JP1528485S - - Google Patents

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Publication number
JP1528485S
JP1528485S JPD2015-436F JP2015000436F JP1528485S JP 1528485 S JP1528485 S JP 1528485S JP 2015000436 F JP2015000436 F JP 2015000436F JP 1528485 S JP1528485 S JP 1528485S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2015-436F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2015-436F priority Critical patent/JP1528485S/ja
Application granted granted Critical
Publication of JP1528485S publication Critical patent/JP1528485S/ja
Priority to US29/533,041 priority patent/USD787456S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2015-436F 2015-01-14 2015-01-14 Active JP1528485S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2015-436F JP1528485S (ja) 2015-01-14 2015-01-14
US29/533,041 USD787456S1 (en) 2015-01-14 2015-07-14 Substrate for an electronic circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-436F JP1528485S (ja) 2015-01-14 2015-01-14

Publications (1)

Publication Number Publication Date
JP1528485S true JP1528485S (ja) 2015-07-13

Family

ID=53778801

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2015-436F Active JP1528485S (ja) 2015-01-14 2015-01-14

Country Status (2)

Country Link
US (1) USD787456S1 (ja)
JP (1) JP1528485S (ja)

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JP1564043S (ja) * 2016-04-27 2017-11-13
JP1564455S (ja) * 2016-05-11 2017-11-13
USD798251S1 (en) * 2016-11-07 2017-09-26 Transcend Information, Inc. Printed circuit board of solid-state memory
TWD189067S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189069S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189068S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189065S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189071S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189070S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189066S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD190983S (zh) * 2017-02-17 2018-06-11 三星電子股份有限公司 固態硬碟儲存裝置
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
AU201815958S (en) * 2018-04-09 2018-11-06 Samsung Electronics Co Ltd SSD Storage Device
USD958762S1 (en) * 2019-09-09 2022-07-26 The Noco Company Circuit board
USD947801S1 (en) * 2019-11-07 2022-04-05 Phoenix Contact Gmbh & Co. Kg Printed circuit board
USD937230S1 (en) * 2019-12-20 2021-11-30 Fleece Performance Engineering, Inc. Circuit board

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US6347394B1 (en) * 1998-11-04 2002-02-12 Micron Technology, Inc. Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals
US7649742B2 (en) * 2000-01-06 2010-01-19 Super Talent Electronics, Inc. Thin flash-hard-drive with two-piece casing
USD432096S (en) * 1999-11-24 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor module
US6307754B1 (en) * 1999-12-09 2001-10-23 Gateway, Inc. Circuit card guide
US6576972B1 (en) * 2000-08-24 2003-06-10 Heetronix High temperature circuit structures with expansion matched SiC, AlN and/or AlxGa1-xN(x>0.69) circuit device
USD459706S1 (en) 2001-04-27 2002-07-02 Taiyo Yuden Co., Ltd. Hybrid integrated circuit device
USD508681S1 (en) 2002-11-01 2005-08-23 Siemens Aktiengesellschaft Circuit board
TW200825931A (en) * 2006-12-11 2008-06-16 Kreton Corp Memory packaging element and insert card module using the memory packaging element
JP4832419B2 (ja) * 2007-12-25 2011-12-07 トヨタ自動車株式会社 半導体モジュール
US8379391B2 (en) * 2009-05-13 2013-02-19 Smart Modular Technologies, Inc. Memory module with vertically accessed interposer assemblies
JP2011109002A (ja) * 2009-11-20 2011-06-02 Citizen Holdings Co Ltd 集積デバイスおよび集積デバイスの製造方法
USD637192S1 (en) 2010-10-18 2011-05-03 Apple Inc. Electronic device
USD637193S1 (en) * 2010-11-19 2011-05-03 Apple Inc. Electronic device
USD673922S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
USD673921S1 (en) * 2011-04-21 2013-01-08 Kabushiki Kaisha Toshiba Portion of a substrate for an electronic circuit
WO2012144070A1 (ja) * 2011-04-22 2012-10-26 三菱電機株式会社 半導体装置
USD716310S1 (en) * 2012-06-09 2014-10-28 Apple, Inc. Electronic device
JP1519750S (ja) * 2014-05-15 2015-03-23
USD764424S1 (en) * 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
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Publication number Publication date
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