable.

In this embodiment, the porous layer 12 having a fragile structure is formed in the separation area in order to facilitate the process of separating the two substrates after bonding them.
Instead of this porous layer, for example, a microbubble layer may be formed. The microbubble layer can be formed, for example, by implanting ions into a semiconductor substrate.

In this embodiment, in the step shown in FIG. 1D, that is, in at least a part of the step of separating the bonded substrate, the separation layer of porous Si is used.
A separation apparatus is used in which a liquid or a gas (fluid) is jetted toward the layer to separate the bonded substrates into two at the separation layer.

This separation apparatus employs a water jet method. Generally, the water jet method is
Water (adding abrasives when cutting hard material) is jetted at high speed and high pressure into the bundle,
This method involves cutting and processing ceramics, metal, concrete, resin, rubber, wood, etc., removing the coating film on the surface, and cleaning the surface (see Water Jet Vol. 1, No. 1, page 4). Conventionally, the water jet method is mainly used for cutting, processing,
It was used to remove coatings and clean surfaces.

In this separation apparatus, the fluid is jetted in a bundled flow toward the porous layer (separation layer) of the bonded substrate, which is a fragile structure, and the porous layer is selectively collapsed. By doing so, the substrate is separated at the portion of the porous layer. Hereinafter, this bundled flow is referred to as a “jet”. Further, the fluid constituting the jet is referred to as “jet constituting medium”. Water, organic solvent such as alcohol, hydrofluoric acid, nitric acid and other acids, potassium hydroxide and other alkalis, air, nitrogen gas, carbon dioxide gas, rare gas, etching gas and other gases, plasma, etc. I can do it.

When this separation apparatus is applied to a manufacturing process of a semiconductor device, for example, a separation process of a bonded substrate, it is preferable to use pure water from which impurity metals, particles and the like have been removed as much as possible.

This separation device removes the porous layer from the outer peripheral portion toward the central portion by jetting a jet toward the porous layer exposed on the side surface of the bonded substrate. Accordingly, the bonded substrate is separated into two substrates without removing the porous layer having a weak mechanical strength without damaging the main body.

The present inventor has found that a technique for holding a bonded substrate during the separation process is an important factor in performing the separation process stably and efficiently. Hereinafter, a specific description will be given.

FIG. 2 is a view schematically showing an apparatus for separating a bonded substrate developed by the present inventors before the present invention. The separation apparatus shown in FIG. 2 has a substrate holder 503 fixed at one end, a motor (not shown) connected to the other end, a rotatable shaft 501 rotatably supported, and a substrate holder 50 at one end.
4 is fixed, an air cylinder (not shown) is connected to the other end, and a rotating shaft 502 rotatably and slidably supported.
And a nozzle 510 for injecting a jet 511.

When the bonded substrate 101 is separated, the air cylinder connected to the rotating shaft 502 is operated, and the bonded substrate 101 is pressed and held by the substrate holding section 504. In this state, while the bonded substrate 101 is being rotated, a jet 511 is jetted from the nozzle 510 toward the porous layer 101b of the bonded substrate 101, so that the bonded substrate 101 is
And 101c.

As described above, in the separation apparatus shown in FIG. 2, the bonded substrate 101 is separated while pressing and holding the bonded substrate 101 from both sides. This is the bonded substrate 101
If the separation process is performed while pulling the substrate toward both sides, the porous layer 101b is peeled off at the final stage of the separation process, and there is a possibility that a defect occurs in, for example, the vicinity of the center of the two substrates.

In the separation apparatus shown in FIG. 2, for example, from the viewpoint of efficiently performing separation by the pressure of the jet constituting medium injected into the bonded substrate 101, that is, from the viewpoint of improving the efficiency of the separation process. , Substrate holder 50
It can be said that the force for pressing the bonded substrate 101 by 4 is preferably small. Specifically, by reducing the pressing force, the separation force is efficiently applied in a direction in which the bonded substrate 101 is separated into two by the pressure of the jet forming medium injected into the bonded substrate 101. Can be done. On the other hand, in the separation apparatus shown in FIG. 2, for example, from the viewpoint of preventing runout of the outer peripheral portion of the bonded substrate 101, positional deviation in the plane direction, dropping, and the like, that is, from the viewpoint of stabilizing the separation processing, It can be said that the pressing force is preferably somewhat large (for example, 1.5 kgf).

Further, in the separation apparatus shown in FIG. 2, from the viewpoint of improving the efficiency of the above-described separation processing, the substrate holding section 50
It can be said that it is preferable that the area of the portion where 3 and 504 press the bonded substrate 101 be smaller. On the other hand, from the viewpoint of stabilizing the separation process, the substrate holding unit 50
It can be said that it is preferable that the area of the portion where 3 and 504 press the bonded substrate 101 be large.

As described above, in the separation apparatus shown in FIG.
It is difficult to achieve both efficiency and stability of the separation process. Therefore, a separation device that can achieve both efficiency and stability of the separation process is desired.

Hereinafter, a separation device according to a preferred embodiment of the present invention will be described. This separation apparatus is suitable for the above-described separation processing of a bonded substrate, but can also be applied to separation of a sample having another similar structure.

FIG. 3 is a diagram showing a schematic configuration of a separation apparatus according to a preferred embodiment of the present invention. This separation device 10
Numeral 0 has substrate holding portions 120 and 150, and the bonded substrate 101 is pressed and held by the substrate holding portions 120 and 150 so as to sandwich the bonded substrate 101 from both sides. The bonded substrate 101 has a porous layer 101 which is a fragile component inside.
b, and the porous layer 1
01b separates the two substrates 101a and 101c. In the separation apparatus 100, for example, the substrate 101a is the first substrate side (') in FIG.
01c is set on the second substrate side ("+") in FIG.

The substrate holders 120 and 150 are on the same rotation axis. The substrate holding unit 120 includes the bearing 1
The other end of the rotating shaft 104 is connected to the rotating shaft of the motor 110 via one end of the rotating shaft 104 rotatably supported by the support table 109 via 08. Therefore,
The rotation force generated by the motor 110 causes the substrate holding portion 12
The bonded substrate 101 pressed to 0 rotates. The motor 110 is controlled by a controller (not shown), and rotates the rotation shaft 104 at a rotation speed specified by the controller or stops the rotation.

The substrate holding unit 150 is connected to one end of a rotating shaft 103 slidably and rotatably supported by a supporting table 109 via a bearing 111, and the other end of the rotating shaft 103 is connected to the supporting table 109. Air cylinder 112 fixed to
It is connected to. The air cylinder 112 is controlled by a controller (not shown). This air cylinder 1
The bonded substrate 101 is pressed by the substrate holding unit 150 by the 12 extruding the rotating shaft 103.

The substrate holders 120 and 150 come into contact with the vicinity of the center of the bonded substrate 101 and
01 in the thickness direction of the bonded substrate 1
Circular first holding member 12 for holding 01 by pressing force
3,153 respectively. First holding members 123, 153
Is preferably made of a hard material, for example, ceramic, metal, thermosetting resin, or the like. Thus, the first
When the holding portions 123 and 153 are made of a hard material, the nozzle 102 and the bonded substrate 101 can be accurately aligned with each other.
The positional relationship can be maintained.

The substrate holders 120 and 150 have second holding members 121 and 151 for elastically pressing and holding the bonded substrate 101, respectively. The second holding portions 121 and 151 are made of an elastic material, for example, rubber (for example, silicon,
Viton, nitrile, etc.) are preferable. Thus, the bonded substrate 1 is held by the second holding member.
By elastically pressing 01, during the separation process,
1) Separation processing by allowing the bonded substrate 101 to be separated into two pieces and to be warped by the pressure of the jet forming medium injected into the bonded substrate 101 (portion of the porous layer 101b) 2) The bonded substrate 101 is pressed from both sides with an appropriate force to effectively prevent the outer peripheral portion of the bonded substrate 101 from oscillating, being displaced in the plane direction, being dropped, and the like. The separation process can be stabilized.

The second holding members 121 and 151 are, for example,
It is preferable that the first holding members 121 and 151 are arranged on the outer peripheral side, respectively. Also, the second holding members 121 and 1
Preferably, 51 is, for example, annular.

In the separation device shown in FIG. 3, the first holding member 1
Reference numerals 23 and 153 protrude from the cylindrical main bodies 122 and 152 of the substrate holding units 120 and 150. The main body 12
2 and 152 and the first holding portions 123 and 153 can be integrally formed of the same material. The second holding members 121 and 151 are fixed to side surfaces of the main bodies 122 and 152, respectively.

In a state in which the bonded substrate 101 is not held, as shown in FIG.
1 and 151 are first holding members 123 and 153, respectively.
It protrudes from the tip. This is because both the first holding members 123 and 153 made of a hard material and the second holding parts 121 and 151 made of an elastic material are used to bond the substrate 10 together.
This is for pressing and holding 1 from both sides.

As described above, by holding the bonded substrate 101 by the first holding members 123 and 153 and the second holding members 121 and 151, the separation process can be made more efficient and stable. Can be.

Here, it is preferable that both of the substrate holding portions 120 and 150 have the above-described configuration, but only one of the substrate holding portions has the above-described configuration, and the other has a holding surface having an appropriate area (for example, FIG. 3 can be directly held by the main body 122 or 152). Also in this case, the separation processing can be made more efficient and more stable than the separation apparatus shown in FIG.

Further, it is preferable to provide a suction mechanism (for example, a vacuum suction mechanism) on the holding surfaces of the first holding members 123 and 153 (the surfaces that come into contact with the bonded substrate 101). Thereby, the bonded substrate 101 can be held more stably.

In addition, this separation device 100 is
14 and a nozzle 102, and a jet forming medium (for example, water) having a higher pressure than the pump is sent to the nozzle 102;
Thus, a jet is jetted from the nozzle 102. A shutter 106 is provided below the nozzle 102. Here, the pressure of the jet is, for example, 500 k
The diameter of the nozzle 102 is preferably, for example, about 0.1 mm.

FIG. 4 is a drawing illustrating the substrate holders 120 and 150 shown in FIG. The diameter of the second holding members 121 and 151 shown in FIG. 4 gradually increases toward the tip end, that is, the contact portion with the bonded substrate 101. By employing such a shape, the area of the contact surface with the bonded substrate 101 can be increased. Therefore, even when the pressing force by the air cylinder 112 is reduced, the frictional force acting between the second holding members 121 and 151 and the bonded substrate 101 is ensured, and the positional displacement of the bonded substrate 101 in the plane direction is ensured. And falling can be effectively prevented. In this case, the force for pressing the bonded substrate 101 by the air cylinder 112 is preferably, for example, about 100 to 600 gf.

FIG. 5 shows the substrate holder 1 shown in FIGS. 3 and 4.
It is a figure showing other examples of composition of 20 and 150. The substrate holders 120 and 150 shown in FIG. 5 are different from the second holders 121 and 151 shown in FIG.
Is replaced by The second holding members 121 'and 151' according to this configuration example also elastically press and hold the bonded substrate 101 similarly to the configuration examples shown in FIGS. Therefore, the second holding parts 121 'and 151'
It is preferable to be made of an elastic material such as rubber (for example, silicon, viton, nitrile, etc.).

The second holding members 121 'and 151' according to this configuration example have a cylindrical shape. Therefore, the second holding members 121 ′ and 151 ′ according to this configuration example are less likely to be deformed than the second holding members 121 and 151 shown in FIGS. Therefore, as compared with the configuration examples shown in FIGS. 3 and 4, it is necessary to apply a stronger pressing force (for example, about 300 to 800 gf is preferable) by the air cylinder 112. 101
Can be reduced to a small extent.

Hereinafter, the procedure of the separation process by the separation apparatus 100 will be described.

First, the rotary shaft 103 is attached to the air cylinder 112.
Is accommodated, a corresponding distance is provided between the substrate holding units 120 and 150. Next, the substrate holding unit 120
The bonded substrate 101 is transported between the substrate and the substrate holding unit 150 by a transport robot or the like, and the center of the bonded substrate 101 is aligned with the center axes of the rotating shafts 104 and 103. Next, the bonded substrate 101 is pressed and held by causing the air cylinder 112 to push out the rotating shaft 103 (the state shown in FIG. 3). At this time, the bonded substrate 101 is aligned by the first holding members 123 and 153 so that the porous layer 101b is positioned directly below the nozzle 102.

Next, the bonded substrate 101 is rotated at a predetermined rotation speed by the motor 110. This allows
Rotating shaft 104, substrate holding unit 120, bonded substrate 10
1. The substrate holder 150 and the rotating shaft 103 rotate integrally.

Next, a jet forming medium (for example, water) is sent from the pump 114 to the nozzle 102,
Wait until the jet injected from 02 stabilizes. When the jet is stabilized, the shutter 106 is opened, and the jet is inserted into the porous layer 101b of the bonded substrate 101.

When the jet is sandwiched, a separation force due to the pressure of the jet constituting medium continuously injected into the porous layer 101b, which is a fragile structure, acts on the bonded substrate 101. The porous layer 101b connecting 101a and 101c is destroyed. By this processing, the bonded substrate 101 can be completely separated in, for example, about several minutes.

In this separation processing, the bonded substrate 101 can be stably separated even when the bonded substrate 101 is held with a weak pressing force of, for example, about several hundred gf. Therefore, the bonded substrate 101 can be separated by efficiently utilizing the pressure (separation force) of the jet constituting medium injected into the bonded substrate 101.

The bonded substrate 101 is composed of two substrates 101
After separation into a and 101c, the shutter 106 is closed and the operation of the pump 114 is stopped. Next, after the two separated substrates 101a and 101c are sucked to, for example, a robot hand of a transfer robot, the air cylinder 11
2, the rotating shaft 103 is moved backward. Then, for example, the two substrates 101a and 101c are separated by the transfer robot.

Here, as described above, the substrate holder 120
It is also effective to provide a suction mechanism (for example, a vacuum suction mechanism) on the holding surfaces of the first holding members 123 and 153 of FIG. The rotating shaft 10
3, the two separated substrates 10
1a and 101c can be separated.

As described above, according to the preferred embodiment of the present invention, the first holding member for holding the sample while defining the position in the thickness direction of the sample, such as a bonded substrate, The sample can be stably and efficiently separated by providing the substrate holding portion with the second holding member that elastically presses and holds the sample. More specifically, this configuration prevents, for example, runout of the outer peripheral portion of the sample, misalignment in the plane direction, drop, etc., and efficiently reduces the separation force due to the pressure of the fluid injected into the sample, for example. It can act on the sample.

[0085]

According to the present invention, for example, a sample such as a substrate having a separation layer therein can be stably and efficiently separated.

[0086]

[Brief description of the drawings]

FIG. 1 is a view illustrating a method of manufacturing an SOI substrate according to a preferred embodiment of the present invention in the order of steps.

FIG. 2 is a view schematically showing a configuration example of a separation apparatus for a bonded substrate.

FIG. 3 is a diagram showing a schematic configuration of a separation device according to a preferred embodiment of the present invention.

FIG. 4 is a drawing drawn out of a substrate holding unit shown in FIG. 3;

FIG. 5 is a diagram illustrating another configuration example of the substrate holding unit illustrated in FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Single-crystal Si substrate 12 Porous Si layer 13 Non-porous single-crystal Si layer 14 Single-crystal Si substrate 15 Insulating layer 100 Separator 101 Bonded substrate 101b Porous layer 103, 104 Rotation axis 106 Shutter 108, 111 Bearing 109 Support Table 110 Motor 112 Air cylinder 114 Pump 120, 150 Substrate holding unit 121, 151, 121 ', 151' Second holding member 122, 152 Main body of substrate holding unit 123, 153 First holding member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Kazuaki Omi 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor Takao Yonehara 3-30-2 Shimomaruko, Ota-ku, Tokyo Non-corporation F term (reference) 3C060 AA20 CE07 CE11 CE23 5F043 AA40 DD06 DD13 DD30 EE07 EE08 EE35 EE40

Claims (30)

[Claims] 1. A separation apparatus for separating a sample having a separation layer therein by the separation layer, comprising: a jetting unit for jetting a fluid toward the sample; And a first member that holds the sample while defining a position in the thickness direction of the sample, and a second member that elastically presses and holds the sample. A separation device, comprising: two members, wherein in a state where the sample is not held, a tip of the second member protrudes toward the other holding portion from a tip of the first member. 2. The separation device according to claim 1, wherein the second member is disposed on an outer peripheral side of the first member. 3. The separation device according to claim 2, wherein the second member has an annular shape. 4. The separation device according to claim 2, wherein the second member has an annular shape, and has a diameter gradually increasing toward the other holding portion. 5. The separation device according to claim 4, wherein the thickness of the second member gradually decreases toward the other holding portion. 6. The separation device according to claim 2, wherein the second member has a cylindrical shape. 7. The separation device according to claim 1, wherein the second member is made of an elastic body. 8. The separation device according to claim 1, wherein the first member is made of a hard material. 9. The separation apparatus according to claim 1, wherein a surface of the first member that contacts the sample is substantially circular. 10. The apparatus according to claim 1, wherein the pair of holding units hold the sample by pressing the sample.
The separation device according to claim 9. 11. The apparatus according to claim 1, further comprising a drive source for rotating the pair of holding units so that the sample rotates around an axis orthogonal to the separation layer. The separation device according to claim 1. 12. The separation apparatus according to claim 1, wherein the sample is a plate-like member having a layer having a fragile structure as the separation layer. 13. The sample according to claim 1, wherein the sample is obtained by laminating a first plate-like member having a fragile layer therein and a second plate-like member. The separation device according to claim 1. 14. The separation device according to claim 12, wherein the fragile layer is a porous layer. 15. The separation device according to claim 13, wherein the first plate member is a semiconductor substrate. 16. The semiconductor device according to claim 15, wherein the first plate-like member is formed by forming a porous layer on one surface of a semiconductor substrate and forming a non-porous layer on the porous layer. The separation device according to any one of the preceding claims. 17. The separation device according to claim 16, wherein the non-porous layer includes a single crystal semiconductor layer. 18. A supporting device for supporting a sample having a separation layer therein by injecting a fluid toward the separation layer, wherein the sample is sandwiched from both sides. A pair of holding portions, at least one of the pair of holding portions is a first member that holds the sample while defining a position in a thickness direction of the sample, and a sample that is elastically pressed and held. A supporting member, wherein in a state where the sample is not held, the tip of the second member protrudes toward the other holding portion from the tip of the first member. apparatus. 19. The support device according to claim 18, wherein the second member is disposed on an outer peripheral side of the first member. 20. The support device according to claim 19, wherein the second member has an annular shape. 21. The second member has an annular shape,
20. The support device according to claim 19, wherein the diameter gradually increases toward the other holding portion. 22. The supporting device according to claim 21, wherein the thickness of the second member gradually decreases toward the other holding portion. 23. The supporting device according to claim 19, wherein the second member has a cylindrical shape. 24. The support device according to claim 18, wherein the second member is made of an elastic body. 25. The supporting device according to claim 18, wherein the first member is made of a hard material. 26. The surface where the first member contacts the sample,
18. The method according to claim 18, wherein the shape is substantially circular.
The support device according to any one of claims 5 to 10. 27. The apparatus according to claim 1, wherein the pair of holding portions hold the sample by pressing the sample.
The support device according to any one of claims 8 to 26. 28. Any one of claims 1 to 17
14. A separation method, comprising separating a sample using the separation device described in the above item. 29. Separation in which a porous layer and a non-porous layer are sequentially formed on one side, and a non-porous layer side of a first substrate is bonded to a second substrate to separate the substrate by the porous layer A method comprising the steps of:
A separation method using the separation device according to any one of claims 1 to 7. 30. A step of bonding the non-porous layer side of a first substrate having a porous layer and a non-porous layer formed on one surface in this order to a second substrate, and bonding the bonded substrate to the porous layer. 12. A method for manufacturing a substrate, comprising: a separation step for separating the substrate by using the separation apparatus according to claim 1. .