JP2000003627A - Power cable - Google Patents

Power cable

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Publication number
JP2000003627A
JP2000003627A JP16894298A JP16894298A JP2000003627A JP 2000003627 A JP2000003627 A JP 2000003627A JP 16894298 A JP16894298 A JP 16894298A JP 16894298 A JP16894298 A JP 16894298A JP 2000003627 A JP2000003627 A JP 2000003627A
Authority
JP
Japan
Prior art keywords
semiconductive layer
easily peelable
power cable
inorganic filler
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP16894298A
Other languages
Japanese (ja)
Inventor
Atsushi Suzuki
淳 鈴木
Kazuhiko Goto
和彦 後藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP16894298A priority Critical patent/JP2000003627A/en
Publication of JP2000003627A publication Critical patent/JP2000003627A/en
Withdrawn legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent projections, eruptions, etc., from arising on a surface of an easily peelable outer semiconductive layer, in the case of a power cable having an easily peelable outer semiconductive layer comprising a composition made by mixing a base polymer mainly composed of an EVA with carbon black and a nonorganic filler. SOLUTION: An easily peelable outer semiconductive layer 4 comprises a composition made by mixing an ethylene-vinyl acetate copolymer with carbon black and a surface treated nonorganic filler, and the number of projections not less than 20 μm in height is one or less per 10 cm2 of its surface. As the nonorganic filler, a filler surface-treated by a higher fatty acid such as stearic acid or by a surfactant is used.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、使用電圧が6〜
33kv級の電力ケーブルに関する。
BACKGROUND OF THE INVENTION The present invention relates to a power supply having a working voltage of 6 to
It relates to a 33 kv class power cable.

【0002】[0002]

【従来の技術】この種の電力ケーブルは、導体上に内部
半導電層,架橋ポリエチレンからなる絶縁体を設け、こ
の上に易剥離性外部半導電層を設け、この上に銅テープ
を巻回して遮蔽層を設け、さらにポリエチレン,ポリ塩
化ビニルなどからなるシースを被覆した構造となってい
る。上記易剥離性外部半導電層には、エチレン−酢酸ビ
ニル共重合体(EVA)をベースポリマーとし、これに
カーボンブラック,老化防止剤等を配合し、架橋ポリエ
チレンからなる絶縁体に対する接着力を弱めた半導電性
組成物が主に使用される。
2. Description of the Related Art In this type of power cable, an inner semiconductive layer and an insulator made of crosslinked polyethylene are provided on a conductor, an easily peelable outer semiconductive layer is provided thereon, and a copper tape is wound thereon. A shielding layer is provided, and a sheath made of polyethylene, polyvinyl chloride, or the like is further covered. The easily peelable outer semiconductive layer is made of an ethylene-vinyl acetate copolymer (EVA) as a base polymer, and is blended with carbon black, an antioxidant and the like to weaken the adhesive strength to an insulator made of cross-linked polyethylene. Semiconductive compositions are mainly used.

【0003】この半導電性組成物は、加熱されるとベー
スポリマーのEVAが部分的に分解し、酢酸を発生す
る。このために、このケーブルが高温環境下に置かれる
と、易剥離性外部半導電層で発生した酢酸によって遮蔽
層の銅テープが腐食し、緑青が生じる。このような不都
合を防止するため、易剥離性外部半導電層をなす半導電
性組成物に、発生する酢酸を捕捉し、中和するための受
酸剤が配合される。この受酸剤には、炭酸カルシウムな
どの無機充填剤が用いられるが、この無機充填剤粒子が
半導電性組成物中で凝集して大きな塊となり、これが押
出被覆された易剥離性外部半導電層の表面に突起やブツ
として表われ、電界が集中する電気的欠陥となることが
あった。
When this semiconductive composition is heated, the base polymer EVA is partially decomposed to generate acetic acid. Therefore, when the cable is placed in a high-temperature environment, acetic acid generated in the easily peelable outer semiconductive layer corrodes the copper tape of the shielding layer and produces patina. In order to prevent such inconvenience, an acid acceptor for capturing and neutralizing acetic acid generated is blended in the semiconductive composition forming the easily peelable external semiconductive layer. As the acid acceptor, an inorganic filler such as calcium carbonate is used, and the inorganic filler particles are aggregated in the semiconductive composition to form a large lump, which is extruded and coated to form an easily peelable external semiconductive material. It appeared as protrusions or bumps on the surface of the layer, and sometimes caused electrical defects in which the electric field was concentrated.

【0004】[0004]

【発明が解決しようとする課題】よって、本発明におけ
る課題は、電力ケーブルの易剥離性外部半導電層をなす
組成物として、無機充填剤の受酸剤を配合したものを用
いた場合において易剥離性外部半導電層の表面に突起や
ブツが生じないようにすることにある。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an easy-to-separate outer semiconductive layer for an electric power cable, in which a composition containing an acid acceptor of an inorganic filler is used. An object of the present invention is to prevent projections and bumps from being formed on the surface of the peelable external semiconductive layer.

【0005】[0005]

【課題を解決するための手段】かかる課題は、受酸剤と
して用いられる無機充填剤として表面処理された無機充
填剤を用い分散性を高めて粒子の凝集を防止し、これに
より易剥離性外部半導電層の表面10cm2当り、高さ
20μm以下の突起を1個以下とすることによって解決
できる。
The object of the present invention is to use a surface-treated inorganic filler as an inorganic filler used as an acid acceptor to enhance dispersibility and prevent agglomeration of particles. The problem can be solved by reducing the number of projections having a height of 20 μm or less to one or less per 10 cm 2 of the surface of the semiconductive layer.

【0006】[0006]

【発明の実施の形態】以下、本発明を詳しく説明する。
図1は、本発明の電力ケーブルの一例を示すもので、図
中符号1は導体である。この導体1上には内部半導電層
2が設けられ、この内部半導電層2上には架橋ポリエチ
レンからなる絶縁体3が設けられ、この絶縁体3上に
は、易剥離性外部半導電層4が設けられている。さら
に、この易剥離性外部半導電層4上には銅テープが巻回
されて遮蔽層5が設けられ、この上にはポリエチレン,
ポリ塩化ビニルなどからなるシース6が被覆されてい
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
FIG. 1 shows an example of a power cable according to the present invention, in which reference numeral 1 denotes a conductor. An inner semiconductive layer 2 is provided on the conductor 1, and an insulator 3 made of cross-linked polyethylene is provided on the inner semiconductive layer 2. On the insulator 3, an easily peelable outer semiconductive layer is provided. 4 are provided. Further, a copper tape is wound around the easily peelable outer semiconductive layer 4 to provide a shielding layer 5, on which polyethylene,
A sheath 6 made of polyvinyl chloride or the like is covered.

【0007】上記易剥離性外部半導電層4は、EVA7
0〜100重量%とスチレン変性EVA0〜30重量部
%からなるベースポリマー100重量部に対してカーボ
ンブラック40〜80重量部、表面処理無機充填剤0.
5〜10重量部,老化防止剤0.5〜5重量部、滑剤0
〜3重量部を配合してなる組成物を押出被覆法によって
形成したものである。
The easily peelable external semiconductive layer 4 is made of EVA7
40 to 80 parts by weight of carbon black based on 100 parts by weight of a base polymer consisting of 0 to 100% by weight and 0 to 30% by weight of styrene-modified EVA, and a surface-treated inorganic filler of 0.
5 to 10 parts by weight, antioxidant 0.5 to 5 parts by weight, lubricant 0
~ 3 parts by weight of a composition formed by extrusion coating.

【0008】ベースポリマーとなるEVAには、酢酸ビ
ニル含量が20〜30重量%、メルトインデックスが1
〜50程度のものが用いられる。スチレン変性EVA
は、酢酸ビニル含量20〜30重量%のEVAにスチレ
ン系モノマーを3〜10重量%グラフト処理して得られ
たもので、このスチレン変性EVAを添加することで、
架橋ポリエチレンに対する密着力が低下し、外部半導電
性の剥離性が向上するが、その上限はベースポリマー中
30重量%とされ、これを越えると密着性が過度に低下
する。このスチレン変性EVAは必ずしも必要とされる
わけではない。
EVA as a base polymer has a vinyl acetate content of 20 to 30% by weight and a melt index of 1
Approximately 50 are used. Styrene-modified EVA
Is obtained by grafting 3 to 10% by weight of a styrene monomer to EVA having a vinyl acetate content of 20 to 30% by weight. By adding this styrene-modified EVA,
The adhesion to the crosslinked polyethylene is reduced, and the releasability of the external semiconductive is improved. The upper limit is 30% by weight in the base polymer, and if it exceeds this, the adhesion is excessively reduced. This styrene-modified EVA is not always required.

【0009】表面処理無機充填剤は、炭酸カルシウム,
酸化マグネシウム,水酸化マグネシウム,酸化亜鉛など
の無機充填剤の粒子の表面をステアリン酸,オレイン
酸,パルミチン酸などの高級脂肪酸やカチオン系,アニ
オン系の界面活性剤で薄く10〜100nm程度に、コ
ーティングしたものである。表面処理の具体的な手法
は、無機充填剤を高速攪拌しながら、これに液状の処理
剤を滴下するか、霧状で噴霧するなどの方法によって行
われる。処理剤の無機充填剤粒子への付着量は5〜10
重量%程度とされる。この表面処理無機充填剤の配合量
は、ベースポリマー100重量部に対して、0.5〜1
0重量部とされ、0.5重量部未満では、受酸剤として
効果が得られず、10重量部を越えると半導電材料の吸
水量が増加し、押出成形時の発泡の原因となる。
The surface-treated inorganic filler includes calcium carbonate,
Coating the surface of inorganic filler particles such as magnesium oxide, magnesium hydroxide, zinc oxide, etc., with a higher fatty acid such as stearic acid, oleic acid, palmitic acid or a cationic or anionic surfactant to a thickness of about 10 to 100 nm. It was done. As a specific method of the surface treatment, a method in which a liquid treatment agent is dropped or sprayed in a mist state while stirring the inorganic filler at a high speed is performed. The amount of the treatment agent attached to the inorganic filler particles is 5 to 10
% By weight. The amount of the surface-treated inorganic filler is 0.5 to 1 with respect to 100 parts by weight of the base polymer.
When the amount is less than 0.5 part by weight, the effect as an acid acceptor cannot be obtained. When the amount exceeds 10 parts by weight, the water absorption of the semiconductive material increases, which causes foaming during extrusion molding.

【0010】カーボンブラックとしては、特に限定され
ることはないが、粒子が細かく、凝集しにくいものが好
ましく、なかでもファーネスブラックが望ましい。この
カーボンブラックの配合量は、ベースポリマー100重
量部に対して40〜80重量部の範囲とされ、外部半導
電層4に要求される導電性によって決められる。また、
老化防止剤には、4,4’−チオビス−(6−第3ブチ
ル−3−メチルフェノール)などのフェノール系老化防
止剤が用いられ、滑剤にはステアリン酸亜鉛などの金属
石けんが用いられる。
[0010] The carbon black is not particularly limited, but preferably has fine particles and is hardly aggregated, and furnace black is particularly preferred. The amount of the carbon black is in the range of 40 to 80 parts by weight based on 100 parts by weight of the base polymer, and is determined by the conductivity required for the external semiconductive layer 4. Also,
As the antioxidant, a phenolic antioxidant such as 4,4'-thiobis- (6-tert-butyl-3-methylphenol) is used, and as the lubricant, a metallic soap such as zinc stearate is used.

【0011】このような電力ケーブルの易剥離性外部半
導電層4にあっては、受酸剤として配合された無機充填
剤が表面処理された無機充填剤であるので、無機充填剤
粒子のベースポリマーへの分散性が高まり、組成物中で
粒子が凝集することがなくなり、その表面に突起,ブツ
などとして表われることがなくなり、平坦となる。この
ため、この易剥離性外部半導電層4の表面10cm2
り、高さ20μm以下の突起の数が1個以下、ほぼ0個
となり、電界が集中する電気的欠陥が生じない。
In the easily peelable outer semiconductive layer 4 of such a power cable, the inorganic filler compounded as an acid acceptor is a surface-treated inorganic filler. The dispersibility in the polymer is increased, the particles do not agglomerate in the composition, and the surface does not appear as projections or bumps, and the surface becomes flat. For this reason, the number of protrusions having a height of 20 μm or less per one 10 cm 2 of the surface of the easily peelable external semiconductive layer 4 is one or less, almost zero, and an electric defect in which an electric field is concentrated does not occur.

【0012】また、電力ケーブルが高温環境下に置か
れ、易剥離性外部半導電層4のベースポリマーのEVA
から酢酸が発生しても表面処理無機充填剤によって同様
に捕捉,,中和され、この外側の銅テープからなる遮蔽
層5が腐食,劣化することがない。 さらに、ベースポ
リマーとして、EVAもしくはEVAとスチレン変性E
VAとの混合物を用いているので、架橋ポリエチレンか
らなる絶縁体に対して良好な剥離性を発揮する。
The power cable is placed in a high temperature environment, and the EVA of the base polymer of the easily peelable outer semiconductive layer 4 is used.
Even when acetic acid is generated, the acetic acid is similarly trapped and neutralized by the surface-treated inorganic filler, so that the outer shielding layer 5 made of copper tape does not corrode or deteriorate. Further, EVA or EVA and styrene-modified E
Since a mixture with VA is used, it exhibits good releasability from an insulator made of cross-linked polyethylene.

【0013】以下、具体例を示して作用,効果を明確に
するが、本発明はこれら具体例に限定されるものではな
い。ベースポリマーとして、酢酸ビニル含量28重量
%、メルトインデックス4.0のEVAと、このEVA
にスチレンモノマーを種々の割合でグラフト共重合させ
たスチレンモノマー含有量が3重量%、7重量%、10
重量%のスチレン変性EVA(以下、S−EVA−3、
S−EVA−7、S−EVA−10と表記する。)とを
用い、これに表1および表2に示すファーネスカーボン
ブラック,表面処理無機充填剤,無処理無機充填剤,老
化防止剤,滑剤を配合して組成物とした。
Hereinafter, the operation and effects will be clarified by showing specific examples, but the present invention is not limited to these specific examples. As a base polymer, EVA having a vinyl acetate content of 28% by weight and a melt index of 4.0;
The styrene monomer is graft-copolymerized at various ratios to the styrene monomer content of 3% by weight, 7% by weight,
% By weight of styrene-modified EVA (hereinafter, S-EVA-3,
It is described as S-EVA-7 or S-EVA-10. ), And furnace carbon black, a surface-treated inorganic filler, an untreated inorganic filler, an antioxidant, and a lubricant as shown in Tables 1 and 2 were blended into a composition.

【0014】表面処理無機充填剤としては、ステアリン
酸を用いて表面処理したものを用い、老化防止剤にフェ
ノール系老化防止剤を、滑剤にはステアリン酸亜鉛を使
用した。。
As the surface-treated inorganic filler, a surface-treated one using stearic acid was used. A phenolic antioxidant was used as an antioxidant, and zinc stearate was used as a lubricant. .

【0015】これら組成物を架橋ポリエチレン絶縁体上
に押出被覆して易剥離性外部半導電層とし、6kv 1
×100mm2の架橋ポリエチレン絶縁電力ケーブルを
製造した。この電力ケーブルの易剥離性外部半導電層に
ついて、剥離性,押出加工性,平滑性を検討した。
These compositions were extrusion coated onto a crosslinked polyethylene insulator to form an easily releasable outer semiconductive layer, comprising 6 kv 1
A crosslinked polyethylene insulated power cable of × 100 mm 2 was manufactured. The peelability, extrusion workability, and smoothness of the easily peelable outer semiconductive layer of this power cable were examined.

【0016】剥離性は、得られた電力ケーブルの易剥離
性外部半導電層にケーブルの長手方向に0.5インチ幅
の平行な切り目を入れ、50℃で絶縁体からの剥離の容
易さで評価した。押出加工性は、組成物を押出機で押し
出す際、組成物が押出機からでないか、電動機の負荷が
著しく高い場合を×として評価した。
The peelability of the obtained power cable was determined by making parallel cuts of 0.5 inch width in the longitudinal direction of the cable in the easily peelable outer semiconductive layer of the obtained power cable, and at 50 ° C. for easy peeling from the insulator. evaluated. The extrudability was evaluated as x when the composition was not extruded or the load on the motor was extremely high when the composition was extruded with an extruder.

【0017】平滑性は、得られたケーブルの易剥離性外
部半導電層の表面を面積10cm2にわって顕微鏡観察
し、20μm以上の高さの突起の有無によって評価し、
突起がない場合を○とし、5個以上ある場合には×とし
て表示した。
The smoothness is evaluated by observing the surface of the easily peelable external semiconductive layer of the obtained cable over an area of 10 cm 2 under a microscope and detecting the presence of projections having a height of 20 μm or more.
When there were no protrusions, the result was indicated by ○, and when there were five or more protrusions, the result was indicated by ×.

【0018】また、銅変色試験を以下のように実施し
た。上記組成物を押出成形して厚さ約1mmのテストシ
ートとし、このテストシートと厚さ5mmの架橋ポリエ
チレンからなるシートとをホットプレスによって貼り合
せ、さらにこの貼り合せシートのテストシート側に銅箔
(厚さ0.1mm)を250℃で貼り合せて銅変色試験
用のサンプルとした。このサンプルを、湿度70%RH
一定とし、温度室温〜60℃のヒートサイクルを与えつ
つ2週間放置し、2週間後に銅箔の変色を目視で観察
し、変色が生じないか緑青が発生していない場合を○と
し、変色,緑青が認められたものを×とした。
Further, a copper discoloration test was carried out as follows. The above composition was extruded into a test sheet having a thickness of about 1 mm, and this test sheet and a sheet made of crosslinked polyethylene having a thickness of 5 mm were bonded by hot pressing, and a copper foil was further placed on the test sheet side of the bonded sheet. (Thickness: 0.1 mm) was bonded at 250 ° C. to obtain a sample for a copper discoloration test. This sample was subjected to a humidity of 70% RH.
Leave constant for 2 weeks while giving a heat cycle of room temperature to 60 ° C., and visually observe the discoloration of the copper foil after 2 weeks. Those with patina were recognized as x.

【0019】以上を結果をまとめて、表1および表2に
示す。表1および表2において、配合量はすべて重量部
である。
The above results are summarized in Tables 1 and 2. In Tables 1 and 2, all amounts are parts by weight.

【0020】[0020]

【表1】 [Table 1]

【0021】[0021]

【表2】 [Table 2]

【0022】表1および表2から明らかなように、受酸
剤として表面処理無機充填剤を用いることによって、易
剥離性外部半導電層の表面に突起やブツが発生すること
が防止できることがわかる。
As is clear from Tables 1 and 2, the use of the surface-treated inorganic filler as the acid acceptor can prevent the occurrence of projections and bumps on the surface of the easily peelable external semiconductive layer. .

【0023】[0023]

【発明の効果】以上説明したように、本発明の電力ケー
ブルにあっては、エチレン−酢酸ビニル共重合体を主体
とするベースポリマーと表面処理無機充填剤を含む組成
物からなる易剥離性外部半導電層を有するものであるの
で、易剥離性外部半導電層の表面に突起やブツが表われ
ることがなくなり、電気的欠陥が生じることがない。ま
た、エチレン−酢酸ビニル共重合体の分解によって発生
する酢酸が表面処理無機充填剤によって捕捉,中和さ
れ、遮蔽層の銅テープの腐食が防止される。
As described above, in the power cable of the present invention, an easily peelable external cable made of a composition containing a base polymer mainly composed of an ethylene-vinyl acetate copolymer and a surface-treated inorganic filler. Since it has a semiconductive layer, no protrusions or bumps appear on the surface of the easily peelable external semiconductive layer, and no electrical defect occurs. Also, acetic acid generated by the decomposition of the ethylene-vinyl acetate copolymer is trapped and neutralized by the surface-treated inorganic filler, thereby preventing corrosion of the copper tape of the shielding layer.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明の電力ケーブルの一例を示す概略断面
図である。
FIG. 1 is a schematic sectional view showing an example of a power cable of the present invention.

【符号の説明】[Explanation of symbols]

4…易剥離性外部半導電層、5…遮蔽層 4: Easy peeling outer semiconductive layer, 5: Shielding layer

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4J002 BB061 BN072 DA036 DE077 DE107 DE237 FB087 FB237 FD017 FD030 FD170 GQ01 GQ02 5G301 DA18 DA32 DA33 DA45 DD04 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J002 BB061 BN072 DA036 DE077 DE107 DE237 FB087 FB237 FD017 FD030 FD170 GQ01 GQ02 5G301 DA18 DA32 DA33 DA45 DD04

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 易剥離性外部半導電層を有する電力ケー
ブルにおいて、 上記、易剥離性外部半導電層は、エチレン−酢酸ビニル
共重合体にカーボンブラック,表面処理無機充填剤が配
合された組成物からなり、その表面10cm2当り、高
さ20μm以上の突起が1個以下であることを特徴とす
る電力ケーブル。
1. A power cable having an easily peelable external semiconductive layer, wherein the easily peelable external semiconductive layer is a composition in which carbon black and a surface-treated inorganic filler are blended in an ethylene-vinyl acetate copolymer. A power cable, comprising: a projection having a height of 20 μm or more per surface 10 cm 2 .
【請求項2】 表面処理無機充填剤が、高級脂肪酸で表
面処理されたものであることを特徴とする請求項1記載
の電力ケーブル。
2. The power cable according to claim 1, wherein the surface-treated inorganic filler is surface-treated with a higher fatty acid.
【請求項3】 易剥離性外部半導電層上に銅テープが巻
回されたことを特徴とする請求項1記載の電力ケーブ
ル。
3. The power cable according to claim 1, wherein a copper tape is wound on the easily peelable outer semiconductive layer.
JP16894298A 1998-06-16 1998-06-16 Power cable Withdrawn JP2000003627A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16894298A JP2000003627A (en) 1998-06-16 1998-06-16 Power cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16894298A JP2000003627A (en) 1998-06-16 1998-06-16 Power cable

Publications (1)

Publication Number Publication Date
JP2000003627A true JP2000003627A (en) 2000-01-07

Family

ID=15877406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16894298A Withdrawn JP2000003627A (en) 1998-06-16 1998-06-16 Power cable

Country Status (1)

Country Link
JP (1) JP2000003627A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006152112A (en) * 2004-11-29 2006-06-15 Mitsubishi Plastics Ind Ltd Vinyl chloride-based copolymer composition and molded product of the same
CN102163473A (en) * 2010-02-17 2011-08-24 日立电线株式会社 Electric wire and cable using non-halogen flame retardant resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006152112A (en) * 2004-11-29 2006-06-15 Mitsubishi Plastics Ind Ltd Vinyl chloride-based copolymer composition and molded product of the same
CN102163473A (en) * 2010-02-17 2011-08-24 日立电线株式会社 Electric wire and cable using non-halogen flame retardant resin composition
JP2011168676A (en) * 2010-02-17 2011-09-01 Hitachi Cable Ltd Electric wire and cable using non-halogen flame-retardant resin composition

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