JP2000086759A5 - - Google Patents
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- JP2000086759A5 JP2000086759A5 JP1998258812A JP25881298A JP2000086759A5 JP 2000086759 A5 JP2000086759 A5 JP 2000086759A5 JP 1998258812 A JP1998258812 A JP 1998258812A JP 25881298 A JP25881298 A JP 25881298A JP 2000086759 A5 JP2000086759 A5 JP 2000086759A5
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- Prior art keywords
- acid
- polyamide
- fibers
- dicarboxylic
- acids
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- 239000004952 Polyamide Substances 0.000 description 16
- 229920002647 polyamide Polymers 0.000 description 16
- 239000011528 polyamide (building material) Substances 0.000 description 16
- -1 aliphatic dicarboxylic acid Chemical class 0.000 description 14
- 239000000835 fiber Substances 0.000 description 11
- 239000002253 acid Substances 0.000 description 9
- 150000004985 diamines Chemical class 0.000 description 7
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- XBDQKXXYIPTUBI-UHFFFAOYSA-N propionic acid Chemical compound CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N Adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butanoic acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N Hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N Isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- TUNFSRHWOTWDNC-UHFFFAOYSA-N Myristic acid Chemical compound CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N Palmitic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N Sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N Stearic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N Valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atoms Chemical group C* 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Azelaic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N Decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N Glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N Lauric acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 235000021360 Myristic acid Nutrition 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N Pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N Suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 229940005605 valeric acid Drugs 0.000 description 2
- SJSYJHLLBBSLIH-SDNWHVSQSA-N (E)-3-(2-methoxyphenyl)-2-phenylprop-2-enoic acid Chemical compound COC1=CC=CC=C1\C=C(\C(O)=O)C1=CC=CC=C1 SJSYJHLLBBSLIH-SDNWHVSQSA-N 0.000 description 1
- GBURUDXSBYGPBL-UHFFFAOYSA-N 2,2,3-trimethylhexanedioic acid Chemical compound OC(=O)C(C)(C)C(C)CCC(O)=O GBURUDXSBYGPBL-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N 2,6-Naphthalenedicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- JZUMVFMLJGSMRF-UHFFFAOYSA-N 2-Methyladipic acid Chemical compound OC(=O)C(C)CCCC(O)=O JZUMVFMLJGSMRF-UHFFFAOYSA-N 0.000 description 1
- ZVMAGJJPTALGQB-UHFFFAOYSA-N 2-[3-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=CC(OCC(O)=O)=C1 ZVMAGJJPTALGQB-UHFFFAOYSA-N 0.000 description 1
- DNXOCFKTVLHUMU-UHFFFAOYSA-N 2-[4-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=C(OCC(O)=O)C=C1 DNXOCFKTVLHUMU-UHFFFAOYSA-N 0.000 description 1
- ZSPDYGICHBLYSD-UHFFFAOYSA-N 2-methylnaphthalene-1-carboxylic acid Chemical class C1=CC=CC2=C(C(O)=O)C(C)=CC=C21 ZSPDYGICHBLYSD-UHFFFAOYSA-N 0.000 description 1
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical class C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4,4'-Oxydianiline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- VTDMBRAUHKUOON-UHFFFAOYSA-N 4-[(4-carboxyphenyl)methyl]benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C=C1 VTDMBRAUHKUOON-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N AI2O3 Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- NZNMSOFKMUBTKW-UHFFFAOYSA-N Cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N Dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N Hexamethylenediamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N Hypophosphorous acid Chemical compound OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- WLJVXDMOQOGPHL-UHFFFAOYSA-N Phenylacetic acid Natural products OC(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-N 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N Pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- ZGKNDXOLMOFEJH-UHFFFAOYSA-M Sodium hypophosphite Chemical compound [Na+].[O-]P=O ZGKNDXOLMOFEJH-UHFFFAOYSA-M 0.000 description 1
- SZHOJFHSIKHZHA-UHFFFAOYSA-N Tridecylic acid Chemical compound CCCCCCCCCCCCC(O)=O SZHOJFHSIKHZHA-UHFFFAOYSA-N 0.000 description 1
- QMKYBPDZANOJGF-UHFFFAOYSA-N Trimesic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- XMKWCYAHVZZBKW-UHFFFAOYSA-N benzoic acid;2-methylpropanoic acid Chemical compound CC(C)C(O)=O.OC(=O)C1=CC=CC=C1 XMKWCYAHVZZBKW-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000005712 crystallization Effects 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N cyclohexane-1,4-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative Effects 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- TVZISJTYELEYPI-UHFFFAOYSA-J dioxido-oxo-phosphonato-$l^{5}-phosphane Chemical compound [O-]P([O-])(=O)P([O-])([O-])=O TVZISJTYELEYPI-UHFFFAOYSA-J 0.000 description 1
- UWLPCYBIJSLGQO-UHFFFAOYSA-N dodecanoic acid;propane-1,2,3-triol Chemical compound OCC(O)CO.CCCCCCCCCCCC(O)=O UWLPCYBIJSLGQO-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 229960003424 phenylacetic acid Drugs 0.000 description 1
- 239000003279 phenylacetic acid Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Description
すなわち、本発明は、ジカルボン酸成分の60〜100モル%がテレフタル酸および炭素数4〜40の脂肪族ジカルボン酸からなり、かつテレフタル酸と炭素数4〜40の脂肪族ジカルボン酸の割合が重量比で50:50〜90:10であるジカルボン酸成分と、ジアミン成分の60〜100モル%が炭素数9の脂肪族ジアミンであるジアミン成分とからなるポリアミドであって、濃硫酸中30℃で測定した極限粘度[η]が0.4〜3.0dl/gであるポリアミドに関する。
また、本発明は、上記のポリアミド100重量部に対し、0.01〜10重量部の結晶核剤および/または0.1〜200重量部の充填剤を配合してなるポリアミド組成物に関する。
さらに、本発明は、上記のポリアミドまたはポリアミド組成物からなる成形品に関する。
That is, in the present invention, 60 to 100 mol% of the dicarboxylic acid component is composed of terephthalic acid and an aliphatic dicarboxylic acid having 4 to 40 carbon atoms, and the ratio of terephthalic acid to the aliphatic dicarboxylic acid having 4 to 40 carbon atoms is by weight. A polyamide composed of a dicarboxylic acid component having a ratio of 50:50 to 90:10 and a diamine component in which 60 to 100 mol% of the diamine component is an aliphatic diamine having 9 carbon atoms , at 30 ° C. in concentrated sulfuric acid. It relates to a polyamide having a measured extreme viscosity [η] of 0.4 to 3.0 dl / g.
The present invention also relates to a polyamide composition obtained by blending 0.01 to 10 parts by weight of a crystal nucleating agent and / or 0.1 to 200 parts by weight of a filler with 100 parts by weight of the above-mentioned polyamide.
Furthermore, the present invention relates to a molded product made of the above-mentioned polyamide or polyamide composition.
炭素数4〜40の脂肪族ジカルボン酸としては、例えば、マロン酸、ジメチルマロン酸、コハク酸、グルタル酸、アジピン酸、2−メチルアジピン酸、トリメチルアジピン酸、ピメリン酸、2,2−ジメチルグルタル酸、2,2−ジエチルコハク酸、アゼライン酸、セバシン酸、スベリン酸、ダイマー酸などを挙げることができ、これらの脂肪族ジカルボン酸の1種または2種以上を用いることができる。これらの脂肪族ジカルボン酸の中でも、アジピン酸、アゼライン酸、セバシン酸が好ましい。 Examples of the aliphatic dicarboxylic acid having 4 to 40 carbon atoms include malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyladipic acid, pimelic acid, and 2,2-dimethylglutar. acid, 2, 2 - diethyl succinate, azelaic acid, sebacic acid, suberic acid, etc. can be mentioned dimer acid may be used one or two or more of these aliphatic dicarboxylic acids. Among these aliphatic dicarboxylic acids, adipic acid, azelaic acid, and sebacic acid are preferable.
本発明のポリアミドにおける他のジカルボン酸成分として、例えば、1,3−シクロペンタンジカルボン酸、1,4−シクロヘキサンジカルボン酸などの脂環式ジカルボン酸;イソフタル酸、2,6−ナフタレンジカルボン酸、2,7−ナフタレンジカルボン酸、1,4−ナフタレンジカルボン酸、1,4−フェニレンジオキシジ酢酸、1,3−フェニレンジオキシジ酢酸、ジフェン酸、4,4’−オキシジ安息香酸、ジフェニルメタン−4,4’−ジカルボン酸、ジフェニルスルホン−4,4’−ジカルボン酸、4,4’−ビフェニルジカルボン酸などの芳香族ジカルボン酸などが挙げられ、これらは1種または2種以上で用いることができる。これらの中でも、イソフタル酸などの芳香族ジカルボン酸が好ましく使用される。さらに、トリメリット酸、トリメシン酸、ピロメリット酸などの多価カルボン酸を、得られるポリアミドが溶融成形が可能な範囲内で用いることもできる。 Other dicarboxylic acid components in the polyamide of the present invention include alicyclic dicarboxylic acids such as 1,3-cyclopentanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid; isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2 , 7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid , 1,3-phenylenedioxydiacetic acid, diphenylic acid, 4,4'-oxydibenzoic acid, diphenylmethane-4 , 4'-dicarboxylic acid, diphenylsulfon-4,4'-dicarboxylic acid, aromatic dicarboxylic acid such as 4,4'-biphenyldicarboxylic acid, etc., and these can be used in one kind or two or more kinds. .. Among these, aromatic dicarboxylic acids such as isophthalic acid are preferably used. Further, polyvalent carboxylic acids such as trimellitic acid, trimesic acid and pyromellitic acid can be used within a range in which the obtained polyamide can be melt-molded.
末端封止剤として使用できるモノカルボン酸としては、アミノ基との反応性を有するものであれば特に制限はないが、例えば、酢酸、プロピオン酸、酪酸、吉草酸、カプロン酸、カプリル酸、ラウリン酸、トリデシル酸、ミリスチン酸、パルミチン酸、ステアリン酸、ピバリン酸、イソブチル酸などの脂肪族モノカルボン酸;シクロヘキサンカルボン酸などの脂環式モノカルボン酸;安息香酸、トルイル酸、α−ナフタレンカルボン酸、β−ナフタレンカルボン酸、メチルナフタレンカルボン酸、フェニル酢酸などの芳香族モノカルボン酸、あるいはこれらの任意の混合物を挙げることができる。これらのうち、反応性、封止末端の安定性、価格などの点から、酢酸、プロピオン酸、酪酸、吉草酸、カプロン酸、カプリル酸、ラウリン酸、トリデシル酸、ミリスチン酸、パルミチン酸、ステアリン酸、安息香酸が特に好ましい。 The monocarboxylic acid that can be used as an end-capping agent is not particularly limited as long as it has reactivity with an amino group, but for example, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, capric acid, and laurin. cycloaliphatic monocarboxylic acids such as cyclohexanecarboxylic acid; acid, tridecyl acid, myristic acid, palmitic acid, stearic acid, pivalic acid, aliphatic monocarboxylic acids such as isobutyric acid benzoic acid, Tolui Le acid, alpha-naphthalene carboxylic Aromatic monocarboxylic acids such as acids, β-naphthalenecarboxylic acids, methylnaphthalenecarboxylic acids, phenylacetic acid, or any mixture thereof can be mentioned. Of these, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, etc. , Saprosylic acid is particularly preferred.
本発明のポリアミドは、結晶性ポリアミドを製造する方法として知られている任意の方法を用いて製造することができる。例えば、酸クロライドとジアミンを原料とする溶液重合法または界面重合法;ジカルボン酸とジアミンを原料とする溶融重合法、固相重合法、溶融押出重合法などの方法により製造することが可能である。ポリアミドを製造する際に、重縮合速度の増加および重合時に生成したポリアミドが劣化するのを防止する目的で、リン酸、亜リン酸、次亜リン酸、またはそれらの塩、さらにはそれらのエステルなどのリン系触媒を反応系に添加するのが好ましい。このうち、生成するポリアミドの品質の点から、次亜リン酸誘導体が好ましく、特に、次亜リン酸ナトリウムが価格および取り扱いの容易さから好ましい。これらのリン系触媒の添加量は、ジカルボン酸およびジアミンの合計重量に対して0.01〜5重量%であるのが好ましく、0.05〜2重量%であるのがより好ましく、0.07〜1重量%であるのが特に好ましい。また、上記の末端封止剤の使用量は、用いる末端封止剤の反応性、沸点、反応装置、反応条件などによって変化するが、通常、ジカルボン酸とジアミンの総合計モル数に対して0.1〜15モル%の範囲内で用いることができる。 The polyamide of the present invention can be produced by using any method known as a method for producing a crystalline polyamide. For example, a solution polymerization method or interfacial polymerization method for the acid chloride and a diamine as raw materials; melt polymerization the dicarboxylic acid and diamine as raw materials, solid phase polymerization, can be produced by a method such as melt pressing Dekasane legitimate is there. Phosphoric acid, phosphorous acid, hypophosphorous acid, or salts thereof, and esters thereof, for the purpose of increasing the polycondensation rate and preventing the polyamide produced during polymerization from deteriorating during the production of polyamide. It is preferable to add a phosphorus-based catalyst such as the above to the reaction system. Of these, a hypophosphorous acid derivative is preferable from the viewpoint of the quality of the produced polyamide, and sodium hypophosphate is particularly preferable from the viewpoint of price and ease of handling. The amount of these phosphorus-based catalysts added is preferably 0.01 to 5% by weight, more preferably 0.05 to 2% by weight, and 0.07, based on the total weight of the dicarboxylic acid and diamine. It is particularly preferably ~ 1% by weight. The amount of the terminal encapsulant used varies depending on the reactivity, boiling point, reaction apparatus, reaction conditions, etc. of the end encapsulant used, but is usually 0 with respect to the total number of moles of the dicarboxylic acid and the diamine. It can be used in the range of 1 to 15 mol%.
繊維状充填剤としては、例えば、ポリパラフェニレンテレフタルアミド繊維、ポリメタフェニレンテレフタルアミド繊維、ポリパラフェニレンイソフタルアミド繊維、ポリメタフェニレンイソフタルアミド繊維、ジアミノジフェニルエーテルとテレフタル酸またはイソフタル酸からの縮合物から得られる繊維などの全芳香族ポリアミド繊維、あるいは全芳香族液晶ポリエステル繊維、ビニロン繊維などの有機系の繊維状充填剤;あるいはガラス繊維、炭素繊維、アルミナ繊維、金属繊維、ホウ素繊維などの無機系の繊維状充填剤が挙げられる。このような繊維状充填剤を配合する場合には、ポリアミド組成物から得られる成形品は、摺動特性が優れるだけでなく、機械的特性、耐熱特性、化学的物理的特性などが優れるので好ましい。これらの繊維状充填剤は、平均長が0.05〜50mmの範囲にあるものが好ましい。さらに、成形性が良好であり、得られる成形品の摺動特性、耐熱特性、機械的特性がより優れる点で、平均長が1〜10mmの範囲のものを用いるのがより好ましい。これらの繊維状充填剤は、クロス状などに2次加工されていてもよい。 Examples of the fibrous filler, for example, polyparaphenylene terephthalamide data Ruamido fibers, poly meta-phenylene terephthalamide fibers, polyparaphenylene isophthalamide fibers, polymetaphenylene isophthalamide fibers, condensate from diaminodiphenyl ether and terephthalic acid or isophthalic acid Total aromatic polyamide fibers such as fibers obtained from, or organic fibrous fillers such as total aromatic liquid crystal polyester fibers and vinylon fibers; or inorganics such as glass fibers, carbon fibers, alumina fibers, metal fibers and boron fibers. Examples include fibrous fillers of the system. When such a fibrous filler is blended, the molded product obtained from the polyamide composition is preferable because it not only has excellent sliding properties but also excellent mechanical properties, heat resistance properties, chemical physical properties and the like. .. These fibrous fillers preferably have an average length in the range of 0.05 to 50 mm. Further, it is more preferable to use one having an average length in the range of 1 to 10 mm in that the moldability is good and the obtained molded product has more excellent sliding characteristics, heat resistance characteristics and mechanical characteristics. These fibrous fillers may be secondarily processed into a cloth or the like.
比較例2
ジカルボン酸成分としてテレフタル酸を2290.9g(13.79モル)、イソフタル酸を981.8g(5.91モル)、ジアミン成分として1,6−ヘキサンジアミンを2324.2g(20.00モル)、また次亜リン酸ナトリウム一水和物を6.5g用いた以外は実施例1と同様の方法に従って、極限粘度[η]が1.00dl/gのポリアミドを得た。このポリアミドをシリンダー温度330℃の2軸押出機を用いてペレット化し、溶融時アウトガス試験を行った。得られた結果を表3に示す。上記方法で得られたペレットを、シリンダー温度330℃、金型温度80℃で射出成形し、得られた成形品を用いて、吸水率、引張強度、スチーム処理後の強度保持率、アルコール処理後の強度保持率、IZOD衝撃強度を測定した。得られた結果を表3に示す。また、上記方法で得られたペレットを用いて330℃でプレス成形し、得られたプレスフィルムを用いて急冷後の結晶化発熱量を測定した。得られた結果を表3に示す。
Comparative Example 2
2290.9 g (13.79 mol) of terephthalic acid as a dicarboxylic acid component, 981.8 g (5.91 mol) of isophthalic acid, and 2324.2 g (20.00 mol) of 1,6-hexanediamine as a diamine component. also in a similar manner to that of example 1 except that had a 6.5 g of sodium hypophosphite monohydrate, an intrinsic viscosity [eta] was obtained polyamide 1.00 dl / g. This polyamide was pelletized using a twin-screw extruder having a cylinder temperature of 330 ° C., and an outgas test at the time of melting was performed. The results obtained are shown in Table 3. The pellets obtained by the above method are injection-molded at a cylinder temperature of 330 ° C. and a mold temperature of 80 ° C., and the obtained molded product is used for water absorption, tensile strength, strength retention after steam treatment, and after alcohol treatment. The strength retention rate and IZOD impact strength were measured. The results obtained are shown in Table 3. Further, the pellets obtained by the above method were press-molded at 330 ° C., and the obtained press film was used to measure the calorific value of crystallization after quenching. The results obtained are shown in Table 3.
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JP2002220462A (en) * | 2001-01-29 | 2002-08-09 | Mitsui Chemicals Inc | Polyamide resin, polyamide resin composition and its molded product |
CA2386717A1 (en) | 2001-05-21 | 2002-11-21 | Kuraray Co., Ltd. | Polyamide composition |
JP3986889B2 (en) * | 2001-05-21 | 2007-10-03 | 株式会社クラレ | Polyamide composition |
JP4203262B2 (en) * | 2002-05-22 | 2008-12-24 | 三菱製紙株式会社 | Nonwoven fabric for separators for alkaline batteries |
DE10224296A1 (en) * | 2002-05-31 | 2003-12-11 | Behr Gmbh & Co | Method for producing a heat exchanger box |
JP4162455B2 (en) * | 2002-09-11 | 2008-10-08 | 株式会社クラレ | Alkaline battery separator and battery using the same |
JP2006002113A (en) * | 2004-06-21 | 2006-01-05 | Kuraray Co Ltd | Polyamide resin composition and molded article of the same |
WO2008072754A1 (en) * | 2006-12-11 | 2008-06-19 | Ube Industries, Ltd. | Polyamide resin |
JP5546349B2 (en) * | 2009-05-25 | 2014-07-09 | ユニチカ株式会社 | Process for producing stretched semi-aromatic polyamide film and stretched semi-aromatic polyamide film produced by the method |
WO2012023671A1 (en) * | 2010-08-20 | 2012-02-23 | 제일모직 주식회사 | Bracket for protecting lcd of portable display device |
US20130328244A1 (en) * | 2010-12-14 | 2013-12-12 | Ndsu Research Foundation | Polyamides and methods of making and using same |
US11155686B2 (en) | 2016-03-30 | 2021-10-26 | Toray Industries, Inc. | Fiber-reinforced polyamide resin base, method for producing same, molded article containing same, and composite molded article |
JP7087716B2 (en) * | 2017-06-23 | 2022-06-21 | 東レ株式会社 | Polyamide resin composite molded product and its manufacturing method |
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