JP2000007743A - Resin composition and use thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a compsn. capable of fixing onto a partition wall the good phosphor with no unevenness of the luminance and no lack thereof in manufacturing a phosphor display by compounding a silicon compd., a base polymer, an ethylenically unsatd. compd. and a hydroxy fatty acid. SOLUTION: This resin compsn. comprises 100 pts.wt. of (A) a base polymer, 10-200 pts.wt. of (B) an ethylenically unsatd. compd., 0.5-800 pts.wt., based on the sum total amt. of components A and B, of (C) a silicon compd. of at least such one kind as selected from glass frits, and 0.5-25 pts.wt., based on the sum total amt. of components A and B, of a hydroxy fatty acid. A process for fixing a phosphor onto a partition wall, comprises setting a layer of this resin compsn. on the partition wall of a plasma display panel, then setting a layer contg. the phosphor, pattern-exposing to light, developing and baking. The phosphor-contg. layer is such a resin compsn. layer as contg. the phosphor, base polymer, ethylenically unsatd. compd. and photopolymerization initiator.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition useful for fixing a phosphor in a partition (cell) at the time of manufacturing a phosphor display device such as a plasma display panel (PDP) and the use of the resin composition. And a method for fixing the phosphor.

[0002]

2. Description of the Related Art Recently, various flat panel display panels have been actively developed. Among them, PDPs have attracted attention. From now on, display screens of laptop personal computers will be used to display various electronic bulletin boards and so-called "wall-mounted". Its use is expanding to TV. A phosphor for display is sealed (fixed) in the cell of the display panel of the PDP, and the phosphor emits color by ultraviolet rays generated by the sealing gas in the cell due to an applied voltage. As a method for fixing the phosphor, a liquid photoresist in which phosphors of each color are dispersed has been used, but recently, two layers of a resin composition layer containing the phosphor and another layer have been used. A method has been proposed. For example, a method has been proposed in which a phosphor-containing photosensitive resin layer and a photosensitive thermoplastic resin layer are provided in a partition to form a phosphor pattern (JP-A-9-199027 and JP-A-9-199030). The present applicant has also proposed a pattern forming method using a laminate of an acrylic resin layer and a phosphor-containing photosensitive resin composition layer (Japanese Unexamined Patent Application Publication No.
-69339). On the other hand, there is also a method of forming a phosphor pattern by providing a phosphor-containing photosensitive resin composition layer containing a specific crystalline vinyl polymerizable polymer binder in a partition (JP-A-9-244230). Proposed.

[0003]

However, Japanese Patent Application Laid-Open Nos. Hei 9-199027 and Hei 9-19903 describe the above.
In the technology disclosed in Japanese Patent Publication No. 0, there is a possibility that the ability to follow the embedding of the resin layer into the partition walls may be insufficient, and since the phosphor-containing layer also contains a photosensitive resin, the phosphor accompanying the curing shrinkage during firing may be used. There is a concern about the occurrence of pattern unevenness.
In the technology disclosed in Japanese Patent No. 9339, although unevenness of the phosphor pattern due to curing shrinkage at the time of firing can be suppressed, the composition layer is inferior in embedding in the partition walls, and furthermore, Japanese Patent Application Laid-Open No. 9-244230. For the technology disclosed in Japanese Patent Publication No.
Actually, there remains a problem that unevenness occurs in the phosphor pattern after firing.

[0004]

In view of the above circumstances, the present inventors have conducted intensive studies and have found that the silicon-based compound (a), the base polymer (b), the ethylenically unsaturated compound (c), When the resin composition comprising the fatty acid (d) has excellent storage stability and further fixes the phosphor in the partition (cell) of the plasma display panel,
After the layer (I) of the resin composition and the layer (II) containing the phosphor are provided in the partition (cell) and then baked, a good fixation of the phosphor without unevenness in luminance or loss can be performed. This led to the completion of the present invention.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
The resin composition of the present invention comprises a silicon compound (a), a base polymer (b), an ethylenically unsaturated compound (c) and a hydroxy fatty acid (d). Examples thereof include glass frit, alumina powder, silica powder, magnesium oxide, tin oxide powder, indium tin oxide powder, and the like. Also,
As the base polymer (b), an acrylic resin, a polyester resin, a polyurethane resin, or the like is used.
Of these, (meth) acrylate is the main component,
Acrylic copolymers obtained by copolymerizing ethylenically unsaturated carboxylic acids and other copolymerizable monomers as necessary are important. An acetoacetyl group-containing acrylic copolymer can also be used. Here, as the (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, cyclohexyl (Meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycidyl (meth)
Acrylate and the like are exemplified.

As the ethylenically unsaturated carboxylic acid, monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid are preferably used. In addition, dicarboxylic acids such as maleic acid, fumaric acid and itaconic acid, and their anhydrides are also used. Products and half esters can also be used. Of these, acrylic acid and methacrylic acid are particularly preferred.

[0007] When the resin composition of the present invention is a photosensitive resin composition as described below, it is preferable to use a dilute alkali development type. It is necessary to copolymerize the saturated carboxylic acid at about 15 to 30% by weight (about 100 to 200 mg KOH / g in acid value). Other copolymerizable monomers include:
Examples thereof include acrylamide, methacrylamide, acrylonitrile, methacrylonitrile, styrene, α-methylstyrene, vinyl acetate, and alkyl vinyl ether.

Further, as the ethylenically unsaturated compound (c), ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, polypropylene glycol Di (meth) acrylate, butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, glycerin di (meth) acrylate , Pentaerythritol di (meth) acrylate,
Pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, 2,
2-bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis- (4- (meth) acryloxypolyethoxyphenyl) propane, 2-hydroxy-3- (meth) acryloyloxypropyl ( (Meth) acrylate, ethylene glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, phthalic acid diglycidyl ester di (meth) acrylate, glycerin triacrylate, glycerin polyglycidyl ether poly (meth) acrylate And other polyfunctional monomers.

An appropriate amount of a monofunctional monomer may be used in combination with these polyfunctional monomers. Examples of such a monofunctional monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, -Hydroxybutyl (meth) acrylate, 2-
Phenoxy-2-hydroxypropyl (meth) acrylate, 2- (meth) acryloyloxy-2-hydroxypropyl phthalate, 3-chloro-2-hydroxypropyl (meth) acrylate, glycerin mono (meth)
Acrylate, 2- (meth) acryloyloxyethyl acid phosphate, half (meth) acrylate of a phthalic acid derivative, N-methylol (meth) acrylamide and the like can be mentioned.

Further, as the hydroxy fatty acid (d),
2-oxy-2-methylpentanoic acid, 2-oxy-5
Methylhexanoic acid, 3-oxy-2-methylpentanoic acid, 8-oxytetradecanoic acid, 11-oxytetradecanoic acid, 10-oxyhexadecanoic acid, 11-oxyhexadecanoic acid, 14-oxyhexadecanoic acid, 12-oxidedecanoic acid, 16-oxyhexadecanoic acid, 12-
Oxyoctadecanoic acid, 9-oxyoctadecanoic acid, 2
Examples thereof include 2-oxidecosanoic acid, and preferably, 12-oxyoctadecanoic acid, 8-oxytetradecanoic acid, and 10-oxyhexadecanoic acid are used.

[0011] The resin composition of the present invention comprises the above (a) to
(D), and their content is not particularly limited, but the content of the silicon-based compound (a) is 100 parts by weight in total of the base polymer (b) and the ethylenically unsaturated compound (c). Is preferably 0.5 to 800 parts by weight, more preferably 1 to 500 parts by weight, and if the content is less than 0.5 part by weight, the effect of fixing the phosphor is reduced,
Conversely, if it exceeds 800 parts by weight, the luminance of the phosphor is undesirably reduced, and the ratio of the ethylenically unsaturated compound (c) to 100 parts by weight of the base polymer (b) is 10 to 10%.
It is preferably selected from the range of 200 parts by weight, particularly from 60 to 150 parts by weight, and an insufficient amount of the ethylenic compound (c) causes a decrease in flexibility when the layer (I) of the resin composition described later is used, In addition, when a photosensitive resin composition as described below is used, poor curing or a delay in development speed is caused, and an excessive amount of the ethylenically unsaturated compound (c) causes a cold flow, and a photosensitive resin composition as described below. In the case of using a cured product, the peeling rate of the cured resist is reduced, which is not preferable. Further, the content of the hydroxy fatty acid (d) is preferably 0.5 to 25 parts by weight, more preferably 1 to 100 parts by weight of the total amount of the base polymer (b) and the ethylenically unsaturated compound (c).
If the content is less than 0.5 part by weight, sufficient storage stability cannot be obtained, and if it exceeds 25 parts by weight, the dissolving operation of the fatty acid becomes complicated, which is not preferable.

The resin composition of the present invention further comprises a dye (colored or colored), an adhesion promoter, a plasticizer, an antioxidant, a solvent, a surface tension modifier, a stabilizer, a chain transfer agent,
Additives such as defoamers and flame retardants can also be added as appropriate. Thus, the resin composition of the present invention is obtained. Such a resin composition is useful for fixing a phosphor in a PDP or the like, and a method for fixing the phosphor using such a resin composition will be described in detail. In the present invention, when the phosphor is fixed in the partition (cell) of the plasma display panel, the resin composition layer (I) and the phosphor-containing layer (II) are fixed in the partition (cell). After baking, it is possible to perform good fixing of the phosphor by baking. The thickness of the layer (I) of this time (h _a) is not be indiscriminately also varies depending on the structure of the PDP, usually bulkhead side height (h
Thinner is favored over _0), even according h _a (mu
m) and h ₀ (μm) is _{h a / h 0 = 1 /} 20~15 / 20
Is preferably, in particular _{h a / h 0 = 1 /} 20~10
/ Is preferably 20, according h _a / h ₀ 1/2
If it is less than 0, the thickness of the phosphor after firing becomes insufficient, and conversely,
When the ratio exceeds / 20, the space at the time of discharging the cell becomes small, which is not preferable. It is very preferable that the layer (I) is previously formed into a film or a sheet in terms of followability, workability and the like.

The layer (II) containing a phosphor is preferably a layer of a photosensitive resin composition.
The base polymer, which is composed of an ethylenic compound and a photopolymerization initiator, and such a phosphor is not particularly limited, but is preferably a rare earth oxyhalide or the like as a base, and the base is activated with an activator, for example, Examples of the ultraviolet-excited phosphor include Y ₂ O ₃ : Eu, YVO ₄ : Eu, (red or more), BaAl ₁₂ O ₁₉ : Mn, Zn ₂ SiO ₄ : M
n, LaPO ₄ : Tb (green above), BaMgAl ₁₀ O
₁₇ : Eu, BaMgAl ₁₄ O ₂₃ : Eu, BaMgAl ₁₆
O ₂₇ : Eu (more than blue) and the like, and other phosphors include Y ₂ O ₃ S: Eu, γ-Zn ₃ (PO ₄ ) ₂ : M
n, (ZnCd) S: Ag + In ₂ O ₃ (red or more), Z
nS: Cu, Al, ZnS: Au, Cu, Al, (Zn
Cd) S: Cu, Al, Zn ₂ SiO ₄ : Mn, As, Y
₃ Al ₅ O ₁₂ : Ce, Gd ₂ O ₂ S: Tb, Y ₃ Al ₅ O ₁₂ :
Tb, ZnO: Zn (more green), ZnS: Ag + red pigment, Y ₂ SiO ₃ : Ce (more blue), etc. can also be used.

[0014] The content of the phosphor is 100% of the total amount of the base polymer (b) and the ethylenically unsaturated compound (c).
The content is preferably from 1 to 1500 parts by weight, more preferably from 10 to 800 parts by weight, and if the content is less than 1 part by weight, the fixed phosphor pattern becomes insufficient in luminance, and conversely exceeds 1500 parts by weight. The flexibility when formed into a film is unfavorably reduced, and the base polymer and the ethylenically unsaturated compound are not limited to the base polymer (b).
And the ethylenically unsaturated compound (c) can be used in the same manner.

Further, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n
-Butyl ether, benzoin phenyl ether, benzyl diphenyl disulfide, benzyl dimethyl ketal, dibenzyl, diacetyl, anthraquinone, naphthoquinone, 3,3'-dimethyl-4-methoxybenzophenone, benzophenone, 4,4'-bis (dimethylamino) benzophenone, , 4'-bis (diethylamino) benzophenone, pivaloin ethyl ether, 1,
1-dichloroacetophenone, pt-butyldichloroacetophenone, hexaarylimidazole dimer (eg, 2,2′-bis (o-chlorophenyl) 4
5,4 ′, 5′-tetraphenyl-1-biimidazole) and the like, and 0.1 to 20 parts by weight based on 100 parts by weight of the total amount of the base polymer and the ethylenically unsaturated compound. It is preferable to mix them.

The thickness of the layer containing such phosphor (II) (h _b) is not be indiscriminately also varies depending on the structure of the content and PDP phosphor, usually similar to the above h _a, the partition wall side It is preferable that the height is smaller than the height (h ₀ ), and further, such h _b (μm) and h ₀ (μm) are h _b / h ₀ = 1/20.
１５15/20, especially h _b / h ₀ = 1
/ 20 to 10/20, and such h _b
If / h ₀ is less than 1/20, it becomes difficult to sufficiently push the resin composition layer (I) into the partition walls (cells), and if it exceeds 15/20, the patterning properties are undesirably reduced. In addition, it is preferable that the layer (II) is formed into a film or a sheet in advance in terms of uniform dispersibility, followability, workability, and the like of the phosphor.

In the layer (II) containing the phosphor, dyes (coloring and coloring), adhesion promoters, plasticizers, antioxidants, thermal polymerization inhibitors, solvents, surface tension modifiers, Additives such as a stabilizer, a chain transfer agent, an antifoaming agent, and a flame retardant can be appropriately added. Further, it is preferable that the layer (I) of the resin composition and the layer (II) containing the phosphor are formed into a film in advance as described above. Specifically, the respective compositions are made of a polyester film, a polypropylene film, After coating on a base film surface such as a polystyrene film, polyethylene film,
It is preferable to coat a protective film such as a polyvinyl alcohol film to form a laminate, and then provide the laminate for fixing the phosphor.

Next, a method for fixing the phosphor will be specifically described. (Formation of Layer (I) of Resin Composition) Base film (polyester film, polyvinyl alcohol film, nylon film, cellulose film, etc.) of a laminate having the above-mentioned resin composition layer (I) as an intermediate layer and resin composition The adhesive strength between the protective film and the resin composition layer (I) is compared with the adhesive strength of the resin composition layer (I), and the film having the lower adhesive strength is peeled off, and then the resin composition layer (I) is removed. Is pressed into the partition (cell) using a hot laminator or the like on the PDP substrate on which partition walls (cells) have been formed in advance, so that the resin composition layer (I) ) Is formed. (Formation of Phosphor-Containing Layer (II)) The film left on the surface of the resin composition layer (I) is peeled off, and a laminate containing the phosphor-containing layer (II) as an intermediate layer is formed on the film. Similarly to the layer (I) of the resin composition, the layer (II) containing the phosphor is formed by using a hot laminator or the like so as to be pressed into the cell. Here, the layer (I) of the resin composition / the layer containing the phosphor (I) is formed in the partition (cell) of the PDP substrate.
Although mean that two layers of I) is laminated and filled, the thickness of the thickness of the layer (I) of the resin composition used in this case (the layer containing the h _a) and phosphor (II) (h _b) the ratio h _a / h _b of a, 10
/ 90-75 / 25 is preferred.

(Exposure) A pattern mask is brought into close contact with the phosphor-containing layer (II) for exposure. If necessary, and if the phosphor-containing layer (II) has no tackiness, the film on the surface of the phosphor-containing layer (II) is peeled off, and the pattern mask is replaced with the phosphor. Exposure can also be carried out by directly contacting the layer (II). Exposure is usually performed by ultraviolet irradiation, and as a light source at this time, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a chemical lamp, or the like is used. After irradiation with ultraviolet rays, heating can be performed as necessary to complete the curing.

(Development) After the exposure, the film on the phosphor-containing layer (II) is peeled off and developed. Since the layer (II) containing the phosphor is a diluted alkali-developable photosensitive resin composition, development after exposure is performed using a dilute aqueous solution of about 1 to 2% by weight of an alkali such as sodium carbonate or potassium carbonate. Do it. At this time, it is also possible to use a developer such as an organic alkali.

(Firing) The partition (cell) forming substrate after the above treatment is baked at 450 to 550 ° C. to fix the phosphor inside the partition (cell). Thus, the phosphor can be fixed in the partition (cell) by the method of the present invention. However, in order to form a full-color PDP, the layer (I) of each of the red, blue, and green resin compositions is used. And the above-mentioned (formation of the layer (I) of the resin composition) to (development) is repeated using the layer (II) containing the phosphor, and after the phosphors of the above three colors are filled in the cell, (Firing).

[0022]

EXAMPLES Hereinafter, the present invention will be described specifically with reference to examples.
I do. In the examples, “parts” means heavy unless otherwise noted.
Means the quantity standard. Example 1 10 parts of the following silicon compound (a), base polymer
(B) 46 parts, ethylenically unsaturated compound (c) 54 parts and
And 2 parts of hydroxy fatty acid (d) are mixed to form a resin composition
Was prepared.Silicon compound (a)  Glass fritBase polymer (b) Methyl methacrylate / n-butyl methacrylate / meth
The copolymerization ratio of tacrylic acid is 30/49/21 on a weight basis.
(Glass transition temperature 69 ° C., acid value 137 m
gKOH / g, weight average molecular weight 60,000)Ethylenically unsaturated compound (c) Tetraethylene glycol dimethacrylateHydroxy fatty acid (d) 12-oxyoctadecanoic acid

Next, 100 parts of the obtained resin composition is dissolved in 100 parts of a solvent (methyl ethyl ketone) to obtain a dope. The dope is coated on a polyester film having a thickness of 20 μm, and the coating is performed at room temperature for 1 minute 30 minutes. After leaving for 6 seconds, 6
The resin composition was dried in an oven at 0 ° C., 90 ° C., and 110 ° C. for 3 minutes each to prepare a resin composition layer (I) having _a thickness (ha) of 50 μm. Using the layer (I) of the obtained resin composition, the phosphor was fixed as described below and evaluated. First, a layer containing a phosphor having a thickness (h _b ) of 70 μm according to the above using 65 parts of the following phosphor, 50 parts of a base polymer, 75 parts of an ethylenically unsaturated compound, and 6 parts of a photopolymerization initiator ( II) (however, no protective film was provided).

Phosphor (Y, Gd) BO ₃ : Eu [K-Keisei Optonics “K
X-504A]] (R: red, emission wavelength; 590, 610, 620 nm,
Particle size: 2 to 4 μm, specific gravity: 5.1) Base polymer methyl methacrylate / n-butyl methacrylate / 2
A copolymer having a copolymerization ratio of ethylhexyl acrylate / methacrylic acid of 50/15/10/25 by weight (glass transition temperature 75 ° C., acid value 163 mg KOH /
g, weight average molecular weight 60,000) Ethylene unsaturated compound Tetraethylene glycol dimethacrylate / trimethylolpropane triacrylate Mixture in which the mixing ratio is 80/20 by weight Photopolymerization initiator benzyl dimethyl ketal

Next, using a laminate of the layer (I) of the resin composition obtained above (provided that the protective film is not provided) and the layer (II) containing the phosphor, a phosphor is prepared in the following manner. Was fixed. (Layer (I) of resin composition and layer (II) containing phosphor)
Formation) Partition walls preheated to 60 ° C. in an oven (height (h ₀ ): 100 μm, width: 80 μm, slit: 150 μm
PDP substrate (20 stripe pattern)
(0 mm × 200 mm × 3.1 mm), the layer (I) (laminated film) of the above resin composition was laminated under the conditions of a laminating roll temperature of 100 ° C., a roll pressure of 3 kg / cm ² , and a laminating speed of 1.0 m / sec. Thereafter, the polyester film is peeled off, and the phosphor-containing layer (II) (laminated film) is similarly laminated on the polyester film to form a resin composition layer (I) and a phosphor-containing layer (II). did. _{(H a / h b = 50} /70)

(Exposure and Development) Next, a pattern is placed on the entire surface of the polyester film on the surface of the phosphor-containing layer (II) such that the inside of the partition (cell) (other than the upper part of the partition) is exposed. And an exposure machine HMW-
Exposure was performed at 532D with a 3 kw ultrahigh pressure mercury lamp at 80 mj. After taking hold time of 15 minutes after exposure, 1%
Development was carried out at 30 ° C. in an aqueous solution of Na ₂ CO ₃ for 1.5 times the minimum development time. Further, the layer (I) of the above resin composition
The phosphor (a) in the sample was Zn ₂ SiO ₄ : Mn [“PI-GIS” manufactured by Kasei Optonics Co., Ltd.] (G: green, emission wavelength: 5).
20 nm, particle size: 2 to 6 μm, specific gravity: 4.2) and [KX-510A manufactured by Kasei Optonics] (B; blue;
2. emission wavelength; 450 nm, particle size: 2 to 6 μm, specific gravity;
The same procedure was carried out using the layer (I) of the resin composition changed to 8), and the layer (I) of the resin composition containing the respective phosphors of R, G, and B in the partition walls (cells) and The layer (II) containing no phosphor was formed in a stripe shape.

(Firing) Next, put in a firing furnace at about 550 ° C.
Then, the resin in the layer (I) of the resin composition and the layer (II) containing the phosphor was burned off, and each phosphor was fixed in the partition (cell). The obtained RGB phosphor pattern was irradiated with a UV lamp (main emission wavelength: 254 nm) and visually observed, but no line defect or unevenness of each phosphor pattern was observed, and a good phosphor pattern was obtained. Was. In addition, the phosphor was similarly fixed using the layer (I) of the resin composition after the storage stability promotion test described below.
A good phosphor pattern was obtained. In addition, a polyethylene film was laminated as a protective film to the obtained resin composition layer (I), and while slitting to a width of 300 mm, 50 m was wound around a branch pipe having an outer diameter of 84.2 mm to form a roll. A storage stability promotion test was carried out by leaving it horizontally in a dryer at 3 ° C. for 3 days, but no exudation (edge fusion) of the resin composition from the side end of the roll was observed.

Example 2 The procedure of Example 1 was repeated, except that the hydroxy fatty acid (d) in the resin composition was changed to 7 parts of 8-oxydecanoic acid. In each case, the phosphor pattern obtained was The storage stability was good as in Example 1, and the storage stability was good, with no seepage of the resin composition (edge fusion) from the side end of the roll.

Example 3 In Example 1, 30 parts of the silicon compound (a), 50 parts of the base polymer (b), 75 parts of the ethylenically unsaturated compound (c) and 75 parts of the hydroxy fatty acid ( d) The same procedure was performed except that the amount was changed to 5 parts. In each case, the obtained phosphor pattern was as good as in Example 1, and the storage stability was also determined by the resin composition from the side end of the roll. No exudation (edge fusion) of the product was observed and the product was good.

Example 4 In Example 1, the copolymer ratio of methyl methacrylate / n-butyl methacrylate / methacrylic acid was 56/2 by weight based on the base polymer (b) in the resin composition.
The same procedure was performed except that the copolymer was changed to 1/23 (glass transition temperature: 74 ° C., acid value: 150 mg KOH / g, weight average molecular weight: 120,000). It was as good as in Example 1, and the storage stability was good with no seepage of the resin composition (edge fusion) from the side end of the roll.

Example 5 The procedure of Example 1 was repeated, except that the ethylenically unsaturated compound (c) in the resin composition was changed to EO-modified bisphenol A dimethacrylate [“BPE-500” manufactured by Shin-Nakamura Chemical Co., Ltd.]. In each case, the obtained phosphor pattern was as good as in Example 1, and the storage stability of the resin composition from the side end of the roll (edge fusion) was observed. It was good.

Comparative Example 1 The procedure of Example 1 was repeated, except that the hydroxy fatty acid (d) in the resin composition was not added, but the phosphor pattern before the storage stability test was successfully formed. However, after the storage stability test, unevenness or the like occurs in the phosphor pattern, and the storage stability also shows that the resin composition exudes from the side edge of the roll (edge fusion).
After the expiration of days, it was recognized.

[0033]

The resin composition of the present invention has excellent storage stability. In particular, exudation (edge fusion) from the side edge of the roll is observed even when the resin composition is formed into a roll and stored at room temperature for a long period of time. In addition, the resin composition is very useful for fixing a phosphor such as PDP.

[Procedure amendment]

[Submission date] May 31, 1999 (1999.5.3
1)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0011

[Correction method] Change

[Correction contents]

[0011] The resin composition of the present invention comprises the above (a) to
(D), and their content is not particularly limited, but the content of the silicon-based compound (a) is 100 parts by weight in total of the base polymer (b) and the ethylenically unsaturated compound (c). Is preferably 0.5 to 800 parts by weight, more preferably 1 to 500 parts by weight, and if the content is less than 0.5 part by weight, the effect of fixing the phosphor is reduced,
Conversely, if it exceeds 800 parts by weight, the luminance of the phosphor is undesirably reduced, and the ratio of the ethylenically unsaturated compound (c) to 100 parts by weight of the base polymer (b) is 10 to 10%.
It is preferably selected from the range of 200 parts by weight, particularly from 60 to 150 parts by weight, and an insufficient amount of the ethylenic compound (c) causes a decrease in flexibility when the layer (I) of the resin composition described later is used, In addition, when a photosensitive resin composition as described below is used, poor curing and a delay in development speed are caused, and an excessive amount of the ethylenically unsaturated compound (c) causes cold flow.
Now, good better wards. Further, the content of the hydroxy fatty acid (d) is preferably 0.5 to 25 parts by weight, more preferably 1 to 20 parts by weight, based on 100 parts by weight of the total of the base polymer (b) and the ethylenically unsaturated compound (c). If the content is less than 0.5 part by weight, sufficient storage stability cannot be obtained, and if it exceeds 25 parts by weight, the dissolving operation of the fatty acid becomes complicated, which is not preferable.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01J 11/02 H01J 11/02 BF term (Reference) 4J002 BG011 BG041 BG051 BG061 BG071 BH021 CF031 CH052 CK021 DE076 DE096 DE146 DJ016 DL006 EF038 EF058 EH077 EH107 FD020 FD030 FD070 FD090 FD130 FD142 FD147 FD200 FD208 FD340 GQ00 4J011 PA07 PA13 PA15 PA28 PA69 PA88 PA95 PB25 PB30 PB39 PB40 PC02 PC08 4J026 AAA AAAAAAAAAAAAAAAAAA BA30 BA32 BA50 BB01 BB02 DB06 DB29 DB30 DB36 EA06 EA08 GA07 GA08 5C028 FF16 5C040 DD13

Claims (9)

[Claims] 1. A resin composition comprising a silicon compound (a), a base polymer (b), an ethylenically unsaturated compound (c) and a hydroxy fatty acid (d). 2. The content of hydroxy fatty acid (d) is 1 in total of base polymer (b) and ethylenic compound (c).
The resin composition according to claim 1, wherein the amount is 0.1 to 10 parts by weight based on 00 parts by weight. 3. The resin composition according to claim 1, wherein the silicon-based compound (a) is at least one selected from glass frit. 4. The content of the silicon compound (a) is 10 in total of the base polymer (b) and the ethylenic compound (c).
The resin composition according to any one of claims 1 to 3, wherein the amount is 0.5 to 800 parts by weight based on 0 part by weight. 5. In fixing a phosphor in a partition (cell) of a plasma display panel, the layer (I) of the resin composition and the layer (II) containing the phosphor according to any one of claims 1 to 4 are used. A method for fixing a phosphor, wherein the phosphor is provided in the partition (cell) and fired. 6. The layer (II) containing a phosphor is a photosensitive resin composition layer comprising a phosphor, a base polymer, an ethylenically unsaturated compound, and a photopolymerization initiator. Fixing method of phosphor. 7. The layer (II) containing a phosphor is a photosensitive resin composition layer comprising a phosphor, a base polymer, an ethylenically unsaturated compound, a photopolymerization initiator, and a hydroxy fatty acid. Item 6. The method for fixing a phosphor according to Item 5. 8. The phosphor according to claim 5, wherein after the layer (I) is provided in the partition (cell), a layer (II) containing the phosphor is provided next. How to fix. 9. The method according to claim 5, wherein the method according to claim 5 is repeated three times to fix phosphors of three colors R (red), G (green), and B (blue). Fixing method.