JP2000067985A - Connector and resin for forming connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector which serves for an electronic component to operate at a high speed and is made of a polyamide resin having a low moisture absorptiveness and also a high dielectric characteristic both in the dry and moistened conditions. SOLUTION: A connector to serve for an electronic component operating at a high speed is made of an aromatic series polyamide having a melting point according to the DSC measurement of 280 deg.C or more and consisting of dicarboxylic acid whose 45-100 mol% is terephthalic acid and diamine whose 80-100 mol% is of aliphatic series diamine, wherein the dielectic tangent tanδ2 obtained in the moistened condition after leaving seven days in a moisture absorbing environment with 60 deg.C and a relative humidity of 95% should range 1.0-3.0 times as large as tanδ1 in the absolutely dried condition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector for operating electronic components operating at high speed and a resin forming the connector. More specifically, the present invention relates to a connector for high-frequency electronic components such as a connector for a CPU of a computer and a resin forming the connector.

[0002]

2. Description of the Related Art In recent years, computers have been required to process more information at a high speed, and for high-speed information processing, it is essential to improve an operation clock frequency. Central processing unit (CP) for mainstream computer products
U) The internal clock frequency has increased about 10 times in the past several years, and current products having a high frequency of 400 MHz or more have been developed. In addition, the number of base clocks on the computer motherboard is also 100
The speed has been increased to about MHz.

[0003] Thus, the transmission signal of the computer is
As the frequency increases, the transmission loss of electrical signals on insulating members increases in proportion to the increase in frequency. Increase. For this reason, an insulating member used for a connection portion that is deeply involved in high-speed transmission of an electric signal, such as a connector for a CPU corresponding to a high frequency, has a dielectric constant (ε) and a dielectric loss tangent (tanδ).
It is demanded to use a member having a smaller dielectric constant and an excellent dielectric property.

Hitherto, polyamide-based engineering plastics have been frequently used as insulating members for electric and electronic products such as computer products. For example, aliphatic polyamides such as nylon 46 are heat resistant,
It has excellent properties such as chemical resistance and moldability, and is suitably used in electrical and electronic products after being subjected to treatment for imparting flame retardancy and the like.

[0005] However, aliphatic polyamides generally have high hygroscopicity, and when moisture is absorbed, their dielectric properties tend to decrease, and their dielectric constant (ε) and dielectric tangent (tan δ) tend to increase significantly. In a high-frequency electronic component such as a CPU, the dielectric constant (ε) and the dielectric loss tangent (ta) depend on the use conditions.
Since a large change in nδ) is likely to cause trouble, it is desired to use it in a stable state. Therefore, there is a strong demand for an insulating member having excellent dielectric properties, low hygroscopicity, and a small increase in dielectric constant (ε) and dielectric loss tangent (tan δ) even when absorbing moisture.

[0006] Japanese Patent Application Laid-Open No. 7-228775 discloses that a polyamide containing terephthalic acid and 1,9-diaminononane as a main component and a specific flame retardant are combined to have heat resistance, impact resistance, low water absorption and flame retardancy. Polyamide compositions have been proposed.

[0007] However, this polyamide composition is
It does not suggest the use of high-speed operating electronic components, which require high dielectric properties, to provide flame retardancy to connectors.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a connector for operating electronic components that operate at high speed, and in particular to a CPU for a computer.
It is intended to provide a connector for use. Another object of the present invention is to provide a resin for forming a connector which forms the connector.

[0009]

SUMMARY OF THE INVENTION A connector according to the present invention has a melting point of 280 ° C. or higher as measured by
Dicarboxylic acid of 5 to 100 mol% is terephthalic acid and diamine of 80 to 100 mol% of diamine is aliphatic diamine, and the dielectric loss tangent t in a completely dry state
an δ1 and dielectric loss tangent ta in a moisture-absorbed state obtained by allowing to stand for 7 days in a moisture-absorbing environment at 60 ° C. and 95% relative humidity.
nδ2, tan δ2 is 1.0 to 1.0 of tan δ1.
It is characterized by realizing electronic components which are made of aromatic polyamide in a range of 3.0 times and operate at high speed.

The resin for forming a connector according to the present invention is a resin for forming a connector for operating electronic parts operating at high speed, and has a melting point of 2 as measured by DSC.
80 ° C or higher, 45 to 100 mol% of dicarboxylic acid
Is a terephthalic acid dicarboxylic acid and a diamine 80
-100% by mole of a diamine which is an aliphatic diamine, and a dielectric loss tangent tan δ1 in a completely dry state;
C. and a dielectric loss tangent tan δ2 in a moisture-absorbed state where the tan δ2 was left standing for 7 days in a moisture-absorbing environment at a relative humidity of 95%, where tanδ2 was 1.0 to 3.0 times tanδ1. It is characterized by becoming.

[0011]

DETAILED DESCRIPTION OF THE INVENTION Hereinafter, the connector and the resin for forming the connector of the present invention will be specifically described. [Connector] A connector is a connector for connecting circuits or equipment to each other.It is a metal piece called a contact that generally makes electrical contact with the other party, an insulator that supports them, and an insert. , And an auxiliary mechanism for preparing for removal and fixing.

In the present invention, the connector mainly refers to the insulator portion supporting the electrical connection portion. An example is shown in FIG. In FIG. 1, 1 is a male connector, 2
Is a female connector, which is a portion formed of a resin for forming a connector. 3 is a contact (electrode), 4
Indicates an outer lead.

If the dielectric properties of the connector are low, an electric signal is also transmitted to the connector, causing a dielectric loss, which may cause incomplete transmission between the conductive terminals. The connector of the present invention has a high dielectric property and a small dielectric constant (ε) and a small dielectric tangent (tan δ).
It is possible to reduce trouble in transmission of an electric signal due to dielectric loss.

Further, the connector of the present invention may be used at a frequency of 100 MHz.
As described above, when used at a high frequency of preferably 200 MHz or more, more preferably 300 MHz or more, since the effect of preventing dielectric loss is great, the transmission loss of an electric signal is small and the trouble in information transmission hardly occurs. Therefore, the connector of the present invention can be effectively used as a connector for a CPU which transmits an electric signal at a high frequency, particularly as a connector for a CPU corresponding to a high frequency.

Further, when the connector of the present invention is used for a CPU, the effect of suppressing heat generation due to dielectric loss can be achieved, so that a device such as a cooler for cooling the CPU can be simplified.

The production of the connector of the present invention can be carried out by a conventional melt molding method such as a compression molding method, an injection molding method, an extrusion molding method, or cutting. For example, the resin for forming a connector of the present invention is melted in a cylinder of an injection molding machine whose cylinder temperature is equal to or higher than the melting point of the resin, injected into a mold having a desired connector shape, cooled, and then cooled. By taking it out, it can be manufactured. [Connector-Forming Resin] The connector-forming resin of the present invention has a melting point measured by DSC of 280 ° C. or higher, and 45 to 100% by mole of dicarboxylic acid is terephthalic acid and 80 to 100 moles of diamine. % Of a diamine which is an aliphatic diamine, and a dielectric loss tangent tan δ1 in a completely dry state and a dielectric loss tangent tan δ2 in a moisture-absorbing state obtained by allowing the apparatus to stand in a moisture-absorbing environment at 60 ° C. and a relative humidity of 95% for 7 days to absorb moisture. , Tanδ2 is tanδ
1 to 1.0 to 3.0 times the aromatic polyamide.

The aromatic polyamide as the resin for forming a connector of the present invention has a melting point of 280 ° C. or higher, preferably 290-350 ° C., more preferably 29 ° C. as measured by DSC.
It is good to be 0-310 degreeC.

When this aromatic polyamide is produced by blending two or more polyamides, the melting point is determined by the DS of the blend of two or more polyamides.
It can be observed by C measurement. Alternatively, DSC measurement may be performed by sampling from the connector.

In the dicarboxylic acid used in the present invention, the terephthalic acid component of the dicarboxylic acid component used is usually 4%.
It is 5% or more, preferably 75% by mole or more, more preferably 90% by mole or more, and most preferably 95% by mole or more. If the terephthalic acid component is less than 45 mol%, the resulting polyamide does not have sufficient heat resistance and the moisture absorption becomes too large, which is not preferable.

The dicarboxylic acid components other than terephthalic acid include isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedioxydiacetic acid, diphenic acid,
Aromatic dicarboxylic acids such as dibenzoic acid, 4,4'-oxydibenzoic acid, diphenylmethane-4,4'-dicarboxylic acid, diphenylsulfone-4,4'-dicarboxylic acid, 4,4'-biphenyldicarboxylic acid; malon Acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-
Aliphatic dicarboxylic acids such as methyladipic acid, trimethyladipic acid, pimelic acid, 2,2-dimethylglutaric acid, 3,3-diethylsuccinic acid, azelaic acid, sebacic acid and suberic acid; 1,3-cyclopentanedicarboxylic acid And alicyclic dicarboxylic acids such as 1,4-cyclohexanedicarboxylic acid; and one or more of these can be used as appropriate. Among them, aromatic dicarboxylic acids are preferably used.

Further, polycarboxylic acids such as trimellitic acid, trimesic acid and pyromellitic acid can also be used. In the diamine used in the present invention, the aliphatic diamine in the diamine component is usually 80 to 100 mol%, preferably 9 to 100 mol%.
The content is preferably 0 to 100 mol%, more preferably 95 to 100 mol%.

When the composition of the diamine component is within this range,
The obtained polyamide is preferable because it has excellent heat resistance, moldability, low moisture absorption, light weight, and impact resistance. Of these aliphatic diamines, the branched aliphatic diamine is preferably 0 to 25 mol%, and the linear aliphatic diamine is preferably 75 to 100 mol%.

In the present invention, unless otherwise specified, the number of carbon atoms in the description of the aliphatic diamine component is as follows:
It is the sum of the number of carbon atoms in the main chain alkylene group and the number of carbon atoms in the side chain alkyl group.

The linear aliphatic diamine is not particularly limited, but includes 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, and 1,11-diaminoundecane. And 1,1
2-diaminododecane and the like can be mentioned. The linear aliphatic diamine preferably has 7 to 20 carbon atoms, more preferably 9 carbon atoms, and particularly preferably 1,9-diaminononane.

The branched aliphatic diamine is not particularly limited, but includes 2,5-dimethyl-1,6-diaminohexane, 2,4-dimethyl-1,6-diaminohexane, 3,3-dimethyl-diamine. 1,6-diaminohexane,
2,2-dimethyl-1,6-diaminohexane, 2,
2,4-trimethyl-1,6-diaminohexane, 2,
4,4-trimethyl-1,6-diaminohexane, 2,
4-diethyl-1,6-diaminohexane, 2,3-dimethyl-1,7-diaminoheptane, 2,4-dimethyl-1,7-diaminoheptane, 2,5-dimethyl-1,
7-diaminoheptane, 2,2-dimethyl-1,7-diaminoheptane, 2-methyl-4-ethyl-1,7-diaminoheptane, 2-ethyl-4-methyl-1,7-diaminoheptane, 2, 2,5,5-tetramethyl-1,
7-diaminoheptane, 3-isopropyl-1,7-diaminoheptane, 3-isooctyl-1,7-diaminoheptane, 1,3-dimethyl-1,8-diaminooctane, 1,4-dimethyl-1,8- Diaminooctane,
2,4-dimethyl-1,8-diaminooctane, 3,4
-Dimethyl-1,8-diaminooctane, 4,5-dimethyl-1,8-diaminooctane, 2,2-dimethyl-
1,8-diaminooctane, 3,3-dimethyl-1,8
-Diaminooctane, 4,4-dimethyl-1,8-diaminooctane, 3,3,5-trimethyl-1,8-diaminooctane, 2,4-diethyl-1,8-diaminooctane, 2-methyl-1 , 8-diaminooctane and 5-methyl-1,9-diaminononane.

The branched aliphatic diamine preferably has 7 to 20 carbon atoms, more preferably 9 carbon atoms, and particularly preferably 2-methyl-1,8-diaminooctane. Good.

Further, other diamines include cyclohexanediamine, methylcyclohexanediamine,
Alicyclic diamines such as isophorone diamine; p-phenylenediamine, m-phenylenediamine, xylenediamine, 4,4′-diaminodiphenylmethane, 4,4 ′
Aromatic diamines such as -diaminodiphenylsulfone and 4,4'-diaminodiphenylether; and the like.

In the present invention, the use of the above-mentioned dicarboxylic acid and diamine allows the resin to have a particularly low hygroscopicity and a high dielectric property both in a completely dried state and in a hygroscopic state. A polyamide having a small dielectric constant (ε) and a small dielectric loss tangent (tan δ) can be obtained.

The aromatic polyamide used in the present invention can be produced by polycondensation of a dicarboxylic acid component and a diamine component. Specifically, this aromatic polyamide is
Terephthalic acid, or an aromatic dicarboxylic acid other than terephthalic acid, an aliphatic dicarboxylic acid, and a diamine component are mixed in the above-described amount in an aqueous medium, and pressurized in the presence of a catalyst such as sodium hypophosphite. While heating, a polyamide precursor is first produced, and then the polyamide precursor can be produced by melt-kneading or solid-phase polymerization. When producing the polyamide precursor, a molecular weight modifier such as benzoic acid may be blended.

The aromatic polyamide includes a polyamide having a branched aliphatic diamine and a straight aliphatic diamine, for example, when the aromatic polyamide contains a branched aliphatic diamine and a linear aliphatic diamine as diamine components. It can also be produced by separately producing polyamide and melt kneading them to carry out an amide exchange reaction.

The aromatic polyamide used in the present invention is melt-kneaded by adjusting the blending amounts of at least two kinds of polyamides having different compositions so that the dicarboxylic acid component unit and the diamine component unit fall within the above ranges. Can also be produced.

Dielectric constant (ε) and dielectric tangent (tan δ)
Is smaller as the dielectric property is higher. Polyamide resins generally have high hygroscopicity, and the dielectric properties tend to be lower when dry than when dry. Therefore, the values of the dielectric constant and the dielectric loss tangent tend to be higher when dry than when dry. The resin for forming a connector of the present invention is required to have high dielectric properties regardless of the humidity conditions during use.

The resin for forming a connector of the present invention includes:
The dielectric constant ε1 under the absolutely dry condition is usually 2.5 to 6, preferably 2.5 to 5, and more preferably 2.5 to 4, and the dielectric loss tangent tanδ1 under the absolutely dry condition is usually 0. 0.001 to 0.05, preferably 0.001 to 0.0
3, more preferably 0.001 to 0.02.

It is also desirable that the decrease in the dielectric properties during moisture absorption and the increase in the dielectric constant (ε) and the dielectric loss tangent (tan δ) are small, and that the resin is placed in a moisture-absorbing environment at 60 ° C. and a relative humidity of 95%. The value of the dielectric loss tangent tan δ2 in the moisture-absorbed state after standing for one day and absorbing moisture is 1.0 to 3.0 times, preferably 1.0 to 2.5 times, more preferably 1.0 to 3.0 times the value of tan δ1. It is desirable to be in the range of 2.0 times.

The dicarboxylic acid component and the diamine component used in the present invention have a melting point of 280 ° C. or higher as measured by DSC, and have a tan tan δ1 in a completely dry state and a tan tan δ2 in the above-mentioned moisture absorption state.
As long as δ2 is in the range of 1.0 to 3.0 times tan δ1, it can be appropriately used.

The resin for forming a connector of the present invention may contain, if necessary, a stabilizer, a coloring agent, an ultraviolet absorber, an antioxidant,
An antistatic agent, a flame retardant, a plasticizer, a functional resin, a glass fiber and the like can be added, and it is preferable to use those additives having high dielectric properties.

The resin for forming a connector of the present invention has a high dielectric property and a small dielectric loss, so that troubles due to dielectric loss occurring in high-frequency electronic parts and the like can be reduced, and as a connector member of electronic parts operating at high speed. It can be suitably used.

The resin for forming a connector of the present invention can be used for a connector for operating electronic parts operating at high speed, especially C
It can be suitably used as an insulating member of a connector for a PU, among which 100 MHz or more, preferably 200M
When used for a CPU connector having an internal clock frequency of at least Hz, particularly preferably at least 300 MHz, the effect of avoiding troubles due to transmission loss of electric signals is high.

At present, the speed of a motherboard of a computer has been increased to about 100 MHz, and the connector of the present invention can be suitably used as a connector for a motherboard.

The connector of the present invention can be manufactured by molding into a desired shape by a usual melt molding method such as a compression molding method, an injection molding method, an extrusion molding method, or cutting.
For example, the resin for molding a connector of the present invention is melted in a cylinder of an injection molding machine having a cylinder temperature equal to or higher than the melting point of the resin, injected into a mold having a desired shape, and taken out from the mold after cooling. Thereby, a desired connector can be manufactured.

[0041]

According to the present invention, it is possible to provide a connector for operating electronic parts having high dielectric properties and operating at high speed, particularly a connector for a CPU of a computer.

Further, it is possible to provide a resin for forming a connector, which has a high dielectric property at the time of absolute drying and a small decrease in the dielectric property even at the time of moisture absorption.

[0043]

EXAMPLES Hereinafter, the present invention will be described more specifically based on examples, but the present invention is not limited to these examples. <Measurement method> [Melting point] An endothermic curve of DSC was determined, and the temperature at the maximum peak position was defined as the melting point (Tm).

The endothermic curve was obtained by packing the sample in an aluminum pan,
The temperature was rapidly raised to 50 ° C., maintained at 350 ° C. for 5 minutes, cooled to room temperature at 10 ° C./min, and then raised at 10 ° C./min. [Moisture Absorption Rate] The moisture absorption rate in the moisture absorbing state was determined by measuring the weight of the molded square plate at the time of absolute drying and after the moisture absorption, and calculating the difference in weight. [Dielectric constant (ε) and dielectric loss tangent (tan δ)] 23 ° C.
In an atmosphere with a relative humidity of 50%, the measurement was performed at a frequency of 1 MHz using an R-1100 type dielectric loss automatic measurement device (manufactured by Ando Electric Co., Ltd.).

[0045]

Example 1 3256.2 g of terephthalic acid (19.60)
Mol), 2690.9 g of 1,9-diaminononane (1
7.0 mol), 474.9 g (3.0 mol) of 2-methyl-1,8-diaminooctane, 97.7 g of benzoic acid
(0.80 mol), sodium hypophosphite monohydrate6.
5 g (0.1% by weight based on the raw material) and 2.2 parts of distilled water
The liter was placed in an autoclave having an internal volume of 20 liters and purged with nitrogen. The mixture was stirred at 100 ° C for 30 minutes, and the internal temperature was raised to 210 ° C over 2 hours. At this time, the pressure in the autoclave was increased by 22 kg / cm ² . After continuing the reaction for 1 hour, the temperature was raised to 230 ° C.
Maintain the temperature at 30 ° C.
The reaction was performed while keeping the weight at kg / cm ² . Next, the pressure was reduced to 10 kg / cm ² over 30 minutes, and the reaction was further performed for 1 hour.

Thus, the repeating unit composed of 1,9-diaminononane and terephthalic acid is 85 mol%, and the repeating unit composed of 2-methyl-1,8-diaminooctane and terephthalic acid is 15 mol%. Was synthesized.

Using this polyamide, 130 × 120 × 2 mm at a cylinder temperature of 320 ° C. and a mold temperature of 120 ° C.
Was injection molded. With respect to this square plate, a moisture absorption rate in a moisture absorbing state, a dielectric constant and a dielectric loss tangent in an absolutely dry state and a moisture absorbing state were measured. The moisture absorption was performed by allowing the sample to stand in a moisture absorbing environment at 60 ° C. and a relative humidity of 95% for 7 days. In the measurement, molding was performed using a polyamide dried at 120 ° C. for 12 hours under reduced pressure in an N ₂ atmosphere.

Table 1 shows the results. The molded article obtained from the resin for forming a connector of the present invention obtained as described above has a low dielectric constant ε1 and a low dielectric loss tangent tanδ1 in a completely dry state, and shows sufficient dielectric properties. Also,
Even when moisture is absorbed, the dielectric constant ε2 and the dielectric loss tangent t
It was found that the value of anδ1 was sufficiently small and good dielectric properties were maintained. At this time, the dielectric loss tangent tan δ2 is t
It is 1.29 times the value of an δ1, indicating that the increase in the dielectric loss tangent value is small and the decrease in the dielectric properties is extremely small.

The connector manufactured using this resin is:
It has high dielectric properties as described above and is suitable as a connector for a high-speed CPU.

[0050]

[Comparative Example 1] Nylon 4,6 (manufactured by Unitika Ltd., F5
000N), a 130 × 120 × 2 mm square plate was injection molded at a cylinder temperature of 300 ° C. and a mold temperature of 80 ° C.

Next, in the same manner as in Example 1, the dielectric constant and the dielectric loss tangent of the molded article in the absolutely dry state and in the moisture absorbing state were measured. Table 1 shows the results.

[0052]

Comparative Example 2 Cylinder temperature of 280 using nylon 6,6 (Amilan CM-3001N, manufactured by Toray Industries, Inc.)
A square plate of 130 × 120 × 2 mm was injection molded at 70 ° C. and a mold temperature of 70 ° C. Next, in the same manner as in Example 1, the dielectric constant and the dielectric loss tangent of the molded article in a completely dry state and a moisture absorption state were measured. Table 1 shows the results.

[0053]

Comparative Example 3 Nylon 12 (301 manufactured by Ube Industries, Ltd.)
4B), cylinder temperature 190 ° C., mold temperature 5
At 0 ° C., a 130 × 120 × 2 mm square plate was injection molded.
Next, in the same manner as in Example 1, the dielectric constant and the dielectric loss tangent of the molded article in a completely dry state and a moisture absorption state were measured. Table 1 shows the results.

[0054]

Comparative Example 4 99.8 kg of 1,6-diaminohexane
(859 moles) and 78.1 kg (470 moles) of terephthalic acid are polycondensed according to a conventional method.
6.0 kg (384 moles) were polycondensed to give 55 parts by weight of a repeating unit composed of 1,6-diaminohexane and terephthalic acid and 45 parts by weight of a repeating unit composed of 1,6-diaminohexanetoadipic acid. Pellets of semi-aromatic polyamide as parts by weight were prepared.

Using this polyamide, a 130 × 120 × 2 mm square plate was injection molded at a cylinder temperature of 320 ° C. and a mold temperature of 80 ° C. Then, in the same manner as in Example 1,
The dielectric constant and the dielectric loss tangent of the molded article in a completely dry state and a moisture absorbing state were measured. Table 1 shows the results.

[0056]

[Table 1]

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a connector of the present invention.

[Explanation of symbols]

 1 ... male connector 2 ... female connector 3 ... contact (electrode) 4 ... outer lead

 ──────────────────────────────────────────────────続 き Continued on front page F-term (reference) 4J001 DA01 DB04 DC14 EB05 EB06 EB07 EB08 EB09 EB13 EB14 EB36 EB37 EB46 EB55 EB56 EB60 EB67 EC04 EC09 EC13 EC14 EC15 EC44 EC45 EC46 EC66 EC67 EC70 FA01 FB01 JB05B07 FCB EE02 EE14 GG34 HH01 KK04 MM03 QQ06 RR02 RR47

Claims (8)

[Claims] (1) a dicarboxylic acid having a melting point of 280 ° C. or higher as measured by DSC and 45 to 100 mol% of dicarboxylic acid being terephthalic acid and a diamine being 80 to 100 mol% of diamine being an aliphatic diamine; In the absolutely dry state, the dielectric loss tangent tan δ1 and the dielectric loss tangent tan δ2 in a moisture-absorbed state in which the dielectric tangent tan δ2 is left standing for 7 days in a moisture-absorbing environment at 60 ° C. and a relative humidity of 95% to obtain tan tan
A connector for operating high-speed electronic components made of an aromatic polyamide, wherein δ2 is in the range of 1.0 to 3.0 times tan δ1. 2. 75-100 mol% of dicarboxylic acid
Is a terephthalic acid; 0 to 25 mol% of the aliphatic diamine is a branched aliphatic diamine; and 75 to 100 mol% is a linear aliphatic diamine. . 3. The connector according to claim 2, wherein the straight-chain aliphatic diamine has 7 to 20 carbon atoms. 4. The connector according to claim 2, wherein the branched aliphatic diamine has 7 to 20 carbon atoms. 5. The connector according to claim 1, wherein the electronic component is a high-frequency electronic component that operates at 100 MHz or more. 6. The connector according to claim 1, wherein the electronic component is a CPU. 7. The connector according to claim 6, wherein the CPU is a CPU having an internal clock frequency of 200 MHz or more. 8. A dicarboxylic acid having a melting point of 280 ° C. or higher as measured by DSC, wherein 45 to 100 mol% of dicarboxylic acid is terephthalic acid, and 80 to 100 mol% of diamine.
Is a diamine which is an aliphatic diamine, and has a dielectric loss tangent tan δ1 in a completely dry state, 60 ° C., and a relative humidity of 95.
% Of the dielectric loss tangent tan δ2 in a moisture-absorbed state where the tan δ2 is left standing for 7 days in a moisture-absorbing environment for 7 days.
A resin for forming a connector for operating electronic parts operating at high speed, comprising an aromatic polyamide in the range of 1.0 to 3.0 times an δ1.