JP1620194S - - Google Patents

Info

Publication number
JP1620194S
JP1620194S JPD2018-1070F JP2018001070F JP1620194S JP 1620194 S JP1620194 S JP 1620194S JP 2018001070 F JP2018001070 F JP 2018001070F JP 1620194 S JP1620194 S JP 1620194S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-1070F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-1070F priority Critical patent/JP1620194S/ja
Priority to TW106307446D01F priority patent/TWD195622S/zh
Priority to US29/649,486 priority patent/USD855027S1/en
Application granted granted Critical
Publication of JP1620194S publication Critical patent/JP1620194S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-1070F 2018-01-22 2018-01-22 Active JP1620194S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2018-1070F JP1620194S (enExample) 2018-01-22 2018-01-22
TW106307446D01F TWD195622S (zh) 2018-01-22 2018-05-03 Sealing cover inner cover
US29/649,486 USD855027S1 (en) 2018-01-22 2018-05-30 Cover of seal cap for reaction chamber of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-1070F JP1620194S (enExample) 2018-01-22 2018-01-22

Publications (1)

Publication Number Publication Date
JP1620194S true JP1620194S (enExample) 2018-12-10

Family

ID=64560011

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-1070F Active JP1620194S (enExample) 2018-01-22 2018-01-22

Country Status (3)

Country Link
US (1) USD855027S1 (enExample)
JP (1) JP1620194S (enExample)
TW (1) TWD195622S (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1624334S (enExample) * 2018-05-18 2019-02-12
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD913979S1 (en) * 2019-08-28 2021-03-23 Applied Materials, Inc. Inner shield for a substrate processing chamber
US12100577B2 (en) 2019-08-28 2024-09-24 Applied Materials, Inc. High conductance inner shield for process chamber
USD931241S1 (en) * 2019-08-28 2021-09-21 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD981973S1 (en) * 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
USD980813S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD980814S1 (en) * 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5789810A (en) * 1995-12-21 1998-08-04 International Business Machines Corporation Semiconductor cap
USD642547S1 (en) * 2010-05-26 2011-08-02 Beat Untersee Cover plate for electrical devices
USD720309S1 (en) * 2011-11-18 2014-12-30 Tokyo Electron Limited Inner tube for process tube for manufacturing semiconductor wafers
USD742339S1 (en) * 2014-03-12 2015-11-03 Hitachi Kokusai Electric Inc. Reaction tube
USD748594S1 (en) * 2014-03-12 2016-02-02 Hitachi Kokusai Electric Inc. Reaction tube
US10211115B2 (en) * 2014-05-21 2019-02-19 Materion Corporation Method of making a ceramic combo lid with selective and edge metallizations
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
TWD178424S (zh) * 2016-01-08 2016-09-21 Asm Ip Holding Bv 用於半導體製造設備的氣流控制板
US9859185B2 (en) * 2016-01-28 2018-01-02 Kyocera International, Inc. Semiconductor packaging structure and package having stress release structure
USD813181S1 (en) 2016-07-26 2018-03-20 Hitachi Kokusai Electric Inc. Cover of seal cap for reaction chamber of semiconductor
JP1598442S (enExample) 2017-08-09 2018-02-26
USD840981S1 (en) * 2017-10-20 2019-02-19 Avery Dennison Retail Information Services, Llc RFID inlay

Also Published As

Publication number Publication date
TWD195622S (zh) 2019-01-21
USD855027S1 (en) 2019-07-30

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