JP1582475S - - Google Patents

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Publication number
JP1582475S
JP1582475S JPD2016-22415F JP2016022415F JP1582475S JP 1582475 S JP1582475 S JP 1582475S JP 2016022415 F JP2016022415 F JP 2016022415F JP 1582475 S JP1582475 S JP 1582475S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2016-22415F
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2016-22415F priority Critical patent/JP1582475S/ja
Priority to TW106301241F priority patent/TWD187000S/zh
Priority to US29/596,960 priority patent/USD825502S1/en
Application granted granted Critical
Publication of JP1582475S publication Critical patent/JP1582475S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2016-22415F 2016-10-14 2016-10-14 Active JP1582475S (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JPD2016-22415F JP1582475S (enExample) 2016-10-14 2016-10-14
TW106301241F TWD187000S (zh) 2016-10-14 2017-03-13 基板處理裝置用加熱機之部分
US29/596,960 USD825502S1 (en) 2016-10-14 2017-03-13 Heater for substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2016-22415F JP1582475S (enExample) 2016-10-14 2016-10-14

Publications (1)

Publication Number Publication Date
JP1582475S true JP1582475S (enExample) 2017-07-31

Family

ID=59384954

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2016-22415F Active JP1582475S (enExample) 2016-10-14 2016-10-14

Country Status (3)

Country Link
US (1) USD825502S1 (enExample)
JP (1) JP1582475S (enExample)
TW (1) TWD187000S (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD860420S1 (en) 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus
USD860419S1 (en) 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1731671S (ja) * 2022-03-15 2025-12-15 基板処理装置用炉
JP1731672S (ja) * 2022-03-15 2025-12-15 基板処理装置用炉

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD518450S1 (en) * 2003-12-18 2006-04-04 Honeywell International, Inc. Modular electronic housing
CN100517599C (zh) * 2004-10-07 2009-07-22 株式会社日立国际电气 衬底处理装置以及半导体器件的制造方法
US8148271B2 (en) * 2005-08-05 2012-04-03 Hitachi Kokusai Electric Inc. Substrate processing apparatus, coolant gas supply nozzle and semiconductor device manufacturing method
JP4944228B2 (ja) * 2009-09-16 2012-05-30 株式会社日立国際電気 基板処理方法及び基板処理装置
JP2011066219A (ja) * 2009-09-17 2011-03-31 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置
JP5647502B2 (ja) * 2010-02-23 2014-12-24 株式会社日立国際電気 熱処理装置、半導体装置の製造方法及び基板処理方法。
US8409352B2 (en) * 2010-03-01 2013-04-02 Hitachi Kokusai Electric Inc. Method of manufacturing semiconductor device, method of manufacturing substrate and substrate processing apparatus
JP5529634B2 (ja) * 2010-06-10 2014-06-25 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板の製造方法
JP1548462S (enExample) * 2015-09-04 2016-04-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD860420S1 (en) 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus
USD860419S1 (en) 2018-02-27 2019-09-17 Kokusai Electric Corporation Electric furnace for substrate processing apparatus

Also Published As

Publication number Publication date
USD825502S1 (en) 2018-08-14
TWD187000S (zh) 2017-12-01

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