JP2000003827A - Manufacture of laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic component which can obtain stable characteristics, when component mounting direction is changed by the shape and the position of a terminal electrode. SOLUTION: Sheets B1-B4 for coil layers, where four kinds of U-shaped conductors Pb1-Pb4 for coils are so formed that these end portions overlap with through-holes (h) are laminated, so that the respective conductors Pb1-Pb4 for coils of the sheets are connected spirally in the laminating direction via the through-holes (h) filled with the conductors. On both sides of the laminating direction, a plurality of green sheets A and C having the through-holes (h) filled with conductors are so laminated that the respective through-hole filling conductors of the sheets are made continuous in a pillar type in the laminating direction, and the through-hole filling conductors of one ends are connected with the conductors Pb1 and Pb4 for coils at the ends of the laminating direction. The overall body of a laminated member is compression-bonded, the laminated member after compression-bonding is baked, and terminal electrodes are formed facing opposite at the end portions in the laminating direction of the laminating member after baking, so as to be connect with the exposed ends of the through-hole filling conductors at the laminating direction ends.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated electronic component in which one or more coils are embedded in a chip having a laminated structure.

[0002]

2. Description of the Related Art FIG.
2 shows a schematic cross-sectional view of the multilayer inductor.

In FIG. 1, reference numeral 11 denotes a rectangular chip made of a magnetic material, 12 denotes a spiral coil embedded in the chip 11, and 13 denotes a pair of terminal electrodes provided at the longitudinal end of the chip 11. It is. The circling center line Y of the coil 12 is orthogonal to the direction connecting the terminal electrodes 13 (chip longitudinal direction), and the end of the coil 12 is led out to the chip end face and connected to each terminal electrode 13.

[0004] In this laminated inductor, a plurality of magnetic green sheets formed with U-shaped or L-shaped coil conductors by a method such as screen printing are stacked and crimped together with a non-conductor-formed sheet in a predetermined order. After baking this, a conductor paste for terminal electrodes is applied to the end of the chip and baked. The coil conductors adjacent to each other via the sheet are connected to each other through a through-hole portion formed in the sheet before the conductor is formed to form a spiral coil 12. The coil conductors in the uppermost layer and the lowermost layer have lead-out portions extending to sheet ends, and the lead-out ends exposed at both ends of the chip are connected to the terminal electrodes 13.

[0005]

By the way, in the above-mentioned conventional laminated inductor, the four surfaces of the terminal electrode 13 can be used as mounting surfaces, respectively. Therefore, when these are mounted on the conductor pattern Za of the substrate Z, FIG. The two directions shown in FIG. 8, that is, the direction in which the circling center line Y of the coil 12 is perpendicular to the substrate surface (see FIG. 7) and the direction in which the circulating center line Y of the coil 12 is parallel to the substrate surface (see FIG. 8) ) Occurs.

In the mounting direction shown in FIG. 7 and the mounting direction shown in FIG. 8, there is a difference in magnetic resistance with respect to the magnetic flux outside the chip due to the difference in the positional relationship between the coil 12 and the substrate Z. This results in a difference in inductance. Will appear. In particular,
In a multilayer inductor using a material having a low relative magnetic permeability as a chip material, a large difference occurs in the magnetic resistance depending on the mounting direction, and a considerable difference appears in the inductance.

The above problem is not limited to the laminated inductors illustrated in FIGS. 6 to 8, but is limited to a laminated inductor or a composite component such as an LC having a mounting direction restricted by a terminal electrode, or a laminated structure in which two or more coils are embedded. Even with a transformer,
This can also occur when the form and position of the terminal electrode are changed to change the mounting direction.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a laminated type which can obtain stable characteristics even when the component mounting direction changes depending on the form and position of the terminal electrode. An object of the present invention is to provide a method for manufacturing an electronic component.

[0009]

In order to achieve the above object, a method of manufacturing a laminated electronic component according to the present invention is directed to a non-circular conductor for a coil and a through-filling of a conductor connected to an end of the non-cyclic conductor. A plurality of green sheets each having a hole are stacked so that the non-annular conductors of the sheets are spirally connected in the stacking direction via the through holes filled with conductors, and through holes filled with conductors are provided on both sides in the stacking direction. A plurality of green sheets having the through-hole-filled conductors of the sheets connected in the stacking direction, and the through-hole-filled conductor at one end thereof connected to the non-annular conductor at the end in the stacking direction. The whole is crimped, the laminated body after crimping is fired, and the end of the fired laminated body in the laminating direction is connected to each exposed end of the through-hole-filled conductor at the laminating end. That it has formed opposite the terminal electrode so that the its features.

According to the method of manufacturing a laminated electronic component according to the present invention, a chip having a structure laminated in a direction connecting terminal electrodes is provided with a coil whose circumferential center line is parallel to the direction connecting terminal electrodes. A laminated electronic component can be manufactured accurately.

The above and other objects, constitutional features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0012]

FIG. 1 is a schematic sectional view of a laminated inductor according to the present invention.

In FIG. 1, reference numeral 1 denotes a rectangular chip made of a magnetic material or a non-magnetic material (insulating material), 2 denotes a spiral coil embedded in the chip 1, and 3 denotes a chip 1.
Are a pair of terminal electrodes provided at the ends in the longitudinal direction. The circling center line Y of the coil 2 is parallel to the direction connecting the terminal electrodes 3 (chip longitudinal direction), and the end of the coil 2 is led out to the chip end face and connected to each terminal electrode 3.

In the above-described multilayer inductor, the terminal electrodes 3
Since each surface can be used as a mounting surface,
When mounted on the conductor pattern Za, the direction shown in FIG. 2 and the direction different from the direction by 90 degrees are generated. However, since the circling center line Y of the coil 2 is parallel to the direction connecting the terminal electrodes 3 (chip longitudinal direction), the direction of the circulating center line Y of the coil 2 with respect to the substrate surface does not change even if the mounting direction changes. .

Therefore, the positional relationship between the coil 2 and the substrate Z can be maintained constant regardless of the mounting direction, and a stable inductance can be obtained by preventing a difference in magnetic resistance with respect to magnetic flux outside the chip. Can be.

Here, a method of manufacturing the multilayer inductor shown in FIG. 1 will be described with reference to FIGS.

In production, first, an upper layer sheet A, coil layer sheets B1 to B4, and a lower layer sheet C are prepared (see FIG. 3). It should be noted that although the drawing shows one corresponding to one part, each actual sheet has a size capable of taking a large number of pieces, and is cut into parts dimensions after lamination and pressure bonding.

The upper layer sheet A is made of Fe ₂ O ₃ , NiO,
After forming a through hole h having a predetermined diameter at a predetermined position of a ferrite green sheet containing ZnO or CuO as a main component, a rectangular lead conductor Pa is formed so as to overlap the through hole h. I have.

The coil layer sheets B1 to B4 are formed by forming four through-holes h at predetermined positions of the same ferrite green sheet as described above, and then forming four types of U-shaped coils so that the ends thereof overlap the through-holes h. It is created by forming the conductors Pb1 to Pb4 for use. As the shape of the coil conductors Pb1 to Pb4, various non-annular shapes such as an L-shape other than a U-shape can be adopted.

As in the case of the upper layer sheet A, the lower layer sheet C is formed with a through hole h having a predetermined diameter at a predetermined position of the ferrite green sheet, and then a rectangular lead conductor Pc is overlapped with the through hole h. It is created by forming.

The above-mentioned through hole h is formed by irradiating a laser beam when the ferrite green sheet is supported by a film, and by punching out a die when the ferrite green sheet is not supported by a film. The conductors Pa, Pb1 to Pb4, and Pc are formed by thick-film printing of a conductor paste containing a metal powder such as Ag by screen printing or the like. Will be filled.

Next, the prepared sheets A, B1 to B
4 and C are peeled off when a film is attached.
And then pressure-bonded at a pressure of about 500 kg / cm ² . By the way, the number of sheets A and C for the upper and lower layers corresponds to the layer thickness, and the sheets B1 to B for the coil layers.
4 is the number corresponding to the number of coil turns.

Next, the laminate of the sheets A, B1 to B4, and C (see FIG. 4) is fired at a temperature corresponding to the metal component contained in the conductor, for example, about 900 ° C. in the case of Ag. As a result, the conductors Pa, Pb1 to Pb4, and Pc adjacent to each other via the sheets A, B1 to B4, and C are connected to each other through the portion filled with the through hole to form the spiral coil 2 in the stacking direction.

Next, the same conductive paste P as described above is applied to the end of the fired chip 1 in the stacking direction by a technique such as dipping (see FIG. 5), and this is baked at a temperature lower than the firing temperature. The electrode 3 is formed, and a plating process such as Sn-Pb is performed on the electrode 3 if necessary. Since the ends (leading conductors Pa and Pc) of the coil 2 are led out to the chip end surfaces and are exposed, the exposed portions are connected to the terminal electrodes 3.

Next, another method of manufacturing the laminated inductor shown in FIG. 1 will be described with reference to FIG.

In production, first, an upper layer sheet D, coil layer sheets E1 to E3, and a lower layer sheet F are prepared. It should be noted that although the drawing shows one corresponding to one part, each actual sheet has a size capable of taking a large number of pieces, and is cut into parts dimensions after lamination and pressure bonding.

The upper layer sheet D and the lower layer sheet F are the same, and each is made of a ferrite green sheet mainly composed of Fe ₂ O ₃ , NiO, ZnO or CuO.

The coil layer sheet E1 is obtained by forming a plurality of (five in the figure) through-holes h corresponding to the number of coil turns in the same ferrite green sheet as described above in a substantially line-symmetric manner at intervals in the longitudinal direction. A strip-shaped conductor Pe1 such that both ends thereof overlap with the through hole h facing in the lateral direction.
a is formed, and a U-shaped lead-out conductor Pe1b is formed so that the end thereof overlaps the through hole h at the end position. The conductor Pe1b is for connecting a terminal electrode, and extends to the end of the sheet.

In the sheet E2 for the coil layer, the same number of through holes h as the sheet E1 are formed in the same ferrite green sheet at the same position, and then a circular point conductor Pe2 is formed so as to overlap each through hole h. It is created by doing.

The sheet E3 for a coil layer is formed by forming a strip-shaped conductor Pe3a on a ferrite sheet similar to the above, so that both ends of the through-hole h are obliquely opposed in the short direction of the upper sheet (sheet E2). The L-shaped lead-out conductor Pe3b is formed so that the end of the upper sheet (sheet E2) coincides with the through hole h at the end of the upper sheet (sheet E2). The conductor Pe3b is for connecting a terminal electrode, and extends to the end of the sheet.

The above-mentioned through hole h is formed by laser beam irradiation when the ferrite green sheet is supported by a film, and is formed by punching a die when the ferrite green sheet is not supported by a film. The conductors Pe1a, Pe1b, Pe2, Pe3a, and Pe3b are formed by thick-film printing of a conductor paste containing a metal powder such as Ag by screen printing or the like. Part is filled.

Next, the prepared sheets D, E1 to E
When the film 3 and F are attached, peel them off as shown in FIG.
And then pressure-bonded at a pressure of about 500 kg / cm ² . Incidentally, the number of sheets corresponding to the layer thickness is used for the upper and lower layer sheets D and F, and the number of sheets corresponding to the layer thickness is used for the coil layer sheet E2.

Next, the laminate of the sheets D, E1 to E3, and F is fired at a temperature corresponding to the metal component contained in the conductor. As a result, the conductors Pe1a, Pe1b, Pe2, Pe3a,
Pe3b is connected to each other through the through hole filling portion to form the spiral coil 2 orthogonal to the laminating direction.

Next, the same conductive paste as described above is applied to the end of the fired chip at a side perpendicular to the laminating direction by a technique such as dipping, and this is baked at a temperature lower than the firing temperature to form the terminal electrode 3. Is formed, and a plating process such as Sn-Pb is applied to this, if necessary. Since the ends (leading conductors Pe1b and Pe3b) of the coil 2 are led out to the chip end surfaces and are exposed, the exposed portions are connected to the terminal electrodes 3. Thus, the manufacture of the multilayer inductor shown in FIG. 1 is completed.

In the manufacturing method described above, the lead conductors Pe1b and Pe3b are provided on the coil layer sheets E1 and E3, respectively.
However, it is also possible to provide a pair of lead conductors on one sheet.

Next, still another method of manufacturing the laminated inductor shown in FIG. 1 will be described with reference to FIGS.

In manufacturing, first, an upper layer sheet G, coil layer sheets H1 to H3, and a lower layer sheet I are prepared. It should be noted that although the drawing shows one corresponding to one part, each actual sheet has a size capable of taking a large number of pieces, and is cut into parts dimensions after lamination and pressure bonding.

The upper-layer sheet G and the lower-layer sheet I are the same, each being a ferrite green sheet mainly composed of Fe ₂ O ₃ , NiO, ZnO or CuO.

A plurality of (five in the figure) through holes h corresponding to the number of coil turns are collectively formed in the same ferrite green sheet as described above, and the coil layer sheet H1 is spaced substantially in the longitudinal direction and is substantially line-symmetric. Then, a strip-shaped conductor Ph1a is formed so that both ends thereof overlap with the through hole h facing in the lateral direction, and a U-shaped drawing conductor is formed so that the end overlaps the through hole h at the end position. It is created by forming the conductor Ph1b. This conductor Ph1b
Is for connecting terminal electrodes and extends to the end of the sheet.

The coil layer sheet H2 is formed by forming the same number of through holes h in the same ferrite green sheet as the sheet H1 at the same position, and then aligning the upper and lower through holes h as shown in FIG. 12 is formed by filling the through holes h of the stacked sheets with a conductor paste Ph by a method such as screen printing as shown in FIG. 12, and the paste-filled portion is a point-shaped conductor described in FIG. Instead of

The coil layer sheet H3 is formed by forming a strip-shaped conductor Ph3a on a ferrite sheet similar to the above, so that both ends of the through-hole h are obliquely opposed in the short direction of the upper sheet (sheet H2). The L-shaped lead-out conductor Ph3b is formed so that the end thereof matches the through hole h at the end of the upper sheet (sheet H2). The conductor Ph3b is for connecting a terminal electrode and extends to the end of the sheet.

The above-mentioned through hole h is formed by laser light irradiation when the ferrite green sheet is supported by a film, and is formed by punching a die when the ferrite green sheet is not supported by a film. The conductors Ph1a, Ph1b, Ph3a, and Ph3b are formed by thick-film printing of a conductor paste containing a metal powder such as Ag by screen printing or the like. Will be filled.

Next, the prepared sheets G, H1 to H
When the film 3, 3 is attached,
The layers are laminated in the order shown in FIG. 0, and are pressure-bonded at a pressure of about 30 kg / m ² . Incidentally, the number of sheets G and I for upper and lower layers corresponding to the layer thickness is used.

Next, the laminate of the sheets G, H1 to H3, and I is fired at a temperature corresponding to the metal component contained in the conductor. As a result, the conductors Ph1a, Ph1b, Ph3a, Ph3b adjacent via the sheets G, H1 to H3, I
And the filling paste Ph are connected to each other through the through holes h to form the spiral coil 2 orthogonal to the laminating direction.

Next, the same conductor paste as described above is applied to the end of the fired chip on the side orthogonal to the laminating direction by a technique such as dipping, and is baked at a temperature lower than the sintering temperature. Is formed, and a plating process such as Sn-Pb is applied to this, if necessary. Since the ends (leading conductors Ph1b and Ph3b) of the coil 2 are led out to the chip end surfaces and are exposed, the exposed portions are connected to the terminal electrodes 3. Thus, the manufacture of the multilayer inductor shown in FIG. 1 is completed.

In the manufacturing method described above, the lead-out conductors Ph1b and Ph3b are provided on the coil layer sheets H1 and H3, respectively.
However, it is also possible to provide a pair of lead conductors on one sheet.

FIG. 13 is a schematic perspective view of a laminated transformer according to the present invention.

In the figure, 21 is a rectangular chip made of a magnetic material, 22 is a spiral primary coil embedded in the chip 21, and 23 is embedded in the chip 21 adjacent to the primary coil 22. The spiral secondary coil 24 is a pair of terminal electrodes provided at the end of the chip 21 corresponding to the coils 22 and 23. The circling center line Y of both coils 22 and 23 is parallel to the direction connecting each terminal electrode 24, and the ends of each coil 22 and 23 are led out to the chip end face and connected to each terminal electrode 24.

In the above-described laminated transformer, each coil 22,
Since the circling center line Y of 23 is parallel to the direction connecting the respective terminal electrodes 24, even when the form and position of the terminal electrode 24 are changed and the mounting direction changes, the circulating center of each coil 22, 23 with respect to the substrate surface. The direction of the line Y does not change, and the positional relationship between each of the coils 22 and 23 and the substrate Z is maintained constant, so that stable electric characteristics can be obtained.

Here, a method of manufacturing the laminated transformer shown in FIG. 13 will be described with reference to FIG.

In manufacturing, first, an upper layer sheet J, coil layer sheets K1 to K4, and a lower layer sheet L are prepared. It should be noted that although the drawing shows one corresponding to one part, each actual sheet has a size capable of taking a large number of pieces, and is cut into parts dimensions after lamination and pressure bonding.

The upper sheet J is made of Fe ₂ O ₃ , NiO,
After forming two through holes h of a predetermined diameter at predetermined positions of a ferrite green sheet mainly composed of ZnO or CuO or the like, a rectangular lead conductor Pj is formed so as to overlap each through hole h. Have been.

The coil layer sheets K1 to K4 are formed by forming two through holes h at predetermined positions of the same ferrite green sheet as described above, and then forming four types of U-shape so that the ends thereof overlap the respective through holes h. Coil conductors Pk1 to Pk
4 are formed by forming two pieces each. The shape of the coil conductors Pk1 to Pk4 may be variously non-annular, such as L-shaped, in addition to U-shaped.

As in the case of the upper layer sheet J, the lower layer sheet L is formed by forming two through holes h of a predetermined diameter at predetermined positions of the ferrite green sheet, and then forming a rectangular lead conductor so as to overlap each through hole h. It is created by forming Pl.

The above-mentioned through hole h is formed by laser beam irradiation when the ferrite green sheet is supported by a film, or by punching out a die when the ferrite green sheet is not supported by a film. The conductors Pj, Pk1 to Pk4, and Pl are formed by thick-film printing of a conductor paste containing a metal powder such as Ag by screen printing or the like, and a part of the print paste is printed in the through hole h at the time of printing. Will be filled.

Next, the prepared sheets J, K1 to K
4, when L is attached to the film,
The layers are laminated in the order shown in FIG. 4 and pressed under a pressure of about 30 kg / m ² . Incidentally, the number of sheets for the upper and lower layers J and L corresponds to the layer thickness, and the sheets for coil layers K1 to K
4 is the number corresponding to the number of coil turns.

Next, the laminate of each of the sheets J, K1 to K4, L is subjected to a temperature corresponding to the metal component contained in the conductor, for example, A
In the case of g, firing is performed at a temperature of about 900 ° C. As a result, the adjacent conductors Pj, Pk1 to Pk4, and Pl are connected to each other through the through-hole filling portions via the sheets J, K1 to K4, and L, and the spiral coils 22, 2 in the stacking direction are connected.
It becomes 3.

Next, the same conductive paste as described above is partially applied in a band shape to the end of the fired chip 21 in the laminating direction by a technique such as dipping, and is baked at a temperature lower than the sintering temperature. 24 is formed and, if necessary, is plated with Sn-Pb or the like. Since the ends (leading conductors Pj and Pl) of the coils 22 and 23 are led out to the chip end surfaces and are exposed, the exposed portions are connected to the terminal electrodes 24. Thus, the manufacture of the multilayer transformer shown in FIG. 13 is completed.

Next, another method of manufacturing the laminated transformer shown in FIG. 13 will be described with reference to FIG.

In manufacturing, first, an upper layer sheet M, coil layer sheets N1 to N3, and a lower layer sheet O are prepared. It should be noted that although the drawing shows one corresponding to one part, each actual sheet has a size capable of taking a large number of pieces, and is cut into parts dimensions after lamination and pressure bonding.

The upper layer sheet M and the lower layer sheet O are the same, and each is made of a ferrite green sheet mainly composed of Fe ₂ O ₃ , NiO, ZnO or CuO.

The sheet N1 for the coil layer is formed by forming a plurality (five in the figure) of through-holes h corresponding to the number of turns of the coil on the same ferrite green sheet as described above, leaving a gap in the lateral direction and forming a substantially line-symmetric left and right shape. After the two sets are formed, a strip-shaped conductor Pn1a is formed so that both ends thereof overlap with the through hole h facing in the longitudinal direction, and a U-shaped drawing hole is formed so that the end overlaps the through hole h at the end position. It is created by forming the conductor Pn1b. The conductor Pn1b is for connecting a terminal electrode, and extends to the end of the sheet.

In the coil layer sheet N2, the same number of through holes h as the sheet N1 are formed in the same ferrite green sheet at the same position, and then a circular point conductor Pn2 is formed so as to overlap each through hole h. It is created by doing.

The coil layer sheet N3 is formed by forming a strip-shaped conductor Pn3a on a ferrite sheet similar to the above so that both ends of the through-hole h are obliquely opposed in the short direction of the upper sheet (sheet N2). The L-shaped lead-out conductor Pn3b is formed so that the end of the upper sheet (sheet N2) matches the through hole h at the end of the upper sheet (sheet N2). The conductor Pn3b is for connecting a terminal electrode and extends to the end of the sheet.

The above-mentioned through hole h is formed by laser beam irradiation when the ferrite green sheet is supported by a film, and by punching out a die when the ferrite green sheet is not supported by a film. The conductors Pn1a, Pn1b, Pn2, Pn3a, and Pn3b are formed by thick-film printing of a conductor paste containing a metal powder such as Ag by screen printing or the like. Part is filled.

Next, the prepared sheets M, N1 to N
In the case where 3, O is attached to the film,
The layers are laminated in the order shown in FIG. 5, and are pressure-bonded at a pressure of about 30 kg / m ² . Incidentally, the number of sheets corresponding to the layer thickness is used for the upper and lower sheets M and O, and the number of sheets corresponding to the layer thickness is used for the coil layer sheet N2.

Next, the laminate of the sheets M, N1 to N3, O is fired at a temperature corresponding to the metal component contained in the conductor. As a result, the conductors Pn1a, Pn1b, Pn2, Pn3a,
Pn3b is connected to each other through a through hole h to form spiral coils 22 and 23 orthogonal to the stacking direction.

Next, the same conductive paste as described above is partially applied in a strip shape to the end of the fired chip 21 on the side orthogonal to the laminating direction by a technique such as dipping, and the temperature is lower than the firing temperature. To form a terminal electrode 24, which is plated with Sn-Pb or the like as necessary. Ends of the coils 22 and 23 (leading conductors Pn1
b, Pn3b) is led out to the end face of the chip and is exposed, so that the exposed portion is connected to the terminal electrode 24. Fig. 1
The manufacture of the multilayer transformer shown in FIG. 3 is completed.

The above-mentioned coil layer sheet N2 is the same as that shown in FIG.
Similarly to the manufacturing method described with reference to FIG. 0 to FIG. 12, a predetermined number of ferrite green sheets after the formation of the through holes are stacked, and the conductive paste is filled into the through holes of the stacked sheets by a method such as screen printing. In the above-described manufacturing method, the lead conductors Pn1b and Pn3 are provided on the coil layer sheets N1 and N3, respectively.
Although b is formed, it is also possible to provide a pair of lead conductors on one sheet.

In the case where a high magnetic permeability portion is formed at the center of each coil of the laminated transformer shown in FIG. 13, the coil layer sheet shown in FIG. A coil K1a in which a hole K1a is filled with an unfired ferrite material μH having high magnetic permeability in the center portion of the coil may be used as the coil layer sheet K1 (the same applies to the sheets K2 to K4). In addition, the manufacturing method described with reference to FIG.
, A sheet in which a long hole N2a formed in the center of the coil of the sheet is filled with an unfired ferrite material μH having a high magnetic permeability may be used as the coil layer sheet N2. In any case, a method such as laser beam irradiation or die punching can be used to form the holes, and a method such as screen printing can be used to fill the unfired ferrite material.

Although the example in which the present invention is applied to the multilayer inductor and the multilayer transformer has been described above, the present invention can be widely applied to electronic components other than the embodiment in which one or a plurality of coils are incorporated, and the same effect can be obtained. it can.

[0072]

As described in detail above, according to the present invention,
It is possible to accurately manufacture a laminated electronic component including a coil having a structure in which a circumferential center line is parallel to a direction connecting terminal electrodes in a chip having a structure stacked in a direction connecting terminal electrodes. In this laminated electronic component, since the winding center line of the coil is parallel to the direction connecting the terminal electrodes, even when a plurality of mounting directions are possible or when the mounting direction is changed by changing the form and position of the terminal electrodes. In addition, the orientation of the winding center line of the coil with respect to the substrate surface does not change, and the positional relationship between the coil and the substrate can be maintained constant to obtain stable electric characteristics.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of a multilayer inductor according to the present invention.

FIG. 2 is a schematic perspective view of a multilayer inductor according to the present invention.

FIG. 3 is a diagram showing a method of manufacturing the multilayer inductor shown in FIG.

FIG. 4 is a perspective view showing a lamination and pressure bonding process.

FIG. 5 is a perspective view showing a terminal electrode forming step.

FIG. 6 is a schematic sectional view of a conventional multilayer inductor.

FIG. 7 is a diagram showing a mounting example of a conventional multilayer inductor.

FIG. 8 is a diagram showing a mounting example of a conventional multilayer inductor.

FIG. 9 is a view showing another method of manufacturing the multilayer inductor shown in FIG. 1;

FIG. 10 is a view showing another method of manufacturing the multilayer inductor shown in FIG. 1;

FIG. 11 is an explanatory diagram of a procedure for preparing a coil layer sheet.

FIG. 12 is an explanatory diagram of a procedure for preparing a coil layer sheet.

FIG. 13 is a schematic sectional view of a multilayer transformer according to the present invention.

14 is a diagram showing a method of manufacturing the laminated transformer shown in FIG.

FIG. 15 is a view showing another method of manufacturing the laminated transformer shown in FIG. 13;

FIG. 16 is a diagram showing a method of forming a high magnetic permeability portion at the center of the coil.

FIG. 17 is a diagram showing a method of forming a high magnetic permeability portion at the center of the coil.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Chip, 2 ... Coil, 3 ... Terminal electrode, Y ... Circumferential center line, A ... Upper layer sheet, Pa ... Lead-out conductor, B
1 to B4: sheet for coil layer, Pb1 to Pb4: conductor for coil, C: sheet for lower layer, Pc: conductor for extraction, D: sheet for upper layer, E1 to E3: sheet for coil layer, Pe1
a, Pe3a: strip conductor, Pe1b, Pe3b: lead conductor, Pe2: point conductor, F: lower layer sheet, G: upper layer sheet, H1 to H3: coil layer sheet, Ph1a,
Ph3a: strip conductor, Ph1b, Ph3b: lead conductor, Ph: filling paste, I: lower layer sheet, 21: chip, 22: primary coil, 23: secondary coil, 24: terminal electrode, Y: coil winding Center line, J ... upper layer sheet,
Pj: Leading conductor, K1 to K4: Coil sheet, P
k1 to Pk4: conductor for coil, L: sheet for lower layer, Pl
... Lead-out conductors, M ... upper layer sheets, N1 to N3 ... coil layer sheets, Pn1a, Pn3a ... strip conductors, Pn1
b, Pn3b: Leading conductor, Pn2: Point conductor, O: Sheet for lower layer.

Claims (5)

[Claims] 1. A plurality of green sheets each having a non-circular conductor for a coil and a conductor-filled through-hole connected to an end of the non-circular conductor, wherein each non-circular conductor of the sheet passes through a conductor-filled through-hole. A plurality of green sheets having conductor-filled through holes on both sides in the stacking direction are connected in the stacking direction, and a plurality of green sheets having through holes filled with conductors are connected in the stacking direction. The through-hole-filled conductor at one end is stacked so as to connect to the non-annular conductor at the end in the stacking direction, the entire stack is crimped, the crimped laminate is fired, and the end of the fired laminate is stacked. A terminal electrode formed so as to be connected to each of the exposed ends of the through-hole-filled conductor at the end in the stacking direction. . 2. A plurality of through-hole-filling conductors connected in the stacking direction, the through-hole-filling conductor on the non-annular conductor side is connected to the non-circular conductor in surface contact, and the through-hole-filling conductor on the terminal electrode side is connected to the terminal electrode. The method for manufacturing a multilayer electronic component according to claim 1, wherein the components are connected to each other in a surface contact state. 3. A total length of a plurality of through-hole filling conductors connecting the non-circular conductor and the terminal electrode is made larger than a length of a part of the terminal electrode which goes around the chip side surface. 3. The method for manufacturing a multilayer electronic component according to item 1. 4. The multilayer electronic component according to claim 1, wherein a size of a connection surface of the through hole filling conductor connected to the terminal electrode is larger than that of the through hole. Manufacturing method. 5. The non-circular conductor according to claim 1, wherein the size of the connecting surface of the through-hole filling conductor connected to the non-circular conductor is substantially equal to the width of the non-circular conductor. Of manufacturing a multilayer electronic component.