USD853977S1 - Heat sink plate - Google Patents
Heat sink plate Download PDFInfo
- Publication number
- USD853977S1 USD853977S1 US29/618,583 US201729618583F USD853977S US D853977 S1 USD853977 S1 US D853977S1 US 201729618583 F US201729618583 F US 201729618583F US D853977 S USD853977 S US D853977S
- Authority
- US
- United States
- Prior art keywords
- heat sink
- sink plate
- view
- plate
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR30-2017-0019170 | 2017-04-25 | ||
KR20170019170 | 2017-04-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD853977S1 true USD853977S1 (en) | 2019-07-16 |
Family
ID=61968417
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/618,583 Active USD853977S1 (en) | 2017-04-25 | 2017-09-22 | Heat sink plate |
Country Status (2)
Country | Link |
---|---|
US (1) | USD853977S1 (ko) |
JP (1) | JP1602558S (ko) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090229864A1 (en) * | 2005-09-15 | 2009-09-17 | Mitsubishi Materials Corporation | Insulating circuit board and insulating circuit board having cooling sink |
USD601515S1 (en) * | 2008-12-17 | 2009-10-06 | Celsia Technologies Taiwan, Inc. | Heat sink |
US20100193941A1 (en) * | 2009-02-04 | 2010-08-05 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device |
US20130277034A1 (en) * | 2012-04-19 | 2013-10-24 | Showa Denko K.K. | Heat dissipation device and method for manufacturing the same |
US20130328200A1 (en) * | 2012-06-12 | 2013-12-12 | Electronics And Telecommunications Research Institute | Direct bonded copper substrate and power semiconductor module |
US20150284296A1 (en) * | 2012-11-20 | 2015-10-08 | Tokuyama Corporation | Metal/ceramic bonding substrate and method for producing same |
US20160014878A1 (en) * | 2014-04-25 | 2016-01-14 | Rogers Corporation | Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom |
US20170205149A1 (en) * | 2016-01-15 | 2017-07-20 | Hamilton Sundstrand Corporation | Heat exchanger channels |
US20170309499A1 (en) * | 2014-10-16 | 2017-10-26 | Mitsubishi Materials Corporation | Power-module substrate with cooler and method of producing the same |
US20180218920A1 (en) * | 2017-02-02 | 2018-08-02 | Panasonic Intellectual Property Management Co., Ltd. | Graphite heat sink |
US20180301391A1 (en) * | 2015-10-08 | 2018-10-18 | Mitsubishi Materials Corporation | Heat-sink-attached power-module substrate and power module |
US20180315679A1 (en) * | 2015-10-07 | 2018-11-01 | Ceramtec Gmbh | Circuit cooled on two-sides |
US20190037692A1 (en) * | 2012-07-06 | 2019-01-31 | Nhk Spring Co., Ltd. | Method of manufacturing a circuit board laminate |
-
2017
- 2017-07-26 JP JPD2017-16115F patent/JP1602558S/ja active Active
- 2017-09-22 US US29/618,583 patent/USD853977S1/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090229864A1 (en) * | 2005-09-15 | 2009-09-17 | Mitsubishi Materials Corporation | Insulating circuit board and insulating circuit board having cooling sink |
USD601515S1 (en) * | 2008-12-17 | 2009-10-06 | Celsia Technologies Taiwan, Inc. | Heat sink |
US20100193941A1 (en) * | 2009-02-04 | 2010-08-05 | Kabushiki Kaisha Toyota Jidoshokki | Semiconductor device |
US20130277034A1 (en) * | 2012-04-19 | 2013-10-24 | Showa Denko K.K. | Heat dissipation device and method for manufacturing the same |
US20130328200A1 (en) * | 2012-06-12 | 2013-12-12 | Electronics And Telecommunications Research Institute | Direct bonded copper substrate and power semiconductor module |
US20190037692A1 (en) * | 2012-07-06 | 2019-01-31 | Nhk Spring Co., Ltd. | Method of manufacturing a circuit board laminate |
US20150284296A1 (en) * | 2012-11-20 | 2015-10-08 | Tokuyama Corporation | Metal/ceramic bonding substrate and method for producing same |
US20160014878A1 (en) * | 2014-04-25 | 2016-01-14 | Rogers Corporation | Thermal management circuit materials, method of manufacture thereof, and articles formed therefrom |
US20170309499A1 (en) * | 2014-10-16 | 2017-10-26 | Mitsubishi Materials Corporation | Power-module substrate with cooler and method of producing the same |
US20180315679A1 (en) * | 2015-10-07 | 2018-11-01 | Ceramtec Gmbh | Circuit cooled on two-sides |
US20180301391A1 (en) * | 2015-10-08 | 2018-10-18 | Mitsubishi Materials Corporation | Heat-sink-attached power-module substrate and power module |
US20170205149A1 (en) * | 2016-01-15 | 2017-07-20 | Hamilton Sundstrand Corporation | Heat exchanger channels |
US20180218920A1 (en) * | 2017-02-02 | 2018-08-02 | Panasonic Intellectual Property Management Co., Ltd. | Graphite heat sink |
Also Published As
Publication number | Publication date |
---|---|
JP1602558S (ko) | 2018-04-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO SMALL (ORIGINAL EVENT CODE: SMAL); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |