JP2000059029A - Buildup multilayer wiring board and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent through-hole losses which bring about defective electrical connections failures by providing a builtup multilayer wiring board with builtup insulating resin layers, first copper plated layers, second copper plated layers, via holes and a through-hole. SOLUTION: A double sided printed wiring board 11 is prepared by forming inner layer conductive patterns 13 on the front and back surfaces of a core substrate 12, and builtup resin layers 14 are laminated on the front and back surfaces of the board 11. Next, via holes 15 are formed by boring the layers 14 partly. Successively, the front surface 14a of each layer 14 and the inside 15a of each hole 15 are subjected to a roughening step that serves also as a desmearing step. The resulting board is thereafter subjected to a first copper plating step, thereby forming first copper plated layers 16. Furthermore, after a through-hole 17 is formed using a drill or the like, the resultant board is subjected to a second copper plating step, thereby forming second copper plated layers 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a build-up multi-layer wiring board capable of high-density wiring used in portable terminal equipment and the like that require small size and light weight, and a method of manufacturing the same.

[0002]

2. Description of the Related Art A typical conventional build-up multilayer wiring board and a method of manufacturing the same will be described with reference to FIGS.

[Manufacturing Process of Prior Art] (1) Step of Preparing Double-Sided Printed Wiring Board In FIG. Double-sided printed wiring board 10
Prepare 0. This double-sided printed wiring board may be a multilayer board including an inner layer circuit.

(2) Build-up resin layer forming step In FIG. 3B, a build-up resin layer 103 is laminated on the front and back surfaces of the double-sided printed wiring board. Lamination of build-up resin, curtain coat, lamination,
Alternatively, a lamination method using a press or the like is used.

(3) Via Hole Forming Step In FIG. 3C, a part of the build-up resin layer 103 is perforated to form a via hole 104. This via hole forming method is formed by perforating the build-up resin layer 103 by using a photolithography method, a laser irradiation method, or the like.

(4) Step of forming through-hole hole In FIG. 3D, a through-hole hole 106 is formed by using a drill or the like. At this time, glass epoxy or polyimide (resin of the inner layer) 102 is exposed on the inner wall 106 a of the through-hole 106.

(5) Roughening treatment step In FIG. 3E, the build-up resin surface 103a,
A roughening process also serving as a desmear process is performed on the via hole 104a and the through hole.

(6) Step of forming copper plating layer In FIG.
5 is formed. As a result, the electrical connection with the inner layer pattern 101 is made, the copper plating layer 105 is formed also in the through hole, and the upper and lower patterns are simultaneously connected.

(7) Step of Forming Predetermined Pattern on Copper Plating Layer In FIG. 3 (g), by forming the copper plating 105 into a predetermined pattern, a build-up multilayer wiring board can be manufactured.

[0010]

However, the material of the multilayer wiring board manufactured by the conventional build-up method is as follows.
Whether it is a thermosetting type or an ultraviolet curing type, it is mainly composed of a single component material mainly composed of an epoxy resin.

In the manufacturing process of the conventional example, a copper plating layer 105 is deposited on the build-up resin 103, and in order to make an electrical connection with a layer below, a via hole 106a formed in the resin and the entirety thereof are formed. In order to make electrical connection between layers, copper plating is simultaneously deposited in the through-hole hole,
Electrical connection is made between the layers. As a pre-process for depositing this copper plating, conditions that combine all of resin roughening to obtain the adhesion strength of copper plating on the build-up resin surface, removal of resin residue in via holes, and removal of smear in through-holes, etc. The treatment is performed with a chemical such as permanganic acid having This is a processing method that has become possible because the materials constituting each layer are all made of the same epoxy resin (single component material).

However, in the structure of each layer of the multilayer wiring board, when a layer other than the epoxy resin is present,
For example, when a polyimide resin layer is present and it is necessary to apply copper plating to the layer by drilling through-holes, in the pre-plating process, if the treatment is performed under the conventional single-chemical treatment condition, a different material layer is formed. It is difficult to remove the smear under the optimal conditions, and a through-hole defect 110 may be caused on the surface of the through-hole. This is shown in FIG.

Here, the terms “resistivity smear” and “through-hole loss” will be briefly described. “Resin smear” means Resin smear. If the heat of frictional heat generated during high-speed drilling of an ML-PWB (printed circuit board) is insufficient, heat is generated in a drill pit. Due to this heat generation, resin or resin chips are softened and melted, and stains, that is, a state in which they are reattached as smear to the cross section of the inner and outer layer copper foils of the inner wall of the through hole, the resin and the base material. Next, "through-hole loss" refers to the through-hole between the copper plating layer (copper foil layer) on one surface and the copper plating layer (copper foil layer) on the other surface on the surface of the multilayer wiring board, which is the purpose of the through hole. It means an electrical connection failure via hole plating. If smear exists on the inner wall of the through hole, the copper plating layer cannot cover the smear, resulting in poor electrical connection and loss of the through hole.

In particular, under the conventional conditions of pre-plating of an epoxy resin, an attack (attack) occurs on a different material layer.
Is too strong, dissimilar materials are excessively eluted, and conversely, a large amount of smear (smear due to pretreatment) is generated, which causes through-hole defects such as poor electrical connection. Conversely, when a plating pretreatment that is weak for the build-up resin is performed under conditions suitable for different materials, the copper plating adhesion strength on the surface of the build-up resin cannot be sufficiently obtained. As described above, when a different kind of material layer exists in the build-up method, it is extremely difficult to perform the pre-treatment of the copper plating step in the through-hole at once under the same conditions.

It is an object of the present invention to provide a build-up multilayer wiring board using a core substrate of a different material and a method of manufacturing the same by performing different copper plating pretreatment conditions under conditions suitable for each material.

[0016]

According to a first aspect of the present invention, there is provided a build-up multilayer wiring board comprising a core substrate made of a different material, comprising at least a build-up insulating resin layer; It has a first copper plating layer, a second copper plating layer, a via hole hole, and a through-hole hole.

Further, the build-up multilayer wiring board according to claim 2 of the present invention is characterized in that the thickness of the first copper plating layer is different from the thickness of the second copper plating layer.

Further, in the build-up multilayer wiring board according to a third aspect of the present invention, the first copper plating layer or the second copper plating layer formed on the inner wall of the through-hole is made of the different material. Characterized in that it is in contact with or in close contact with the inner wall surface of the core substrate.

Further, according to a fourth aspect of the present invention, there is provided a method for manufacturing a build-up multilayer wiring board, comprising the steps of forming a build-up resin layer, forming a via hole, forming a first copper plating layer, and forming a through-hole. And a second step of forming a copper plating layer.

The method for manufacturing a build-up multilayer wiring board according to claim 5 of the present invention comprises: (1) a step of preparing a printed wiring board; (2) a step of forming a build-up resin layer; and (3) a step of forming a via hole. (4) roughening process, (5) first
A second copper plating layer forming step, (6) a through-hole hole forming step, (7) a second copper plating layer forming step,
(8) Second copper plating layer or second and first copper plating layers
It is characterized in that it is manufactured in the order of a predetermined pattern forming step on the second copper plating layer.

According to a sixth aspect of the present invention, there is provided a method for manufacturing a build-up multilayer wiring board, comprising: (1) a step of preparing a printed wiring board; (2) a step of forming a build-up resin layer; Step (4) Roughening treatment and first copper plating layer forming step, (5) Step of leaving first copper plating layer on the inner wall of through-hole hole, (6) Via hole forming step, (7) ) Roughening treatment and second copper plating layer forming step, (8) second copper plating layer or second copper plating layer
The second and first copper plating layers are manufactured in the order of a predetermined pattern forming step.

Further, in the method for manufacturing a build-up multilayer wiring board according to claim 7 of the present invention, the step (5) of leaving the first copper plating layer on the inner wall of the through-hole hole is performed by coating an etching resist. A step of leaving the first copper plating layer, or a step of leaving the first copper plating layer by filling or covering the through-hole hole with a resin.

The means for solving the above problems will be further described. First, a multilayer wiring board containing different materials is prepared. This multilayer board is a multilayer wiring board manufactured by a normal laminating process, and is manufactured by the following method after forming a build-up resin layer above and below a multilayer wiring board in which circuits are formed in all layers.

When a multilayer wiring board made of a different material, for example, a composite multilayer wiring board having a polyimide resin layer as an inner layer is used, a build-up resin layer is first formed, a via hole is drilled, and a pre-treatment of copper plating on the build-up resin is performed. Roughening treatment suitable for the following, and then forming the first copper plating layer, drilling through holes, and desmearing treatment (smear removal processing) suitable for dissimilar materials exposed in the through holes, for example, polyimide resin ), And the formation of the second copper plating layer makes it possible to manufacture a high-quality build-up multilayer wiring board by performing copper plating suitable for each resin.

In this method, the thickness of the first copper plating layer and the thickness of the second copper plating layer can be changed. By changing the thickness of the copper plating, for example,
(A) By increasing the thickness of the second copper plating layer from the thickness of the first copper plating layer, the reliability of the via hole can be improved and the solder heat resistance can be increased.

(B) By making the thickness of the second copper plating layer thinner than the thickness of the first copper plating layer, a fine pattern can be formed on the outermost layer.

Although the methods (A) and (B) are different from each other and have advantages and disadvantages, according to the present invention, the thickness of the copper plating performed twice can be freely selected as compared with the prior art. The thickness of the copper plating layer can be set according to the purpose.
The method (B) is suitable when the overall thickness is small, the reliability of the sulfol is not required to be very high, and there is a need to form a fine pattern in the build-up layer.

Alternatively, after the build-up resin layer is formed, a through-hole is formed, a desmear process suitable for a different material exposed inside the hole is performed, and copper plating is performed. afterwards,
The inside of the through-hole is protected by filling with etching resist or ink for filling holes, copper plating in other areas is removed by etching, and via holes are drilled in the exposed build-up resin, and finally, build-up resin and via holes It is also possible to manufacture a high-quality build-up multilayer wiring board by performing a roughening treatment suitable for the above and copper plating.

[0029]

1 and 2 are drawings according to an embodiment of the present invention, and the present invention will be specifically described below with reference to examples.

[Manufacturing Step 1 of the Present Invention] (Embodiment 1) A build-up multilayer wiring board according to Embodiment 1 of the present invention and a manufacturing method thereof will be specifically described with reference to FIG. Each step of the manufacturing method is as follows.

(1) Step of Preparing Printed Wiring Board In FIG. 1A, an inner conductor pattern 13 is formed on the front and back surfaces of a core substrate 12 made of a different material such as an epoxy resin or a polyimide resin. A double-sided printed wiring board 11 is prepared. Naturally, this double-sided printed wiring board may be a multilayer wiring board including an inner layer circuit.

(2) Build-up resin layer forming step In FIG. 1B, a build-up resin layer 14 is laminated on the front and back surfaces of the double-sided printed wiring board 11. For lamination of the build-up resin, curtain coating, lamination, a lamination method using a press, or the like is used.

(3) Via Hole Hole Forming Step In FIG. 1C, a part of the build-up resin layer 14 is perforated to form a via hole 15. This via hole forming method is formed by perforating the build-up resin layer 14 using a photolithography method, a laser irradiation method, or the like.

(4) Roughening Process In FIG. 1D, a roughening process (also referred to as a roughening process) also serving as a desmear process is performed on the build-up resin surface 14a and the inside 15a of the via hole.

(5) First Step of Forming Copper Plating Layer In FIG. 1E, a first copper plating is performed,
A copper plating layer 16 is formed.

(6) Step of Forming Through-Through Hole In FIG. 1F, a through-hole 17 is formed by using a drill or the like. At this time, the glass epoxy or polyimide (resin of the inner layer) 12 is inserted into the through hole 1.
7 is exposed on the inner wall 17a.

(7) Second Copper Plating Layer Forming Step In FIG. 1 (g), a desmear treatment suitable for the polyimide resin of the inner layer is performed, and then a second copper plating is performed to form a second copper plating. The layer 18 is formed. Thereby, the electrical connection with the inner layer conductor pattern 13 is performed, and
A copper plating layer 18a is also formed in the through hole, and at the same time, electrical connection of the upper and lower patterns is performed.

(8) Step of Forming a Predetermined Pattern on the Copper Plating Layer In FIG. 1H, the first copper plating layer 16 and the second copper plating layer 18 are formed in a predetermined pattern to be formed of different materials. The build-up multilayer wiring board 10 can be manufactured. At this time, the thickness of the second copper plating layer 18 can be changed from that of the first copper plating layer 16 described above.

By making the layer thickness of the second copper plating layer 18 larger than the layer thickness of the first copper plating layer 16, electrical connection of upper and lower patterns (outer layers) via the copper plating layer of through holes and the inner layer can be formed. The reliability of the electrical connection between the conductor layer and the outer conductor layer can be improved. Conversely, by making the layer thickness of the second copper plating layer 18 thinner than the layer thickness of the first copper plating layer 16, the second copper plating layer 1
8 can form a fine pattern.

[Manufacturing Step 2 of the Present Invention] (Embodiment 2) A build-up multilayer wiring board according to Embodiment 2 of the present invention and a manufacturing method thereof will be specifically described with reference to FIG. Each step of the manufacturing method is as follows.

(1) Step of Preparing Printed Wiring Board In FIG. 2A, an inner conductor pattern 13 is formed on the front and back surfaces of a core substrate 12 made of, for example, a different material such as an epoxy resin or a polyimide resin. A double-sided printed wiring board 11 is prepared. Naturally, this double-sided printed wiring board may be a multilayer wiring board including an inner layer circuit.

(2) Build-up Resin Layer Forming Step In FIG. 2A, a build-up resin layer 14 is laminated on the front and back surfaces of the double-sided printed wiring board 11. For lamination of the build-up resin, curtain coating, lamination, a lamination method using a press, or the like is used.

(3) Step of forming through-hole hole In FIG. 2B, a through-hole hole 17 is formed by using a drill or the like. At this time, the glass epoxy or polyimide (resin of the inner layer) 12 is inserted into the through hole 1.
7 is exposed on the inner wall 17a.

(4) Roughening Treatment (Roughening Treatment) and First Step of Forming Copper Plating Layer In FIG. 2C, the polyimide resin exposed on the build-up resin surface 14a and the inner surface 17a of the through-hole 17 is shown. A desmear process suitable for the (inner layer resin) is performed, and then a first copper plating is performed to form a first copper plating layer 16.

(5A) The first wall is formed on the inner wall of the through hole.
Step of Remaining Copper Plating Layer Next, in FIG.
An unnecessary portion of the first copper plating layer is formed on the copper plating layer 16 by exposure and development, leaving the etching resist 21 only in the through-hole 17 and removing the unnecessary first copper plating layer by etching. As a result, the first copper plating layer 16a necessary for the inner wall 17a of the through hole 17 is
In a protected and coated form.

(5B) First inner wall of the through hole
Step of Remaining Copper Plating Layer Next, in FIG. 2E, the resin 22 is filled in the through-hole 17 by printing or the like, and the first copper plating layer 16 formed other than the through-hole is removed. As a result, the first wall necessary for the inner wall 17a of the through hole 17 is formed.
The copper plating layer 16a is left protected and covered by the filling resin 22.

As the production step 2 of the present invention, the step (5A)
Or (5B) can be taken, but FIG.
(F) to FIG. 2 (h) show process diagrams when the process (5A) is taken.

(6) Via Hole Forming Step In FIG. 2 (f), the first of the exterior surface is etched by etching.
A part of the build-up resin layer 14 from which the copper plating layer 16 has been removed is perforated by laser irradiation or the like to form a via hole 15.
To form This via hole forming method may be formed by perforating the build-up resin layer 14 using a photolithography method or the like.

(7) Roughening treatment (roughening treatment) and second copper plating layer forming step In FIG. 2 (g), a desmear treatment suitable for the build-up resin is performed on the build-up resin surface 14a, and thereafter, ,
A second copper plating is performed to form a second copper plating layer 23. As a result, the electrical connection with the inner conductor pattern 13 is made, the copper plating layer 23a is formed in the through hole, and the upper and lower patterns are simultaneously connected.

(8) Step of Forming Predetermined Pattern on Copper Plating Layer In FIG. 2 (h), by forming the second copper plating layer 23 in a predetermined pattern, the build-up multilayer wiring board 20 made of a dissimilar material is formed. Can be manufactured.

The feature of the manufacturing process 2 of the present invention is,
By making the layer thickness of the copper plating layer 23 larger than the layer thickness of the first copper plating layer 16, the reliability of the electrical connection of the upper and lower patterns via the copper plating layer of the through hole can be improved. Conversely, the thickness of the second copper plating layer 23 is set to the first thickness.
By making the thickness smaller than the thickness of the copper plating layer 16, a fine pattern by the second copper plating layer 23 can be formed on the surface of the build-up resin.

[0052]

As described above, according to the build-up multilayer wiring board of the first aspect of the present invention, it is a build-up multilayer wiring board composed of a core substrate made of a different material, and at least the build-up insulation. Resin layer, first copper plating layer, second copper plating layer, via hole hole, through-hole hole,
It is characterized by having. Therefore, according to the present invention, since a build-up multilayer wiring board can be manufactured using a core substrate made of a different material, the degree of freedom in selecting the core substrate is high, for example, “dimensional change rate”, “ The material of the core substrate can be selected according to the purpose of use of each product such as “dielectric properties”, “electrical insulation”, and “bending properties”. Further, compared to the conventional build-up multilayer wiring board using a core substrate made of a single material, it is easy to increase the added value.

Further, according to the build-up multilayer wiring board of the second aspect of the present invention, the thickness of the first copper plating layer and the second
The thickness is different from that of the copper plating layer. Therefore, for example, (A) By increasing the thickness of the second copper plating layer from the first copper plating layer, it is possible to improve the reliability of the via hole and improve the solder heat resistance. .

(B) By making the thickness of the second copper plating layer smaller than that of the first copper plating layer, a fine pattern can be formed on the outermost layer.

Although the methods (A) and (B) are different from each other and have advantages and disadvantages to each other, according to the present invention, the thickness of the copper plating performed twice can be freely selected as compared with the prior art. The thickness of the copper plating layer can be set according to the purpose.
The method (B) is suitable when the overall thickness is small, the reliability of the sulfol is not required to be very high, and there is a need to form a fine pattern in the build-up layer.

According to the build-up multilayer wiring board of the third aspect of the present invention, the first copper plating layer or the second copper plating layer formed on the inner wall of the through-hole is
It is characterized by being brought into contact with or in close contact with the inner wall surface of the core substrate made of the different material. Therefore, since no smear remains on the inner wall of the through hole, the reliability of the electrical connection of the upper and lower patterns (outer layer) and the electrical connection between the inner layer and the outer layer via the copper plating layer of the through hole, which is the original purpose of the through hole, is reduced. Can be enhanced. Further, since no smear remains on the inner wall of the through hole, the adhesion between the copper plating layer and the inner wall surface of the through hole of the core substrate can be improved.

According to the method of manufacturing a build-up multilayer wiring board of the present invention, a build-up resin layer forming step, a via hole forming step, a first copper plating layer forming step, The method is characterized by including a hole hole forming step and a second copper plating layer forming step. Therefore, according to the present invention, it is possible to obtain a method for manufacturing a build-up multilayer wiring board in which a build-up multilayer wiring board is formed using a core substrate made of a different material. Further, for example, (A) By increasing the thickness of the second copper plating layer from the thickness of the first copper plating layer, it is possible to improve the reliability of the via hole and improve the solder heat resistance. .

(B) By making the thickness of the second copper plating layer thinner than the thickness of the first copper plating layer, a fine pattern can be formed on the outermost layer.

According to the present invention, it is possible to obtain a method for manufacturing a build-up multilayer wiring board in which (A) or (B) can be selected according to the purpose.

Further, according to the method of manufacturing a build-up multilayer wiring board according to claim 5 of the present invention, (1) a step of preparing a printed wiring board, (2) a step of forming a build-up resin layer,
(3) via-hole forming step, (4) roughening step,
(5) first copper plating layer forming step, (6) through-hole forming step, (7) second copper plating layer forming step, (8) second copper plating layer or second step. The second and first copper plating layers are manufactured in the order of a predetermined pattern forming step. Therefore, since the first copper plating layer is formed after the roughening treatment of the build-up resin layer, the build-up that can increase the adhesion between the build-up resin layer and the first and second copper plating layers can be achieved. A method for manufacturing an up multilayer wiring board can be obtained.

Further, according to the method of manufacturing a build-up multilayer wiring board according to claim 6 of the present invention, (1) a printed wiring board preparation step, (2) a build-up resin layer forming step,
(3) a through-hole-hole forming step, (4) a roughening treatment and a first copper-plated layer forming step, (5) a step of leaving the first copper-plated layer on the inner wall of the through-hole hole, (6).
Via hole hole forming step, (7) roughening treatment and second copper plating layer forming step, (8) second copper plating layer or a predetermined pattern on the second and first copper plating layers It is characterized by being manufactured in the order of the forming step. Accordingly, the first copper plating layer is left thick on the inner wall of the through-hole, the first copper plating layer in all other areas is removed, and the thickness of the second copper plating layer is reduced. And a method of manufacturing a build-up multilayer wiring board capable of forming a fine pattern by a second copper plating layer on the surface of a build-up resin.

Further, according to the method of manufacturing a build-up multilayer wiring board according to claim 7 of the present invention, the step (5) of leaving the first copper plating layer on the inner wall of the through-hole hole includes: A step of leaving a first copper plating layer by coating, or a step of leaving the first copper plating layer by filling or coating a resin in a through-hole hole;
It is characterized by comprising. Accordingly, it is possible to obtain a method for manufacturing a build-up multilayer wiring board in which the first copper plating layer can be left on the inner wall of the through-hole hole easily, reliably and simply.

[Brief description of the drawings]

FIG. 1 is a cross-sectional process diagram showing an example of a build-up multilayer wiring board composed of dissimilar materials and a method for manufacturing the same according to an embodiment of the present invention, in which (a) shows a process (1) double-sided printed wiring board (B) is a diagram for explaining the step (2) formation of a build-up resin layer,
(C) is a diagram illustrating (3) formation of a via hole, (d) is a diagram illustrating (4) a roughening process,
(E) is a view for explaining (5) first copper plating, (f) is a view for explaining (6) formation of a through-hole, and (g) is a view (7) for the second time. It is a figure explaining copper plating of (h), (h) is a figure explaining formation of a predetermined pattern in a copper plating layer.

FIGS. 2A and 2B are cross-sectional process diagrams showing an example of a build-up multilayer wiring board composed of different materials and a method for manufacturing the same according to another embodiment of the present invention, and FIG. It is a figure explaining preparation of a wiring board and formation of a build-up resin layer, (b) is a figure explaining (2) formation of a through-hole hole, (c) is (3) roughening processing and the It is a figure explaining the 1st copper plating, (d) is a figure explaining the (4A) 1st copper plating layer remaining on the inner wall of a through-hole hole, (e) is (4B) a through-hole. It is a figure explaining the 1st copper plating layer remaining on the inner wall of a hole, (f) is a figure explaining (5) formation of a via hole, (g) is (6) roughening processing and the 2nd time FIG. 7H is a view for explaining copper plating, and FIG. 7H illustrates formation of a predetermined pattern on the copper plating layer. It is a diagram.

3A and 3B are cross-sectional process diagrams illustrating an example of a conventional build-up multilayer wiring board and a method for manufacturing the same, wherein FIG. 3A is a diagram illustrating (1) preparation of a double-sided printed wiring board, and FIG. (2) is a diagram illustrating the formation of a build-up resin layer,
(C) is a diagram illustrating (3) formation of a via hole, (d) is a diagram illustrating (4) formation of a through-hole hole, and (e) is a diagram (5) illustrating a roughening process. (F) is a diagram illustrating (6) copper plating,
(G) is a figure explaining a predetermined pattern formation in a (7) copper plating layer.

FIG. 4 is a cross-sectional view illustrating a problem of a conventional build-up multilayer wiring board and a method of manufacturing the same.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Build-up multilayer wiring board 11 Double-sided printed wiring board 12 Core substrate composed of different materials 13 Inner-layer conductor pattern 14 Build-up resin layer 14a Build-up resin surface 15 Via hole 15a Via hole 16 First copper plating layer 16a Penetration through First copper plating layer on inner wall of hole hole 17 Through-hole hole 17a Inner wall of through-hole hole 18 Second copper plating layer 18a Second copper plating layer on inner wall of through-hole hole 20 Build made of different materials Up multilayer wiring board 21 Etching resist 22 Resin filled in through-hole 23 Second copper plating layer 23a Second copper plating layer on inner wall surface of through-hole

Claims (7)

[Claims] In a build-up multilayer wiring board comprising a core substrate made of a different material, at least a build-up insulating resin layer, a first copper plating layer, a second copper plating layer, a via hole hole, a through-hole hole. A build-up multilayer wiring board comprising: 2. The build-up multilayer wiring board according to claim 1, wherein the thickness of the first copper plating layer is different from the thickness of the second copper plating layer. 3. The core substrate according to claim 1, wherein the first copper plating layer or the second copper plating layer formed on the inner wall of the through-hole is made of the different material. A build-up multilayer wiring board characterized by being in contact with or in close contact with an inner wall surface of a multi-layer wiring board. 4. A method for manufacturing a build-up multilayer wiring board comprising a core substrate made of a dissimilar material, comprising: a build-up resin layer forming step; a via hole forming step; a first copper plating layer forming step; A method for manufacturing a build-up multilayer wiring board, comprising: a hole hole forming step; and a second copper plating layer forming step. 5. The method for manufacturing a build-up multilayer wiring board according to claim 4, wherein (1) a printed wiring board preparation step, (2) a build-up resin layer forming step, (3) a via hole hole forming step, (4) ) Roughening treatment step, (5) First copper plating layer forming step, (6) Through-hole hole forming step, (7) Second copper plating layer forming step, (8) Second copper Plating layer or second and first
A method for manufacturing a build-up multilayer wiring board, comprising: manufacturing in the order of a predetermined pattern forming step on a second copper plating layer. 6. The method for manufacturing a build-up multilayer wiring board according to claim 4, wherein (1) a printed wiring board preparation step, (2) a build-up resin layer forming step, (3) a through-hole hole forming step, 4) Roughening treatment and first copper plating layer forming step, (5) Step of leaving first copper plating layer on inner wall of through-hole hole, (6) Via hole hole forming step, (7) Roughening Processing and second copper plating layer forming step, (8) second copper plating layer or second and first copper plating layers
A method for manufacturing a build-up multilayer wiring board, comprising: manufacturing in the order of a predetermined pattern forming step on a second copper plating layer. 7. The method for manufacturing a build-up multilayer wiring board according to claim 6, wherein the step (5) of leaving the first copper plating layer on the inner wall of the through hole has a first copper plating layer covered with an etching resist. A method for manufacturing a build-up multilayer wiring board, comprising: a step of leaving a plating layer; or a step of leaving a first copper plating layer by filling or covering a through-hole hole with a resin.