JP2000017435A5 - - Google Patents

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Publication number
JP2000017435A5
JP2000017435A5 JP1998188419A JP18841998A JP2000017435A5 JP 2000017435 A5 JP2000017435 A5 JP 2000017435A5 JP 1998188419 A JP1998188419 A JP 1998188419A JP 18841998 A JP18841998 A JP 18841998A JP 2000017435 A5 JP2000017435 A5 JP 2000017435A5
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JP
Japan
Prior art keywords
magnet
substrate
target
magnetron
disposed
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JP1998188419A
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English (en)
Japanese (ja)
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JP2000017435A (ja
JP4056132B2 (ja
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Priority to JP18841998A priority Critical patent/JP4056132B2/ja
Priority claimed from JP18841998A external-priority patent/JP4056132B2/ja
Publication of JP2000017435A publication Critical patent/JP2000017435A/ja
Publication of JP2000017435A5 publication Critical patent/JP2000017435A5/ja
Application granted granted Critical
Publication of JP4056132B2 publication Critical patent/JP4056132B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP18841998A 1998-07-03 1998-07-03 マグネトロンスパッタ方法及び装置 Expired - Fee Related JP4056132B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18841998A JP4056132B2 (ja) 1998-07-03 1998-07-03 マグネトロンスパッタ方法及び装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18841998A JP4056132B2 (ja) 1998-07-03 1998-07-03 マグネトロンスパッタ方法及び装置

Publications (3)

Publication Number Publication Date
JP2000017435A JP2000017435A (ja) 2000-01-18
JP2000017435A5 true JP2000017435A5 (cg-RX-API-DMAC10.html) 2005-10-20
JP4056132B2 JP4056132B2 (ja) 2008-03-05

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP18841998A Expired - Fee Related JP4056132B2 (ja) 1998-07-03 1998-07-03 マグネトロンスパッタ方法及び装置

Country Status (1)

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JP (1) JP4056132B2 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011086390A (ja) * 2009-10-13 2011-04-28 Kawamura Sangyo Kk プラズマ処理装置
US11476099B2 (en) * 2018-02-13 2022-10-18 Evatec Ag Methods of and apparatus for magnetron sputtering
GB201815216D0 (en) * 2018-09-18 2018-10-31 Spts Technologies Ltd Apparatus and a method of controlling thickness variation in a material layer formed using physical vapour deposition

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