ITUA20162465A1 - Metodo e macchina per la realizzazione di circuiti stampati - Google Patents

Metodo e macchina per la realizzazione di circuiti stampati

Info

Publication number
ITUA20162465A1
ITUA20162465A1 ITUA2016A002465A ITUA20162465A ITUA20162465A1 IT UA20162465 A1 ITUA20162465 A1 IT UA20162465A1 IT UA2016A002465 A ITUA2016A002465 A IT UA2016A002465A IT UA20162465 A ITUA20162465 A IT UA20162465A IT UA20162465 A1 ITUA20162465 A1 IT UA20162465A1
Authority
IT
Italy
Prior art keywords
machine
printed circuits
making printed
making
circuits
Prior art date
Application number
ITUA2016A002465A
Other languages
English (en)
Inventor
Alessandro Grando
Original Assignee
Alessandro Grando
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alessandro Grando filed Critical Alessandro Grando
Priority to ITUA2016A002465A priority Critical patent/ITUA20162465A1/it
Publication of ITUA20162465A1 publication Critical patent/ITUA20162465A1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
ITUA2016A002465A 2016-04-11 2016-04-11 Metodo e macchina per la realizzazione di circuiti stampati ITUA20162465A1 (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ITUA2016A002465A ITUA20162465A1 (it) 2016-04-11 2016-04-11 Metodo e macchina per la realizzazione di circuiti stampati

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUA2016A002465A ITUA20162465A1 (it) 2016-04-11 2016-04-11 Metodo e macchina per la realizzazione di circuiti stampati

Publications (1)

Publication Number Publication Date
ITUA20162465A1 true ITUA20162465A1 (it) 2017-10-11

Family

ID=56413780

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUA2016A002465A ITUA20162465A1 (it) 2016-04-11 2016-04-11 Metodo e macchina per la realizzazione di circuiti stampati

Country Status (1)

Country Link
IT (1) ITUA20162465A1 (it)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1076212B (de) * 1956-11-09 1960-02-25 Int Standard Electric Corp Verfahren zur Herstellung von elektrisch leitenden Schaltverbindungen
US4635368A (en) * 1984-08-10 1987-01-13 Golden Michael G Apparatus for making electronic circuit boards
DE19544480A1 (de) * 1995-08-01 1997-02-06 Dieter Hanika Verfahren und Vorrichtung zur Herstellung von Leiterplatten
JPH0945158A (ja) * 1995-07-31 1997-02-14 Furukawa Electric Co Ltd:The フラット電線とその製造方法
US5638598A (en) * 1993-06-17 1997-06-17 Hitachi Chemical Company, Ltd. Process for producing a printed wiring board
US20020066179A1 (en) * 2000-12-01 2002-06-06 Hall Hendley W. System and method for metalization of deep vias

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1076212B (de) * 1956-11-09 1960-02-25 Int Standard Electric Corp Verfahren zur Herstellung von elektrisch leitenden Schaltverbindungen
US4635368A (en) * 1984-08-10 1987-01-13 Golden Michael G Apparatus for making electronic circuit boards
US5638598A (en) * 1993-06-17 1997-06-17 Hitachi Chemical Company, Ltd. Process for producing a printed wiring board
JPH0945158A (ja) * 1995-07-31 1997-02-14 Furukawa Electric Co Ltd:The フラット電線とその製造方法
DE19544480A1 (de) * 1995-08-01 1997-02-06 Dieter Hanika Verfahren und Vorrichtung zur Herstellung von Leiterplatten
US20020066179A1 (en) * 2000-12-01 2002-06-06 Hall Hendley W. System and method for metalization of deep vias

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