JP1624352S - - Google Patents

Info

Publication number
JP1624352S
JP1624352S JPD2018-15808F JP2018015808F JP1624352S JP 1624352 S JP1624352 S JP 1624352S JP 2018015808 F JP2018015808 F JP 2018015808F JP 1624352 S JP1624352 S JP 1624352S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-15808F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-15808F priority Critical patent/JP1624352S/ja
Priority to TW107306664F priority patent/TWD197467S/zh
Priority to US29/672,229 priority patent/USD924953S1/en
Application granted granted Critical
Publication of JP1624352S publication Critical patent/JP1624352S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-15808F 2018-07-19 2018-07-19 Active JP1624352S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-15808F JP1624352S (enExample) 2018-07-19 2018-07-19
TW107306664F TWD197467S (zh) 2018-07-19 2018-11-12 基板處理裝置用氣體導入管
US29/672,229 USD924953S1 (en) 2018-07-19 2018-12-04 Gas inlet attachment for substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-15808F JP1624352S (enExample) 2018-07-19 2018-07-19

Publications (1)

Publication Number Publication Date
JP1624352S true JP1624352S (enExample) 2019-02-12

Family

ID=65269374

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-15808F Active JP1624352S (enExample) 2018-07-19 2018-07-19

Country Status (3)

Country Link
US (1) USD924953S1 (enExample)
JP (1) JP1624352S (enExample)
TW (1) TWD197467S (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD964443S1 (en) 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD1089130S1 (en) 2024-01-19 2025-08-19 Applied Materials, Inc. Process chamber manifold
USD1112376S1 (en) 2024-01-19 2026-02-10 Applied Materials, Inc. Process chamber mixer

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1651622S (enExample) * 2019-07-17 2020-01-27
JP1700780S (ja) 2021-03-22 2021-11-29 基板処理装置用ノズルホルダー
JP1746467S (enExample) * 2023-01-25 2023-06-16
JP1774816S (enExample) * 2024-03-08 2024-07-05
JP1774817S (enExample) * 2024-03-08 2024-07-05

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD326272S (en) * 1988-07-25 1992-05-19 Tel Sagami Limited Heat insulating cylinder for thermal treatment of semiconductor wafers
US20030159653A1 (en) * 2002-02-28 2003-08-28 Dando Ross S. Manifold assembly for feeding reactive precursors to substrate processing chambers
JP5137366B2 (ja) * 2006-01-24 2013-02-06 株式会社日立国際電気 基板処理システム及び液体材料供給装置
US7700054B2 (en) * 2006-12-12 2010-04-20 Hitachi Kokusai Electric Inc. Substrate processing apparatus having gas side flow via gas inlet
WO2013126323A1 (en) * 2012-02-23 2013-08-29 Applied Materials, Inc. Method and apparatus for precursor delivery
US20130276707A1 (en) * 2012-04-23 2013-10-24 Asm Ip Holding B.V. Vertical furnace with circumferentially distributed gas inlet system
TWI473903B (zh) * 2013-02-23 2015-02-21 Hermes Epitek Corp 應用於半導體設備的噴射器與上蓋板總成
US10683571B2 (en) * 2014-02-25 2020-06-16 Asm Ip Holding B.V. Gas supply manifold and method of supplying gases to chamber using same
JP6578243B2 (ja) * 2015-07-17 2019-09-18 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ ガス供給ノズル、基板処理装置、半導体装置の製造方法およびプログラム
KR101710944B1 (ko) * 2015-09-11 2017-02-28 주식회사 유진테크 기판처리장치
KR102483924B1 (ko) * 2016-02-18 2023-01-02 삼성전자주식회사 기화기 및 이를 구비하는 박막 증착 장치
TWI677593B (zh) * 2016-04-01 2019-11-21 美商應用材料股份有限公司 用於提供均勻流動的氣體的設備及方法
JP6710134B2 (ja) * 2016-09-27 2020-06-17 東京エレクトロン株式会社 ガス導入機構及び処理装置
JP1624354S (enExample) * 2018-07-19 2019-02-12
JP1648531S (enExample) * 2019-01-28 2019-12-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD964443S1 (en) 2020-08-18 2022-09-20 Kokusai Electric Corporation Gas inlet attachment for wafer processing apparatus
USD1089130S1 (en) 2024-01-19 2025-08-19 Applied Materials, Inc. Process chamber manifold
USD1112376S1 (en) 2024-01-19 2026-02-10 Applied Materials, Inc. Process chamber mixer

Also Published As

Publication number Publication date
TWD197467S (zh) 2019-05-11
USD924953S1 (en) 2021-07-13

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