JP1602558S - - Google Patents
Info
- Publication number
- JP1602558S JP1602558S JPD2017-16115F JP2017016115F JP1602558S JP 1602558 S JP1602558 S JP 1602558S JP 2017016115 F JP2017016115 F JP 2017016115F JP 1602558 S JP1602558 S JP 1602558S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20170019170 | 2017-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1602558S true JP1602558S (ko) | 2018-04-23 |
Family
ID=61968417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2017-16115F Active JP1602558S (ko) | 2017-04-25 | 2017-07-26 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD853977S1 (ko) |
| JP (1) | JP1602558S (ko) |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090229864A1 (en) * | 2005-09-15 | 2009-09-17 | Mitsubishi Materials Corporation | Insulating circuit board and insulating circuit board having cooling sink |
| USD601515S1 (en) * | 2008-12-17 | 2009-10-06 | Celsia Technologies Taiwan, Inc. | Heat sink |
| JP5120284B2 (ja) * | 2009-02-04 | 2013-01-16 | 株式会社豊田自動織機 | 半導体装置 |
| JP6189015B2 (ja) * | 2012-04-19 | 2017-08-30 | 昭和電工株式会社 | 放熱装置および放熱装置の製造方法 |
| KR20130139011A (ko) * | 2012-06-12 | 2013-12-20 | 한국전자통신연구원 | Ｄｂｃ 기판 및 전력 반도체 모듈 |
| CN104412721B (zh) * | 2012-07-06 | 2018-07-27 | 日本发条株式会社 | 电路基板用层叠板、金属基底电路基板及电源模块 |
| KR101975633B1 (ko) * | 2012-11-20 | 2019-05-07 | 도와 메탈테크 가부시키가이샤 | 금속-세라믹스 접합 기판 및 그 제조 방법 |
| US20160014878A1 (en) * | 2014-04-25 | 2016-01-14 | Rogers Corporation | Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom |
| JP6048558B2 (ja) * | 2014-10-16 | 2016-12-21 | 三菱マテリアル株式会社 | 冷却器付パワーモジュール用基板及びその製造方法 |
| JP6903051B2 (ja) * | 2015-10-07 | 2021-07-14 | セラムテック ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｅｒａｍＴｅｃ ＧｍｂＨ | 二面冷却式回路 |
| JP6137267B2 (ja) * | 2015-10-08 | 2017-05-31 | 三菱マテリアル株式会社 | ヒートシンク付きパワーモジュール用基板及びパワーモジュール |
| US20170205149A1 (en) * | 2016-01-15 | 2017-07-20 | Hamilton Sundstrand Corporation | Heat exchanger channels |
| JP6754973B2 (ja) * | 2017-02-02 | 2020-09-16 | パナソニックＩｐマネジメント株式会社 | グラファイト放熱板 |
-
2017
- 2017-07-26 JP JPD2017-16115F patent/JP1602558S/ja active Active
- 2017-09-22 US US29/618,583 patent/USD853977S1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| USD853977S1 (en) | 2019-07-16 |