JP2000040718A - Wafer map display device, method therefor, and storage medium with wafer map display control program stored therein - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make display coordinate axes coincide with each other by changing the different directions of wafers separately fixed in a wafer measuring device. SOLUTION: A display control part 21 successively renews the display coordinates (X, Y) stored in a buffer B 24d based on the assembly of a series of X, Y, display coordinates, stored in a buffer X 24a and a buffer Y 24b for converting by each display coordinates (X, Y) by an objective coordinate changing part 25 to be stored in a buffer C 24e, making reference to a corresponding data array (V) for making out the entire objective coordinates according to the entire transformation coordinates so that the coordinate axis initialization which restores the positions of the display coordinate axis stored in the buffer A 24c is performed by a coordinate axis initializing part 26 for displaying respective wafer map data collected from a wafer measuring device 11 on a display image plane of a data display part 27.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer map display device, a wafer map display method, and a wafer map display method, which uses an IC tester to display, on a display device, pass / fail judgment data obtained during IC chip measurement for each wafer. The present invention relates to a storage medium storing a map display control program.

[0002]

2. Description of the Related Art A conventional wafer map display apparatus displays map data of good / bad judgment for each wafer sent from an IC tester as coordinates at the time of measurement. The display state of the map data will be described with reference to FIG.
As shown in FIG. 11, there is no problem if the coordinates of the lower left corner of the wafer (hereinafter, referred to as start coordinates) fall within the display screen initially set on the display device (hereinafter, referred to as first screen). As shown in FIG. 12, when the wafer map data does not fit within the right end of the display screen, that is, when there is wafer map data over a wide range of the X coordinate, the screen moves to the further right screen of the first screen (hereinafter referred to as an X-axis extension screen). You need to scroll to see the data. Similarly, if the wafer map data does not fit on the first screen over a wide range of Y coordinates, it is necessary to scroll to a screen further above the first screen (hereinafter referred to as a Y-axis extension screen) to check the data.

In the case where tens of wafers (hereinafter referred to as one lot) are dispersed in several types of IC testers to measure each wafer, a wafer measuring device attached to each IC tester is used to measure the wafer. Are fixed individually, the wafer directions of the obtained wafer map data do not always match. For this reason, when the wafer map data obtained from each IC tester is displayed using the wafer map display device, even if the orientation of each wafer matches the displayed wafer map data, Even if they did not match, they were compared by visual inspection to determine whether the IC chip was good or bad.

[0004]

In the above-described conventional wafer map display device, the starting coordinates of the wafer map data obtained from each IC tester differ depending on the position of the IC chip on the wafer measured by the IC tester. . For this reason, if the start coordinates of the wafer map data displayed on the display screen of the wafer map display device start on an X-axis extension screen or a Y-axis extension screen that does not fit within the display screen, no data is displayed on the first screen. May seem to be missing. Further, even when the wafer map data is extremely deviated to one axis, it may not fit on the first screen. Thus, there is a problem that the wafer map data obtained from the IC tester may not fit on the first screen set on the wafer map display device.

When a wafer is measured by distributing one lot to several types of IC testers, the wafer directions are individually fixed by wafer measuring devices attached to each IC tester. The wafer directions of the wafer map data obtained from are not necessarily the same. When the orientations of the wafers match, the display positions of the wafer map data on each wafer displayed on the wafer map display device match. This can be easily performed by comparing the wafer map data at the same display position by eye measurement. However, when the orientations of the wafers do not match, the display position of the wafer map data of each wafer displayed on the wafer map display device is different. In determining whether the IC chip on each wafer is good or defective, it is necessary to compare the display positions of the wafer map data among the wafers while confirming the display positions one by one, so that the measured positions are likely to be shifted. ,
There has been a problem that the determination time is longer than in the case where the wafer orientations match, and the work efficiency of the user is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems in the conventional wafer map display device by displaying the wafer map data on the wafer map display device when the direction of the wafer individually fixed in the wafer measurement device is increased. It is an object of the present invention to provide a wafer map display device, a wafer map display method, and a storage medium storing a wafer map display control program for changing the difference to the same coordinate axis to match the display coordinates.

[0007]

According to the first aspect of the present invention,
In a wafer map display device for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer with an IC tester, a display range designating means for designating a display coordinate range for displaying the wafer map data And display control means for displaying the wafer map data on the display screen of the display means in accordance with the display coordinate range designated by the display range designating means.

According to the first aspect of the present invention, in a wafer map display device for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester, When a display coordinate range for displaying the wafer map data is designated, the display control means displays the wafer map data on a display screen of the display means according to the designated display coordinate range.

Therefore, the display range can be arbitrarily specified by the user, and the wafer map data desired by the user can be displayed on the screen.

[0010] In this case, the above object is achieved, for example, in claim 2.
2. The wafer map display device according to claim 1, wherein the display range designating unit designates an X coordinate display range as the display coordinate range, and the display coordinate range. And a Y coordinate range designating means for designating the display range of the Y coordinate as described above, so that the user can arbitrarily designate the display range of the X axis and the Y axis, and the wafer map data desired by the user can be displayed on the screen. Can be displayed.

According to a third aspect of the present invention, there is provided a wafer map display device for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester, wherein the wafer map data is displayed. A coordinate axis storage means for storing the position of the reference coordinate axis, a target coordinate change means for changing the position of the target coordinate axis based on the position of the coordinate axis stored in the coordinate axis storage means, and Coordinate axis initialization means for returning the changed position of the coordinate axis to the original display coordinate axis position to generate display coordinates, and the wafer map is displayed in the display screen of the display means in accordance with the display coordinates generated by the coordinate axis initialization means. Display control means for displaying data.

According to the third aspect of the present invention, in a wafer map display device for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester, When the position of the reference coordinate axis is displayed in the coordinate axis storage unit, and the target coordinate change unit changes the position of the target coordinate axis based on the position of the coordinate axis stored in the coordinate axis storage unit, the coordinate axis initial value is displayed. The display unit generates display coordinates by returning the position of the coordinate axis changed by the target coordinate change unit to the original position of the display coordinate axis, and the display control unit displays the display coordinates generated by the coordinate axis initialization unit.
The wafer map data is displayed on a display screen of a display means.

Therefore, it is possible to compare the wafer map data having different wafer directions for each wafer measuring apparatus in the same direction, so that the comparison time of the wafer map data between the wafers is longer than the time required for the user to perform the visual comparison. It is possible to significantly reduce the time, efficiently perform the good / bad judgment processing of the IC formed on the wafer, and improve the work efficiency of the user.

According to a fourth aspect of the present invention, there is provided a wafer map display for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means. A method of specifying a display range of an X coordinate and a display coordinate range of a Y coordinate when displaying the wafer map data, and according to the specified display coordinate ranges of the X coordinate and the Y coordinate, Displaying the wafer map data on a display screen.

According to the present invention, the wafer map data obtained by measuring the plurality of IC chips formed on the wafer by the IC tester is displayed on the display screen set on the display means. In the wafer map display method, a step of designating a display range of an X coordinate and a display coordinate range of a Y coordinate when displaying the wafer map data, and according to the designated display coordinate range of the X coordinate and the Y coordinate, Displaying the wafer map data on a display screen of a display means.

Therefore, the display range of the X-axis and the Y-axis can be arbitrarily specified by the user, and a wafer map display method for displaying the wafer map data desired by the user on the screen can be provided.

According to a fifth aspect of the present invention, there is provided a wafer map display for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means. Storing a position of a coordinate axis that is a reference when displaying the wafer map data; and changing a position of a target coordinate axis based on the stored position of the coordinate axis. Generating a display coordinate by returning the position of the coordinate axis to the position of the original display coordinate axis; and displaying the wafer map data on a display screen of the display unit according to the generated display coordinate. It is characterized by.

According to the present invention, the wafer map data obtained by measuring a plurality of IC chips formed on the wafer by the IC tester is displayed on the display screen set on the display means. In the wafer map display method, a step of storing a position of a coordinate axis serving as a reference when displaying the wafer map data, and a step of changing a position of a target coordinate axis based on the stored position of the coordinate axis; A step of generating display coordinates by returning the position of the changed coordinate axis to the position of the original display coordinate axis, and displaying the wafer map data on a display screen of the display means according to the generated display coordinates; Having.

Therefore, it is possible to compare the wafer map data in which the wafer directions are different for each wafer measuring apparatus in the same direction, so that the comparison time of the wafer map data between the wafers is longer than the time required for the user to perform the visual comparison. It is possible to provide a wafer map display method that can significantly reduce the time, efficiently perform the good / bad judgment processing of the IC formed on the wafer, and improve the work efficiency of the user.

According to a sixth aspect of the present invention, there is provided a wafer map display for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means. A storage medium storing a control program, the program code for specifying a display coordinate range of an X coordinate and a display coordinate range of a Y coordinate when displaying the wafer map data, and the designated X coordinate and Y coordinate. And a program code for displaying the wafer map data on a display screen of the display means in accordance with each of the display coordinate ranges.

According to the present invention, wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester is displayed on a display screen set on a display means. A storage medium storing a wafer map display control program, the program code for designating a display range of an X coordinate and a display coordinate range of a Y coordinate when displaying the wafer map data, and the designated X coordinate. And each display coordinate range of Y coordinate,
And a program code for displaying the wafer map data on a display screen of the display means.

Accordingly, the display range of the X axis and the Y axis can be arbitrarily specified by the user, and a wafer map display control program for displaying the wafer map data desired by the user on the screen can be provided.

According to a seventh aspect of the present invention, there is provided a wafer map display for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means. A storage medium storing a control program, wherein a program code for storing a position of a coordinate axis serving as a reference when displaying the wafer map data, and a target coordinate axis based on the stored position of the coordinate axis. A program code for changing the position, a program code for returning the changed position of the coordinate axis to the original position of the display coordinate axis to generate the display coordinates, and the display means according to the generated display coordinates. And a program code for displaying the wafer map data in a display screen. Is characterized in that the stored.

According to the present invention, wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester is displayed on a display screen set on a display means. A storage medium storing a wafer map display control program, wherein a program code for storing a position of a coordinate axis serving as a reference when displaying the wafer map data, and an object based on the stored position of the coordinate axis. A program code for changing the position of the coordinate axes, a program code for generating the display coordinates by returning the changed position of the coordinate axes to the position of the original display coordinate axis, and according to the generated display coordinates, A program code for displaying the wafer map data in a display screen of a display means. It stores the program.

Therefore, it is possible to compare the wafer map data having different wafer directions for each wafer measuring apparatus in the same direction, and to make the comparison time longer than the time required for the user to compare the wafer map data between wafers by visual measurement. It is possible to provide a wafer map display control program that can greatly reduce the number of times, efficiently perform good / bad judgment processing of an IC formed on a wafer, and improve the work efficiency of a user.

[0026]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 10 are diagrams showing an embodiment of an IC measurement system to which the present invention is applied.

First, the configuration will be described. FIG. 1 is a block diagram illustrating a main configuration of a control system of the IC measurement system 1 according to the present embodiment. In FIG. 1, an IC measurement system 1 includes an IC tester 10 and a wafer map display device 2.
0.

Referring to FIG. 1, an IC tester 10 has a built-in wafer measuring device 11, which has a function of measuring various operating characteristics of a plurality of ICs formed on a wafer. Various test signals corresponding to the operating conditions are applied to the terminal portion of each IC formed by the measuring probe or the like, and the data indicating the test result of each IC indicates the measurement position of each IC on the wafer. The wafer map data including the coordinate data is transmitted to the wafer map display device 20 via the cable 30.

When a wafer is measured by the wafer measuring apparatus 11, the measurement start position on the wafer is determined. For example, the orientation of the wafer with respect to the orientation flat position is fixed in a predetermined direction. I have. The setting of the direction of the wafer differs depending on the type of the wafer measuring device, and the origin of the coordinate axis for starting the measurement of the IC formed on the wafer differs for each wafer measuring device. For this reason, in the present embodiment,
When performing display processing of wafer map data received from a plurality of wafer measurement devices in the wafer map display device 20, which will be described later, the display coordinates are calculated from the measurement coordinates in consideration of the orientation of the wafer fixed for each wafer measurement device. Is performed.

In FIG. 1, the wafer map display device 20 includes a display control unit 21, an input unit 22, a program storage unit 23, a coordinate position storage unit 24, a target coordinate change unit 25,
It is composed of a coordinate axis initialization unit 26, a data display unit 27, and the like, and each unit is mutually connected by a bus 28.

The display control section 21 allows the user to specify a display range when displaying the wafer map data. The display control section 21 selects each range of the user in the X coordinate range axis selecting section 22a and the Y coordinate range axis selecting section 22b of the input section 22. When each display range of the X axis and the Y axis is selected by the designation operation, the X
A plurality of X and Y display coordinate data relating to each display range of the X and Y axes are stored in a buffer X24a and a buffer Y24b in the coordinate position storage unit 24.
A display screen in which display coordinates are set based on the display coordinate data is displayed on the data display unit 27.

Then, the display control unit 21
Is connected to the wafer measurement device 11 in the IC tester 10 via the IC, and when the wafer map data transmitted from the wafer measurement device 11 is received through the cable 30,
A display control process, which will be described later, is executed, and first, a position (lower left, upper left, lower right, lower right) of a display coordinate axis serving as a reference of a display position is set by the user based on the orientation of the wafer fixed in the wafer measuring apparatus 11. The position of the set display coordinate axis is stored in the buffer A in the coordinate position storage unit 24.
24c, buffer X24a, buffer Y2
4b, first, the X, Y display coordinate data (X, Y) corresponding to the display start position is stored in the buffer B24d in the coordinate position storage unit 24.
After that, an object requiring a coordinate conversion process based on the position of the display coordinate axis stored in the buffer A24c and the setting contents of the coordinate conversion table (see FIG. 2) stored in the coordinate position storage unit 24 in advance. The coordinate axes (only the X axis, only the Y axis, or both the X and Y axes) are checked, and the coordinate conversion processing of the target coordinates of the start coordinates (X, Y) stored in the buffer B24d by checking the target coordinate axes. Is performed by the target coordinate changing unit 25, and the coordinate coordinates storage unit 24 associates the converted coordinates with the corresponding wafer map data array [V].
In the buffer C24e.

Then, the display controller 21 controls the buffer X2
Since the wafer map data is sequentially arranged by a combination of the series of X and Y display coordinates stored in the buffer 4a and the buffer Y24b, the display stored in the buffer B24d based on the series of X and Y coordinates stored in the buffers X24a and Y24b. The coordinates (X, Y) are sequentially updated, and the buffer B2 is updated.
A coordinate position storage unit that causes the target coordinate change unit 25 to perform the coordinate conversion process for each of the display coordinates (X, Y) stored in 4d and associates each of the converted coordinates with each corresponding wafer map data array [V]. Upon completion of the storage processing in the buffer C24e in the buffer 24, all target coordinates for displaying the wafer map data are created based on all the converted coordinates stored in the buffer C24e, and the buffer A
The coordinate axis initialization unit 26 performs a coordinate axis initialization process for returning the position of the display coordinate axis stored in the display coordinate 24c to the original display coordinate axis, and the display screen displayed on the data display unit 27 in accordance with the initialized display coordinate coordinates. Then, each wafer map data received from the wafer measuring device 11 is displayed.

The input unit 22 is composed of a keyboard, a pointing device, and the like, and outputs to the display control unit 21 an input signal corresponding to a key input operation by the user, a position signal by operating the pointing device, and the like. The input unit 22 includes an X-coordinate range axis selection unit 22a and a Y-coordinate range axis selection unit 22b, and allows the user to input each of the X-axis and Y-axis display ranges by performing each range specification operation.

The program storage section 23 stores a display control processing program of the display control processing executed by the display control section 21.

A coordinate position storage unit 24 stores a plurality of X-axis display coordinate data relating to the X-axis display range selected by the X-coordinate range axis selection unit 22a.
And Y selected by the Y coordinate range axis selection unit 22b.
A buffer Y24b for storing a plurality of Y display coordinate data relating to the axis display range, a buffer A24c for storing a position of a measurement coordinate axis set in the display control process,
It has a buffer B24d for storing the display coordinates to be subjected to the coordinate conversion in the display control processing, and a buffer C24e for storing the converted coordinates subjected to the coordinate conversion processing and the wafer map data array [V] in the display control processing in association with each other.

The coordinate position storage unit 24 stores a coordinate conversion table as shown in FIG. 2, and the coordinate conversion table stores the positions of the measurement coordinate axes (lower left, upper left , Lower right, upper right), the conversion contents of the target coordinates requiring the coordinate conversion processing are set.
That is, when the position of the measurement coordinate axis is “lower left”, the X and Y coordinates of the display coordinate are both “as is”, and when the position of the measurement coordinate axis is “upper left”, the X coordinate of the display coordinate is “as is”. The Y coordinate is “× (−1): (−1) multiplied”, and when the position of the measurement coordinate axis is “lower right”, the X coordinate of the display coordinate is “× (−1): (−1)”. When the position of the measurement coordinate axis is “upper right”, both the X and Y coordinates of the display coordinates are “× (−1): (−)”.
1) ".

The target coordinate changing unit 25 is provided with the display control unit 2.
In the display control process executed by the control unit 1, the display coordinates (X, Y) stored in the buffer B 24 d in accordance with an instruction from the display control unit 21 are subjected to a coordinate conversion process according to the setting contents of the coordinate conversion table of FIG. It has a function to do.

The coordinate axis initialization unit 26 is provided with the display control unit 2
In the display control process executed by the control unit 1, a function of executing an initialization process of returning display coordinates created from the transformed coordinates stored in the buffer C24e to the original display coordinate axis position according to an instruction from the display control unit 21 is provided. Have.

The data display unit 27 is a CRT (Cathode Rad).
y Tube), a liquid crystal display panel, and the like. In a display control process performed by the display control unit 21, a display screen in which display coordinates for displaying wafer map data are set according to an instruction from the display control unit 21 is displayed. In addition to the display, the wafer map data input from the display control unit 21 is displayed at the designated display coordinates on the display screen.

Next, the operation of this embodiment will be described.

First, an example in which the wafer map data transmitted from the wafer measuring device 11 is displayed on the data display section 27 of the wafer map display device 20 without specifying the display ranges of the X axis and the Y axis by the user. Is shown in FIG. In the display example of the wafer map data shown in FIG. 3, the display start position coordinates of the wafer map data located at the lower left in the figure with respect to the origin (0, 0) of the display coordinates set on the display screen are ( 20, 20), which indicates that a part of the wafer map data located on the right side of the right end of the display screen is not displayed.

This is because, as described above, the direction of the wafer is fixed in a predetermined direction according to the type of the wafer measuring device, and the coordinate axis for starting the measurement of the IC formed on the wafer for each wafer measuring device is determined. This is because the origins are different.

In order to convert the measured coordinates of the wafer map data into the display coordinates, first, in the wafer map display device 20, the data display unit 27 has the X
Coordinate range axis selector 22a and Y coordinate range axis selector 22b
Is displayed to prompt the user to specify the display coordinate range, and the user specifies the display coordinate range. In response to this display, the display coordinate range is designated by the user, for example, as shown in FIG. , The X-axis display coordinate range is determined by the X-coordinate range axis selection unit 22.
a, X is stored in the buffer X24a in the coordinate position storage unit 24.
Coordinates (30, 31, 32, 33, 34, 35, 36, 3
7, 38, 39, 40) are stored. Similarly, the Y coordinate (20, 21, 22, 23, 24, 2) is stored in the buffer Y 24b in the coordinate position storage unit 24 by the Y coordinate range axis selection unit 22b.
5) is stored.

By specifying the display coordinate range, wafer map data corresponding to the display coordinate range of the wafer map data shown in FIG. 3 is displayed as shown in FIG.
At this time, the wafer map data is displayed by a combination of the X coordinate stored in the buffer X24a and the Y coordinate stored in the buffer Y24b, and the minimum value (30) of the buffer X24a and the buffer Y24b are displayed at the display start position.
Are set and the display is started from the original display start position coordinates (1, 1).

That is, if there is wafer map data corresponding to the position of coordinates (30, 20), it is displayed at the original display start position coordinates (1, 1). If there is no corresponding wafer map data, the next coordinate ( 30, 21) ... (3
0, 25) in the X direction, and coordinates (31, 2).
0)... Wafer map data is displayed until (40, 25). As a result, as shown in FIG. 4, the display range from the coordinate (1) to the coordinate (29) on the X axis and the coordinate (1) to the coordinate (19) on the Y axis is omitted, and is limited to the display coordinate range specified by the user. The displayed wafer map data can be displayed on the data display unit 27.

Next, when the wafer measurement devices A and B have different wafer orientations at the time of measurement, the wafer measurement devices A and B are executed by the wafer map display device 20 to adjust the orientation of the wafers. The display control process of the wafer map data performed will be described below. Before starting the display control process, the display coordinate range is specified by the X coordinate range axis selecting unit 22a and the Y coordinate range axis selecting unit 22b in the input unit 22.
The display coordinate range of the wafer map data to be displayed is determined in advance by the buffer X24a and the buffer Y24 in the coordinate position storage unit 24.
b.

For example, it is assumed that the direction of the wafer measured by the wafer measuring device A is set to ABCD clockwise from the upper left as shown in FIG. Assume that the direction is set to CDAB clockwise from the upper left as shown in FIG. FIG. 7 shows wafer map data displayed on the wafer map display device 20 in the direction of the wafer in FIG. 5, and FIG. 8 shows wafer map data displayed on the wafer map display device 20 in the direction of the wafer in FIG. .

In this case, when the display position of the wafer map data in FIG. 7 is compared with the display position of the wafer map data in FIG. 8, the display coordinates are directed to the Y axis.
When the wafer map data of FIG. 7 is inverted with respect to the Y axis, the coordinates of the display start position are at the lower right, and the direction of the wafer map data shown in FIG. 8, that is, the coordinates of the display start position are the same.

In order to align the display position of the wafer map data of FIG. 7 with the same direction as the wafer map data of FIG. 8, when displaying the wafer map data measured by the wafer measuring device A on the wafer map display device 20, The user sets the coordinate axis for setting the display start position for the Y axis at the lower right. When the X axis is the target, the coordinate axis for setting the display start position is set to the upper left, and when the origin is the target, the coordinate axis for setting the display start position is set to the upper right.

Hereinafter, a display control process executed by the display control unit 21 in the wafer map display device 20 will be described with reference to a flowchart shown in FIG.

In FIG. 9, first, the display control unit 21
A display prompting the user to specify the coordinate axes (lower left, upper left, lower right, upper right) of the display start position and the display start coordinates is displayed on the data display unit 27, and the user specifies the coordinate axes of the display start position and the display start coordinates. Input unit 22 by user
When the display start position and the display start coordinate are designated by the predetermined operation in, the display control unit 21 sets the designated coordinate axes (lower left, upper left, lower right, upper right) in the buffer A 24 c in the coordinate position storage unit 24. (Step S1), and the designated display start coordinates (X, Y) are stored in a buffer B 24d in the coordinate position storage unit 24 (step S2).

However, the display start coordinates (X, Y) stored in the buffer B24d are the display start coordinates included in the display coordinate range set by the combination of the X coordinates and the Y coordinates stored in the buffers X24a and Y24b. Matches.

In order to correct such a deviation between the measured coordinates of the wafer map data and the display coordinates, first, in the wafer map display device 20, a display prompting the user to specify a display coordinate range is displayed on the data display section 27, and the user is prompted to specify the display coordinate range. Specify the display coordinate range.

Next, the display control unit 21 sets "0" to a data array [V] for setting the arrangement order when displaying the wafer map data (step S3), and displays coordinates (X) according to the arrangement order. , Y) is the last (step S4). Here, since the display coordinates (X, Y) are not the last, it is further confirmed whether or not the display coordinates (X, Y) are stored in the buffer B 24d (step S5). By the processing in the above step S2, the buffer B24
Since the display start coordinates (X, Y) are stored in d,
The display start coordinates (X, Y) are subjected to coordinate conversion processing by the target coordinate changing unit 25 based on the setting of the coordinate axes stored in the buffer A24c in the processing of step S1 (step S6).

That is, in order to make the direction of the wafer map data of FIG. 7 the same as the direction of the wafer map data of FIG. 8, its coordinate axis is set to “lower right”. The conversion processing of the XY coordinates when the coordinate axis is set to “lower right” is executed according to the setting contents of the coordinate conversion table shown in FIG. In the coordinate conversion table of FIG. 2, when the setting of the coordinate axis is “lower right”, the coordinate of the X axis is set to “multiply by (−1)” and the coordinate of the Y axis is set to “as is”. Therefore, in this case, the target coordinate changing unit 21 performs a coordinate conversion process of multiplying the X coordinate by (−1).

Therefore, first, the display control section 21 causes the target coordinate changing section 21 to perform a coordinate conversion process on the display start coordinates (X, Y) stored in the buffer B 24 d.
The obtained transformed coordinates (P, Q) are stored in the above step S3.
Is stored in the buffer C24e in the coordinate position storage device 24 in association with the data array [V: 0] set in (step S7). For example, if the display start coordinates are (20, 2)
If 0), the converted coordinates are (−20, 20), and the display position coordinates of the first wafer map data have been obtained.

Next, the display controller 21 sets the buffer X2
In order to sequentially arrange and display the wafer map data by a combination of a series of X and Y display coordinates stored in the buffer 4a and the buffer Y24b, "1" is added to the set value of the data array [V] (step S8), It is confirmed whether or not the display target X coordinate for displaying the wafer map data is stored in the buffer X24a (step S9). When it is confirmed that the display target X coordinate is stored in the buffer X24a, "1" is added to the X coordinate of the display start position to obtain the display coordinate (21, 20) (step S10), and the display coordinate (21, 20) is obtained. In step 20), the storage contents of the buffer B 24d are updated (step S12), and the process returns to step S4.

Then, the display control unit 21 repeats the processing of steps S4 to S10 for all the X coordinates stored in the buffer X24a, so that the X coordinate is fixed at "20" first. The direction coordinate conversion processing is sequentially performed, and the correspondence between the converted coordinates (P, Q) and the data array [V] is sequentially stored in the buffer C24e.

Next, the display controller 21 proceeds to step S9.
When it is confirmed that the display target X coordinate for displaying the next wafer map data is not stored in the buffer X24a, "1" is added to the Y coordinate of the display start position and the display coordinates (21, 21) are displayed. (Step S1
1) The buffer B24d is displayed at the display coordinates (21, 21).
Is updated (step S12), and step S12 is performed.
The process returns to step 4.

Then, the display control section 21 again executes the processing of the above steps S4 to S10 to set the Y coordinate to "2".
1 "and all X stored in the buffer X24a.
By repeating the coordinates again, the Y coordinate "2
The coordinate conversion process in the X coordinate direction is sequentially performed at the position of “1”,
The correspondence between the respective transformed coordinates (P, Q) and the data array [V] is sequentially stored in the buffer C24e.

Next, the display controller 21 repeats the processing of the above-described steps S4 to S12 for all combinations of a series of X and Y coordinates stored in the buffer X24a and the buffer Y24b, as shown in FIG. In the buffer C24e, the correspondence between the transformed coordinates (P, Q) and the data array [V] for all the display coordinates within the display coordinate range specified in the buffer C24e is stored.

Then, the display controller 21 proceeds to step S4
After confirming that the coordinate conversion process has been completed for all combinations of a series of X and Y coordinates stored in the buffer X24a and the buffer Y24b, the process proceeds to step S13, and the wafer is determined based on all the conversion coordinates stored in the buffer C24e. Create all target coordinates for displaying map data.

Next, the display control unit 21 causes the coordinate axis initialization unit 26 to perform a coordinate axis initialization process of returning the position of the display coordinate axis stored in the buffer A 24c to the original display coordinate axis for all the created target coordinates (step S12). S1
4) Display each wafer map data received from the wafer measurement device 11 on the display screen displayed on the data display unit 27 according to the initialized display coordinate coordinates (step S15), and execute the display control process. finish.

By the above display control processing, the display position of the wafer map data by the wafer measurement apparatus A shown in FIG. 7 is changed to the display of the wafer map data by the wafer measurement apparatus B shown in FIG. It will be the same as the position.

As described above, in the wafer measurement system 1 according to the present embodiment, all the wafer map data received from the wafer measurement device 11 are displayed in the data display screen frame set on the data display section 27 of the wafer map display device 20. Is not accommodated, the X coordinate range axis selecting unit 22a and the Y coordinate range axis selecting unit 22b provided in the input unit 22 provide the X coordinate and Y coordinate.
Since the display range of the coordinates can be arbitrarily specified by the user, wafer map data desired by the user can be displayed on the screen.

Further, in the wafer measurement system 1 according to the present embodiment, one lot of wafers is dispersed and measured in a plurality of types of wafer measurement devices, and when the wafer orientation at the time of measurement differs for each wafer measurement device, When each of the wafer map data is displayed on the wafer map display device 20, coordinate conversion processing is performed with the display coordinates as the X-axis target, the Y-axis target, or the origin target, so that the directions of the display positions of the wafer map data match. With this function, it is possible to compare wafer map data with different wafer orientations in the same direction for each wafer measurement device. Can significantly reduce the comparison time, and can efficiently perform the good / bad judgment processing of the IC formed on the wafer. It is possible to improve the work efficiency of over.

[0068]

According to the wafer map display device of the first aspect of the present invention, the display range can be arbitrarily specified by the user, and the wafer map data desired by the user can be displayed on the screen.

According to the wafer map display device of the present invention, the display range of the X axis and the Y axis can be arbitrarily specified by the user, and the desired wafer map data can be displayed on the screen. it can.

According to the wafer map display device of the present invention, it is possible to compare wafer map data having different wafer directions for each wafer measuring device in the same direction, and to compare wafer map data between wafers. The comparison time can be significantly reduced compared to the time when the user makes a visual comparison, and the pass / fail judgment processing of the IC formed on the wafer can be efficiently performed, thereby improving the work efficiency of the user. be able to.

According to the wafer map display method of the present invention, the user can arbitrarily specify the display ranges of the X-axis and the Y-axis, and the wafer map data desired by the user is displayed on the screen. A display method can be provided.

According to the wafer map display method of the present invention, it is possible to compare wafer map data having different wafer directions for each wafer measuring apparatus in the same direction. The comparison time can be significantly reduced compared to the time when the user makes a visual comparison, and the pass / fail judgment processing of the IC formed on the wafer can be efficiently performed, thereby improving the work efficiency of the user. A method for displaying a wafer map can be provided.

According to the storage medium of the invention described in claim 6,
The user can arbitrarily specify the display ranges of the X axis and the Y axis, and it is possible to provide a wafer map display control program for displaying the wafer map data desired by the user on the screen.

According to the storage medium of the invention described in claim 7,
It is possible to compare wafer map data with different wafer directions for each wafer measurement device in the same direction,
The comparison time can be significantly reduced compared to the time when the user compares the wafer map data between wafers by eye measurement.
It is possible to provide a wafer map display control program that can efficiently perform the good / bad judgment processing of the IC formed on the wafer and improve the work efficiency of the user.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a main configuration of a wafer measurement system 1 according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating an example of a coordinate conversion table stored in a coordinate position storage unit 24 in the wafer map display device 20 of FIG.

FIG. 3 is a diagram showing an example of wafer map data transmitted from the wafer measurement apparatus 11 of FIG. 1 and displayed on the data display unit 27 of the wafer map display device 20.

FIG. 4 is a diagram showing a state in which the wafer map data of FIG. 3 is displayed by specifying a display coordinate range.

FIG. 5 is a diagram showing the direction of wafer map data when measured by a wafer measuring device A;

FIG. 6 is a diagram showing the direction of wafer map data when measured by a wafer measuring device B.

FIG. 7 is a diagram showing a state where the wafer map data of FIG. 5 is displayed on a wafer map display device 20;

8 is a diagram showing a state where the wafer map data of FIG. 6 is displayed on a wafer map display device 20. FIG.

FIG. 9 is a flowchart showing a display control process executed by a display control unit 21 in the wafer map display device 20 of FIG.

10 is a diagram illustrating an example of a display coordinate table in which converted display coordinates are set in the order of arrangement of wafer map data by the display control process of FIG. 9;

FIG. 11 is a diagram showing a display example of wafer map data in a conventional wafer map display device.

FIG. 12 is a diagram showing another display example of wafer map data in a conventional wafer map display device.

[Explanation of symbols]

 Reference Signs List 1 IC measurement system 10 IC tester 11 Wafer measurement device 20 Wafer map display device 21 Display control unit 22 Input unit 22a X coordinate range axis selection unit 22b Y coordinate range axis selection unit 23 Program storage unit 24 Coordinate position storage unit 24a Buffer X 24b Buffer Y 24c Buffer A 24d Buffer B 24e Buffer C 25 Target coordinate change unit 26 Coordinate axis initialization unit 27 Data display unit 28 Bus

Claims (7)

[Claims] 1. A wafer map display device for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester, wherein a display coordinate range for displaying the wafer map data is designated. And a display control means for displaying the wafer map data in a display screen of the display means in accordance with the display coordinate range designated by the display range designating means. Display device. 2. An X-coordinate range designating means for designating an X-coordinate display range as the display coordinate range, and a Y-coordinate range designating means for designating a Y-coordinate display range as the display coordinate range. 2. The wafer map display device according to claim 1, further comprising: 3. A wafer map display device for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester, wherein a coordinate axis serving as a reference when displaying the wafer map data is provided. Coordinate axis storage means for storing the position, target coordinate changing means for changing the position of the target coordinate axis based on the position of the coordinate axis stored in the coordinate axis storage means, and the position of the coordinate axis changed by the target coordinate changing means Axis initialization means for returning display to the original display coordinate axis position and generating display coordinates, and display control for displaying the wafer map data on a display screen of the display means in accordance with the display coordinates generated by the coordinate axis initialization means. Means, and a wafer map display device. 4. A wafer map display method for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means, wherein: Specifying a display range of an X coordinate and a display coordinate range of a Y coordinate when displaying data; and displaying the wafer in a display screen of the display means in accordance with the specified display coordinate ranges of the X coordinate and the Y coordinate. Displaying a map data; and a method for displaying a wafer map. 5. A wafer map display method for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means, wherein: A step of storing the position of the reference coordinate axis when displaying data; a step of changing the position of the target coordinate axis based on the stored position of the coordinate axis; and Returning to the position of the display coordinate axis to generate display coordinates; and displaying the wafer map data in a display screen of the display means in accordance with the generated display coordinates. Display method. 6. A memory storing a wafer map display control program for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means. A program code for designating a display range of an X coordinate and a display coordinate range of a Y coordinate when displaying the wafer map data; and a display code range of the designated X coordinate and the Y coordinate. And a program code for displaying the wafer map data in a display screen of the display means. A storage medium storing a wafer map display control program. 7. A storage for storing a wafer map display control program for displaying wafer map data obtained by measuring a plurality of IC chips formed on a wafer by an IC tester on a display screen set on a display means. A program code for storing a position of a coordinate axis serving as a reference when displaying the wafer map data; anda medium for changing a position of a target coordinate axis based on the stored position of the coordinate axis. A program code, a program code for returning the changed position of the coordinate axis to the original position of the display coordinate axis and generating display coordinates, and, in accordance with the generated display coordinates, the wafer in the display screen of the display means. A program code for displaying map data and a wafer map display control program including And the storage medium.