JP1528485S - - Google Patents
Info
- Publication number
- JP1528485S JP1528485S JPD2015-436F JP2015000436F JP1528485S JP 1528485 S JP1528485 S JP 1528485S JP 2015000436 F JP2015000436 F JP 2015000436F JP 1528485 S JP1528485 S JP 1528485S
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-436F JP1528485S (ja) | 2015-01-14 | 2015-01-14 | |
US29/533,041 USD787456S1 (en) | 2015-01-14 | 2015-07-14 | Substrate for an electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2015-436F JP1528485S (ja) | 2015-01-14 | 2015-01-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP1528485S true JP1528485S (ja) | 2015-07-13 |
Family
ID=53778801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JPD2015-436F Active JP1528485S (ja) | 2015-01-14 | 2015-01-14 |
Country Status (2)
Country | Link |
---|---|
US (1) | USD787456S1 (ja) |
JP (1) | JP1528485S (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA169446S (en) * | 2016-01-22 | 2017-02-21 | Shenzhen Longsys Electronics Co Ltd | Ssd storage module |
JP1564043S (ja) * | 2016-04-27 | 2017-11-13 | ||
JP1564455S (ja) * | 2016-05-11 | 2017-11-13 | ||
USD798251S1 (en) * | 2016-11-07 | 2017-09-26 | Transcend Information, Inc. | Printed circuit board of solid-state memory |
TWD189067S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189069S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189068S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189065S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189071S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189070S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD189066S (zh) * | 2017-02-17 | 2018-03-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
TWD190983S (zh) * | 2017-02-17 | 2018-06-11 | 三星電子股份有限公司 | 固態硬碟儲存裝置 |
USD869469S1 (en) * | 2018-04-09 | 2019-12-10 | Samsung Electronics Co., Ltd. | SSD storage device |
AU201815958S (en) * | 2018-04-09 | 2018-11-06 | Samsung Electronics Co Ltd | SSD Storage Device |
USD958762S1 (en) * | 2019-09-09 | 2022-07-26 | The Noco Company | Circuit board |
USD947801S1 (en) * | 2019-11-07 | 2022-04-05 | Phoenix Contact Gmbh & Co. Kg | Printed circuit board |
USD937230S1 (en) * | 2019-12-20 | 2021-11-30 | Fleece Performance Engineering, Inc. | Circuit board |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5303121A (en) * | 1992-12-28 | 1994-04-12 | Ncr Corporation | Multi-chip module board |
US6347394B1 (en) * | 1998-11-04 | 2002-02-12 | Micron Technology, Inc. | Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals |
US7649742B2 (en) * | 2000-01-06 | 2010-01-19 | Super Talent Electronics, Inc. | Thin flash-hard-drive with two-piece casing |
USD432096S (en) * | 1999-11-24 | 2000-10-17 | Samsung Electronics Co., Ltd. | Semiconductor module |
US6307754B1 (en) * | 1999-12-09 | 2001-10-23 | Gateway, Inc. | Circuit card guide |
US6576972B1 (en) * | 2000-08-24 | 2003-06-10 | Heetronix | High temperature circuit structures with expansion matched SiC, AlN and/or AlxGa1-xN(x>0.69) circuit device |
USD459706S1 (en) | 2001-04-27 | 2002-07-02 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit device |
USD508681S1 (en) | 2002-11-01 | 2005-08-23 | Siemens Aktiengesellschaft | Circuit board |
TW200825931A (en) * | 2006-12-11 | 2008-06-16 | Kreton Corp | Memory packaging element and insert card module using the memory packaging element |
JP4832419B2 (ja) * | 2007-12-25 | 2011-12-07 | トヨタ自動車株式会社 | 半導体モジュール |
US8379391B2 (en) * | 2009-05-13 | 2013-02-19 | Smart Modular Technologies, Inc. | Memory module with vertically accessed interposer assemblies |
JP2011109002A (ja) * | 2009-11-20 | 2011-06-02 | Citizen Holdings Co Ltd | 集積デバイスおよび集積デバイスの製造方法 |
USD637192S1 (en) | 2010-10-18 | 2011-05-03 | Apple Inc. | Electronic device |
USD637193S1 (en) * | 2010-11-19 | 2011-05-03 | Apple Inc. | Electronic device |
USD673922S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
USD673921S1 (en) * | 2011-04-21 | 2013-01-08 | Kabushiki Kaisha Toshiba | Portion of a substrate for an electronic circuit |
WO2012144070A1 (ja) * | 2011-04-22 | 2012-10-26 | 三菱電機株式会社 | 半導体装置 |
USD716310S1 (en) * | 2012-06-09 | 2014-10-28 | Apple, Inc. | Electronic device |
JP1519750S (ja) * | 2014-05-15 | 2015-03-23 | ||
USD764424S1 (en) * | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
US9501110B2 (en) * | 2014-06-05 | 2016-11-22 | Liqid Inc. | Adjustable data storage drive module carrier assembly |
US9934825B2 (en) * | 2014-12-12 | 2018-04-03 | Toshiba Memory Corporation | Semiconductor device and electronic device |
USD753073S1 (en) * | 2014-12-30 | 2016-04-05 | Altia Systems, Inc. | Printed circuit board |
JP6381480B2 (ja) * | 2015-05-12 | 2018-08-29 | 東芝メモリ株式会社 | 半導体装置 |
JP2017022241A (ja) * | 2015-07-09 | 2017-01-26 | 株式会社東芝 | 半導体装置及び電子機器 |
-
2015
- 2015-01-14 JP JPD2015-436F patent/JP1528485S/ja active Active
- 2015-07-14 US US29/533,041 patent/USD787456S1/en active Active
Also Published As
Publication number | Publication date |
---|---|
USD787456S1 (en) | 2017-05-23 |