JP2000067968A - Connector device and its connecting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To establish certain connection of a lead wire without using a soldering process in a configuration where the connecting pitch is set very narrow. SOLUTION: From the forefront of a flexible board 1, three parts are formed, i.e., a folded part 5, opening part 8, and a connecting region part 9. A protection film 4 is provided on a wiring circuit pattern formed on a base film 2 in the connecting region part 9, and the wiring circuit pattern is exposed at a notch 10 provided in the protection film 4. A lead wire 12 is passed through the opening part 8 from the rear, and if the core wire 12a of the lead wire is contacted with the exposed wiring circuit pattern 3, the lead wire 12 is held provisionally by a sticker 11 applied to the board 1 and can thereby be connected with the wiring circuit pattern 3 by folding the opening part 8 into two parts and bonding the folding-back 5 to the connecting region part 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a connector device for connecting a lead wire to a wiring circuit pattern formed on a flexible substrate, and a connection method therefor.

[0002]

Conventionally, the connection between a flexible substrate and a lead wire has been made by soldering the lead wire to a wiring circuit pattern formed on the flexible substrate.

However, if the pitch of the wiring circuit pattern of the flexible substrate is extremely small for miniaturization of the product, workability is deteriorated and the occurrence of troubles such as generation of a bridge increases.

The present invention has been made in view of the above circumstances, and an object of the present invention is to reliably connect lead wires without soldering on a flexible substrate in which a connection pitch with the lead wires is extremely small. It is an object of the present invention to provide a connector device and a connection method thereof.

[0005]

According to the present invention, a long base film is provided, a folded portion is provided at a leading end of the base film, and the base film is separated from the folded portion by a predetermined distance. Provide the set connection area part,
An opening formed in the base film between the folded portion and the connection region; a wiring circuit pattern formed on the base film and having an end located in the connection region; A protective film for covering the pattern is provided, a notch is formed on the protective film to expose an end of the wiring circuit pattern located in the connection region, and the folded portion is folded in a state where the opening is folded in two. An adhesive member that adheres to the connection region is provided (claim 1).

According to such a configuration, in the wiring circuit pattern formed on the base film, the end located in the connection region is exposed from the notch, so that it is exposed from the notch. When the lead wire is brought into contact with the wiring circuit pattern and the folded portion is brought into close contact with the cutout portion in a folded state with an adhesive member, the wiring circuit pattern and the lead wire can be electrically connected.

In the above configuration, a dummy pattern for forming a concave portion is provided at a position corresponding to the cutout portion in the folded portion of the base film, and a protective film for covering the dummy pattern is provided. .

According to such a configuration, since the concave portion is formed by the dummy pattern in the portion corresponding to the notch in the folded portion, the lead wire is sandwiched between the notch and the concave, and the lead wire is formed. The line can be reliably positioned.

[0009] In the connection method for a connector device according to the present invention, in the above structure, the lead wire passed through the opening is brought into contact with an end of the wiring circuit pattern facing the notch, and then the opening is closed. The folded portion is bonded to the connection region portion by the bonding member by folding in two (Claim 3).

According to such a configuration, in order to connect the flexible substrate and the lead wire, first, the lead wire is passed through the opening, and is then brought into contact with the wiring circuit pattern facing the notch.

Subsequently, when the folded portion is bonded to the connection region by an adhesive member by folding the opening into two portions, the lead wire is sandwiched between the cutout portion and the connection region.
The lead wire can be reliably conducted to the wiring circuit pattern.

Further, the lead wire is formed between the cutout portion and the folded portion after the folded portion is bonded to the connection region by the adhesive member by folding the opening portion in half. You may make it enter into an insertion space part (claim 4).

[0013] According to such a configuration, first, the opening is folded in two to bond the folded portion to the connection region with an adhesive member. Thereby, an insertion space portion is formed between the notch portion and the folded portion.

Subsequently, when the lead wire enters the insertion space, the lead wire comes into pressure contact with the wiring circuit pattern, so that the lead wire can be reliably conducted to the wiring circuit pattern.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described below with reference to FIGS. FIG. 2 is a plan view of a distal end portion of a long flexible substrate. In FIG. 2, the flexible substrate 1 constitutes a connector device having an extremely narrow pitch, and is used for connecting a fine lead wire as described later.

The flexible substrate 1 is formed by forming a wiring circuit pattern 3 (Cu 18 to 35 μm, Au plating) on a base film 2 (polyimide 25 to 50 μm), and further covering the wiring circuit pattern 3 with a protective film 4. Is formed.

A bent portion 5 is formed at the tip of the flexible substrate 1. The folded portion 5 is formed by forming a dummy pattern 6 on the base film 2 and covering the upper surface thereof with the protective film 4. The dummy patterns 6 are formed at the same time when the wiring circuit patterns 3 are formed, and the recesses 7 are formed between the dummy patterns 6 by being formed in parallel at a predetermined pitch.

An opening 8 is stamped and formed in a portion of the flexible substrate 1 adjacent to the folded portion 5. No protective film is provided on the opening edge 8a of the opening 8, and the base film 2 is exposed.

In the flexible substrate 1, a connection region 9 is set adjacent to the opening 8, and the end of the wiring circuit pattern 3 is provided at a predetermined pitch (0.
(4 mm pitch). In this case, a notch 10 is formed at a predetermined portion corresponding to an end of the wiring circuit pattern 3 in the protective film 4 for protecting the connection region 9, and the wiring circuit pattern 3 is formed through the notch 10.
End is exposed. In this case, the width of the notch 10 is 0.1 mm. An adhesive 11 is provided on the flexible substrate 1 at a position before and after the notch 10.
(Corresponding to an adhesive member) is applied.

In order to connect a very fine lead wire to the flexible substrate 1 having the above structure, the lead wire 12 is passed from the back side of the opening 8 as shown in FIG. 1) is attached to the end of the wiring circuit pattern 3 exposed from the notch 10. Here, since an adhesive is applied to portions of the flexible substrate 1 that are located before and after the notch 10, the core 12 a of the lead wire 12 adheres to the wiring circuit pattern 3 exposed from the notch 10 by the adhesive 11. Temporarily held in the state. At this time, since the core portion 12a of the lead wire 12 is located in the concave notch portion 10, no displacement occurs.

Subsequently, the folded portion 5 is brought into close contact with the connection region 9 by folding the opening 8 in half. As a result, the folded portion 5 is adhered to the connection region 9 with the adhesive 11, and in this state, the core portion 12a of the lead wire 12 is pressed against the wiring circuit pattern 3, thereby securely connecting the lead wire 12. It can be connected to the wiring circuit pattern 3.

On the other hand, in the folded portion 5, the notch 10
Since the concave portion 7 is formed by the dummy pattern 6 corresponding to the wiring circuit pattern 3 facing from above, the core portion 12 a of the lead wire 12 is added to the notch portion 10 when the folded portion 5 is in close contact with the connection region portion 9. The lead wire 1 is positioned by the concave portion 7 formed by the dummy pattern 6.
2 can be reliably prevented from being displaced.

According to such an embodiment, the folded portion 5, the opening 8 and the connection region 9 are provided adjacent to the leading end of the flexible substrate 1, and the opening 8 is folded in two to thereby form the folded portion 5 The lead wire 12 is pressed against the wiring circuit pattern 3 facing the notch 10 of the protective film 4 in a state where the lead wire 12 is bonded to the connection region 9 with the adhesive 11, so that the pitch of the wiring circuit pattern is set to be extremely small. In this case, soldering is performed even when the pitch of the wiring circuit pattern 3 is set to be small unlike the conventional example in which the workability is deteriorated and the occurrence of defects such as the occurrence of bridges is increased. The lead wire 12 can be reliably connected to the wiring circuit pattern 3 of the flexible substrate 1 without any need.

In this case, in the folded portion 5, a concave portion 7 is formed by the dummy pattern 6 corresponding to the wiring circuit pattern 3 facing the notch portion 10, and the lead wire 11 is positioned by the notch portion 10 and the concave portion 7. Therefore, it is possible to effectively prevent the lead wire 11 from being displaced. In addition, since the dummy pattern 6 having such an effect can be formed simultaneously with the wiring circuit pattern 3, the total number of manufacturing steps does not increase.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. The basic configuration of the second embodiment is the same as that of the first embodiment, and the connection method of the lead wire 11 is different. Note that, of the pressure-sensitive adhesives 11 provided in the first embodiment, the pressure-sensitive adhesive located on the front end side of the flexible substrate 1 is not provided.

First, the folded portion 5 is bonded to the connection region 9 by folding the opening 8 of the flexible substrate 1 in two. In this state, an insertion space 13 surrounded by the cutout 10 and the recess 7 is formed in the opening 8 bent as shown in FIG.

Therefore, as shown in FIG.
When the core portion 12a of the lead wire 12 is inserted into the lead wire 12, the lead wire 12 comes into contact with the wiring circuit pattern 3 facing the cutout portion 10. At this time, since the folded portion 5 is adhered to the connection region 9, the core portion 12a of the lead wire 12 inserted into the insertion space portion 13 comes into pressure contact with the wiring circuit pattern 3, and the lead wire 12 is securely connected. Can be connected to the wiring circuit pattern 3. When the lead wire 12 is completely fixed to the flexible substrate 1, an adhesive is applied to a portion where the lead wire 12 is inserted.

According to the second embodiment, the work of connecting the folded portion 5 to the connection region 9 in the assembling process is simplified by bonding the folded portion 5 to the connection region 9 in advance. be able to.

The present invention is not limited to the above embodiments, but can be modified or expanded as follows. The dummy pattern 6 of the folded portion 5 may be formed as needed. Further, the adhesive 11 may be applied to the connection area 9 other than the notch 10.

[0030]

As is clear from the above description, according to the connector device and the connection method of the present invention, the folded portion, the opening, and the connection region are formed in order from the front end of the flexible board, and the opening is formed in two. The lead wire is connected to the end of the wiring circuit pattern facing the notch in a state where the folded portion is connected to the connection region by an adhesive member by folding, so that soldering is performed in a configuration where the connection pitch is extremely small. It is possible to obtain an excellent effect that the lead wires can be securely connected without performing the above.

[Brief description of the drawings]

FIG. 1 is a perspective view of a flexible substrate in a state in which lead wires are temporarily held in a first embodiment of the present invention.

FIG. 2 is a plan view of a tip portion of a flexible substrate.

FIG. 3 is a perspective view of a flexible substrate showing a folded portion in a folded state in the second embodiment of the present invention.

FIG. 4 is a cross-sectional view showing the state of close contact between the folded portion and the connection region

[Explanation of symbols]

1 is a flexible substrate, 2 is a base film, 3 is a wiring circuit pattern, 4 is a protective film, 5 is a folded portion, 6 is a dummy pattern, 7 is a concave portion, 8 is an opening, 9 is a connection region portion, 1
0 is a notch, 11 is an adhesive (adhesive member), 12 is a lead wire, 12a is a core wire, and 13 is an insertion space.

Claims (4)

[Claims] An elongate base film, a folded portion set at a front end of the base film, a connection area portion set at a predetermined distance from the folded portion in the base film, and the base An opening formed in the film between the folded portion and the connection region, a wiring circuit pattern formed on the base film and having an end located in the connection region, and covering the wiring circuit pattern A protective film, a notch formed in the protective film and exposing an end of the wiring circuit pattern located in the connection region, and bonding the folded portion to the connection region in a state where the opening is folded in two. A connector device, comprising: 2. The semiconductor device according to claim 1, further comprising: a dummy pattern for forming a concave portion at a position corresponding to the cutout portion in the folded portion of the base film; and a protective film for covering the dummy pattern. Connector equipment. 3. The connector device according to claim 1, wherein the lead wire passed through the opening is brought into contact with an end of the wiring circuit pattern facing the notch, and then the opening is closed. A connection method for a connector device, wherein the folded portion is bonded to the connection region by the bonding member by folding. 4. The connector device according to claim 1, wherein the opening is folded in two so that the folded portion is adhered to the connection region by the adhesive member, and then the lead wire is cut into the notch. A connector method for connecting a connector device, wherein the connector device is caused to enter an insertion space formed between the connector and the folded portion.