JP1643134S - - Google Patents
Info
- Publication number
- JP1643134S JP1643134S JPD2019-5628F JP2019005628F JP1643134S JP 1643134 S JP1643134 S JP 1643134S JP 2019005628 F JP2019005628 F JP 2019005628F JP 1643134 S JP1643134 S JP 1643134S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-5628F JP1643134S (de) | 2019-03-15 | 2019-03-15 | |
| US29/704,639 USD923587S1 (en) | 2019-03-15 | 2019-09-05 | Semiconductor driving circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2019-5628F JP1643134S (de) | 2019-03-15 | 2019-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1643134S true JP1643134S (de) | 2019-10-07 |
Family
ID=68095697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2019-5628F Active JP1643134S (de) | 2019-03-15 | 2019-03-15 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD923587S1 (de) |
| JP (1) | JP1643134S (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP1650295S (ja) * | 2019-01-11 | 2020-01-20 | 半導体モジュール | |
| JP1649258S (ja) * | 2019-01-11 | 2022-12-21 | 半導体モジュール | |
| JP1710763S (ja) * | 2021-07-21 | 2022-03-25 | プログラマブルコントローラ用メモリーカードリーダー | |
| JP1716511S (ja) * | 2021-11-11 | 2022-06-02 | 電流検出器 | |
| JP1746817S (ja) * | 2022-09-12 | 2023-06-20 | 電流検出器 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013015216A1 (ja) * | 2011-07-26 | 2013-01-31 | 京セラ株式会社 | 半導体素子収納用パッケージ、これを備えた半導体装置および電子装置 |
| DE112013003222B4 (de) * | 2012-06-29 | 2021-08-19 | Denso Corporation | Halbleitervorrichtung und Halbleitervorrichtungsverbindungsstruktur |
| JP2016015821A (ja) * | 2014-07-02 | 2016-01-28 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
| US9425143B2 (en) * | 2014-11-17 | 2016-08-23 | Qualcomm Incorporated | Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield |
| US11246230B2 (en) * | 2016-07-21 | 2022-02-08 | Xcelsis Corporation | Configurable smart object system with methods of making modules and contactors |
-
2019
- 2019-03-15 JP JPD2019-5628F patent/JP1643134S/ja active Active
- 2019-09-05 US US29/704,639 patent/USD923587S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD923587S1 (en) | 2021-06-29 |