JP1665228S - - Google Patents
Info
- Publication number
- JP1665228S JP1665228S JPD2019-26362F JP2019026362F JP1665228S JP 1665228 S JP1665228 S JP 1665228S JP 2019026362 F JP2019026362 F JP 2019026362F JP 1665228 S JP1665228 S JP 1665228S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-26362F JP1665228S (fr) | 2019-11-28 | 2019-11-28 | |
TW109302373F TWD212726S (zh) | 2019-11-28 | 2020-05-04 | 基板處理裝置用晶舟之部分 |
US29/735,900 USD958093S1 (en) | 2019-11-28 | 2020-05-26 | Boat of substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-26362F JP1665228S (fr) | 2019-11-28 | 2019-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1665228S true JP1665228S (fr) | 2020-08-03 |
Family
ID=71843123
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2019-26362F Active JP1665228S (fr) | 2019-11-28 | 2019-11-28 |
Country Status (3)
Country | Link |
---|---|
US (1) | USD958093S1 (fr) |
JP (1) | JP1665228S (fr) |
TW (1) | TWD212726S (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1700777S (fr) * | 2021-03-15 | 2021-11-29 | ||
JP1731675S (fr) * | 2022-05-30 | 2022-12-08 | ||
JP1731674S (fr) * | 2022-05-30 | 2022-12-08 | ||
JP1731673S (fr) * | 2022-05-30 | 2022-12-08 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6341935B1 (en) * | 2000-06-14 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer boat having improved wafer holding capability |
KR100410982B1 (ko) * | 2001-01-18 | 2003-12-18 | 삼성전자주식회사 | 반도체 제조장치용 보트 |
JP2002324830A (ja) * | 2001-02-20 | 2002-11-08 | Mitsubishi Electric Corp | 基板熱処理用保持具、基板熱処理装置、半導体装置の製造方法、基板熱処理用保持具の製造方法及び基板熱処理用保持具の構造決定方法 |
JP4506125B2 (ja) * | 2003-07-16 | 2010-07-21 | 信越半導体株式会社 | 熱処理用縦型ボート及びその製造方法 |
USD655255S1 (en) * | 2010-06-18 | 2012-03-06 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
USD655682S1 (en) * | 2010-06-18 | 2012-03-13 | Hitachi Kokusai Electric Inc. | Boat of wafer processing apparatus |
TWD166332S (zh) * | 2013-03-22 | 2015-03-01 | 日立國際電氣股份有限公司 | 基板處理裝置用晶舟之部分 |
JP1537313S (fr) * | 2014-11-20 | 2015-11-09 | ||
JP1537629S (fr) * | 2014-11-20 | 2015-11-09 | ||
JP1584066S (fr) * | 2017-01-18 | 2017-08-21 |
-
2019
- 2019-11-28 JP JPD2019-26362F patent/JP1665228S/ja active Active
-
2020
- 2020-05-04 TW TW109302373F patent/TWD212726S/zh unknown
- 2020-05-26 US US29/735,900 patent/USD958093S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD958093S1 (en) | 2022-07-19 |
TWD212726S (zh) | 2021-07-21 |