JP2000030536A - Polyamide imide enameled wire having solderability - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyamide imide enameled wire having the capability of maintaining good heat softening resistance and heat deterioration resistance, and further having good solderability as well. SOLUTION: This enameled wire is constituted so that a polyamide imide enamel cover 2 is formed on a conductor 1. In this case, the polyamide imide enamel cover 2 is obtained by applying and baking a polyamide coat obtainable through the reaction of a diisocyanate component made of alicyclic diisocyanate and aromatic diisocyanate, and aliphatic dicaroboxylic acid and polyvalent aromatic carboxylic acid or an anhydride thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a solderable polyamide-imide enameled wire. More specifically, the present invention relates to a polyamide-imide enameled wire that can be soldered without peeling off the polyamide-imide enamel coating layer.

[0002]

2. Description of the Related Art Enameled wires are widely used as magnet wires for coils of electric equipment. In the manufacture of the electric device coil, the enamel wire of the coil terminal is soldered to a connection terminal, an insulated electric wire, or the like.

[0003] Since soldering is a connection between conductors,
Prior to the soldering operation, the enamel film is peeled off from the general enameled wire to expose the conductor.

[0004] On the other hand, a polyurethane enameled wire can be soldered directly on the enamel coating without peeling off the enamel coating. For this reason,
Polyurethane enameled wires are widely used as solderable enameled wires for small-sized applications where it is difficult to mechanically peel off the enamel coating.

On the other hand, in recent years, demands for miniaturization, high performance, high reliability, and the like have been increasing year by year. In response to such demands, heat-resistant enameled wires having solderability have been demanded.

Examples of the heat-resistant enameled wire having solderability include a solderable imide-modified polyurethane enameled wire obtained by introducing an imide bond or the like into a part of a polyurethane resin, and a solderable polyesterimide enameled wire formed by modifying a polyesterimide resin. Etc. have been put to practical use.

[0007]

However, the solderable imide-modified polyurethane enameled wire has a slightly better heat resistance than the polyurethane enameled wire, and is not an enameled wire having essentially excellent heat resistance. It is not sufficient as a heat-resistant enamel wire having stickiness.

[0008] The heat-resistant class defined by JIS is 155 to 180 ° C for the solderable polyesterimide enameled wire.
/ 20,000Hrs, which is good. However, in this solderable polyesterimide enameled wire, when the solderability is improved, the heat softening property and the heat deterioration property deteriorate rapidly, and conversely, when the heat softening property and the heat deterioration property are increased, the solderability deteriorates. The reciprocal properties of the heat-resistant enameled wire having such a property are inadequate.

The present invention has been made in view of such a point, and an object of the present invention is to solve the above-mentioned drawbacks of the prior art, to maintain good heat softening properties and heat deterioration resistance, Another object of the present invention is to provide a polyamideimide enameled wire having good solderability.

[0010]

The gist of the present invention is to provide a polyamide-imide enamel wire comprising a conductor and a polyamide-imide enamel film, wherein the polyamide-imide enamel film comprises an alicyclic diisocyanate and an aromatic diisocyanate. And a polyamide-imide paint obtained by reacting a diisocyanate component consisting of: and an acid component consisting of an aliphatic dicarboxylic acid and a polyvalent aromatic carboxylic acid or an anhydride thereof. A feature is the solderable polyamide-imide enameled wire.

[0011]

Next, an embodiment of a solderable polyamide-imide enameled wire according to the present invention will be described.

In the present invention, examples of the alicyclic diisocyanate include dicyclohexylmethane-4,4'-diisocyanate and isophorone diisocyanate. These may be used alone or as a mixture.

As the aromatic diisocyanate, 4,4'-diphenylmethane diisocyanate,
There are 4'-diphenyl ether diisocyanate, toluene diisocyanate, xylene diisocyanate and the like. These may be used alone or as a mixture.

In the present invention, examples of the aliphatic dicarboxylic acid include succinic acid, adipic acid and pimelic acid. These may be used alone or as a mixture.

The polyvalent aromatic carboxylic acid or anhydride thereof includes divalent aromatic carboxylic acid, trivalent aromatic carboxylic acid or anhydride thereof, and tetravalent aromatic carboxylic acid or anhydride thereof. preferable. Particularly preferred are trimellitic anhydrides of trivalent aromatic carboxylic anhydrides. Examples of the divalent aromatic carboxylic acid include terephthalic acid, and examples of the tetravalent aromatic carboxylic acid anhydride include pyromellitic anhydride.

In the present invention, as the diisocyanate component, 10 to 50 mol% /
Preferably, it comprises 90 to 50 mol% of aromatic diisocyanate. Particularly preferred diisocyanate components are those comprising 10 to 50 mol% of dicyclohexylmethane-4,4'-diisocyanate / 90 to 50 mol% of 4,4'-diphenylmethane diisocyanate.

Here, the reason why the diisocyanate component is 10 to 50 mol% of alicyclic diisocyanate / 90 to 50 mol% of aromatic diisocyanate is that good solderability cannot be obtained if the alicyclic diisocyanate is 10 mol% or less. If it is 50 mol% or more, the heat resistance softening property and the heat deterioration resistance deteriorate.

In the present invention, the acid component preferably comprises 10 to 50 mol% of an aliphatic dicarboxylic acid / 90 to 50 mol% of a polyvalent aromatic carboxylic acid or an anhydride thereof. Particularly preferred acid components include adipic acid 1
0-50mol% / trimellitic anhydride 90-50m
ol%.

Here, the reason why the acid component is 10 to 50 mol% of aliphatic dicarboxylic acid / 90 to 50 mol% of polyvalent aromatic carboxylic acid or its anhydride is that good solderability is obtained when aliphatic dicarboxylic acid is 10 mol% or less. On the other hand, if it is 50 mol% or more, the softening resistance under heat and the deterioration resistance under heat are deteriorated.

[0020]

Next, examples of the solderable polyamide-imide enameled wire of the present invention and comparative examples of the prior art will be described.

Example 1 First, 1 liter of N-methyl-2-pyrrolidone was placed in a four-necked flask equipped with a stirrer and a condenser, and the stirrer was operated.

Next, the following materials were weighed and collected.

Dicyclohexylmethane-4,4′-diisocyanate 20 mol% 4,4′-diphenylmethane diisocyanate 80 mol% adipic acid ……………………………………………………… …… 20 mol% trimellitic anhydride ……………………………………………………………………………………………………………………………………………………………………………………… 80mol% The mixture was stirred and dissolved while being added.

Next, when the dissolution was completed, the temperature in the flask was raised to 140 ° C. over 30 minutes, and the reaction was carried out at 140 ° C. for 1 hour. Then, the temperature of the solution was raised to 160 ° C., and the mixture was reacted at 160 ° C. for 1 hour to obtain a polyamide-imide enamel paint of Example 1.

Next, the polyamide-imide enamel paint of Example 1 was applied to a copper wire having a conductor diameter of 0.3 mm, squeezed and passed through an enamel wire baking furnace. An enameled wire was obtained.

FIG. 1 is a sectional view of the polyamide imide enameled wire of Example 1 thus obtained.

In FIG. 1, 1 is a conductor, and 2 is a polyamideimide enamel coating layer.

Example 2 A polyamideimide enameled wire of Example 2 was obtained in the same manner as in Example 1 except that the materials and reaction conditions were as follows.

[Material] Dicyclohexylmethane-4,4'-diisocyanate: 10 mol% 4,4'-diphenylmethane diisocyanate: 90 mol% Adipic acid: ………………………………… ... 10 mol% trimellitic anhydride 90 mol% [Reaction conditions] Reaction at 140 ° C for 1 hour Reaction at 160 ° C for 8 hours (Example 3) ) A polyamideimide enameled wire of Example 3 was obtained in the same manner as in Example 1 except that the materials and reaction conditions were as follows.

[Material] Dicyclohexylmethane-4,4'-diisocyanate: 30 mol% 4,4'-diphenylmethane diisocyanate: 70 mol% Adipic acid: ........................... 30 mol% trimellitic anhydride 70 mol% [Reaction conditions] Reaction at 140 ° C. for 1 hour Reaction at 160 ° C. for 8 hours (Example 4) ) A polyamideimide enameled wire of Example 4 was obtained in the same manner as in Example 1 except that the materials and reaction conditions were as follows.

[Material] Dicyclohexylmethane-4,4'-diisocyanate: 50 mol% 4,4'-diphenylmethane diisocyanate: 50 mol% Adipic acid: …………………………… 50 mol% trimellitic anhydride 50 mol% [Reaction conditions] Reaction at 140 ° C. for 1 hour Reaction at 160 ° C. for 8 hours (Example 5) ) A polyamideimide enamel wire of Example 5 was obtained in the same manner as in Example 1 except that cyclohexylmethane-4,4'-diisocyanate was changed to isophorone diisocyanate.

Example 5 A polyamideimide enameled wire of Example 6 was obtained in the same manner as in Example 1 except that pimelic acid was used as adipic acid.

Comparative Example 1 First, 1 liter of N-methyl-2-pyrrolidone was placed in a four-necked flask equipped with a stirrer and a condenser, and the stirrer was operated.

Next, the following materials were weighed and collected.

Dicyclohexylmethane-4,4′-diisocyanate 5 mol% 4,4′-diphenylmethane diisocyanate 95 mol% adipic acid ……………………………………………… …… 5mol% trimellitic anhydride ………………………………………………………………………………………………………………………………………………… 95 mol% The mixture was stirred and dissolved while being added.

Next, when the dissolution was completed, the temperature in the flask was raised to 140 ° C. over 30 minutes, and the reaction was carried out at 140 ° C. for 1.5 hours. Then, the liquid temperature was raised to 160 ° C., and the mixture was reacted at 160 ° C. for 1 hour to obtain a polyamideimide enamel paint of Comparative Example 1.

Next, the polyamide-imide enamel paint of Comparative Example 1 was applied onto a copper wire having a conductor diameter of 0.3 mm, squeezed, and then passed through an enamel wire baking furnace. An enameled wire was obtained.

Comparative Example 2 A polyamideimide enameled wire of Comparative Example 2 was obtained in the same manner as in Comparative Example 1, except that the materials and reaction conditions were as follows.

[Material] Dicyclohexylmethane-4,4'-diisocyanate: 60 mol% 4,4'-diphenylmethane diisocyanate: 40 mol% Adipic acid: ............... 60 mol% trimellitic anhydride 40 mol% [Reaction conditions] Reaction at 140 ° C. for 1 hour Reaction at 160 ° C. for 4 hours Reaction at 180 ° C. 4 Time Reaction (Comparative Example 3) A polyamideimide enamel paint HI-406-30 manufactured by Hitachi Chemical Co., Ltd.
It was coated on a 3 mm copper wire, squeezed in a die, and then passed through an enamel wire baking furnace to obtain a polyamideimide enamel wire of Comparative Example 3.

(Comparative Example 4) FS- "2 of a solderable polyesterimide enamel paint manufactured by Dainichi Seika Kogyo Co., Ltd.
Was coated on a copper wire having a conductor diameter of 0.3 mm, squeezed by a die, and then passed through an enamel wire baking furnace to obtain a solderable polyesterimide enamel wire of Comparative Example 4.

(Method for Testing Properties of Enamelled Wire) The obtained enameled wires of Examples and Comparative Examples were subjected to a property test in accordance with JIS-C3003.

(Characteristic test results of enameled wire) Table 1 shows the characteristic test results.

[0043]

[Table 1]

As can be seen from Table 1, the polyamide-imide enameled wire of Comparative Example 1 has an excellent heat-softening temperature of 410 ° C., but has a soldering time of at least 30 seconds when immersed in a 460 ° C. solder bath. Poor.

The polyamide-imide enameled wire of Comparative Example 2 has excellent solderability with a soldering time of 1 second when immersed in a solder bath at 460 ° C., but has the lowest heat-resistant softening temperature of 300 ° C. and the heat degradation. The worst case is 15% of the initial value.

The polyamide-imide enameled wire of Comparative Example 3 has the best heat-softening temperature of 420 ° C., but its soldering time when dipping in a 460 ° C. solder bath is 30 minutes.
Seconds or more, poor solderability.

The solderable polyesterimide enameled wire of Comparative Example 4 has a good solderability with a soldering time of 6 seconds when immersed in a solder bath at 460 ° C., but has a low heat-resistant softening temperature as low as 320 ° C. The initial value of heat resistance is 3
0% is bad.

On the other hand, the polyamide-imide enameled wires of Examples 1 to 6 have heat-resistant softening temperatures of 330 ° C. to 390 ° C.
° C, and the heat deterioration resistance is 35% to 7 of the initial value.
As good as 5%. In addition, the soldering time when immersing the solder bath at 460 ° C. is 10 seconds or less, and the solderability is also good.

[0049]

The polyamide-imide enameled wire of the present invention has good heat-resistant softening temperature and heat-resistant deterioration. In addition, the soldering time at the time of immersion in a solder bath at 460 ° C. is 10 seconds or less, and the solderability is good, which is industrially useful.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a polyamide-imide enameled wire of Example 1 of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductor 2 Polyamide imide enamel film layer

Claims (3)

[Claims] 1. A polyamide-imide enamel wire comprising a conductor and a polyamide-imide enamel film provided thereon, wherein the polyamide-imide enamel film comprises a diisocyanate component comprising an alicyclic diisocyanate and an aromatic diisocyanate; A solderable polyamide-imide enameled wire obtained by applying and baking a polyamide-imide paint obtained by reacting an acid component comprising an aromatic carboxylic acid or an anhydride thereof. 2. A diisocyanate component comprising 10 to 50 mol% of an alicyclic diisocyanate / an aromatic diisocyanate 9
2. The solderable polyamide according to claim 1, wherein the polyamide comprises 0 to 50 mol% and the acid component comprises 10 to 50 mol% of aliphatic dicarboxylic acid / 90 to 50 mol% of polyvalent aromatic carboxylic acid or anhydride thereof. Imido enamel wire. 3. The diisocyanate component is 10 to 50 mol of dicyclohexylmethane-4,4'-diisocyanate.
% / 4,4'-diphenylmethane diisocyanate 90
~ 50 mol% and the acid component is adipic acid 10
-50mol% / trimellitic anhydride 90-50mo
The solderable polyamide-imide enameled wire according to claim 1, comprising 1% by weight.