JP2003149299A - Device and method for positioning - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for positioning that provides the adjustment of a relative position between work and a jig to the work, which can be easily and quickly done independently of experiences and skills. SOLUTION: In the device for positioning that adjusts the positioning for the relative position between the jig 15 and the work, an inspection plate 30 to be held with a work holder instead of an actual work, where penetrated holes 31, 32 are arranged at least at two points of opposite corners, is held and therewith light radiated with a light source 52 from the outside 52 of an optical fiber positioned at the upper part of the penetrated holes 31, 32 of the inspection plate 30 is radiated to the holes 31, 32. Then the relative position between the inspection plate 30 and the jig 15 is adjusted with verifying a shadow 61 formed on the surface of the jig 15 near to the forward center of the penetrated holes 31, 32 so that the shadow 61 is positioned to the specified jig 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning device and a positioning method for positioning and adjusting the relative positions of a jig and a work.

[0002]

2. Description of the Related Art Therefore, a conventional inspection apparatus is, for example,
The stage that holds the pattern wiring board to be inspected, which is a workpiece, is transported to the inspection position, and on the other hand, a contact probe (hereinafter referred to as “jig”) in which a large number of conductive pins are planted at predetermined intervals is manufactured. The jig is brought into contact with the wiring board of the stage that is positioned and conveyed to the inspection position, the contact probe is used to check the inspection signal, the shape of the wiring pattern is detected, and the quality of the wiring pattern is determined.

In such a pattern inspection apparatus,
By matching the relative positions of the jig and the stage, the contact probe that detects the inspection signal is determined when the wiring pattern to which the inspection signal is supplied is in a normal state, and it always becomes a constant contact probe. When the inspection signal cannot be detected by a predetermined contact probe or when the inspection signal is detected by another contact probe, it can be recognized that the wiring pattern is defective.

Therefore, for example, when the jig is first attached to the inspection device or when the inspection target (workpiece) is changed, the positions of the conductive pins implanted in the jig and the pattern wiring board of the work It was necessary to accurately position the relative positional relationship.

A conventional jig positioning method will be described with reference to FIG. FIG. 5 is a diagram for explaining a general positioning method of a jig of a conventional inspection device.

In the conventional inspection apparatus, as shown in FIG. 5, two marks 110 are provided on the center line 101 of the jig 100, and the jig 100 is provided by, for example, a camera or a mark detector installed in the inspection apparatus. The position of the two marks 101 provided on the
The intermediate point of 1 + L2 was calculated and recorded so as to be the center position 102 of the jig 100 (L1 = L2).

Then, if the center position of the stage holding the work is brought to the center position 102 of the jig 100 obtained as a result of the calculation, there is no deviation in the center position of the jig 100 and the center position of the stage, and the work Can be inspected.

In FIG. 5, for simplification of description, an example in which the contact probe 120 is three in a row is schematically shown. However, in reality, a large number of contact ropes are arranged in both columns and rows, and two marks to be described later are arranged on the center side surface of the row of the contact rope group.

[0009]

However, it is difficult to make the mark position 110 provided on the jig 100 as designed due to problems such as processing accuracy and material. Also,
The size of the mark 110 needs to be a certain size, and there is a problem that the center position 102 also changes depending on which position of the mark 110 is the detection position.

Therefore, it is necessary to finely adjust the center position once it has been obtained. Conventionally, the jig 100 is brought into contact with the workpiece to be inspected to check the degree of deviation,
The jig 100 is separated again and the position of the jig 100 is changed.
It was necessary to repeat the operation of bringing the jig 100 into contact with the work again to adjust the position, which required a great deal of labor.

[0011]

SUMMARY OF THE INVENTION The present invention has been made for the purpose of solving the above-mentioned problems, and solves the above-mentioned problems, and a positioning device and a positioning device capable of easily adjusting the jig position with respect to a workpiece. The purpose is to provide a method. For example, the following configuration is provided as one means for achieving the object.

That is, a positioning device for positioning and adjusting the relative position of a jig and a work, comprising a work holding part for holding the work, a work held by the work holding part, and a jig for the work. A jig positioning means for positioning the relative position, wherein the jig positioning means is an inspection plate in which punch holes are provided at least at two diagonal points held by the work holding portion in place of an actual work; A shadow formed by light emitted from the light source on the jig surface near the forward center of the hole, the light source being positioned above the hole of the inspection plate. While confirming, the relative position of the inspection plate and the jig can be adjusted so that the shadow becomes the specific jig position.

Alternatively, there is provided a positioning method in a positioning device for positioning and adjusting the relative position of the jig and the work, wherein the relative position between the work held by the work holding section for holding the work and the jig with respect to the work is determined. At the time of positioning, the work holding part is held in place of the actual work and holds an inspection plate having punched holes at least at two diagonal points, and is positioned above the punched hole of the inspection plate. The inspection plate so that the light emitted from the light source passes through the hole and confirms the shadow formed on the jig surface near the forward center of the hole so that the shadow is located at a specific jig position. And the relative position of the jig can be adjusted.

For example, the inspection plate is made of transparent acrylic, and the light emitted from the light source is reflected by the side surface of the hole to form a shadow on the surface of the jig near the lower center of the hole. Is characterized by.

Further, for example, the jig is an assembly of inspection pins for inspecting the work, the hole is formed to have a diameter of at least the diameter of the inspection pin, and the positioning means has the inspection pin. It is characterized in that the position of the inspection pin is adjusted with reference to the shadow position on the surface.

Furthermore, for example, the jig position is adjusted by confirming the shadow position by a picked-up image picked up by an image pickup means.

[0017]

DETAILED DESCRIPTION OF THE INVENTION An embodiment of the present invention will be described in detail below with reference to the drawings. The following explanation is about an example in which the work to be inspected is a substrate (plate) on which a circuit pattern is formed, and a jig is configured to have a large number of contact probes to be inspected for inspecting the wiring pattern of the substrate. To do.

Then, when the jig is moved in the direction of the board to bring the contact probe group into contact with the board on which the wiring pattern is formed and when the inspection signal is supplied to the wiring pattern, which contact probe can detect this inspection signal. As an example, a case where the detection condition of the inspection signal is patterned to detect a short circuit with another wiring pattern or an open in the middle of the wiring pattern is performed.

However, the present invention is not limited to the examples described below and can be variously modified. First, the configuration of the present embodiment will be described with reference to FIGS.

FIG. 1 is a diagram for explaining a schematic structure of a substrate inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a through hole 3 of an inspection dummy plate 30 according to the present embodiment.
1, 32 and the contact rope 1 arranged on the lower jig 10
5 is a diagram for explaining the positional relationship with the optical disc 5, and FIG. 3 is a diagram for explaining the positioning principle of the present embodiment.

In the substrate inspecting apparatus of the present embodiment shown in FIG. 1, reference numeral 10 denotes a lower jig in which a contact probe 15 which is slidable in the vertical direction is planted on the upper surface in a range covering an inspection object, It can move up and down.

The contact probe 15 has a detection contact at its tip, and can detect an inspection signal from an object to be inspected. On both sides of the center line of the contact probe mounting surface of the lower jig 10, as shown in FIG.
Point alignment marks are provided.

Reference numeral 20 denotes a dummy plate 30 for inspection or an actual work (inspection substrate) shown in FIG.
Is a table that can be moved in each direction of the XYZ lock by locking the, and is provided with a detection unit that detects two alignment marks (not shown).

In the present embodiment shown in FIG. 1, the lower jig 1
The inspection dummy plate 30 for easily performing the positioning adjustment of 0 is held, and the actual inspection process is performed after the position adjustment of the table 20 is performed using the inspection dummy plate 30 as described later in detail. To do.

Inspection dummy plate 3 of the present embodiment
Reference numeral 0 is made of transparent acrylic and is manufactured according to the external dimensions of the actual work from the CAD data of the work to be inspected. Then, as shown in FIG. 2A, in this embodiment, the holes 31 and 32 each having a thickness of about 2 mm and about 2 mm are provided at two diagonal positions. The positions of the holes 31 and 32 may be arbitrary positions.

Reference numeral 40 is an upper jig used for positioning the lower jig 10. For example, the hole 3 provided integrally with the table 20 and provided in the inspection dummy plate 3
The tip end of the fiber of the imaging unit 50 is positioned and fixed at a position substantially above the parts 1 and 32.

The upper jig 40 is not formed integrally with the table 20, but is formed as a separate body, and the fiber tip of the photographing section 50 is a hole for the inspection dummy plate 30 only during inspection. It may be configured to move the upper part of 31, 32.

Further, the upper jig 40 and the inspection dummy plate 30 may be integrated so that the tip of the optical fiber 51 of the photographing section 50 is surely arranged above the punched hole.

That is, as long as the relative positional relationship between the punched holes 31 and 32 arranged in the inspection dummy plate 30 and the photographing unit 50 is maintained, there is no limitation on the mutual fixing method or the moving method to the relative position. .

The structure of the photographing unit 50 is the optical fiber unit 50.
And a light source 55, a camera 56, and a display unit 57 that displays an image captured by the camera unit 56.
Optical fibers 51a and 51b are led out to 0, and the tip ends are arranged above the holes 31 and 32 of the inspection dummy plate 30.

The optical fibers 51a, b are composed of, for example, a two-layer optical fiber as shown in FIG. 3, and the peripheral part 52 is a fiber part for guiding the light emitted from the light source 55 to the tip part. Light is emitted toward the holes 31 and 32 of the inspection dummy plate 30. Central part 53
Is a fiber portion that receives light from the holes 31 and 32 of the inspection dummy plate 30 and guides it to the image pickup portion of the camera 56.

Light from the tip of the optical fiber section 50 is extracted through the holes 31 and 32 of the acrylic inspection dummy plate 30.
When the irradiation position (Z axis) is adjusted, the irradiation light is reflected on the side surface of the hole and a shadow 61 is formed below the center of the hole as shown in FIG. The focus of the camera 56 is set on the surface of the contact probe 15.

Therefore, fine adjustment can be performed easily and quickly by adjusting the position of the shadow 61 on the surface of the contact probe 15a, 15b which should be located under the holes 31, 32 of the lower jig 10. . By arranging the optical fibers 51a and 51b tip portions on the upper side of the inspection dummy plate 30 by about 30 mm to 40 mm, and positioning the lower jig 10 on the surface position of the contact probe 15 at a distance of about 3 mm from the lower surface of the inspection dummy plate 30, It is possible to focus on the contact probe surface.

The diameter of the shadow 61 is about (1/4) the size of the holes 31, 32 (the diameter is about 1/2 of the holes 31, 32).

The principle of the positioning control of this embodiment will be described below with reference to FIG. FIG. 4 is a flow chart for explaining the positioning control and work processing of the positioning device of the present embodiment.

In this embodiment, the inspection dummy plate 30 is first prepared in step S1 of FIG. As shown in FIG. 2A, this inspection dummy plate 30 is manufactured according to the external dimensions of a real work made of transparent acrylic resin, and is formed by arranging holes 31 and 32 at two diagonal points.

Next, as shown in step S2, the inspection dummy plate 30 is attached and held on the table 20 via the holder 25. At this time, the table 20 is moved and positioned at the work attachment / detachment position.

In the following step S3, the table 20
Is moved to the position of the lower jig 10, the alignment mark provided on the lower jig 10 is detected by a detection unit (not shown), and the center of the table 20 is moved to the jig center position which is the center position of this mark. Adjust the table position.

The position adjustment of the table corresponds to the conventional center position adjustment described with reference to FIG. This center position adjustment is publicly known, so a detailed description thereof will be omitted. For example, a mark detection unit is provided on the surface of the lower jig 10.

By the above processing, the table 20 (inspection dummy plate 30) is positioned above the lower jig 10. Then, in step S4, the light source 55 is driven to emit light to the optical fiber 50. This light is taken by the imaging unit
Irradiation is performed from the end of the optical fiber of 0 toward the holes 31 and 32 of the inspection dummy plate 30. This state is captured by the camera 56 and displayed on the display unit 57.

Then, in step S5, the display unit 57
While confirming the display screen of, the table is moved up and down to finely adjust the distance between the table 20 and the lower jig 10.
The distance is controlled so that the shadow 61 shown in FIG.

When this distance is known in advance as in the second and subsequent times, the distance between the table 20 and the lower jig 10 is aligned with the adjustment of the step S3, and this process is omitted. Good.

Next, the shadow is confirmed on the display screen of the display unit 57, and the table position is finely adjusted. For example, the lower jig 10
If the relative position between the position and the position of the table 20 is accurate, the contact probe tip is located substantially below the center of the holes 31 and 32, and the desired contact probe tip surface (pin tip surface) is located in the shadow 61. Is located. However, in general, as shown in FIG. 2C, the pin tip is often slightly displaced from the center of the punched holes 31 and 32 only by checking the display screen of the display 57.

Therefore, in the present embodiment, the contact rope to be located below the hole where the shadow 61 is reflected is just the center of the holes 31 and 32 while checking the display screen of the display 57 in step S6. The position of the table 20 is adjusted by slightly moving the table 20 to the lower side. As described above, in the present embodiment, it is not necessary to move the contact probe up and down to bring it into contact with the actual work surface position and then to separate it again to confirm the position.
The position can be easily adjusted by continuously moving the table while checking the shadow 61 on the display screen. For example, the position adjustment, which conventionally takes several tens of minutes for each work or jig change, can be done within a few minutes. It can be done very easily and quickly.

Then, in the subsequent step S7, the table position at this time is stored as the work transfer position. As a result, the table transfer position adjustment is completed, and the process proceeds to step S8. In step S8, the table 20 is moved to the work attachment / detachment position, the adjustment dummy plate is removed, and the process proceeds to step S9.

In step S9, an actual work (such as a substrate on which a wiring pattern has been formed for wiring pattern inspection) is attached to the table 20. Alternatively, the table 20 automatically picks up an actual work and holds it in the holder 25.

Then, in the next step S10, the table 20 is conveyed to the adjustment position stored in step S7 and positioned. This positioning position is a position where the relative position between the actual work and the contact probe is accurately positioned.

Therefore, in the subsequent step S11, necessary processing is executed on the actual work. After the processing is completed, the table 20 is moved to the work attaching / detaching position in step S12, the work is replaced, and the process returns to step S9 to continue the process for the work.

In the embodiment described above, the optical fiber section 50 is used for the inspection dummy plate 3.
Although the images from the 0 holes 31 and 32 are guided to the camera unit 56, the present invention is not limited to the above example, and the light source 55, the camera unit 56, and the display unit 57 are configured differently, and the light source 5 is used.
It is also possible to place only 5 on top of the holes 31, 32 and place the camera 56 at a position where the surface of the contact probe can be focused. For example, it may be arranged above the inspection dummy plate 30, or may be arranged so as to be inclined between the table 20 and the lower jig 10.

Even when it is arranged above the inspection dummy plate 30, the distance from the inspection dummy plate 30 is 30 m.
It is possible to focus on the surface of the contact probe by arranging the lower jig 10 on the upper side by about m to 40 mm and positioning the surface of the contact probe 15 at a distance of about 3 mm from the lower surface of the inspection dummy plate 30. .

As described above, according to this embodiment, it is possible to easily and quickly adjust the position of the table, which is the work transfer means, with respect to the jig, and even when the work or the jig is replaced. The relative position can be adjusted quickly.

This adjustment can also be performed continuously while checking the display screen of the display unit 57, and anyone can adjust the position very easily without the need for skill.

In the above description, the case where only the position of the table 20 holding the work is adjusted has been described as an example. However, the present invention is not limited to the above example, and it is needless to say that the present invention can be applied to the one that adjusts the relative position of the work position and the contact probe. 10 may be configured to be movable in the XYZ directions, and the lower jig 10 may be moved to position the tip of the contact probe at the lower center of the holes 31 and 32, and this position may be stored. .

Alternatively, the work position is fixed and the lower jig 10
It is obvious that the present invention also includes the case where the lower jig 10 is configured to be freely movable and controllable, and the positioning of the lower jig 10 is controlled for both fine adjustment using the shadow 61 and fine adjustment.

[0055]

As described above, according to the present invention, anyone can extremely easily and quickly adjust the relative position between the work and the jig with respect to the work, without changing the work, and exchanging the work and the jig. Even in such a case, the position can be adjusted quickly.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic configuration of a positioning device according to an embodiment of the present invention according to the present invention.

FIG. 2 is a diagram for explaining a positional relationship between an inspection dummy plate and a contact rope arranged on a lower jig according to the present embodiment.

FIG. 3 is a diagram showing a positional relationship between an inspection dummy plate and a contact rope arranged on a lower jig and a state of light emitted from a light source according to the present embodiment.

FIG. 4 is a flowchart for explaining positioning control and work processing of the positioning device according to the present embodiment.

FIG. 5 is a diagram for explaining conventional position adjustment.

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Claims (8)

[Claims] 1. A positioning device for positioning and adjusting a relative position between a jig and a work, comprising: a work holding part for holding the work; a work held by the work holding part; and a jig for the work. A jig positioning means for positioning relative positions, wherein the jig positioning means is an inspection plate in which punch holes are provided at least at two diagonal points held by the work holding portion in place of an actual work; A shadow formed by light emitted from the light source on the jig surface near the forward center of the hole, the light source being positioned above the hole of the inspection plate. While confirming, the relative position of the inspection plate and the jig can be adjusted so that the shadow is at the specific jig position. 2. The inspection plate is made of transparent acrylic, and the light emitted from the light source is reflected by the side surface of the hole to form a shadow on the surface of the jig near the lower center of the hole. The positioning device according to claim 1, which is characterized in that. 3. The jig is an assembly of inspection pins for inspecting the work, the hole is formed to have a diameter of at least the diameter of the inspection pin, and the positioning means has a surface of the inspection pin. The positioning device according to claim 1 or 2, wherein the relative position of the inspection work and the jig is adjusted so that the shadow position of is the position of a specific inspection pin. 4. The positioning device according to claim 1, wherein the jig position is adjusted by confirming the shadow position from an image picked up by an image pickup means. 5. A positioning method in a positioning device for positioning and adjusting a relative position between a jig and a work, wherein the relative position between the work held by a work holding portion holding the work and the jig with respect to the work is determined. At the time of positioning, the work holding part is held in place of an actual work and holds an inspection plate having punched holes at least at two diagonal points, and is positioned above the punched hole of the inspection plate. The inspection plate so that the light emitted from the light source passes through the hole and confirms the shadow formed on the jig surface near the forward center of the hole so that the shadow is located at a specific jig position. A positioning method characterized in that the relative position of the jig and the jig can be adjusted. 6. The inspection plate is made of transparent acrylic, and the light emitted from the light source is reflected on the side surface of the hole to form a shadow on the surface of the jig near the center of the lower part of the hole. The positioning method according to claim 5, characterized in that 7. The jig is an assembly of inspection pins for inspecting the work, the hole is formed to have a diameter of at least the diameter of the inspection pin, and a shadow position on the surface of the inspection pin is 7. The positioning method according to claim 5, wherein the relative position of the inspection work and the jig is adjusted so as to be the position of a specific inspection pin. 8. The relative position between the workpiece and the jig is adjusted by confirming the shadow position by a picked-up image picked up by an image pickup means. Positioning method.