JP2000066396A5 - - Google Patents
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- Publication number
- JP2000066396A5 JP2000066396A5 JP1998229791A JP22979198A JP2000066396A5 JP 2000066396 A5 JP2000066396 A5 JP 2000066396A5 JP 1998229791 A JP1998229791 A JP 1998229791A JP 22979198 A JP22979198 A JP 22979198A JP 2000066396 A5 JP2000066396 A5 JP 2000066396A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- positive photosensitive
- resin composition
- composition according
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002253 acid Substances 0.000 claims 5
- 239000011342 resin composition Substances 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 239000003513 alkali Substances 0.000 claims 1
- 238000004090 dissolution Methods 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 230000002401 inhibitory effect Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- -1 nitrogen containing basic compound Chemical class 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 150000003431 steroids Chemical class 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22979198A JP3934259B2 (ja) | 1998-08-14 | 1998-08-14 | ポジ型感光性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22979198A JP3934259B2 (ja) | 1998-08-14 | 1998-08-14 | ポジ型感光性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000066396A JP2000066396A (ja) | 2000-03-03 |
| JP2000066396A5 true JP2000066396A5 (zh) | 2005-02-24 |
| JP3934259B2 JP3934259B2 (ja) | 2007-06-20 |
Family
ID=16897738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22979198A Expired - Fee Related JP3934259B2 (ja) | 1998-08-14 | 1998-08-14 | ポジ型感光性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3934259B2 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002006483A (ja) * | 2000-06-20 | 2002-01-09 | Sumitomo Chem Co Ltd | フォトレジスト組成物 |
| JP2002049157A (ja) * | 2000-08-03 | 2002-02-15 | Nec Corp | ポジ型化学増幅レジスト及びそのパターン形成方法 |
| JP2002343860A (ja) * | 2001-05-17 | 2002-11-29 | Tokyo Ohka Kogyo Co Ltd | 保護膜形成用材料 |
| JP4574067B2 (ja) * | 2001-06-08 | 2010-11-04 | ルネサスエレクトロニクス株式会社 | レジスト組成物 |
| US6569778B2 (en) * | 2001-06-28 | 2003-05-27 | Hynix Semiconductor Inc. | Method for forming fine pattern in semiconductor device |
| JP4617950B2 (ja) * | 2004-03-23 | 2011-01-26 | 住友化学株式会社 | 化学増幅型ポジ型レジスト組成物 |
| US7132218B2 (en) * | 2004-03-23 | 2006-11-07 | Sumitomo Chemical Company, Limited | Chemically amplified positive resist composition |
-
1998
- 1998-08-14 JP JP22979198A patent/JP3934259B2/ja not_active Expired - Fee Related
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