JPH05211088A - Multiple parallel wire connecting terminal part forming method - Google Patents

Abstract

PURPOSE:To provide a multiple parallel wire connecting terminal part forming method by which the separability of an insulating cover is excellent and highly accurate connection becomes possible. CONSTITUTION:Plural number of insulating electric wires, in which the surfaces of conductors 2b are covered with insulating layers 2a, are arranged in parallel with each other, and desired places of multiple parallel wires 2 whose insulating layers are adhered/fixed to each other and the insulating layers 2a are separated/removed beforehand by using laser beams, and a solder component S is stuck to a part or the whole of the separated parts, and a connecting terminal part can be formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming connecting terminals of multiple parallel wires used for wiring in various coils and equipment.

[0002]

2. Description of the Related Art In recent years, the demand for high-frequency parts and materials has greatly increased as electronic and electric devices have become smaller, lighter and more sophisticated. As one of them, the elongation of the collective electric wire is large, but in particular, the multiple parallel wires formed by arranging a large number of insulated wires in parallel in a plane and adhering each other are space-saving and excellent in high frequency characteristics. Therefore, it has received a great deal of attention.

Under these circumstances, in the conventional multi-parallel wire, an insulating coating layer made of polyurethane and a polyvinyl butyral self-bonding layer is mainly used as the insulating layer of each insulated wire. With the expansion of applications, the heat resistance of the insulation layer is 120 to 155 according to IEC Pub.172.
From ℃ class to 180 ℃ class has become necessary.

On the other hand, when forming a coil or the like by winding this multi-parallel wire or using it as a wiring material, an exposure treatment for peeling the insulating coating at the end or branch of the insulated wire to expose the conductor. Is essential. As a conventional method of peeling the insulating coating of the insulated wire, a method of swelling and peeling the insulating coating of the terminal portion with a chemical, a method of burning out the insulating coating, a method of mechanically scraping the insulating coating, and the like have been studied. It was

[0005]

However, the above-mentioned conventional method of peeling an insulating coating by chemicals or heat burning is as follows.
It has become difficult to peel off a high heat resistant insulating coating of 180 ° C class. On the other hand, since the diameter of the insulated wire is being reduced, it is difficult to mechanically peel the conductor without damaging it.

Further, even if an insulated wire having high heat resistance and capable of being directly soldered is used, there is a problem that the soldering temperature is high, and therefore the reliability of the solder joint cannot be satisfied due to the damage of the conductor. In addition, there are more cases where it is necessary to join multiple parallel lines by ultrasonic welding or pressure bonding to other wiring materials, electrical components or wiring boards, and also to join separated parts of multiple parallel lines to each other. ing. Therefore, in the case of multiple parallel lines, a better peeled state and more accurate joining have been required.

For this reason, recently, as a method capable of improving the drawbacks of the conventional peeling method, a laser peeling method has been attracting attention in which the insulating coating is peeled off by directly irradiating the insulated wire with a laser beam. In the case of the method, since the insulating coating slightly remains on a part of the conductor surface, there is a problem in reliability when used as it is. The present invention has been made in view of the above points, and an object of the present invention is to provide a method for forming a connecting terminal portion of multiple parallel lines, which has excellent peeling property of an insulating coating and can achieve a highly accurate joined state.

[0008]

According to the present invention, in order to achieve the above object, a plurality of insulated wires having conductor surfaces covered with an insulating layer are arranged in parallel and the insulating layers are bonded and fixed to each other. In parallel lines, desired portions of the insulating layer are peeled and removed in advance by using laser light, and a solder component is attached to a part or all of the peeled portions to form connection terminal portions.

According to the method of the present invention, even if a small amount of insulating coating remains on the conductor of the connection terminal portion to be provided on the multiple parallel lines by the laser peeling method, the solder component applied in advance by heating the connection terminal portion. In the case of joining with other wiring materials, electric parts, etc., the residual insulating coating material is completely removed by the heat during joining, and a highly accurate joined state is achieved.

Here, as a material that can be used for the insulating layer of the insulated wire forming the multiple parallel wires, as the lower insulating layer,
Oily enamel, polyurethane, polyvinyl formal,
There are resins such as polyester, polyester imide, polyamide imide, polyhydantoin, polyester amide imide, and polyimide, or a laminated insulating layer in which a plurality of these resins are laminated. Further, as a material for the upper insulating layer which is coated on the lower insulating layer and serves as a fusion bonding layer, there are resins such as polyvinyl butyral, polyester, polyamide, epoxy and melamine, and if the insulated wire is a general insulated wire, Can be used.

As a laser device used for peeling the insulating layer, there are a TEA type carbon dioxide gas laser, an excimer laser and the like. In these laser devices, the energy and the irradiation spot can be set arbitrarily, so that the shape of the connection terminal portion formed by peeling the insulating coating can be freely formed. Further, a solder deposition composition or a solder paste is used for the attachment of the solder component, and the solder deposition composition refers to an organic metal salt of a metal forming the solder alloy, and an ionization tendency in the metal forming the solder alloy. Of the largest metal, and a salt of another metal with a carboxylic acid. On the other hand, the solder paste is Sn,
Any material containing Pb as a main component can be used.

In particular, the solder deposition composition is very effective when the distance between the insulated wires forming the multiple parallel wires is 100 μm or less, and the solder bridge between the wires does not occur. In addition, the insulation layer has low heat resistance.
If it is a material of 5 ° C. or less class, it can be directly soldered to the peeled portion where the insulating coating is peeled off by laser light.

[0013]

EXAMPLES Examples and comparative examples of the present invention will be described below in detail with reference to FIGS. 1 to 4. Example 1 A multi-parallel wire consisting of 100 insulated wires in which a polyurethane resin (heat-resistant temperature 120 ° C.) was coated on the lower insulating layer and a polyvinyl butyral resin was coated on the upper insulating layer on a copper wire having a diameter of 0.1 mm 5 shots of TEA type carbon dioxide gas laser of 5 cm / cm ² , 5 Hz per insulated wire are used, and as shown in FIG. Exposed. Thereafter, a solder deposition composition was applied to the peeled portion and heated to form branching connection terminal portions on the multiple parallel wires 2 in which the solder component S adhered to the conductors 2b of the plurality of insulated wires.

Two multi-parallel lines 2 having such connecting terminals for branching are prepared, the connection terminals are superposed on each other as shown in FIG.
The conductors 2b, 2b of the plurality of insulated wires in 2 were heat-bonded to each other. Table 1 shows the structure of the multiple parallel lines 2 and the peeling conditions of the insulating layer and the like, and Table 2 shows the appearance of the peeled portion and the appearance after soldering.

The insulated wire forming the multiple parallel wires 2 is
It has a two-layer structure of a lower insulating layer and an upper insulating layer, and the number is 100 in this embodiment.
In FIG. 4, for simplification of the drawing, the number of insulating layers is one, and the number of insulated wires is nine. Example 2 On a copper wire having a diameter of 0.3 mm, a polyester imide resin (heat-resistant temperature of 180 ° C.) was used for the lower insulating layer, and an epoxy resin was used for the upper insulating layer. The same TEA carbon dioxide laser used in Example 1 was irradiated from the front surface and the back surface for 20 shots per insulated wire, and an insulating layer having a predetermined length from the end of the multiple parallel wires 4 as shown in FIG. 4a was peeled off to expose a plurality of conductors 4b. After that, a solder paste was applied to the peeled portion and heated to form a connection terminal portion where the solder component S adhered on the conductor 4b at the end portion of the multiple parallel line 4, as shown in FIG.

In this way, two parallel lines 4 having connection terminals formed at the ends are prepared, the connection terminals are superposed, and the solder component S is used to form the conductors 4b, 4 of the parallel lines 4, 4.
b were heat-bonded to each other. Table 1 shows the structure of the multiple parallel lines 4 and peeling conditions of the insulating layer, and Table 2 shows the appearance of the peeled portion and the appearance after solder application. Example 3 An end of a multi-parallel wire consisting of 50 insulated wires in which a polyamide-imide resin (heat-resistant temperature 200 ° C.) is coated on the lower insulating layer and an aromatic polyamide resin is coated on the upper insulating layer on a copper wire having a diameter of 0.1 mm. The exposed area was irradiated with an excimer laser of 1 J / cm ² , 150 Hz from the front and back sides for 150 shots per insulated wire, and the insulating layer was peeled from the ends of the multiple parallel lines. Thereafter, a solder paste was applied to the peeled portion and heated to form a connection terminal portion having a solder component attached thereto at an end portion of the multi-parallel line as in the multi-parallel line 4 of FIG.

Two multi-parallel lines having the connection terminal portions formed at the ends in this manner were prepared, and the connection terminal portions were superposed on each other and the conductors were heat-bonded to each other. The configuration of the multiple parallel lines and the peeling conditions of the insulating layer and the like at this time are shown in Table 1, and the appearance of the peeled portion and the appearance after solder application are shown in Table 2. Comparative Example 1 On a copper wire with a diameter of 0.3 mm, the lower insulation layer was covered with polyesterimide resin (heat-resistant temperature 180 ° C) and the upper insulation layer was coated with epoxy resin. Peel off the insulating layer with a chemical (potassium hydroxide aqueous solution),
Flow solder was applied to the peeled portion. The results are shown in Table 2 as the appearance of the peeled portion and the appearance after solder application.

[0018]

[Table 1]

[0019]

[Table 2]

Comparative Example 2 On a copper wire having a diameter of 0.1 mm, a multi-parallel wire consisting of 50 insulated wires in which a lower insulating layer was coated with polyamide-imide resin (heat-resistant temperature of 200 ° C.) and an upper insulating layer was coated with polyamide resin The insulating layer was mechanically peeled from the end portion using a peeling machine to form a connection terminal portion. In this way, two multi-parallel lines having connection terminals formed at the ends were prepared, and the connection terminals were superposed and a plurality of conductors were joined by ultrasonic welding. The results are shown in Table 2 as the appearance of the peeled portion and the appearance after joining.
It was written side by side.

As is clear from Table 2, since the connecting terminals of the multiple parallel lines formed by the method of the present invention peel off the insulating layer using laser light, the peeled boundary edges are sharp. Thus, it can be seen that the insulated wires can be satisfactorily soldered even if the pitch between the wires is small, and that the terminal processing and branching processing with high reliability can be performed in the connection terminal portion. On the other hand, as is clear from Comparative Examples 1 and 2, when the insulating layer of multiple parallel wires is peeled off by chemicals or machines, the peeling boundary of the insulating layer is unclear in the case of chemical peeling, A solder bridge will be generated. On the other hand, mechanical peeling caused many scratches on the conductor, crushed conductors, and broken wires, and the appearance after joining was also poor. As described above, in the case of the chemical peeling or the mechanical peeling of the comparative example, the peeling state of the insulating layer and the reliability of the bonding at the connection terminal portion are low, and it cannot be used for peeling the insulating layer of multiple parallel lines.

[0022]

As described above, in the method of forming the connecting terminal portion of the multiple parallel lines of the present invention, the insulating layer is peeled off by using the laser beam, so that the peeled boundary edge becomes sharp. Further, since the solder component is adhered to the peeled portion in advance, even if a small amount of insulating coating remains on the peeled portion, it can be completely removed by the heat at the time of joining, and a highly accurate joined state can be achieved. Furthermore, according to the method of the present invention, the pitch between the insulated electric wires can be made small, and good soldering can be performed even if the pitch between the wires is narrow. For this reason, the multi-parallel lines are highly useful as a coil or a wiring material because the connection terminal portion has high reliability and terminal processing and branching processing can be easily performed.

[Brief description of drawings]

FIG. 1 shows an embodiment of the method of the present invention and is a perspective view of a multi-parallel line in which a branching connection terminal portion to which a solder component is attached is formed.

FIG. 2 is a cross-sectional view showing a state in which the connecting terminal portions are overlapped with each other and the conductors are joined together by using the two parallel lines shown in FIG.

FIG. 3 shows another embodiment of the method of the present invention, and is a perspective view of multiple parallel lines in which an insulating layer is peeled off from an end portion.

FIG. 4 is a cross-sectional view showing a connection terminal portion formed by applying solder paste to the end portions of the multiple parallel lines in FIG.

[Explanation of symbols]

 2,4 Multiple parallel lines 2a, 4a Insulating layers 2b, 4b Conductor S Solder component

Claims (1)

[Claims] 1. In a multi-parallel wire in which a plurality of insulated electric wires whose conductor surfaces are covered with an insulating layer are arranged in parallel and the insulating layers are bonded and fixed to each other, a desired portion of the insulating layer is peeled off in advance by using a laser beam. A method for forming a connecting terminal portion of multiple parallel lines, characterized in that a solder component is attached to a part or all of the removed and peeled portion to form a connecting terminal portion.