JP2000012659A - Device and method for positioning semiconductor wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a semiconductor wafer and respective members of the positioning device from wearing out, and to prevent ground powder from being produced owing to the contact between the semiconductor wafer and the respective members of the positioning device. SOLUTION: This device is provided with a feed roller 4 which rotates the semiconductor wafer in a specific direction, by coming into contact with the peripheral surface of the semiconductor wafer 1 which has a V-shaped positioning cut 2 formed at the peripheral edge; a positioning roller 12 which is positioned at a distance from the feed roller 4 in the circumferential direction of the semiconductor wafer 1, and positioned in the cut of the semiconductor wafer 1 when the cut of the semiconductor wafer 1 rotated by the feed roller 4 is positioned opposite; and a receiving plate 10 where the semiconductor wafer 1 is mounted when the positioning roller 12 is positioned in the cut. When the positioning roller 12 is positioned in the cut and the semiconductor wafer 1 is mounted on the receiving plate 10, the feed roller 4 is released from being in contact with the peripheral surface of the semiconductor wafer 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor wafer positioning apparatus and a semiconductor wafer positioning method. More specifically, the present invention relates to a technique for preventing abrasion of a semiconductor wafer and each member of a positioning device and preventing generation of shavings due to contact between the semiconductor wafer and each member of a positioning member.

[0002]

2. Description of the Related Art A semiconductor wafer has a small V around its periphery.
There is a so-called V-notch type semiconductor wafer in which a V-shaped notch for positioning is formed.
Notch-type semiconductor wafers are frequently used.

Usually, in a semiconductor manufacturing process, it is necessary to position a semiconductor wafer. In positioning a V-notch type semiconductor wafer, the semiconductor wafer is rotated in the circumferential direction to set the V notch at a predetermined position. To be performed. The positioning of the semiconductor wafer is usually such that a plurality of semiconductor wafers are arranged at equal intervals in the axial direction, and the plurality of semiconductor wafers are simultaneously advanced.

FIGS. 5 to 7 show an example of a conventional positioning device for a V-notch type semiconductor wafer.

The semiconductor wafer a has a thin and substantially disk shape,
A small notch b for positioning, which is called a V notch, is formed on the periphery.

The positioning device c has a first roller d and a second roller e extending in a long and parallel state in one direction, and a positioning roller f positioned between the first roller d and the second roller e. ing.

The diameters of the first roller d and the second roller e are the same, and the first roller d and the second roller e are rotated in opposite directions by a rotary drive mechanism (not shown), that is, the first roller
The roller d of FIG. 6 and FIG.
The rollers e are rotated counterclockwise at equal speed to each other, and this rotation is started or ended simultaneously. The first roller d is formed as a feed roller for rotating the semiconductor wafer a in the circumferential direction.

The positioning roller f is formed to have a considerably smaller diameter than the first roller d and the second roller e, and is positioned parallel to the first roller d and the second roller e. And, it is located closer to the second roller e side. The positioning roller f is rotated by rotating the semiconductor wafers a, a,... In the circumferential direction in contact with the peripheral surfaces of the semiconductor wafers a, a,. Has become.

Are arranged at equal intervals in the axial direction of the first roller d, the second roller e, and the positioning roller f with their main surfaces facing each other. . In the state before the positioning is performed on the semiconductor wafers a, a,..., The peripheral surfaces of the semiconductor wafers a, a,. The second roller e is not in contact with and slightly separated from the second roller e (see FIG. 6).

Thus, the first roller d from the state shown in FIG.
When the semiconductor wafer a is rotated counterclockwise by the rotation of the semiconductor wafer a, the positioning roller f in contact with the peripheral surface of the semiconductor wafer a is rotated with the rotation of the semiconductor wafer a, and the notch b corresponds to the positioning roller f. The positioning roller f is positioned in the notch b at the position (see FIG. 7). When the positioning roller f is positioned in the notch b, the semiconductor wafer a is tilted slightly downward to the right as viewed in FIG.
The peripheral surface slightly to the right of the notch b comes into contact with the second roller e that is rotated in the counterclockwise direction (see FIG. 7).

As described above, when the positioning roller f is positioned in the notch b, the first roller d and the second roller e, whose peripheral surfaces of the semiconductor wafer a are rotated at equal speeds in opposite directions to each other. Because of the contact, the rotation of the semiconductor wafer a is restricted, and the semiconductor wafer a is not rotated in the circumferential direction, thereby positioning the semiconductor wafer a.

Since the semiconductor wafers a, a,... Are simultaneously rotated by the rotation of the first roller d, the positioning operation for all the arranged semiconductor wafers a, a,. Will be done.

Conventional positioning devices for V-notch type semiconductor wafers include those shown in FIGS.

The positioning device g includes a first feed roller h, a second feed roller i, and a positioning member located between the first feed roller h and the second feed roller i. j.

A first feed roller h and a second feed roller i
Of the first feed roller h and the second feed roller h
9 is driven by a rotation drive mechanism (not shown) in FIG.
10, and rotated in a clockwise direction as viewed in FIG.

The positioning member j is movable in the vertical direction, protrudes upward, and has a first feed roller h.
And the second feed roller i is formed to be long in the axial direction, and the upper end portion is formed in a tapered shape. The positioning member j is positioned in parallel with the first feed roller h and the second feed roller i, and is located closer to the second feed roller i.

The semiconductor wafers a, a,... Are arranged at equal intervals in the axial direction of the first feed roller h and the second feed roller i with their main surfaces facing each other.
Then, in a state before positioning is performed on the semiconductor wafers a, a,.
The peripheral surfaces of a,... are in contact only with the first feed roller h and the tip of the positioning member j, are not in contact with the second feed roller i, and are slightly separated therefrom (FIG. 9).

When the semiconductor wafer a is rotated in the counterclockwise direction by the rotation of the first feed roller h from the state shown in FIG. 9, the notch b is positioned at the position corresponding to the tip of the positioning member j. The tip of the positioning member j is located in the notch b, and the tip is engaged with the notch b. Notch b
When the tip end of the positioning member j is positioned inside, the semiconductor wafer a is tilted slightly downward to the right as viewed in FIG.
The peripheral surface of the semiconductor wafer a does not come into contact with the second feed roller i (see FIG. 10). When the leading end of the positioning member j is engaged with the notch b, the rotation of the semiconductor wafer a is restricted, and the semiconductor wafer a stops in a state where the peripheral surface thereof is in contact with the rotating first feed roller h. As a result, the semiconductor wafer a is positioned.

Since the semiconductor wafers a, a,... Are simultaneously rotated by the rotation of the first feed roller h, the positioning operation for all the arranged semiconductor wafers a, a,. Will be performed.

In the semiconductor manufacturing process, the notch b
May be located at a position different from the position at which the semiconductor wafer a is engaged with the positioning member j. In this case, the positioning member j is moved downward to release the engagement state with the notch b, and the semiconductor wafer a is moved to FIG. The peripheral surface of the semiconductor wafer a and the second feed roller i are brought into contact with each other by tilting downward to the right as viewed in FIG. As described above, when the positioning member j is moved downward to release the engagement state with the notch b, the first feed roller h and the second feed roller h are rotated in synchronization with the peripheral surface of the semiconductor wafer a. When the semiconductor wafer a is rotated by a desired rotation angle by the rotation of the roller i in a counterclockwise direction, the rotation of the first feed roller h and the second feed roller i is stopped. It can be located at the position.

[0021]

However, in the above-described conventional positioning device c, after the positioning of the semiconductor wafer a, the rotation of the first roller d and the second roller e in opposite directions is performed. After the positioning, the first roller d and the second roller e are in contact with the peripheral surface of the semiconductor wafer a in a slipped state after the positioning.

Therefore, in the positioning device c, the semiconductor wafer a, the first roller d, and the second roller e are worn or shavings are generated due to the contact in the slip state. The problem has arisen.

Also, in the conventional positioning device g,
Before the positioning of the semiconductor wafer a, the peripheral surface of the rotated semiconductor wafer a and the tip of the positioning member j are in sliding contact with each other until the positioning is performed, and the first feed roller h is moved after the positioning. It is in contact with the peripheral surface of the semiconductor wafer a in a slipped state.

Therefore, in the positioning device g, the sliding contact between the semiconductor wafer a and the tip of the positioning member j and the first
Problem that the semiconductor wafer a, the first feed roller h, and the positioning member j are worn out or shavings are generated due to the contact of the feed roller h with the peripheral surface of the semiconductor wafer a in a slip state. Has occurred.

Further, in the processing step of the semiconductor wafer a, the peripheral surface of the semiconductor wafer a forming the notch b may be roughened. In this case, the engagement state of the tip of the positioning member j with the notch b is not good. The peripheral surface of the semiconductor wafer a and the first feed roller h in contact therewith.
The engagement state of the positioning member j with the notch b is released by the frictional force between the semiconductor wafer a and the semiconductor wafer a may be rotated by the rotation of the first feed roller h.

Therefore, the semiconductor wafer positioning device and the semiconductor wafer positioning method of the present invention prevent the wear of each member of the semiconductor wafer and the positioning device and the generation of shavings due to the contact between the semiconductor wafer and each member of the positioning member. The task is to prevent it.

[0027]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a semiconductor wafer positioning apparatus according to the present invention provides a semiconductor wafer in contact with a peripheral surface of a semiconductor wafer having a V-shaped positioning notch formed in a peripheral edge thereof. A feed roller that rotates the wafer in a predetermined direction, and is rotated with the rotation of the feed roller of the semiconductor wafer in contact with the peripheral surface of the semiconductor wafer while being separated from the feed roller in the circumferential direction of the semiconductor wafer, A positioning roller positioned in the notch when the notch of the semiconductor wafer rotated by the feed roller is correspondingly positioned, and a receiving plate on which the semiconductor wafer is mounted when the positioning roller is positioned in the notch And the feed roller and the peripheral surface of the semiconductor wafer when the positioning roller is positioned in the notch and the semiconductor wafer is placed on the receiving plate. In which contact is to be released.

In order to solve the above-mentioned problems, the method for positioning a semiconductor wafer according to the present invention is characterized in that a V-shaped notch for positioning is formed on a peripheral edge of the semiconductor wafer so as to be spaced apart from a feed roller in a circumferential direction. The positioning roller, which is in contact with the peripheral surface of the semiconductor wafer and is rotated with the rotation of the semiconductor wafer by the feed roller, is positioned in the notch, and the semiconductor wafer is placed on the receiving plate when the positioning roller is positioned in the notch. When the positioning roller is positioned in the notch and the semiconductor wafer is mounted on the receiving plate, the contact between the feed roller and the peripheral surface of the semiconductor wafer is released at the same time.

Therefore, in the semiconductor wafer positioning apparatus and the semiconductor wafer positioning method according to the present invention, before positioning the semiconductor wafer, each member of the positioning apparatus may be in sliding contact with the peripheral surface of the semiconductor wafer. In addition, after the positioning of the semiconductor wafer, the peripheral surface of the semiconductor wafer in a state in which the rotation is stopped does not come into contact with the rotating feed roller.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the semiconductor wafer positioning apparatus and the semiconductor wafer positioning method according to the present invention will be described below with reference to the accompanying drawings.

Each of the semiconductor wafers 1, 1,... Has a thin disk shape and is formed by, for example, slicing a columnar silicon crystal body in a direction perpendicular to the axial direction. A small V-shaped notch 2, 2,... For positioning, called a V notch, is formed.

The positioning device 3 includes a first feed roller 4 and a second feed roller 5 which extend in a state of being long and parallel in one direction, and a positioning member located between the first feed roller 4 and the second feed roller 5. 6 is provided.

First feed roller 4 and second feed roller 5
Have the same diameter, are spaced apart left and right as viewed in FIGS. 2 to 4, and are rotated in a clockwise direction as viewed in FIGS. 2 to 4 by a rotation driving mechanism (not shown). ing.

The positioning member 6 is movable in the vertical direction, and is formed to be long in the axial direction of the first feed roller 4 and the second feed roller 5. The positioning member 6 includes a base 7, two mounting portions 8 and 9, a receiving plate 10, a roller supporting portion 11, and a positioning roller 12, and is parallel to the first feed roller 4 and the second feed roller 5. And the second
Is slightly shifted toward the feed roller 5 side.

The base 7 has a U-shape that is open upward when viewed in cross-sectional shape, and protrudes upward from both the left and right ends of the base 7a and the base 7a in FIGS. Projection 7b,
7b are integrally formed.

A mounting portion 8 is provided on the outer surface of the left protruding portion 7b in FIGS. 2 to 4, and the upper end of the mounting portion 8 is located above the upper end of the protruding portion 7b. A receiving plate 10 is attached to an upper end portion of the mounting portion 8.
.. Are formed as receiving surfaces on which the semiconductor wafers 1, 1,... Are positioned.

A mounting portion 9 is provided on the outer surface of the right projection 7b in FIGS. 2 to 4, and the upper end of the mounting portion 9 is located above the upper end of the projection 7b. A roller support 11 is attached to an upper end of the mounting portion 9, and a positioning roller 12 is rotatably supported on the upper end of the roller support 11.

The positioning roller 12 is provided on the receiving surface 10 of the receiving portion 10.
The first feed roller 4 and the second feed roller 5 have a diameter that is slightly smaller than that of the first feed roller 4 and the second feed roller 5. The height of the positioning roller 12 at the upper moving end is the same as or slightly higher than the upper end of the second feed roller 5 located immediately to the right in FIGS. 2 and 3. I have. Further, as described later, the positioning roller 12 includes the semiconductor wafers 1, 1,.
Are rotated by rotating the semiconductor wafers 1, 1,... In the circumferential direction in contact with the peripheral surface of.

The semiconductor wafers 1, 1,... Are arranged at equal intervals in the axial direction of the first feed roller 4, the second feed roller 5, and the positioning roller 12 with their main surfaces facing each other. ing. And the semiconductor wafer 1,
In the state before positioning is performed for the first,..., The positioning member 6 is located at the upper moving end, and the peripheral surfaces of the semiconductor wafers 1, 1,. 2 and only contact the positioning roller 12 (FIG. 2).
reference). At this time, the semiconductor wafers 1, 1,.
The peripheral surface and the receiving surface 10a are close to each other (see FIG. 2).

When the semiconductor wafer 1 is rotated counterclockwise by the rotation of the first feed roller 4 from the state shown in FIG. 2, the positioning roller 12 in contact with the peripheral surface of the semiconductor wafer 1 When the notch 2 is rotated in accordance with the rotation of 1 and the notch 2 is positioned corresponding to the positioning roller 12, the positioning roller 12 is positioned in the notch 2 (see FIG. 3).

By positioning the positioning roller 12 in the notch 2, the semiconductor wafer 1 is tilted slightly downward to the right as viewed in FIG. 2 by the depth of the notch 2, and the peripheral surface of the semiconductor wafer 1 is close. It comes into contact with the receiving surface 10 a of the positioning member 6 and is separated from the first feed roller 4.

As described above, the semiconductor wafer 1 has the first peripheral surface.
When the semiconductor wafer 1 is separated from the feed roller 4, the rotation is stopped, and the semiconductor wafer 1 is positioned.

Since the semiconductor wafers 1, 1,... Are simultaneously rotated by the rotation of the first feed roller 4, the positioning operation for all the arranged semiconductor wafers 1, 1,. Will be performed.

In the semiconductor manufacturing process, the semiconductor wafer 1 is positioned at the position where the positioning roller 12 is positioned inside the notch 2 as described above, and then the semiconductor wafer 1 is released by releasing the positioned state. In some cases, the notch 2 may be positioned at another position by rotating in the circumferential direction. In this case, the positioning member 6 is moved downward (see FIG. 4).

When the positioning member 6 is moved downward, the semiconductor wafer 1 is moved downward by its own weight, and its peripheral surface comes into contact with the first feed roller 4 and the second feed roller 5. When the peripheral surface of the semiconductor wafer 1 contacts the first feed roller 4 and the second feed roller 5, the first feed roller is rotated in a clockwise direction as viewed in FIG. 4 is rotated counterclockwise by the rotation of the second feed roller 5 and the first feed roller 4 and the second feed roller 5 are stopped when the semiconductor wafer 1 is rotated by a desired rotation angle. By doing so, the notch 2 can be located at a desired position.

As described above, in the positioning device 3, before the positioning of the semiconductor wafer 1, each part of the positioning device 3 and the peripheral surface of the semiconductor wafer 1 do not slide. Further, after the positioning of the semiconductor wafer 1, the peripheral surface of the semiconductor wafer 1 in a state where the rotation is stopped may come into contact with the rotating first feed roller 4 and the second feed roller 5. There is no.

Therefore, in the positioning device 3, the wear of the semiconductor wafer 1 and the respective portions of the positioning device 3 can be minimized, and the semiconductor wafer 1 and the respective portions of the positioning device 3 are less likely to be chipped. Generation of powder can be suppressed.

It should be noted that the shapes and structures of the respective parts shown in the above-described embodiments are merely examples of the embodiment of the present invention, and the technical scope of the present invention is not limited thereto. Should not be interpreted restrictively.

[0049]

As is apparent from the above description, the semiconductor wafer positioning apparatus of the present invention has a V
A semiconductor wafer positioning device for rotating a semiconductor wafer having a U-shaped positioning notch formed in the circumferential direction to perform positioning in the circumferential direction of the semiconductor wafer, the semiconductor wafer being in contact with the peripheral surface of the semiconductor wafer. A feed roller that rotates the feed roller in a predetermined direction, and is rotated with the rotation of the feed roller of the semiconductor wafer in contact with the circumferential surface of the semiconductor wafer while being separated from the feed roller in the circumferential direction of the semiconductor wafer, A positioning roller positioned in the notch when the notch of the semiconductor wafer rotated by the roller is correspondingly positioned, and a receiving plate on which the semiconductor wafer is mounted when the positioning roller is positioned in the notch. When the positioning roller is positioned in the notch and the semiconductor wafer is placed on the receiving plate, Wherein the contact between the peripheral surface of the wafer was set to be released.

Therefore, the wear of each part of the semiconductor wafer and the positioning device can be minimized, and the semiconductor wafer and each part of the positioning device are hardly shaved and the generation of shavings can be suppressed.

The method of positioning a semiconductor wafer according to the present invention comprises the steps of: rotating a semiconductor wafer having a V-shaped notch formed in the periphery thereof in the circumferential direction to position the semiconductor wafer in the circumferential direction; The method of positioning, wherein the semiconductor wafer is rotated in a predetermined direction by a feed roller that rotates the semiconductor wafer in contact with the peripheral surface of the semiconductor wafer, and the semiconductor is positioned at a distance from the feed roller in the circumferential direction of the semiconductor wafer and Positioning the positioning roller, which is in contact with the peripheral surface of the wafer and rotated with rotation of the semiconductor wafer by the feed roller, in the notch, and places the semiconductor wafer on the receiving plate when the positioning roller is positioned in the notch. The positioning roller is positioned in the notch and fed simultaneously when the semiconductor wafer is placed on the receiving plate. Wherein the contact between the peripheral surface of the over La and the semiconductor wafer was to be released.

Accordingly, the wear of the semiconductor wafer and the components of the positioning device can be minimized, and the semiconductor wafer and the components of the positioning device are hardly chipped and the generation of shavings can be suppressed.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a semiconductor wafer positioning apparatus and a semiconductor wafer positioning method according to the present invention, together with FIG. 2 to FIG. 4, which is a schematic perspective view showing a positioning apparatus and a semiconductor wafer arranged in the semiconductor wafer positioning apparatus. FIG.

FIG. 2 is a schematic enlarged front view of a main part showing a state before a semiconductor wafer is positioned.

FIG. 3 is a schematic enlarged front view of a main part showing a state where a semiconductor wafer is positioned.

FIG. 4 is a schematic enlarged front view of a main part showing a state where the positioning device is moved downward and the semiconductor wafer is rotated.

FIG. 5 shows a conventional positioning device together with FIGS. 6 and 7, and FIG. 5 is a schematic perspective view showing a positioning device and a semiconductor wafer arranged in the positioning device.

FIG. 6 is a schematic enlarged front view of a main part showing a state before a semiconductor wafer is positioned.

FIG. 7 is a schematic enlarged front view of a main part showing a state where the semiconductor wafer is positioned.

8 shows another conventional positioning device together with FIGS. 9 and 10, which is a schematic perspective view showing a positioning device and a semiconductor wafer arranged on the positioning device. FIG.

FIG. 9 is a schematic enlarged front view of a main part showing a state before a semiconductor wafer is positioned.

FIG. 10 is a schematic enlarged front view of a main part showing a state where the semiconductor wafer is positioned.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor wafer, 2 ... Notch, 3 ... Positioning device, 4
... First feed roller, 10 ... Receiving plate, 12 ... Positioning roller

[Procedure amendment]

[Submission date] April 19, 1999 (1999.4.1
9)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

The present invention relates to a semiconductor wafer positioning apparatus and a semiconductor wafer positioning method. Specifically, the semiconductor wafer after positioning and the feed row
Prevention of wear and position due to contact in slip condition with
The present invention relates to a technique for preventing generation of shavings due to sliding contact between a pre-determined semiconductor wafer and the tip of a positioning member .

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction contents]

[0026] Therefore, a method of positioning the positioning device and semiconductor wafer of the present invention a semiconductor wafer after positioning
Contact between semiconductor wafer and feed roller in slip condition
Prevention of wear due to touch and semiconductor wafer before positioning
It is an object to prevent generation of shavings due to sliding contact with a tip of a positioning member .

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0027

[Correction method] Change

[Correction contents]

[0027]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, a semiconductor wafer positioning apparatus according to the present invention provides a semiconductor wafer in contact with a peripheral surface of a semiconductor wafer having a V-shaped positioning notch formed in a peripheral edge thereof. A feed roller that rotates the wafer in a predetermined direction, and is rotated with the rotation of the feed roller of the semiconductor wafer in contact with the peripheral surface of the semiconductor wafer while being separated from the feed roller in the circumferential direction of the semiconductor wafer, A small-diameter positioning roller positioned in the notch when the notch of the semiconductor wafer rotated by the feed roller is correspondingly positioned; and a semiconductor for the depth of the notch when the positioning roller is positioned in the notch. C
A receiving plate on which the semiconductor wafer is placed by lowering the wafer is provided, and when the positioning roller is positioned in the notch and the semiconductor wafer is placed on the receiving plate, contact between the feed roller and the peripheral surface of the semiconductor wafer is made. Is canceled.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0028

[Correction method] Change

[Correction contents]

In order to solve the above-mentioned problems, the method for positioning a semiconductor wafer according to the present invention is characterized in that a V-shaped notch for positioning is formed on a peripheral edge of the semiconductor wafer so as to be spaced apart from a feed roller in a circumferential direction. And a positioning roller having a small diameter, which is in contact with the peripheral surface of the semiconductor wafer and is rotated with rotation of the semiconductor wafer by the feed roller, is positioned in the notch, and the depth of the notch is determined when the positioning roller is positioned in the notch. Semiconductor wafers
Accordingly, the semiconductor wafer is placed on the receiving plate, and the contact between the feed roller and the peripheral surface of the semiconductor wafer is simultaneously released when the positioning roller is positioned in the notch and the semiconductor wafer is placed on the receiving plate. It was made.

[Procedure amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0029

[Correction method] Change

[Correction contents]

Therefore, in the semiconductor wafer positioning apparatus and the semiconductor wafer positioning method of the present invention, before the positioning of the semiconductor wafer, the positioning member is not used.
There is no such that the tip and the peripheral surface of the semiconductor wafer are in sliding contact, and after the positioning of the semiconductor wafer,
The peripheral surface of the semiconductor wafer whose rotation has been stopped and the rotating feed roller do not come into contact with each other while slipping .

[Procedure amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0049

[Correction method] Change

[Correction contents]

[0049]

As is apparent from the above description, the semiconductor wafer positioning apparatus of the present invention has a V
A semiconductor wafer positioning device for rotating a semiconductor wafer having a U-shaped positioning notch formed in the circumferential direction to perform positioning in the circumferential direction of the semiconductor wafer, the semiconductor wafer being in contact with the peripheral surface of the semiconductor wafer. A feed roller that rotates the feed roller in a predetermined direction, and is rotated with the rotation of the feed roller of the semiconductor wafer in contact with the circumferential surface of the semiconductor wafer while being separated from the feed roller in the circumferential direction of the semiconductor wafer, A small-diameter positioning roller positioned in the notch when the notch of the semiconductor wafer rotated by the roller is correspondingly positioned; and a notch when the positioning roller is positioned in the notch.
A receiving plate on which the semiconductor wafer is placed by lowering the semiconductor wafer by the depth, and a feed roller and a semiconductor wafer when the positioning roller is positioned in the notch and the semiconductor wafer is placed on the receiving plate. The contact with the peripheral surface is released.

[Procedure amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0050

[Correction method] Change

[Correction contents]

Therefore, the semiconductor wafer after the positioning is transferred.
Minimizes wear caused by contact with slip rollers
Of the semiconductor wafer before positioning.
The generation of shavings due to the sliding contact between the c and the tip of the positioning member can be suppressed.

[Procedure amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0051

[Correction method] Change

[Correction contents]

The method of positioning a semiconductor wafer according to the present invention comprises the steps of: rotating a semiconductor wafer having a V-shaped notch formed in the periphery thereof in the circumferential direction to position the semiconductor wafer in the circumferential direction; The method of positioning, wherein the semiconductor wafer is rotated in a predetermined direction by a feed roller that rotates the semiconductor wafer in contact with the peripheral surface of the semiconductor wafer, and the semiconductor is positioned at a distance from the feed roller in the circumferential direction of the semiconductor wafer and Position the small-diameter positioning roller in contact with the peripheral surface of the wafer and rotated with the rotation of the semiconductor wafer by the feed roller, and when the positioning roller is positioned in the notch, the semiconductor wafer by the depth of the notch. To go down
Accordingly, the semiconductor wafer is placed on the receiving plate, and the contact between the feed roller and the peripheral surface of the semiconductor wafer is simultaneously released when the positioning roller is positioned in the notch and the semiconductor wafer is placed on the receiving plate. It is characterized by the following.

[Procedure amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0052

[Correction method] Change

[Correction contents]

Therefore, the semiconductor wafer after the positioning is transferred.
Minimizes wear caused by contact with slip rollers
Of the semiconductor wafer before positioning.
The generation of shavings due to the sliding contact between the c and the tip of the positioning member can be suppressed.

[Procedure amendment 11]

[Document name to be amended] Statement

[Correction target item name] Explanation of sign

[Correction method] Change

[Correction contents]

[Description of Signs] 1 ... Semiconductor wafer, 2 ... Notch, 3 ... Positioning device, 4
... First feed roller (feed roller), 10.
… Positioning rollers

Claims (2)

[Claims] 1. A semiconductor wafer positioning apparatus for positioning a semiconductor wafer in a circumferential direction by rotating the semiconductor wafer having a V-shaped notch for positioning at a periphery thereof in the circumferential direction, comprising: A feed roller that contacts the peripheral surface of the semiconductor wafer and rotates the semiconductor wafer in a predetermined direction; and a feed roller that is positioned apart from the feed roller in the peripheral direction of the semiconductor wafer and that contacts the peripheral surface of the semiconductor wafer. Rotated with the rotation,
A positioning roller positioned in the notch when the notch of the semiconductor wafer rotated by the feed roller is correspondingly positioned, and a receiving plate on which the semiconductor wafer is mounted when the positioning roller is positioned in the notch A semiconductor wafer, wherein when the positioning roller is positioned within the notch and the semiconductor wafer is placed on the receiving plate, the contact between the feed roller and the peripheral surface of the semiconductor wafer is released. Positioning device. 2. A semiconductor wafer positioning method comprising: rotating a semiconductor wafer having a V-shaped notch for positioning at a periphery thereof in the circumferential direction to perform positioning in the circumferential direction of the semiconductor wafer; The semiconductor wafer is rotated in a predetermined direction by a feed roller that rotates the semiconductor wafer in contact with the peripheral surface of the semiconductor wafer. The semiconductor wafer is positioned apart from the feed roller in the circumferential direction of the semiconductor wafer and is in contact with the peripheral surface of the semiconductor wafer. A positioning roller rotated with the rotation of the feed roller is positioned in the notch, and when the positioning roller is positioned in the notch, the semiconductor wafer is placed on the receiving plate, and the positioning roller is positioned in the notch. At the same time as the semiconductor wafer is placed on the receiving plate, the contact between the feed roller and the peripheral surface of the semiconductor wafer is released. The method of positioning a semiconductor wafer, comprising the to be.