JP2000046750A - Surface defect confirming apparatus, substrate defect analyzing method using the same and substrate defect analyzing method of liquid crystal display apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface defect confirming apparatus capable of rapidly executing marking work, and efficiently performing the classification of a substrate sample piece after cutting and the analysis of a surface defect. SOLUTION: A surface defect confirming apparatus consists of an optical microscope, for confirming the surface defect P on a substrate K to be inspected, the stamp 2 for marking the position of the surface defect P, and a stage 3 for transferring the substrate K to be inspected so as to allow the position of the reflection lens 4 or permeation lens 5 of the optical microscope 1 and the position of the surface defect P to coincide with each other. The apparatus is further provided with a changeover means A for moving the reflection lens 4 of the optical microscope 1 and moving the stamp 2 to the position of the surface defect P, and the drive means B for raising and lowering the stamp 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface defect confirmation device, a substrate defect analysis method using the device, and a substrate defect analysis method for a liquid crystal display device. More specifically, for example, a surface defect confirmation apparatus for specifying a defect position of a surface defect such as a foreign substance or a scratch attached to a glass substrate used for manufacturing a TFT liquid crystal display device, a substrate defect analysis method using the device, and a liquid crystal display device. The present invention relates to a substrate defect analysis method.

[0002]

2. Description of the Related Art Conventionally, in a TFT liquid crystal display manufacturing process, a semiconductor manufacturing process, or the like, foreign matter adhering to a substrate surface has caused defects such as disconnection of wiring, dielectric breakdown, and short circuit. Such foreign substances include those generated from the driving unit of the manufacturing apparatus, those that are mixed in human body dust, reaction products due to process gas, chemicals, and the like. As an apparatus for detecting these foreign substances adhered to the surface, an apparatus for detecting scattered light generated from the foreign substances by irradiating a laser or the like is known (JP-A-61-99845, JP-A-3-18708). And JP-A-7-92095). In addition, this apparatus can simultaneously detect the distribution of foreign substances and the size of foreign substances on the substrate.

On the other hand, in order to identify the source of a surface defect such as a foreign substance or a flaw attached to a substrate, the defect is identified by SEM.
It is necessary to analyze with an analyzer such as / EDX and FT-IR. For silicon wafers used in semiconductor manufacturing, there are analyzers that can put the wafers in the device as they are,
There is no large analyzer that can directly analyze a large glass substrate used in TFT-LCD production. Therefore, when analyzing a surface defect attached to the substrate, marking the position of the defect with a pen or magic while observing the position of the defect with an optical microscope, etc., and cutting the large substrate into small pieces that can fit in the analyzer. Analyzing.

[0004] In such a marking operation, an operator makes a mark one by one near a surface defect based on experience.
Very annoying and inefficient. When a large number of substrates having surface defects are cut, classification of each substrate sample is troublesome.

[0005] Therefore, as an apparatus for easily performing a marking operation without skill, a mark member slidable in the optical direction of the objective lens is attached to the outer periphery of the objective lens tube of the microscope, and the solenoid is energized. Is projected downward, the mark member is lowered, and a circular mark is attached around the sample (hereinafter, referred to as an apparatus A) (see Japanese Utility Model Laid-Open No. 52-14891). It also includes a swing motor attached to the side of the microscope body, an arm connected to the swing shaft of the swing motor, and a pen device attached to the arm. There is a marking device (hereinafter referred to as device B) in which a core material advances from a pen tip portion of the pen device after the device is moved and ink is attached to a target position of a sample (Japanese Patent Laid-Open No. 5-281473).

[0006]

However, in the apparatus A, when the sample on which the mark is attached is removed from the microscope and then observed and analyzed again, the distance between the objective lens and the sample is short. It is difficult to find a sample within a large circular mark as large as a tube at an early stage. On the other hand, in the apparatus B, unless the pen apparatus is slowly swung, there is a possibility that the ink may erroneously ooze out of the core material at the pen tip. In addition, since the position where the ink is attached is fixed, in the case of a large sample, the ink may be erroneously attached to the sample, making analysis difficult.

Further, in the apparatuses A and B, since the mark and the ink adhering shape are constant for each sample, there is a problem that it is difficult to classify the samples.

SUMMARY OF THE INVENTION In view of the above circumstances, the present invention provides a surface defect confirmation device and a device capable of quickly performing a marking operation and efficiently performing classification of a sample piece after cutting and analysis of a surface defect. It is an object of the present invention to provide a method for analyzing a substrate defect and a method for analyzing a substrate defect of a liquid crystal display device.

[0009]

According to the present invention, there is provided a surface defect confirming apparatus for confirming a surface defect on a substrate to be inspected, a defect position specifying means for marking the position of the surface defect, and the defect confirming apparatus. A surface transfer device for transferring the substrate to be inspected so as to match the position of the inspection unit of the means with the position of the surface defect, wherein the inspection unit of the defect confirmation unit is moved, It is characterized by comprising switching means for moving the defect position specifying means to the position of the surface defect and driving means for raising and lowering the defect position specifying means.

The present invention also provides a method for analyzing a substrate defect in a liquid crystal display device, the method comprising the steps of: A substrate transfer step of transferring the substrate to be inspected, a switching step of switching the defect position specifying unit to the position of the surface defect, a step of marking the surface defect, and a step of marking the surface of the inspected substrate. Observing and / or analyzing the surface defect.

Further, the present invention provides a method of analyzing a substrate defect of a liquid crystal display device, wherein the method of analyzing a substrate defect of a liquid crystal display device using the above-described surface defect confirming device comprises: A data input step of inputting data to the inspection unit, a substrate transfer step of transferring the substrate to be inspected so that the position of the inspection unit of the defect confirmation unit matches the position of the surface defect based on the position coordinate data, and A switching step of switching the defect position specifying means to a defect position, and a step of marking the surface defect,
The method includes a step of cutting out the marked substrate to be inspected into a substrate sample piece, and a step of observing and / or analyzing a surface defect in the substrate sample piece.

[0012]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a liquid crystal display device according to a first embodiment of the present invention;

FIG. 1 is a front view of an essential part showing an embodiment relating to a surface defect checking apparatus of the present invention, FIG. 2 is a front view showing an essential part showing another embodiment of the surface defect checking apparatus of the present invention, FIG. 3 is a front view of an essential part showing still another embodiment related to the surface defect checking device of the present invention, and FIG. 4 is a flowchart showing one embodiment of the substrate defect analyzing method of the present invention.

As shown in FIG. 1, a surface defect confirmation device according to one embodiment of the present invention is a defect confirmation means.
For example, the optical microscope 1 includes a marking stamp 2 as a defect position specifying unit, and a stage 3 as a substrate transfer unit that transfers the substrate K to be inspected in the horizontal direction. The stamp 2 at the position
And a driving means B for raising and lowering the stamp 2.

The substrate K to be inspected is, for example, a glass substrate used for manufacturing a liquid crystal display device. The substrate K to be inspected is located between the reflection lens (objective lens) 4 and the transmission lens 5 in the optical microscope 1. It is arranged on the stage 3 so as not to bend. This transmission lens 5
In order to check whether the surface defect P is transparent or opaque, the surface defect P is switched to the reflective lens 4 and used.

The stage 3 is driven so that the position of the reflection lens 4 and the position of the surface defect P coincide with each other. This stage 3 can be driven manually or automatically. For example, when the stage 3 is automatically driven, the optical microscope 1 includes a pattern defect inspection device 6 for comparing a digital image of a repetitive pattern such as an array substrate of a TFT-LCD to detect a surface defect.
Alternatively, it is preferable to irradiate the substrate K to be inspected with inspection light such as laser or the like, and to connect a surface inspection device or the like which detects scattered light of the inspection light by the surface defect P. By connecting the inspection device 6, the position coordinates of the surface defect P on the substrate K to be inspected can be recorded in the memory unit of the inspection device 6. Therefore, the stage 3 is controlled based on the read position coordinate data from the memory unit. And can be moved. The control of the stage 3 is performed by the inspection device 6 and the stage 3
The transfer control unit 7 can be provided between the steps.

The stamp 2 has a circular ink portion (not shown) in the tip 2a, and the switching means A and the driving means B are provided on the base 2b side. The shape of the ink portion can be appropriately selected depending on the size and shape of the surface defect. Further, the ink section is adapted to supply ink to the cartridge or the ink section.

As the switching means A, if a known mechanism capable of moving the position of the stamp 2 to the position of the reflection lens 4 after confirming the surface defect P on the substrate K to be inspected is used in the present invention, The present invention is not particularly limited, and may be, for example, one using a rotary motor and a rotary slide member or a swing slide member, or one using a solenoid and a rotary slide member or a swing slide member.

In the present invention, if the drive means B is a known actuator which can secure a stroke from lowering the stamp 2 switched on the optical axis of the reflection lens 4 to contact with the substrate K to be inspected, , But not limited to, for example, solenoids,
An air cylinder or a piezoelectric element can be used. It is preferable that fine adjustment means for adjusting the marking position, such as an adjustment screw, be connected to the drive means B. Switching means A and driving means B
Are turned on and off by a switching button 8 and a stamp button 9, respectively, so that they can be activated and stopped.

Therefore, in the present embodiment, after confirming the surface defect P on the substrate K to be inspected, the switching button 8 is pressed to switch between the reflection lens 4 and the stamp 2. Then, when the stamp button 9 is pressed, the stamp 2 is lowered and the surface defect P is centered, for example, around 1c.
m circular ink is marked on the substrate surface. This makes it possible to easily find the marked portion when observing or analyzing a surface defect by SEM on the substrate sample piece cut out using the marked portion as a mark, so that the work time for observation and analysis is reduced. Can be shortened.

Next, another embodiment of the present invention will be described. This embodiment is different from the above embodiment in that marking is performed on the back surface of the substrate to be inspected.

That is, when a resist film or a TFT element is formed on the surface of the substrate K to be inspected, marking around the surface defect P causes ink to bleed around the surface defect P, or resist or the like. Due to the contamination of the stamp itself, accurate observation and analysis results may not be obtained. For this reason, as shown in FIG. 2, the stamp 2, the switching means A and the driving means B are arranged below the substrate K to be inspected.

Therefore, in this embodiment, after confirming the surface defect P, pressing the switching button 8
The stamp 2 and the transmission lens 5 are switched. Then, when the stamp button 9 is pressed, the stamp 2 rises, and a circular ink having a circumference of 1 cm around the surface defect P is marked on the back surface of the substrate.

Next, still another embodiment of the present invention will be described. In the present embodiment, if there are a plurality of cut-out substrate sample pieces, it is difficult to distinguish each of the substrate sample pieces, so that a plurality of surface defects can be classified.

That is, as shown in FIG.
The stamps 2a, 2b and 2c are placed on the lens portion 10 of a reflective lens or a transmissive lens, and the stamps 2a to 2c are switched according to the type of surface defect. For example, surface defects can be classified by making the color and / or shape of the ink marked by each of the stamps 2a to 2c different. The color is red for the surface defect P1, blue for the surface defect P2, and P3 for the surface defect.
May be yellow or the like, and the shape may be a mark such as ○ for the surface defect P1, △ for the surface defect P2, and □ for the surface defect P3. In order to switch the stamps 2a to 2c due to surface defects, a switching unit A and a driving unit B for the stamps 2a to 2c are used.
It is preferable to provide a switching button and a stamp button for activating the button. The positions of the stamps 2a to 2c are adjusted in advance so that the surface defects P1 to P3 are located at the center positions of the marks.

Next, the operation procedure of the present invention will be described with reference to the flowchart shown in FIG. First, the board is inspected (step S1). Then, it is determined whether or not to confirm a surface defect (step S2). If no defect is confirmed, the next substrate inspection is performed (step S).
1). When confirming a defect, the defect is confirmed by, for example, an optical microscope (step 3). It is determined whether or not to perform SEM observation and / or analysis of the defect (step 4). SE
If the M observation and / or analysis is not performed, the next substrate inspection is performed (step S1). If the SEM observation and / or analysis is performed, the defect position is specified (marking). After the determination (color and shape change) (step 5), the substrate is cut (step S6). Then, a series of analysis methods of performing SEM observation and / or analysis (step S7) are performed.

For example, in step S1, LC3090
Inspection is performed by a pattern defect inspection device (manufactured by Orbotec), and in step S2, the defect position data is stored in the MHL425R.
It is input to an optical microscope of S (manufactured by Olympus Corporation). The substrate is transferred so that the position of the stamp of the optical microscope matches the position of the defect based on the defect position data. This is a series of defect analysis methods for switching the defect specifying means according to the defect selected in step S5.

In the present invention, it is also possible to omit the connection of the inspection device, manually check the surface defects, mark them, and then observe and / or analyze the surface defects of the substrate.

[0029]

As described above, according to the present invention,
The marking operation can be performed quickly and, for example, the classification of the cut substrate sample and the observation and / or analysis of surface defects can be efficiently performed.

[Brief description of the drawings]

FIG. 1 is a front view of an essential part showing an embodiment of a surface defect checking device according to the present invention.

FIG. 2 is a front view of an essential part showing another embodiment related to the surface defect checking device of the present invention.

FIG. 3 is a front view of a main part showing still another embodiment related to the surface defect checking device of the present invention.

FIG. 4 is a flowchart showing one embodiment of a substrate defect analysis method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical microscope 2 Stamp 3 Stage 4 Reflection lens 5 Transmission lens 6 Inspection device 7 Transfer control unit 8 Switching button 9 Stamp button A Switching means B Driving means K Substrate to be inspected P Surface defect

Claims (8)

[Claims] 1. A defect confirmation unit for confirming a surface defect on a substrate to be inspected, a defect position identification unit for marking the position of the surface defect, and a position of an inspection unit of the defect confirmation unit and a position of the surface defect. A substrate transfer means for transferring the substrate to be inspected so as to be coincident, wherein the inspection unit of the defect check means is moved, and the defect position specifying means is moved to a position of the surface defect. A surface defect checking device comprising: a switching unit for causing the defect position specifying unit to move up and down; 2. The surface defect confirmation device according to claim 1, wherein said defect confirmation means is an optical microscope. 3. The surface defect checking device according to claim 1, wherein the defect position specifying means is a stamp. 4. The surface defect confirmation device according to claim 1, wherein said defect position specifying means is capable of distinguishing at least two types of surface defects by said switching means. 5. The surface defect checking device according to claim 4, wherein the color and / or shape of the ink of the stamp changes based on the type of the surface defect. 6. An inspection apparatus for inspecting the surface of the substrate to be inspected is connected to the defect position specifying means, and the substrate transfer means moves the substrate based on position coordinate data of a surface defect. Claims 1, 2, 3, comprising:
A surface defect confirmation apparatus according to 4 or 5. 7. A substrate defect analysis method using the surface defect confirmation device according to claim 1, wherein a position of an inspection unit of the defect confirmation means coincides with a position of the surface defect. A substrate transfer step of transferring the substrate to be inspected, a switching step of switching the defect position specifying unit to the position of the surface defect, a step of marking the surface defect, and a step of marking the surface of the inspected substrate. Observing and / or analyzing a surface defect. 8. A substrate defect analysis method for a liquid crystal display device using the surface defect confirmation device according to claim 6, wherein a data input step of inputting position coordinate data of the surface defect to a transfer control unit of the substrate transfer means. Transferring a substrate to be inspected so that the position of the inspection unit of the defect checking unit and the position of the surface defect are matched based on the position coordinate data; and specifying the defect position at the position of the surface defect. A switching step of switching means, a step of marking the surface defect, a step of cutting the marked substrate to be inspected into a substrate sample, and a step of observing and / or analyzing the surface defect in the substrate sample. A substrate defect analysis method for a liquid crystal display device, comprising: