IT201700027161A1 - Metodo e apparato per la fabbricazione di circuiti stampati - Google Patents

Metodo e apparato per la fabbricazione di circuiti stampati

Info

Publication number
IT201700027161A1
IT201700027161A1 IT102017000027161A IT201700027161A IT201700027161A1 IT 201700027161 A1 IT201700027161 A1 IT 201700027161A1 IT 102017000027161 A IT102017000027161 A IT 102017000027161A IT 201700027161 A IT201700027161 A IT 201700027161A IT 201700027161 A1 IT201700027161 A1 IT 201700027161A1
Authority
IT
Italy
Prior art keywords
manufacture
printed circuits
printed
circuits
Prior art date
Application number
IT102017000027161A
Other languages
English (en)
Inventor
Massimo Fiorani
Original Assignee
Wise S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wise S R L filed Critical Wise S R L
Priority to IT102017000027161A priority Critical patent/IT201700027161A1/it
Publication of IT201700027161A1 publication Critical patent/IT201700027161A1/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0392Pretreatment of metal, e.g. before finish plating, etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08Treatments involving gases
    • H05K2203/087Using a reactive gas
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09Treatments involving charged particles
    • H05K2203/095Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
IT102017000027161A 2017-03-13 2017-03-13 Metodo e apparato per la fabbricazione di circuiti stampati IT201700027161A1 (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IT102017000027161A IT201700027161A1 (it) 2017-03-13 2017-03-13 Metodo e apparato per la fabbricazione di circuiti stampati

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102017000027161A IT201700027161A1 (it) 2017-03-13 2017-03-13 Metodo e apparato per la fabbricazione di circuiti stampati

Publications (1)

Publication Number Publication Date
IT201700027161A1 true IT201700027161A1 (it) 2018-09-13

Family

ID=59337794

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102017000027161A IT201700027161A1 (it) 2017-03-13 2017-03-13 Metodo e apparato per la fabbricazione di circuiti stampati

Country Status (1)

Country Link
IT (1) IT201700027161A1 (it)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5192582A (en) * 1989-11-06 1993-03-09 WLS Karl-Heinz Grasmann Weichlotanlagen-und Service Procedure for processing joints to be soldered
JP2008016801A (ja) * 2006-07-04 2008-01-24 Jesagi Hankook Ltd 印刷回路基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5192582A (en) * 1989-11-06 1993-03-09 WLS Karl-Heinz Grasmann Weichlotanlagen-und Service Procedure for processing joints to be soldered
JP2008016801A (ja) * 2006-07-04 2008-01-24 Jesagi Hankook Ltd 印刷回路基板の製造方法

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