JP1582475S - - Google Patents
Info
- Publication number
- JP1582475S JP1582475S JPD2016-22415F JP2016022415F JP1582475S JP 1582475 S JP1582475 S JP 1582475S JP 2016022415 F JP2016022415 F JP 2016022415F JP 1582475 S JP1582475 S JP 1582475S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-22415F JP1582475S (fr) | 2016-10-14 | 2016-10-14 | |
| US29/596,960 USD825502S1 (en) | 2016-10-14 | 2017-03-13 | Heater for substrate processing apparatus |
| TW106301241F TWD187000S (zh) | 2016-10-14 | 2017-03-13 | 基板處理裝置用加熱機之部分 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPD2016-22415F JP1582475S (fr) | 2016-10-14 | 2016-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP1582475S true JP1582475S (fr) | 2017-07-31 |
Family
ID=59384954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JPD2016-22415F Active JP1582475S (fr) | 2016-10-14 | 2016-10-14 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | USD825502S1 (fr) |
| JP (1) | JP1582475S (fr) |
| TW (1) | TWD187000S (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD860420S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
| USD860419S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD518450S1 (en) * | 2003-12-18 | 2006-04-04 | Honeywell International, Inc. | Modular electronic housing |
| KR100860437B1 (ko) * | 2004-10-07 | 2008-09-25 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 및 반도체 디바이스의 제조 방법 |
| JP5117856B2 (ja) * | 2005-08-05 | 2013-01-16 | 株式会社日立国際電気 | 基板処理装置、冷却ガス供給ノズルおよび半導体装置の製造方法 |
| JP4944228B2 (ja) * | 2009-09-16 | 2012-05-30 | 株式会社日立国際電気 | 基板処理方法及び基板処理装置 |
| JP2011066219A (ja) * | 2009-09-17 | 2011-03-31 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法及び基板処理装置 |
| JP5647502B2 (ja) * | 2010-02-23 | 2014-12-24 | 株式会社日立国際電気 | 熱処理装置、半導体装置の製造方法及び基板処理方法。 |
| US8409352B2 (en) * | 2010-03-01 | 2013-04-02 | Hitachi Kokusai Electric Inc. | Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus |
| JP5529634B2 (ja) * | 2010-06-10 | 2014-06-25 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び基板の製造方法 |
| JP1548462S (fr) * | 2015-09-04 | 2016-04-25 |
-
2016
- 2016-10-14 JP JPD2016-22415F patent/JP1582475S/ja active Active
-
2017
- 2017-03-13 US US29/596,960 patent/USD825502S1/en active Active
- 2017-03-13 TW TW106301241F patent/TWD187000S/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD860420S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
| USD860419S1 (en) | 2018-02-27 | 2019-09-17 | Kokusai Electric Corporation | Electric furnace for substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD187000S (zh) | 2017-12-01 |
| USD825502S1 (en) | 2018-08-14 |