JPH04100652A - Method for detaching terminal of high heat resistant insulated wire - Google Patents
Method for detaching terminal of high heat resistant insulated wireInfo
- Publication number
- JPH04100652A JPH04100652A JP2215473A JP21547390A JPH04100652A JP H04100652 A JPH04100652 A JP H04100652A JP 2215473 A JP2215473 A JP 2215473A JP 21547390 A JP21547390 A JP 21547390A JP H04100652 A JPH04100652 A JP H04100652A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- insulated wire
- heat resistant
- coating layer
- high heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000010410 layer Substances 0.000 claims abstract description 29
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 17
- 229920001721 polyimide Polymers 0.000 claims abstract description 16
- 239000009719 polyimide resin Substances 0.000 claims abstract description 15
- 239000011247 coating layer Substances 0.000 claims abstract description 8
- 239000002320 enamel (paints) Substances 0.000 claims abstract description 8
- 230000001678 irradiating effect Effects 0.000 claims abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 31
- 238000000576 coating method Methods 0.000 abstract description 31
- 239000011347 resin Substances 0.000 abstract description 19
- 229920005989 resin Polymers 0.000 abstract description 19
- 229920003055 poly(ester-imide) Polymers 0.000 abstract description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 239000004642 Polyimide Substances 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 10
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 239000004962 Polyamide-imide Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 229920002312 polyamide-imide Polymers 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical class OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyhydantoin Polymers 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Wire Processing (AREA)
- Laser Beam Processing (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、高耐熱電気絶縁電線の端末剥離方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for stripping the ends of a highly heat-resistant electrically insulated wire.
［従来の技術およびその課題］
近年、自動車部品や電子・電気機器は、著しく小型化・
高性能化されている。これに伴い、これらの部品や機器
に用いられるモーター・コイル等の電気絶縁電線には、
細径であることおよび高い耐熱性を有することが要求さ
れる。このため、電気絶縁電線の電気絶縁被覆物の耐熱
性の向上が望まれている。しかし、ポリイミド樹脂、ポ
リアミドイミド樹脂等の高耐熱性の材料は価格が高いの
で、製品として得られるコイルの価格が必然的に高くな
る。このため、ポリイミド樹脂やポリアミドイミド樹脂
等を単独被覆してなる絶縁電線と同等の耐熱性および機
械的特性を有し、しかも安価である絶縁電線の開発が進
められた。その結果、上記の要求を満足する絶縁電線と
して導体上に耐熱クラスがＩ Ｅ ＣＰｕｂ １７２に
よる耐熱クラスが１８０℃以上であるポリエステルイミ
ド樹脂等の材料からなるエナメル被覆層とポリイミド系
樹脂からなるエナメル被覆層を上層／下層比が１１５〜
１／１で順次設けてなる複合絶縁構造の絶縁電線が開発
された。[Conventional technology and its issues] In recent years, automobile parts and electronic and electrical equipment have become significantly smaller and smaller.
High performance. Along with this, electrically insulated wires such as motors and coils used in these parts and devices are
It is required to have a small diameter and high heat resistance. Therefore, it is desired to improve the heat resistance of the electrically insulating coating of electrically insulated wires. However, since highly heat-resistant materials such as polyimide resin and polyamide-imide resin are expensive, the price of the coil obtained as a product is inevitably high. For this reason, progress has been made in the development of insulated wires that have heat resistance and mechanical properties comparable to those of insulated wires that are solely coated with polyimide resin, polyamide-imide resin, etc., and that are also inexpensive. As a result, as an insulated wire that satisfies the above requirements, an enamel coating layer made of a material such as polyesterimide resin with a heat resistance class of 180°C or higher according to IE CPub 172 and an enamel coating made of polyimide resin are formed on the conductor. The upper layer/lower layer ratio is 115~
An insulated wire with a composite insulation structure that is sequentially installed in a 1/1 ratio has been developed.
一方、電気絶縁電線は、他の電気機器の端子等に接続す
るために、絶縁電線の端末部の電気絶縁被覆物を剥離し
て半田つけする端末処理がなされるが、従来の絶縁電線
の電気絶縁被覆物の剥離方法としては、■電気絶縁被覆
物の上から直接半田っけを行い電気絶縁被覆物を焼失さ
せる方法、■薬品を用いて電気絶縁被覆物を溶解する方
法、■電気絶縁被覆物を機械的に削りとる方法等か一般
に用いられる。On the other hand, in order to connect electrically insulated wires to the terminals of other electrical equipment, the electrical insulation coating at the terminals of the insulated wires is peeled off and soldered. Methods for removing the insulating coating include: ■ Soldering directly onto the electrically insulating coating and burning it off, ■ Melting the electrically insulating coating using chemicals, and ■ Dissolving the electrically insulating coating using chemicals. Generally used as a method of mechanically scraping something off.
しかしながら、前記■〜■の方法を、上述の如き複合絶
縁構造の高耐熱性電気絶縁電線に適用するとそれぞれ以
下のような問題があった。However, when the above-mentioned methods (1) to (4) are applied to a highly heat-resistant electric insulated wire having a composite insulation structure as described above, the following problems arise.
■の方法では、従来コイルに使用される絶縁電線被覆材
料の耐熱温度は１５０〜１７０℃であり、その場合の半
田っけ温度が４００〜４６０℃であったが、高耐熱性化
に伴い被覆材料の耐熱温度が１８０℃以上に上がること
により被覆材料が焼失し難くくなり４００〜４６０℃で
の半田つけ性が悪化する。In method (2), the heat-resistant temperature of the insulated wire coating material used for the coil was 150 to 170 degrees Celsius, and the soldering temperature in that case was 400 to 460 degrees Celsius. When the allowable temperature limit of the material increases to 180°C or higher, the coating material becomes difficult to burn out and the solderability at 400 to 460°C deteriorates.
■の方法では、高耐熱性化に伴い被覆材料の耐薬品性が
向上するために、非常に長い剥離時間を要する。あるい
は、従来使用している強酸・強アルカリ溶液をさらに高
温に加熱して用いなければならないなど作業者に危険が
伴うと共に被覆を剥離した後に充分な薬品除去処理を施
さないと腐食などの不具合の原因となる。Method (2) requires a very long peeling time because the chemical resistance of the coating material improves as the coating material becomes more heat resistant. Alternatively, the conventionally used strong acid/alkaline solutions must be heated to even higher temperatures, which poses a danger to workers, and may cause problems such as corrosion if adequate chemical removal treatment is not performed after the coating is removed. Cause.
■の方法では、直径１００μｍ以下の極細径の電気絶縁
電線の場合に、機械的に削りとる際に導体への損傷が無
視できず、接合部の信頼性を著しく低下させる。In the case of the method (2), when an electrically insulated wire with a diameter of 100 μm or less is extremely thin, damage to the conductor cannot be ignored when mechanically scraping it off, which significantly reduces the reliability of the joint.
本発明はかかる点に鑑みてなされたものであり、高い耐
熱特性を保持した複合絶縁構造を持つ電気絶縁電線の絶
縁被覆物を充分に剥離でき、しかも電気絶縁被覆物が剥
離された導体か高い信頼性で電気的接合できる高耐熱電
気絶縁電線の端末剥離方法を提供することを目的とする
。The present invention has been made in view of the above points, and it is possible to sufficiently remove the insulation coating of an electrically insulated wire having a composite insulation structure that maintains high heat resistance characteristics, and furthermore, the conductor from which the electrical insulation coating has been peeled off has a high The object of the present invention is to provide a method for peeling off the ends of highly heat-resistant electrically insulated wires that can be electrically connected with reliability.
［課題を解決するための手段］
本発明者らは、下層がポリエステルイミド樹脂、上層が
ポリイミド樹脂である如き複合絶縁構造を持つ高耐熱電
気絶縁電線の電気絶縁被覆物が、特定のレーザを用いる
ことによって容易に剥離でき、よって高い信頼性で半田
つけ処理できることを見出たした。[Means for Solving the Problems] The present inventors have discovered that the electrical insulation coating of a highly heat-resistant electrically insulated wire having a composite insulation structure in which the lower layer is made of polyesterimide resin and the upper layer is made of polyimide resin uses a specific laser. The inventors have discovered that this allows for easy peeling and therefore highly reliable soldering.
すなわち、本発明は、導体上にＩ Ｅ ＣＰｕｂ １７
２による耐熱クラスが１８０℃以上の材料からなるエナ
メル被覆層およびポリイミド系樹脂からなるエナメル被
覆層を順次設けて複合絶縁構造となした高耐熱電気絶縁
電線の端末部分にエキシマレーザを照射することにより
前記端末部分の被覆層を剥離することを特徴とする高耐
熱電気絶縁電線の端末剥離方法である。That is, the present invention provides IE CPub 17 on a conductor.
By irradiating an excimer laser on the end portion of a highly heat-resistant electrically insulated wire that has a composite insulation structure by sequentially providing an enamel coating layer made of a material with a heat resistance class of 180°C or higher according to 2 and an enamel coating layer made of polyimide resin. A method for peeling off an end of a highly heat-resistant electrically insulated wire, characterized by peeling off a coating layer at the end portion.
本発明で絶縁被覆層の剥離に使用するレーザとして特に
エキシマレーザを用いた理由は、炭酸ガスレーザでは、
高耐熱性の被覆物を充分に剥離することができず、半田
つけ性を低下させ、ＹＡＧ（イツトリウム−アルミニウ
ムーガーネット）レーザでは、被覆物の剥離の際に導体
に大きな損傷を与えるのに対して、エキシマレーザが導
体に損傷をほとんど与えず、かつ、効率よく絶縁被覆層
を剥離することができるためである。The reason why an excimer laser was specifically used as a laser for peeling off an insulating coating layer in the present invention is that a carbon dioxide laser
The highly heat-resistant coating cannot be removed sufficiently, reducing solderability, and YAG (yttrium-aluminum-garnet) lasers cause significant damage to the conductor when the coating is removed. This is because the excimer laser causes almost no damage to the conductor and can efficiently peel off the insulating coating layer.
本発明の高耐熱電気絶縁電線の上層の被覆材料には、ポ
リイミド系樹脂を用いる。これは、ポリイミド系樹脂以
外の樹脂では所望の高耐熱性が発揮されないからである
。ポリイミド系樹脂の中で、テトラカルボン酸と、多価
イソシアネートおよび／または多価アミンを合成してな
るポリイミド樹脂か好ましい。このような材料の市販製
品としては、Ｐｙｒｅ−ＭＬ（デュポン社製、商品名）
やＴＶＥ−５０５１（東芝ケミカル社製、商品名）等が
挙げられる。A polyimide resin is used as the covering material for the upper layer of the highly heat-resistant electrically insulated wire of the present invention. This is because resins other than polyimide resins do not exhibit the desired high heat resistance. Among polyimide resins, polyimide resins synthesized from tetracarboxylic acids, polyvalent isocyanates, and/or polyvalent amines are preferred. Commercially available products of such materials include Pyre-ML (manufactured by DuPont, trade name).
and TVE-5051 (manufactured by Toshiba Chemical Co., Ltd., trade name).
また、下層の被覆材料には、Ｉ Ｅ ＣＰｕｂ １７２
による耐熱クラスが１８０℃以上の材料を用いる。In addition, the lower layer coating material is I E CPub 172
Use materials with a heat resistance class of 180°C or higher.
これは、ポリイミド樹脂との複合絶縁構造にて高い耐熱
特性を付与でき、しかもエキシマレーザによって効率よ
く剥離することができるからである。This is because the composite insulating structure with polyimide resin can provide high heat resistance properties and can be efficiently peeled off using an excimer laser.
このような材料として、ポリアミドイミド、ポリヒダン
トイン、ポリエステルイミド、耐熱ポリエステル等の樹
脂が挙げられる。なお、これらの材料の一般的合成法を
以下に示す。Examples of such materials include resins such as polyamideimide, polyhydantoin, polyesterimide, and heat-resistant polyester. In addition, the general synthesis method of these materials is shown below.
ポリアミドイミド樹脂は、トリカルボン酸無水物と、ジ
イソシアネートあるいはジアミンとを反応させることに
より合成される。市販製品としては、Ｈｌ−４０５（日
立化成社製、商品名）等が挙げられる。Polyamideimide resins are synthesized by reacting tricarboxylic acid anhydrides with diisocyanates or diamines. Examples of commercially available products include Hl-405 (manufactured by Hitachi Chemical Co., Ltd., trade name).
ポリヒダントイン樹脂は、ジグリシン誘導体、ジイソシ
アネート、トリカルボン酸無水物、および多価アルコー
ルを反応させることにより合成される。市販製品として
は、ＰＨ−２０（バイエル社製、商品名）等が挙げられ
る。Polyhydantoin resins are synthesized by reacting diglycine derivatives, diisocyanates, tricarboxylic acid anhydrides, and polyhydric alcohols. Examples of commercially available products include PH-20 (manufactured by Bayer AG, trade name).
ポリエステルイミド樹脂は、トリカルボン酸無水物、ジ
イソシアネート、および多価アルコールを反応させるこ
とにより合成される。市販製品としては、ｌｓｏｍｊｄ
ＲＬ （日蝕スケネクタデイ社製、商品名） 、Ｔ
ｅｒｅｂｅｃ ８００ （大日精化社製、商品名）等が
挙げられる。Polyesterimide resin is synthesized by reacting tricarboxylic anhydride, diisocyanate, and polyhydric alcohol. As a commercially available product, lsomjd
RL (manufactured by Solar Eclipse Schenectaday Co., Ltd., product name), T
Examples include erebec 800 (manufactured by Dainichiseika Chemical Co., Ltd., trade name).
耐熱性ポリエステル樹脂は、ジカルボン酸と多価アルコ
ールと多価アルコールの一部量としてトリアリルシアヌ
レートと反応させることにより合成される。市販製品と
しては、１ｓｏｎｅｌ ２００（スケネクタディーケ
ミカル社製、商品名）等が挙げられる。The heat-resistant polyester resin is synthesized by reacting a dicarboxylic acid, a polyhydric alcohol, and a portion of the polyhydric alcohol with triallyl cyanurate. Examples of commercially available products include 1sonel 200 (trade name, manufactured by Schenectady Chemical Company).
本発明でいう高耐熱電気絶縁電線の被覆物の下層の厚み
に対する上層の厚みの比（以下、上層／下層と省略する
）は、１１５〜２／１程度である。The ratio of the thickness of the upper layer to the thickness of the lower layer (hereinafter abbreviated as upper layer/lower layer) of the coating of the highly heat-resistant electric insulated wire in the present invention is about 115 to 2/1.
［作用］
本発明の高耐熱電気絶縁電線の端末剥離方法では、導体
上にＩ Ｅ ＣＰｕｂ １７２による耐熱クラスか１８
０℃以上の樹脂層とポリイミド系樹脂層を順次設けた複
合構造の被覆物を有する高耐熱電気絶縁電線の端末部分
をエキシマレーザを用いて剥離する。[Function] In the method for stripping the end of a highly heat-resistant electrically insulated wire of the present invention, the conductor is coated with heat resistance class 18 according to IE CPub 172.
An excimer laser is used to peel off the end portion of a highly heat-resistant electrically insulated wire having a composite structure coating in which a resin layer at 0° C. or higher and a polyimide resin layer are successively provided.
エキシマレーザによれば、導体に損傷を与えることなく
短時間で被覆物を軟化させ、充分に剥離することができ
る。端末部分の導体上には、ホぼ完全に被覆物が剥離さ
れているので、露出された導体を高い信頼性で半田接合
することができる。According to the excimer laser, the coating can be softened and removed sufficiently in a short time without damaging the conductor. Since the coating is completely removed from the conductor at the terminal end, the exposed conductor can be soldered with high reliability.
［実施例］ 以下、本発明の実施例を具体的に説明する。[Example] Examples of the present invention will be specifically described below.
実施例１
まず、ジフェニルメタンジイソシアネート１モルと、ト
リメリット酸無水物１モルとを反応させることによりポ
リアミドイミド樹脂塗料を調製した。次いで、得られた
ポリアミドイミド樹脂塗料を直径０．１ｍｍの導体上に
塗布焼付した。その後、この導体上にポリイミド樹脂塗
料としてＰｙｒｅＭＬ （デュポン社製、商品名）を上
層／下層−３７７となるように塗布焼付して実施例１の
高耐熱電気絶縁電線（以下、絶縁電線と省略する）を得
た。なお、被覆層の全体の厚みは７μｍであつた。Example 1 First, a polyamide-imide resin paint was prepared by reacting 1 mol of diphenylmethane diisocyanate with 1 mol of trimellitic anhydride. Next, the obtained polyamide-imide resin paint was applied and baked onto a conductor having a diameter of 0.1 mm. Thereafter, PyreML (manufactured by DuPont, trade name) as a polyimide resin paint was applied and baked on the conductor so as to form an upper layer/lower layer -377. ) was obtained. Note that the total thickness of the coating layer was 7 μm.
実施例２
直径０．１１の導体上にポリヒダントイン樹脂塗料であ
るＰＨ−２０（バイエル社製、商品名）を塗布焼付した
。その後、この導体上にジアミノジフェニルメタン１モ
ルと、ピロメリット酸２無水物０．５モルと、ベンゾフ
ェノンテトラカルボン酸２無水物０，５モルとを用いて
合成されたポリイミド樹脂塗料を上層／下層−３／７と
なるように塗布焼付して実施例２の絶縁電線を得た。な
お、被覆層の全体の厚みは７μｍであった。Example 2 A polyhydantoin resin paint, PH-20 (manufactured by Bayer AG, trade name), was applied and baked on a conductor having a diameter of 0.11. Then, on this conductor, a polyimide resin paint synthesized using 1 mole of diaminodiphenylmethane, 0.5 mole of pyromellitic dianhydride, and 0.5 mole of benzophenone tetracarboxylic dianhydride was applied to the upper/lower layer. The insulated wire of Example 2 was obtained by coating and baking to obtain a ratio of 3/7. Note that the total thickness of the coating layer was 7 μm.
実施例３．４
下層の形成にポリアミドイミド樹脂塗料の代りに下記第
１表に示す樹脂塗料を用いた他は、実施例１と同様にし
て実施例３，４の絶縁電線を得た。Example 3.4 Insulated wires of Examples 3 and 4 were obtained in the same manner as in Example 1, except that the resin paint shown in Table 1 below was used instead of the polyamide-imide resin paint to form the lower layer.
なお、下層に用いた樹脂塗料は、実施例３ては、ポリエ
ステルイミド樹脂塗料としてＩｓｏｍｊｄ ＲＬ（日
蝕スケネクタディ社製、商品名）を用い、実施例４では
、耐熱性ポリエステル樹脂塗料としてｌ５ｏｎｅｌ
２００ （スケネクタディーケミカル社製、商品名）を
用いた。As for the resin paint used for the lower layer, in Example 3, Isomjd RL (manufactured by Solar Eclipse Schenectady Co., Ltd., trade name) was used as a polyester imide resin paint, and in Example 4, l5onel was used as a heat-resistant polyester resin paint.
200 (manufactured by Schenectady Chemical Company, trade name) was used.
しかして作製した実施例１−４の高耐熱性絶縁電線の端
末部分にそれぞれエキシマレーザ、炭酸ガスレーザ、Ｙ
ＡＧレーザを照射して端末部分の絶縁被覆物の剥離処理
を行った。このとき、エキシマレーザの照射は、周波数
が１５０Ｈｚ、ショツト数が１５０、炭酸ガスレーザの
照射は、周波数が１０Ｈｚ、ショツト数が５０、ＹＡＧ
レーザの照射は、周波数が１ ｋＨｚ、ショツト数が１
００の条件でそれぞれ行った。剥離後の絶縁電線の端末
部分の被覆物の剥離状態を調べた。剥離状態は、目視に
より判断し、完全剥離の場合を○、剥離せずの場合をＸ
とした。Eximer laser, carbon dioxide laser, Y
AG laser irradiation was performed to remove the insulating coating at the terminal portion. At this time, the excimer laser irradiation has a frequency of 150 Hz, the number of shots is 150, and the carbon dioxide laser irradiation has a frequency of 10 Hz, the number of shots, and YAG.
Laser irradiation has a frequency of 1 kHz and a number of shots of 1.
Each test was carried out under the conditions of 0.00. The state of peeling of the coating at the end of the insulated wire after peeling was investigated. The peeling condition is determined by visual inspection, with ○ for complete peeling and X for no peeling.
And so.
次に、端末の絶縁物層の剥離処理により絶縁電線から露
出された導体の半田つけ性を調べた。半田つけ性は、４
６０℃の溶融半田洛中に導体を数秒間浸漬したときの半
田の濡れ状態を確認することにより判断した。このとき
、半田のりが良好の場合を○、半田のり不良の場合を×
とした。Next, we investigated the solderability of the conductor exposed from the insulated wire by peeling off the insulating layer of the terminal. Solderability is 4
The determination was made by checking the wetting state of the solder when the conductor was immersed in molten solder at 60° C. for several seconds. At this time, if the solder paste is good, ○, if the solder paste is poor, ×
And so.
得られた端末部絶縁被覆物の剥離状態および半田つけ性
の結果を被覆層の構成と共に下記第１表に示す。The results of the peeling state and solderability of the obtained terminal insulating coating are shown in Table 1 below, together with the structure of the coating layer.
第１表から明らかなように、エキシマレーザを用いた場
合は、高耐熱性被覆物剥離性および半田つけ性が良好で
あった。これに対して、エキシマレーザ以外のレーザ（
炭酸ガスレーザ、ＹＡＧレーサ）を用いた場合は、高耐
熱性被覆物剥離性および半田つけ性が悪かった。As is clear from Table 1, when the excimer laser was used, the highly heat-resistant coating had good removability and solderability. In contrast, lasers other than excimer lasers (
When a carbon dioxide laser, a YAG laser) was used, the removability of the highly heat-resistant coating and the solderability were poor.
［発明の効果］
以上説明した如く、本発明の高耐熱電気絶縁電線の端末
剥離方法は、高い耐熱特性を保持した電気絶縁電線の絶
縁被覆物を充分に剥離でき、しかも電気絶縁被覆物か剥
離された導体が高い信頼性で電気的接合できる。[Effects of the Invention] As explained above, the method for stripping the end of a highly heat-resistant electrically insulated wire according to the present invention can sufficiently strip the insulation coating of an electrically insulated wire that maintains high heat resistance characteristics, and also allows the electrical insulation coating to be peeled off. conductors can be electrically connected with high reliability.
手 続 補 正 書 平成 ３年９月、３７日hand Continued Supplementary Positive book Heisei September 3rd, 37th
Claims (1)
０℃以上の材料からなるエナメル被覆層およびポリイミ
ド系樹脂からなるエナメル被覆層を順次設けてなる高耐
熱電気絶縁電線の端末部分にエキシマレーザを照射する
ことにより前記端末部分の被覆層を剥離することを特徴
とする高耐熱電気絶縁電線の端末剥離方法。Heat resistance class 18 according to IEC Pub172 on the conductor
Peeling off the coating layer at the terminal portion by irradiating the terminal portion of a highly heat-resistant electrically insulated wire with an excimer laser, which is formed by sequentially providing an enamel coating layer made of a material with a temperature of 0° C. or higher and an enamel coating layer made of a polyimide resin. A method for stripping terminals of highly heat-resistant electrically insulated wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2215473A JP2871820B2 (en) | 1990-08-15 | 1990-08-15 | Method of peeling off end of high heat resistant insulated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2215473A JP2871820B2 (en) | 1990-08-15 | 1990-08-15 | Method of peeling off end of high heat resistant insulated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04100652A true JPH04100652A (en) | 1992-04-02 |
| JP2871820B2 JP2871820B2 (en) | 1999-03-17 |
Family
ID=16672957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2215473A Expired - Lifetime JP2871820B2 (en) | 1990-08-15 | 1990-08-15 | Method of peeling off end of high heat resistant insulated wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2871820B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5337941A (en) * | 1993-03-31 | 1994-08-16 | The Furukawa Electric Co., Ltd. | Magnet wire having a high heat resistance and a method of removing insulating film covering magnet wire |
| US6000931A (en) * | 1995-05-19 | 1999-12-14 | Matsushita Electric Industrial Co., Ltd. | Gas safety control system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6467679B2 (en) | 2014-09-28 | 2019-02-13 | 三菱マテリアル株式会社 | Insulated wire having a soldered portion and method for producing the insulated wire |
-
1990
- 1990-08-15 JP JP2215473A patent/JP2871820B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5337941A (en) * | 1993-03-31 | 1994-08-16 | The Furukawa Electric Co., Ltd. | Magnet wire having a high heat resistance and a method of removing insulating film covering magnet wire |
| US6000931A (en) * | 1995-05-19 | 1999-12-14 | Matsushita Electric Industrial Co., Ltd. | Gas safety control system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2871820B2 (en) | 1999-03-17 |
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