JP2000005997A - Method and device for machining wafer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To machine the ends of the front and rear of a wafer at the same time by means of a machining tape. SOLUTION: This device includes a table 11 that rotates while retaining a wafer 10, a polishing tape 12 that runs while disposed oppositely to the end face of the wafer 10, tape benders 20, 21 for bending both side parts of the polishing tape 12 to the front and rear of the wafer, and a pair of end pressing means 40A, 40B for pressing the bent polishing tape 12 against the ends of the front and rear of the wafer 10 from the front and rear of the wafer 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method and apparatus for processing a wafer.

[0002]

2. Description of the Related Art Since a wafer has a disk shape, no pattern is generally formed on an outer peripheral portion. However, when the surface of the wafer is polished, the processing conditions are different between the pattern-formed portion and the non-patterned portion, so that there has been a problem that the entire surface cannot be polished uniformly. Therefore, a wafer having a pattern formed on the entire surface has recently been developed.

[0003] Incidentally, since the outer peripheral portion of the wafer is chucked in a subsequent post-process, the outer peripheral wiring may fall off by the chuck. Therefore, it is necessary to previously remove the wiring at the outer peripheral end by polishing, etching, or the like. In addition, if foreign matter adheres to the removed portion after the wiring at the outer peripheral end is removed, the foreign matter falls off during chucking and adheres to a normal pattern portion of the wafer. Therefore, it is necessary to clean the outer peripheral end.

[0004]

SUMMARY OF THE INVENTION A first object of the present invention is to provide a wafer processing method and apparatus capable of simultaneously processing the front and rear ends with a processing tape.

A second object of the present invention is to provide a wafer processing method and apparatus capable of simultaneously processing the front and rear ends and the end face with a processing tape.

[0006]

According to a first method of the present invention for solving the above-mentioned first object, a method is provided in which both side portions of a processing tape which runs and are disposed opposite to an end surface of a wafer which is driven to rotate. , Bent to the front and back side of the wafer,
The bent processing tape is pressed against the front and rear edges of the wafer to simultaneously process the front and rear edges of the wafer.

A second method of the present invention for solving the above first and second problems is to provide a processing tape which is disposed opposite to an end face of a rotationally driven wafer and travels on the end face of the wafer. Pressing and processing the end face of the wafer, and bending the processing tape toward the front and back sides of the wafer at a position different from the end processing position of the wafer,
The bent processing tape is pressed against the front and rear edges of the wafer to simultaneously process the front and rear edges of the wafer.

A first apparatus of the present invention for solving the first problem is a table which holds and rotates a wafer, a processing tape which runs while being arranged opposite to an end face of the wafer, and A tape bending tool for bending both side surfaces of the processing tape toward the front surface and the back surface of the wafer,
A pair of end pressing means for pressing the bent processing tape to the front and back ends of the wafer from the front and back sides of the wafer, respectively, and simultaneously process the front and back ends of the wafer It is characterized by doing.

A second apparatus of the present invention for solving the above first and second problems is a table which holds and rotates a wafer, and a processing tape which runs while being arranged opposite to an end face of the wafer. And a tape bending tool for bending both side surfaces of the processing tape toward the front and back sides of the wafer, and pressing the bent processing tape toward the front and back ends of the wafer from the front and back surfaces of the wafer, respectively. A pair of end pressurizing means, and end face pressurizing means disposed at a position distant from the tape bending tool to press the processing tape against the end face of the wafer; It is characterized in that the portions are processed simultaneously and the end faces of the wafer are processed simultaneously.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. As shown in FIG.
Is held by a motor described later. On the end face side of the wafer 10, an end face pressing means 13 for pressing the polishing tape 12 against the end face of the wafer 10 is provided. The end surface pressing means 13
Pressure roller 1 rotatably supported by roller holder 14
5 and the roller holder 14 is fixed to the slider 16. The slider 16 is provided on a unit holding plate 17 so as to be movable in the radial direction of the wafer 10, and is driven by a cylinder 18.

On the end face side of the wafer 10, tape folding tools 20 and 21 are fixed on the unit holding plate 17 at a fixed distance from a position about 90 degrees away from the end face pressing means 13. . Tape bending tool 20,
As shown in FIG. 2, V-shaped tape bending portions 20a and 21a are formed in the V-shaped tape.

Referring again to FIG. 1, the unit holding plate 17
Is driven by a cylinder 22 in a direction in which the tape bending tools 20 and 21 approach and separate from the wafer 10.
Guide rollers 23 and 24 for guiding the polishing tape 12 to the pressure roller 15 of the end face pressing means 13 are rotatably disposed on both sides of the end face pressing means 13. Guide rollers 25, 2 for guiding the polishing tape 12 to the tape folding tools 20, 21 are also provided outside the tape folding tools 20, 21.
6 is rotatably arranged. A supply reel 27 around which the polishing tape 12 is wound is provided on the side of the pressing means 13 for the end face, and a take-up reel 28 rotated by a motor (not shown) is provided on the side of the tape bending tool 21.

A tension roller 30 is provided on the guide rollers 24 and 25 side.
Is rotatably provided on the slider 31. The slider 31 is provided movably along a guide rail 32 fixed to the unit holding plate 17, and is moved by a cylinder 33. Therefore, polishing tape 1
2 is the supply reel 27 from the guide rollers 34 and 23, the pressure roller 15, the guide rollers 24 and 35, the tension roller 30, the guide roller 25, the tape bending tool 20,
21, take-up reel 28 via guide rollers 26 and 36
It is wound up.

A pair of end pressing means 40A and 40B for pressing the polishing tape 12 against the upper and lower surfaces of the end of the wafer 10 are disposed above and below the tape bending tools 20 and 21, respectively. The end pressing means 40A and 40B have exactly the same structure and are arranged vertically symmetrically. A vertical driving means 55 for vertically driving the end pressing means 40A, 40B;
A and 55B have substantially the same configuration. Therefore, hereinafter, the configuration of the end pressing means 40A and 40B and the configuration of the vertical drive means 55A and 55B are given the same numbers, and one of them is denoted by the letter A and the other is denoted by the letter B to distinguish them. I do. The configuration of the upper end pressing unit 40A and the vertical driving unit 55A will be described, and the description of the lower end pressing unit 40B and the vertical driving unit 55B will be omitted.

First, the structure of the end pressing means 40A will be described with reference to FIGS. A roller support block 42A is fixed to the lower surface side of the swing block 41A, and a pressing roller 43A is rotatably supported on the roller support block 42A. A swing shaft 44A is fixed to the upper surface side of the swing block 41A, and an inner ring of a ball bearing 45A is fixed to the swing shaft 44A by a nut 46A. The outer ring of the ball bearing 45A is inserted into the support plate 47A,
It is pressed against the support plate 47A by a fixing ring 48A fixed to 7A. Thus, the swing shaft 44A can swing in any direction with respect to the support plate 47A.

A swing block holder 49A is fixed to the lower surface of the support plate 47A, and a protrusion 49a formed on the inner surface of the swing block holder 49A is inserted into a groove 41a formed on the outer periphery of the swing block 41A. ing. Support plate 4
Four air cylinders 50A are fixed to 7A, and the tip of the operating portion of the air cylinder 50A presses the upper surface of the swing block 41A.

Next, the structure of the vertical drive means 55A of the end pressing means 40A will be described with reference to FIGS. Support plate 4
7A is fixed to one end of a swing arm 56A, and the other end of the swing arm 56A is fixed to a swing block 57A. The swing block 57A is swingably supported by a swing center shaft 59A fixed to the support block 58A.

A stopper 60A is fixed to the lower surface of the swing arm 56A so as to extend downward and to the front side shifted from the center of the swing center shaft 59A. A stopper receiver 61A is fixed to the support block 58A so as to face the stopper 60A, and the stopper 60A is connected to the stopper receiver 61A.
In a state where the swing arm 56A contacts the swing arm 56A, the swing arm 56A is kept horizontal. Therefore, a spring 62A is hung on the swing arm 56A and the support block 58A so that the stopper 60A is pressed against the stopper receiver 61A. A pin 63A is fixed to the lower surface of the swing arm 56A on the stopper 60A side, and the pin 6
A roller 64A is provided facing 3A.

The support block 58A includes a vertically moving block 65.
A, and a slider 66A having a vertical guide portion is fixed to the vertical movement block 65A.
The slider 66A is provided with a vertically arranged guide rail 6.
The guide rail 67A is fixed to a vertical plate 68 which is fixed to the unit holding plate 17 vertically. Male screw 69A for vertical movement block 65A
The upper and lower ends of the male screw 69A are rotatably supported by bearings 70A, 71A fixed to the vertical plate 68 (note that the bearing 71A is not shown, so refer to the bearing 71B). A motor 72A (the motor 72A is not shown, so refer to the motor 72B) is fixed to the lower surface of the unit holding plate 17 corresponding to the male screw 69A, and the output shaft of the motor 72A is connected to the male screw 69A. I have.

The portion of the table 11 shown in FIG. 1 has a structure as shown in FIG. The table 11 has a rotating shaft 75
The rotating shaft 75 is rotatably supported by a rotating shaft support cylinder 77 via a bearing 76. The rotation shaft support cylinder 77 is fixed to a base plate 78. Further, the lower end of the rotating shaft 75 is connected to a support block 80 via a bearing 79.
It is supported rotatably.

A through hole 75a is formed in the center axis of the rotating shaft 75, and a suction hole 11a is formed in the table 11 so as to communicate with the through hole 75a. Support block 80
Also, a hole 80a is formed to communicate with the through hole 75a, and a pipe 81 connected to a vacuum source (not shown) is connected to the hole 80a. A pulley 82 is attached to the rotating shaft 75.
Has been fixed. A motor 84 is fixed to the lower surface of the base plate 78 via a bracket 83, and a belt 86 is hung on a pulley 85 fixed to an output shaft of the motor 84 and the pulley 82.

A lower cover support tube 90 for gas introduction is fixed to the outer periphery of the rotary shaft support tube 77, and a lower cover 91 for gas introduction is provided on the lower cover support tube 90 for gas introduction along the lower surface of the table 11. Fixed. One end of a pipe 92 for supplying nitrogen gas between the table 11 and the lower cover 91 for gas introduction is connected to the inner peripheral side of the lower cover 91 for gas introduction, and the other end of the pipe 92 is connected to a nitrogen gas supply (not shown). Connected to the source. Above the table 11, a gas introduction upper cover 93 is provided, and the gas introduction upper cover 93 is fixed to a gas supply member 94 having a gas supply hole 94a.

One end of a pipe 95 is connected to the gas supply member 94, and the other end of the pipe 95 is connected to a nitrogen gas supply source (not shown). The gas supply member 94 is vertically movably provided on a guide rail 96 fixed vertically to the base plate 78, and is moved up and down by a drive source (not shown). A plurality of exhaust joints 97 are attached to the base plate 78, and the exhaust joint 97 is connected to a suction source (not shown) through a pipe (not shown). The gas introduction lower cover support cylinder 90, the gas introduction lower cover 91, and the gas introduction upper cover 93 are covered with a cover 98 except for the end pressing means 40A and 40B.

Next, the operation will be described. 1 and 6
As shown in FIG. 1, the wafer 10 is vacuum-sucked on the table 11. When the motor 84 shown in FIG. 6 rotates, the rotation shaft 75 and the table 11 rotate via the pulley 85, the belt 86, and the pulley 82, and the wafer 10 rotates. At the same time as the motor 84 rotates, the take-up reel 28 shown in FIG. 1 rotates, and the polishing tape 12 wound around the supply reel 27 is
, Tension roller 30, tape bending tool 2
It travels so as to be wound on the take-up reel 28 through 0 and 21. By this running, the tape bending tool 20,
As shown in FIG. 2, the portions of the polishing tape 12 between the tape bending parts 20, 21 are tape bent parts 20 a, 20 a of the tape bending tools 20, 21.
It is bent in a V-shape by 1a.

Subsequently, the cylinder 22 shown in FIG. 1 is operated to move the unit holding plate 17 toward the wafer 10, and the polishing tape 12 between the tape bending tools 20 and 21 is located on the end face of the wafer 10. Then, the end surface pressing means 13
Of the cylinder 18 and the motors 72A, 72B of the end pressing means 40A, 40B are operated. End face pressing means 13
When the cylinder 18 is operated, the pressing roller 15 presses the polishing tape 12 against the end face of the wafer 10, and the end face of the wafer 10 is polished.

The motor 7 of the end pressing means 40A, 40B
When the 2A and 72B are operated, the vertical movement block 65A is guided by the guide rail 67A to descend, and the vertical movement block 65B is guided by the guide rail 67B to rise. When the vertically moving block 65A is lowered, the pin 63A comes into contact with the roller 64A, and the swing arm 56A and the support block 58A rotate in the direction of arrow A about the swing center shaft 59A shown in FIG. When the swing arm 56A rotates by a certain angle, the motor 72A stops. Vertical movement block 6
Similarly, when the pin 5B rises, the pin 63B comes into contact with the roller 64B, and the swing arm 56B and the swing block 57B rotate around the swing center shaft 59B in the direction of the arrow A ', contrary to the above. When the swing arm 56B rotates by a certain angle, the motor 72B stops. That is, the pressing rollers 43A and 43B shown in FIG. 4 press the polishing tape 12 against the upper and lower end surfaces of the outer peripheral portion of the wafer 10 while being inclined at a certain angle.
Thereby, the upper and lower end surfaces and the chamfered portion of the outer peripheral portion of the wafer 10 are polished.

In this case, the end pressing means 40A, 40B
The swing blocks 41A, 41B to which the pressure rollers 43A, 43B are attached are air cylinders 50A, 50B.
By a constant pressure, and the oscillating shaft 44A,
Since the roller 44B can be freely moved by the ball bearings 45A and 45B, the pressing rollers 43A and 43B
A constant pressure is constantly applied to the polishing tape 12 without being affected by zero waviness or surface runout.

As described above, since one polishing tape 12 is pressed against the outer peripheral end of the wafer 10 by the end pressing means 40A, 40B, the front and rear surfaces can be simultaneously polished.
The use amount of the polishing tape 12 is small, and the product cost can be reduced. At the same time as the polishing by the end pressing means 40A and 40B, the same polishing tape 12 can also simultaneously polish the end face of the wafer 10 by the end pressing means 13, which further reduces the product cost. I can do it.

After polishing for a certain time, the cylinder 18 is operated in the opposite direction to the above, and the pressing roller 15 of the pressing means 13 for the end face is used.
Is separated from the polishing tape 12. Motors 72A, 72
B rotates in the reverse direction, the end pressing means 40A rises, and the end pressing means 40B descends and separates from the polishing tape 12. Subsequently, the cylinder 22 operates in the opposite direction to the above, so that the tape folding tools 20 and 21 are separated from the wafer 10.

At the time of polishing the wafer 10, the nitrogen gas is supplied from the pipes 92 and 95 and is sucked through the exhaust joint 97 as shown in FIG. As a result, the nitrogen gas flows from the inner periphery to the outer periphery of the wafer 10, thereby preventing the contamination of the wafer 10 by polishing debris and preventing air contamination outside the apparatus.

In the above embodiment, the case where the end portion and the end surface of the wafer 10 are polished using the processing tape and the polishing tape 12 has been described. The present embodiment is not limited to polishing, but can be applied to the case where the edge and the end face of the wafer 10 are cleaned. In this case, it goes without saying that a cleaning tape such as a cloth tape is used instead of the polishing tape 12 as the processing tape.

[0032]

According to the present invention, both side portions of the processing tape which is arranged and runs opposite to the end face of the rotationally driven wafer are bent toward the front and back sides of the wafer.
Since the bent processing tape is pressed against the front and rear ends of the wafer, the processing tape can simultaneously process the front and rear ends.

Further, a processing tape running while being arranged opposite to the end face of the rotationally driven wafer is pressed against the end face of the wafer to process the end face of the wafer. At the position, the processing tape is bent toward the front and back sides of the wafer, and the bent processing tape is pressed against the front and back edges of the wafer to simultaneously process the front and back edges of the wafer. Therefore, the end processing and the end surface processing of the front surface and the back surface can be simultaneously performed with the processing tape.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a wafer polishing apparatus according to the present invention.

FIG. 2 is an explanatory perspective view showing a tape bending part.

FIG. 3 is a perspective view showing an end pressing unit.

FIG. 4 is a sectional view of FIG. 4;

FIG. 5 is an explanatory perspective view of a swing mechanism of the end pressing means.

FIG. 6 is a sectional view of a table portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Wafer 11 Table 12 Polishing tape 13 End-side pressurizing means 20, 21 Tape bending tool 27 Supply reel 28 Take-up reel 40A, 40B End-side pressurizing means

Continued on the front page F term (reference) 3C049 AA05 AA12 AA13 AA14 CA05 CB03 3C058 AA05 AA12 AA13 AA14 CB03 DA17

Claims (4)

[Claims] 1. A method according to claim 1, wherein both sides of the processing tape, which is arranged to face the end face of the wafer to be rotated and run, are bent toward the front and back sides of the wafer. A method of processing a wafer, comprising simultaneously processing the front and rear ends of the wafer by applying pressure to the rear end. 2. A processing tape, which is disposed to face an end face of a wafer that is driven to rotate and is running, is pressed against the end face of the wafer to process the end face of the wafer, and is separated from an end face processing position of the wafer. At the position, the processing tape is bent toward the front and back sides of the wafer, and the bent processing tape is pressed against the front and back edges of the wafer to simultaneously process the front and back edges of the wafer. A method for processing a wafer, comprising: 3. A table which holds and rotates a wafer, a processing tape which runs while being opposed to an end face of the wafer, and a tape bending which bends both side portions of the processing tape toward the front and back sides of the wafer. Utensils,
A pair of end pressing means for pressing the bent processing tape to the front and back ends of the wafer from the front and back sides of the wafer, respectively, and simultaneously process the front and back ends of the wafer A wafer processing apparatus. 4. A table which holds and rotates a wafer, a processing tape which runs while being opposed to an end surface of the wafer, and a tape bending which bends both side portions of the processing tape toward the front and back sides of the wafer. Utensils,
A pair of pressurizing means for pressurizing the bent processing tape to the front and back ends of the wafer from the front and back surfaces of the wafer, respectively, and disposed at a position separated from the tape bending tool, An end face pressing means for pressing the processing tape against the end face of the wafer, a processing apparatus for a wafer, wherein the front and rear ends of the wafer are simultaneously processed, and the end face of the wafer is simultaneously processed. .