JP2000061363A - Treatment solution-spraying nozzle of substrate treatment apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a treatment solution-spraying nozzle of a substrate treatment apparatus capable of supplying a treatment solution to the whole surface area of a substrate in a short time and treating the substrate with the treatment solution. SOLUTION: This treatment solution-spraying nozzle 1 is provided with a nozzle main body 43 comprising a treatment solution storing part 42 and a treatment solution discharging outlet 47, an ultrasonic oscillator 41 for providing ultrasonic wave vibration to the treatment solution in the treatment solution storing part 42, a restriction part 48 having a smaller orifice than the treatment solution discharging outlet 47, and a foam discharging hole 44 formed in the ultrasonic oscillator 41 for discharging foams existing in the treatment solution storing part 42 to the outside of the treatment solution storing part 42. The restriction part 48 and the treatment solution discharging outlet 47 are connected with each other by an inner wall 45 having a shape with gradually expanded cross-section toward the treatment solution discharging outlet 47 from the restriction part 48. The inner wall 45 has a de Laval nozzle-like shape smoothly changing along the stream line of the treatment solution passing the inside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing liquid discharge nozzle of a substrate processing apparatus for supplying a processing liquid to a substrate such as a semiconductor wafer, a glass substrate for a liquid crystal display panel or a mask substrate for a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art As a kind of such substrate processing apparatus,
For example, by supplying a processing liquid in which ultrasonic vibration of about several hundred kilohertz to several megahertz is applied to the surface of a substrate held by a spin chuck and rotating, the substrate is subjected to a cleaning treatment by using ultrasonic vibration. There is known one having a configuration.

A processing liquid discharge nozzle used in such a substrate processing apparatus has a processing liquid storage portion for temporarily storing the processing liquid and a processing liquid discharge port formed below the processing liquid storage portion. A nozzle main body having an ultrasonic wave and an ultrasonic oscillator that applies ultrasonic vibration to the processing liquid in the processing liquid storage unit, and supplies the processing liquid to which ultrasonic vibration is applied to the substrate from the processing liquid discharge port. I am trying to do it.

[0004]

In such a substrate processing apparatus, the processing liquid concentrates linearly from the processing liquid discharge port of the processing liquid discharge nozzle toward the substrate and at one point on the surface of the substrate. It is discharged in the state. Therefore, it is impossible to supply the processing liquid to a wide area of the substrate surface, and in order to perform uniform processing over the entire area of the substrate surface, while moving the processing liquid discharge nozzle with respect to the surface of the substrate, It is necessary to supply the processing liquid to the entire area of the substrate for a long time to clean the substrate.

Further, even when it is attempted to shorten the time required for the cleaning processing of the substrate by increasing the flow rate of the processing liquid supplied to the substrate, the processing liquid is discharged in the conventional substrate processing apparatus. Since the treatment liquid is discharged from the treatment liquid discharge port of the nozzle toward the substrate in a straight line and concentrated at one point on the substrate surface, the treatment liquid is scattered on the surface of the substrate, Although the flow rate is increased, the processing liquid effectively supplied to the surface of the substrate does not increase, and the time required for the cleaning process cannot be shortened.

Such a problem is caused not only by supplying the processing liquid to which ultrasonic vibration is applied to the substrate to clean the substrate but also by supplying the processing liquid to the substrate. This is a problem that occurs in all processing liquid discharge nozzles.

The present invention has been made to solve the above problems, and provides a processing liquid discharge nozzle of a substrate processing apparatus capable of processing a substrate by supplying the processing liquid over the entire surface of the substrate in a short time. The purpose is to provide.

[0008]

According to a first aspect of the present invention, there is provided a processing liquid discharge nozzle of a substrate processing apparatus for supplying a processing liquid to a substrate, the nozzle main body and a processing in the nozzle main body. A throttle portion formed in the liquid flow path,
A processing liquid discharge port formed below the nozzle body, and the inner wall of the nozzle body has the narrowed portion and the processing liquid discharge port sequentially from the narrowed portion toward the processing liquid discharge port. The feature is that they are connected in a state where the cross-sectional area is enlarged.

According to a second aspect of the present invention, there is provided a processing liquid discharge nozzle of a substrate processing apparatus for supplying the processing liquid to which ultrasonic vibration is applied to the substrate, which temporarily stores the processing liquid. A nozzle body having a treatment liquid storage portion, a treatment liquid discharge port formed below the treatment liquid storage portion, and an ultrasonic oscillator for imparting ultrasonic vibration to the treatment liquid in the treatment liquid storage portion. An inner wall of the nozzle body, comprising: a narrowed portion having an orifice smaller than the processing liquid discharge port, which is disposed between the processing liquid storage part and the processing liquid discharge port.
It is characterized in that the narrowed portion and the processing liquid discharge port are connected in a state in which the cross-sectional area of the narrowed portion sequentially increases toward the processing liquid discharge port.

According to a third aspect of the present invention, in the second aspect of the invention, the processing liquid discharge nozzle is arranged such that the distance between the processing liquid discharge port and the substrate is 10 mm or less.

According to a fourth aspect of the present invention, in the second aspect of the invention, the amount of the processing liquid ejected from the processing liquid ejection nozzle is 10 liters per minute or more.

According to a fifth aspect of the invention, in the invention according to any one of the second to fourth aspects, the inner wall of the nozzle body at a position between the throttle portion and the processing liquid discharge port is -Has a Laval tubular shape.

According to a sixth aspect of the invention, in the invention according to any one of the second to fifth aspects, bubbles for discharging bubbles existing in the treatment liquid storage portion to the outside from the treatment liquid storage portion. The discharge hole is further provided.

According to a seventh aspect of the present invention, in the invention according to the sixth aspect, the ultrasonic oscillator is disposed above the processing liquid reservoir, and the bubble discharge hole is the ultrasonic oscillator. Is formed in the child.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view of a substrate processing apparatus using a processing liquid discharge nozzle 1 according to the present invention, and FIG. 2 is a perspective view showing a main part thereof.

As shown in FIGS. 1 and 2, this substrate processing apparatus discharges pure water and a chemical liquid as a processing liquid from a processing liquid discharge nozzle 1 to a substrate W rotating in a horizontal plane, and thereby the substrate W is processed. For cleaning the
A spin chuck 11 that supports the edge of the substrate W by four support pins 12 provided upright thereon, a motor 14 that rotates the spin chuck 11 around a shaft 13 that is oriented in the vertical direction, and a substrate W that rotates. A scattering prevention cup 15 for capturing the processing liquid scattered from the edge of the substrate W.
And the processing liquid discharge nozzle 1 according to the present invention arranged close to the surface of the substrate W supported by the spin chuck 11, and the processing liquid discharge nozzle 1 is connected via the arm 35 to discharge the processing liquid. A nozzle moving mechanism 36 that reciprocates the nozzle 1 between a position facing the rotation center of the substrate W and a position facing the edge of the substrate W is provided.

The processing liquid discharge nozzle 1 is provided with a chemical liquid tank 22.
, Circulation pump 17, heater 18, and filter 19
And a liquid circulation path 21 having an on-off valve 20, and an on-off valve 2
It is connected via 5. In addition, the processing liquid discharge nozzle 1
Is connected to a pure water supply source through an on-off valve 26.

The bubble discharge passage 34 for discharging bubbles from the treatment liquid discharge nozzle 1 is connected to the bubble discharge passage 31 communicating with the chemical liquid circulation passage 21 through the opening / closing valve 27 and the throttle valve 30. There is. Similarly, the bubble discharge path 34 is
It is connected via an opening / closing valve 28 and a throttle valve 29 to a bubble discharge passage 32 communicating with a drain (not shown). Further, the treatment liquid discharge nozzle 1 has an ultrasonic oscillator 41, which will be described later.
Is connected to the power source 33.

FIG. 3 is a vertical sectional view of the processing liquid discharge nozzle 1 described above.

The processing liquid discharge nozzle 1 includes a processing liquid storage section 42 for temporarily storing the processing liquid and the processing liquid storage section 42.
Ultrasonic oscillation for imparting ultrasonic vibration of about several hundred kilohertz to several megahertz to the processing liquid in the processing liquid storage section 42 and a nozzle body 43 having a processing liquid discharge port 47 formed below The child 41, the throttle portion 48 having an orifice smaller than the treatment liquid discharge port 47, and the treatment liquid storage portion 4
2 is a bubble discharge hole 4 formed in the ultrasonic oscillator 41 for discharging bubbles existing in the treatment liquid storage portion 42 to the outside.
4 and.

The bubble discharge hole 44 is connected to the bubble discharge passage 34 described above. In addition, the ultrasonic oscillator 41 is
It is connected to the power supply 33 described above.

Further, the narrowed portion 48 and the processing liquid discharge port 47.
Are connected to each other by an inner wall 45 having a shape in which the cross section thereof sequentially expands from the narrowed portion 48 toward the processing liquid discharge port 47. The inner wall 45 has a de Laval nozzle-like shape that smoothly changes along the streamline of the processing liquid passing through the inside.

Next, the processing operation of the substrate W by this substrate processing apparatus will be described. In the following description, a case will be described in which the substrate processing apparatus supplies a chemical solution to the substrate W to clean the substrate W with the chemical solution and then further cleans the substrate W with pure water.

Prior to supplying the chemical liquid to the substrate W, the chemical liquid is circulated in the chemical liquid circulation passage 21. During the circulation of the chemical liquid, the chemical liquid pumped up from the chemical liquid tank 22 by the action of the pump 17 is heated by the heater 18,
After being filtered by the filter 19, it is heated to a predetermined temperature during the circulation operation of returning to the chemical liquid tank 22 via the opening / closing valve 20. For example, when this chemical solution is a mixed solution of ammonia, hydrogen peroxide and pure water used for the cleaning process called SC1, this chemical solution is heated to about 80 ° C.

In this state, the substrate 14 held on the spin chuck 11 is rotated by driving the motor 14 and the on-off valve 25 is opened to open the chemical liquid circulation path 2.
A chemical liquid is supplied from 1 to the processing liquid discharge nozzle 1. At this time, the open / close valve 27 is opened. Then, the power source 33 of the ultrasonic oscillator 41 is operated in a state in which the chemical liquid is discharged from the processing liquid discharge nozzle 47 of the processing liquid discharge nozzle 1, and the processing liquid discharge nozzle 1
The nozzle moving mechanism 36 is driven to reciprocate between a position facing the rotation center of the substrate W and a position facing the edge of the substrate W. Thereby, the chemical liquid to which the ultrasonic vibration is applied is supplied to the entire surface of the substrate W, and the substrate W is cleaned by the chemical liquid.

At this time, as described above, the narrowed portion 48 and the processing liquid discharge port 47 in the processing liquid discharge nozzle 1 have such a shape that their cross sections are sequentially enlarged from the narrowed portion 48 toward the processing liquid discharge port 47. Connected by the inner wall 45,
The inner wall 45 is a de Lavaln tube that smoothly changes along the flow line of the liquid medicine passing through the inner wall 45.
It has an ozzle-like shape.

Therefore, the chemical liquid that has reached the treatment liquid discharge port 47 after passing through the throttle portion 48 has a momentum to expand. Therefore, the chemical liquid ejected from the treatment liquid ejection port 47 of the treatment liquid ejection nozzle 1 is the spin chuck 1
It is spread over a wide area on the surface of the substrate W which is supported and rotated by 1. Therefore, the entire surface of the substrate W can be cleaned in a short time.

Similarly, after passing through the diaphragm 48,
Since the chemical liquid that has reached the processing liquid discharge port 47 has a momentum to expand, the chemical liquid is scattered on the surface of the substrate W even when the flow rate of the chemical liquid discharged from the processing liquid discharge nozzle 1 is increased. No phenomenon occurs.
Therefore, by increasing the flow rate of the chemical liquid supplied from the processing liquid discharge nozzle 1 to the substrate W, the time required for the cleaning process of the substrate W can be shortened.

In order to effectively act the expansion function of the chemical liquid discharged from the processing liquid discharge port 47 of the processing liquid discharge nozzle 1 on the surface of the substrate W, the processing liquid discharge port 47.
The distance between the substrate W and the surface of the substrate W which is supported by the spin chuck 11 and rotates is preferably 10 mm or less, and 5 m.
More preferably, it is m or less.

Further, in order to perform the cleaning process on the substrate W promptly after the chemical liquid ejected from the treatment liquid ejection nozzle 1 of the treatment liquid ejecting nozzle 1 has an effective expanding function on the surface of the substrate W, It is preferable that the amount of the chemical liquid discharged from the processing liquid discharge nozzle 1 is 10 liters per minute or more.

The chemical solution supplied to the surface of the substrate W and scattered from the edge of the substrate W as it rotates is captured by the splash prevention cup 15. And in this state,
A discharge port 16 formed on the lower surface of the scattering prevention cup 15
Has moved to a position facing one end of a chemical liquid recovery path 23 communicating with the chemical liquid tank 22. Therefore, this drug solution
It is collected in the chemical liquid tank 22 via the chemical liquid recovery passage 23.

During such a chemical solution supply operation, bubbles are generated from the heated chemical solution. Then, the bubbles are temporarily accumulated in the treatment liquid storage section 42 of the treatment liquid discharge nozzle 1. Treatment liquid reservoir 42 of treatment liquid discharge nozzle 1
When such bubbles are accumulated in the ultrasonic wave, not only the ultrasonic wave energy cannot be sufficiently applied from the ultrasonic wave oscillator 41 to the chemical liquid, but also the ultrasonic wave oscillator 41 is in the empty oscillation state. The problem of breakage arises.

However, in the processing liquid discharge nozzle 1, a narrowed portion 48 as an orifice smaller than the processing liquid discharge port 47 is formed between the processing liquid storage part 42 and the processing liquid discharge port 47. From the treatment liquid storage unit 4
The chemical liquid in 2 is given a pressure by the action of the throttle portion 48. Therefore, the chemical liquid in the treatment liquid storage unit 42 is pressurized, and the bubbles temporarily accumulated in the treatment liquid storage unit 42 due to this pressure are formed in the ultrasonic oscillator 41 together with a small amount of the chemical liquid. From the bubble discharge hole 44 formed to the bubble discharge path 34.
Is discharged to.

In particular, in this embodiment, the ultrasonic oscillator 41 is arranged above the processing liquid reservoir 42, and the bubble discharge hole 44 is formed in the ultrasonic oscillator 41. Therefore, it is possible to prevent the bubbles from stagnating in the treatment liquid storage unit 42, and it is possible to quickly discharge all the bubbles existing in the treatment liquid storage unit 42 from the bubble discharge holes 44.

The bubbles discharged from the bubble discharging hole 44 to the bubble discharging passage 34 together with a small amount of the chemical liquid are opened / closed by the open / close valve 27.
Further, it is guided to the bubble discharge passage 31 and the chemical liquid circulation passage 21 via the throttle valve 30 and collected in the chemical liquid tank 22.

At this time, the bubble discharge passage 34 for discharging bubbles from the treatment liquid discharge nozzle 1 is connected to the bubble discharge passage 31 communicating with the chemical liquid circulation passage 21 through the opening / closing valve 27 and the throttle valve 30. ing. Therefore, by adjusting the open state of the throttle valve 30, it is possible to control the amount of the chemical liquid discharged together with the bubbles from the processing liquid storage section 42 of the processing liquid discharge nozzle 1 to a desired value. Therefore, a large amount of the chemical liquid is discharged from the bubble discharge hole 44 of the treatment liquid discharge nozzle 1, so that the pressure of the chemical liquid in the treatment liquid storage section 42 is lowered,
The problem that the discharge amount of the chemical liquid from the chemical liquid discharge port 47 decreases does not occur.

When the chemical liquid processing on the substrate W is completed, the on-off valves 25 and 27 are closed to stop the supply of the chemical liquid to the processing liquid discharge nozzle 1. And the on-off valves 26 and 2
Open 8.

As a result, pure water is discharged from the processing liquid discharge port 47 of the processing liquid discharge nozzle 1. In this state,
By driving the nozzle moving mechanism 36, the processing liquid discharge nozzle 1 is reciprocated between a position facing the rotation center of the substrate W and a position facing the edge of the substrate W. As a result, pure water to which ultrasonic vibration has been applied is supplied to the entire surface of the substrate W,
The substrate W is washed with pure water.

At this time, as in the case of the above-described chemical liquid, the pure water that has passed through the throttle portion 48 and then reached the processing liquid discharge port 47 has a momentum to expand. Therefore, the pure water discharged from the processing liquid discharge port 47 of the processing liquid discharge nozzle 1 is spread over a wide area on the surface of the substrate W which is supported by the spin chuck 11 and rotates. Therefore, the entire surface of the substrate W can be cleaned in a short time.

Similarly, after passing through the diaphragm 48,
Since the pure water that has reached the processing liquid discharge port 47 has a momentum that tends to expand, even when the flow rate of the pure water discharged from the processing liquid discharge nozzle 1 is increased, the pure water on the surface of the substrate W does not change. The phenomenon of water splashing does not occur.
Therefore, by increasing the flow rate of pure water supplied from the processing liquid discharge nozzle 1 to the substrate W, the time required for the cleaning process of the substrate W can be shortened.

In order to make the expansion function of the pure water discharged from the processing liquid discharge port 47 of the processing liquid discharge nozzle 1 on the surface of the substrate W effective, the processing liquid is the same as in the case of the above-mentioned chemical liquid. The distance between the ejection port 47 and the surface of the substrate W which is supported by the spin chuck 11 and rotates is preferably 10 mm or less, and more preferably 5 mm or less.

In addition, the pure water discharged from the processing liquid discharge nozzle 47 of the processing liquid discharge nozzle 1 is effectively caused to have an expanding function on the surface of the substrate W, and then the substrate W is rapidly cleaned. It is preferable that the amount of pure water discharged from the treatment liquid discharge nozzle 1 be 10 liters per minute or more, as in the case of the above-mentioned chemical liquid.

The pure water supplied to the surface of the substrate W and scattered from the edge of the substrate W as it rotates is captured by the splash preventing cup 15. And in this state,
A discharge port 16 formed on the lower surface of the scattering prevention cup 15
Has moved to a position facing one end of a pure water recovery passage 24 communicating with a drain (not shown). Therefore, this pure water is discharged to the drain through the pure water recovery passage 24.

During such pure water supply operation, bubbles are generated from the pure water to which ultrasonic vibration is applied by the ultrasonic vibrator 41. Then, the bubbles are temporarily accumulated in the treatment liquid storage section 42 of the treatment liquid discharge nozzle 1 as in the case of the chemical liquid.

In this case as well, since the throttle portion 48 as an orifice smaller than the processing liquid discharge port 47 is formed between the processing liquid storage part 42 and the processing liquid discharge port 47, the processing liquid storage part is formed. The pure water in 42 is pressurized, and the bubbles temporarily accumulated in the processing liquid storage part 42 due to this pressure, together with a small amount of pure water, are bubble discharge holes formed in the ultrasonic oscillator 41. The bubbles are discharged from 44 to the bubble discharge path 34.

As described above, in particular, in this embodiment, the ultrasonic oscillator 41 is arranged above the treatment liquid storage section 42, and the bubble discharge hole 44 is provided in the ultrasonic oscillator 41. Has been formed. Therefore, the processing liquid storage unit 42
All bubbles existing inside can be promptly discharged from the bubble discharging hole 44.

The bubbles discharged from the bubble discharge hole 44 to the bubble discharge passage 34 together with a small amount of pure water are the open / close valve 28 in the open state.
And is guided to the bubble discharge passage 32 via the throttle valve 29,
It is discharged to a drain not shown.

At this time, as in the case of the above-mentioned chemical liquid, the bubble discharge passage 34 for discharging bubbles from the treatment liquid discharge nozzle 1 is connected to the bubble discharge passage 32 through the opening / closing valve 28 and the throttle valve 29. There is. Therefore, by adjusting the open state of the throttle valve 29, it is possible to control the amount of pure water discharged from the processing liquid reservoir 42 of the processing liquid discharge nozzle 1 together with the bubbles to a desired value. Therefore, a large amount of pure water is discharged from the bubble discharge holes 44 of the processing liquid discharge nozzle 1, so that the pressure of the pure water in the processing liquid storage section 42 is lowered, and the amount of pure water discharged from the pure water discharge port 47 is discharged. Does not cause the problem that

When the above processing steps are completed, the on-off valve 26
And 28 are closed, and the process ends.

In the above-described embodiment, the processing liquid discharge nozzle 1 is set to the substrate W while the processing liquid is discharged from the processing liquid discharge nozzle 1 toward the substrate W which is supported by the spin chuck 11 and rotates. The case has been described in which the processing liquid supplied with ultrasonic vibration is supplied to the entire surface of the substrate W by reciprocating between the position facing the center of rotation and the position facing the edge of the substrate W. The processing liquid supplied from the processing liquid discharge nozzle 1 to the surface of the substrate W is transferred to the substrate W.
In the case where the treatment liquid discharge nozzle 1 is stationary, the treatment liquid is discharged from the treatment liquid discharge nozzle 1 to the vicinity of the center of the substrate W which is supported by the spin chuck 11 and is rotated. It is also possible to adopt a configuration in which it is supplied.

Further, in the above-described embodiment, the inner wall 45 of the processing liquid discharge nozzle 1 smoothly changes along the flow line of the processing liquid passing through the inside thereof, a de Laval nozzle. Although the inner wall 45 has the narrowed portion 48 and the processing liquid discharge port 47, the cross-sectional area of the narrowed portion 48 and the processing liquid discharge port 47 sequentially increases from the narrowed portion 48 toward the processing liquid discharge port 47. De Laval tube (de
It is also possible to adopt a shape other than the Laval nozzle) shape.

Further, in the above-described embodiments, the present invention is applied to the processing liquid discharge nozzle 1 for cleaning the substrate W by supplying the processing liquid to which the ultrasonic vibration is applied to the substrate W. I explained about the case where it is applied,
The present invention can be applied to all kinds of processing liquid discharge nozzles for supplying the processing liquid to the substrate W.

[0053]

According to the invention as set forth in claim 1, the inner wall of the nozzle body processes the throttle portion and the treatment liquid discharge port formed in the flow passage of the treatment liquid in the nozzle body from the throttle portion. Since the connection is made in such a manner that the cross-sectional area gradually increases toward the liquid discharge port, the processing liquid can be spread over a wide area on the surface of the substrate W, and the processing liquid can be supplied to the entire surface of the substrate in a short time. The substrate can be processed.

According to the second aspect of the present invention, a nozzle body having a processing liquid storage part for temporarily storing the processing liquid and a processing liquid discharge port formed below the processing liquid storage part, An ultrasonic oscillator that applies ultrasonic vibration to the processing liquid in the processing liquid storage section, and a diaphragm having an orifice smaller than the processing liquid discharge port, which is arranged between the processing liquid storage section and the processing liquid discharge port. Since the inner wall of the nozzle body is connected to the narrowed portion and the processing liquid discharge port in such a state that the cross-sectional area of the narrowed portion sequentially increases from the narrowed portion to the processing liquid discharge port, ultrasonic vibration is imparted. The treated liquid thus treated can be spread over a wide area on the surface of the substrate W, and the substrate can be treated by supplying the treated liquid to which ultrasonic vibration is applied to the entire surface of the substrate in a short time.

According to the third aspect of the present invention, since the treatment liquid discharge nozzle is arranged such that the distance between the treatment liquid discharge port and the substrate is 10 mm or less, the treatment liquid to which ultrasonic vibration is applied is provided. Can be effectively spread over a wider area on the surface of the substrate W.

According to the invention described in claim 4, since the amount of the processing liquid ejected from the processing liquid ejection nozzle is 10 liters per minute or more, the phenomenon that the chemical liquid is scattered on the surface of the substrate does not occur, Can be processed quickly.

According to the fifth aspect of the invention, since the inner wall of the nozzle body at the position between the throttle portion and the processing liquid discharge port has a de Laval tubular shape, ultrasonic vibration is applied. The treatment liquid can be spread particularly effectively over a wider area on the surface of the substrate W.

According to the sixth aspect of the present invention, since the bubble discharging hole for discharging the bubbles existing in the processing liquid storage portion to the outside from the processing liquid storage portion is further provided, the bubbles in the processing liquid discharge nozzle are provided. Can be prevented from accumulating. Therefore, it is possible to apply sufficient ultrasonic vibration to the treatment liquid, and it is possible to prevent damage to the ultrasonic oscillator.

According to the seventh aspect of the invention, the ultrasonic wave oscillator is disposed above the processing liquid reservoir, and the bubble discharge hole is formed in the ultrasonic wave oscillator. It is possible to quickly discharge all the bubbles existing in the storage section from the bubble discharging hole.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a substrate processing apparatus using a processing liquid discharge nozzle 1 according to the present invention.

FIG. 2 is a perspective view showing a main part of a substrate processing apparatus using the processing liquid discharge nozzle 1 according to the present invention.

FIG. 3 is a vertical cross-sectional view of a processing liquid discharge nozzle 1.

[Explanation of symbols]

1 Processing liquid discharge nozzle 41 Ultrasonic oscillator 42 Processing Liquid Reservoir 44 Bubble discharge hole 45 Inner wall 47 Processing liquid discharge port 48 throttle W board

Continued front page    F-term (reference) 2H096 AA25 CA14 GA31 LA30                 3B201 AA03 AB02 AB34 AB47 BB44                       BB53 BB82 BB85 BB92 BB93                       CB12 CC01 CC13 CD22                 4F033 AA04 AA14 BA03 CA01 DA01                       EA01                 4F042 AA07 CA01 CA07 CB03 CB10                       DA01 DB39

Claims (7)

[Claims] 1. A processing liquid discharge nozzle of a substrate processing apparatus for supplying a processing liquid to a substrate, the nozzle main body, and a narrowed portion formed in a flow path of the processing liquid in the nozzle main body. And a processing liquid discharge port formed below the nozzle body, wherein the inner wall of the nozzle body has the narrowed portion and the processing liquid discharge port sequentially from the narrowed portion toward the processing liquid discharge port. A processing liquid discharge nozzle for a substrate processing apparatus, which is connected in a state where a cross-sectional area is enlarged. 2. A processing liquid discharge nozzle of a substrate processing apparatus for supplying a processing liquid to which ultrasonic vibration is applied to a substrate, the processing liquid storing section temporarily storing the processing liquid; A nozzle body having a treatment liquid discharge port formed below the treatment liquid storage portion, an ultrasonic oscillator that applies ultrasonic vibration to the treatment liquid in the treatment liquid storage portion, and the treatment liquid storage portion A narrowed portion having an orifice smaller than the processing liquid discharge port, which is disposed between the processing liquid discharge port, and an inner wall of the nozzle body, wherein the narrowed portion and the processing liquid discharge port are A processing liquid discharge nozzle of a substrate processing apparatus, wherein the processing liquid discharge nozzles are connected in such a manner that a cross-sectional area of the narrowed portion is increased toward the processing liquid discharge port. 3. The processing liquid discharge nozzle of the substrate processing apparatus according to claim 2, wherein the processing liquid discharge nozzle is arranged such that a distance between the processing liquid discharge port and the substrate is 10 mm or less. The processing liquid discharge nozzle of the device. 4. The processing liquid discharge nozzle of the substrate processing apparatus according to claim 2, wherein the amount of the processing liquid discharged from the processing liquid discharge nozzle is 1 per minute.
A processing liquid discharge nozzle of a substrate processing apparatus having a volume of 0 liter or more. 5. The processing liquid discharge nozzle of the substrate processing apparatus according to claim 2, wherein the inner wall of the nozzle body at a position between the narrowed portion and the processing liquid discharge port is a nozzle. A processing liquid discharge nozzle of a substrate processing apparatus having a Laval tubular shape. 6. The processing liquid discharge nozzle of the substrate processing apparatus according to claim 2, wherein the bubbles existing in the processing liquid storage unit are discharged to the outside from the processing liquid storage unit. A processing liquid discharge nozzle of a substrate processing apparatus further provided with a discharge hole. 7. The processing liquid discharge nozzle of the substrate processing apparatus according to claim 6, wherein the ultrasonic oscillator is disposed above the processing liquid storage portion, and the bubble discharge hole is the ultrasonic oscillation. A processing liquid discharge nozzle of the substrate processing apparatus formed on the child.