ITTO910789A0 - ELECTROLYTIC NICKEL PLATING PROCESS WITH REDUCED NICKEL ION ACCUMULATION - Google Patents

ELECTROLYTIC NICKEL PLATING PROCESS WITH REDUCED NICKEL ION ACCUMULATION

Info

Publication number
ITTO910789A0
ITTO910789A0 IT91TO789A ITTO910789A ITTO910789A0 IT TO910789 A0 ITTO910789 A0 IT TO910789A0 IT 91TO789 A IT91TO789 A IT 91TO789A IT TO910789 A ITTO910789 A IT TO910789A IT TO910789 A0 ITTO910789 A0 IT TO910789A0
Authority
IT
Italy
Prior art keywords
plating process
ion accumulation
reduced
electrolytic
nickel plating
Prior art date
Application number
IT91TO789A
Other languages
Italian (it)
Inventor
Tremmel Robert A
Original Assignee
Enthone Omi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Omi Inc filed Critical Enthone Omi Inc
Publication of ITTO910789A0 publication Critical patent/ITTO910789A0/en
Publication of ITTO910789A1 publication Critical patent/ITTO910789A1/en
Application granted granted Critical
Publication of IT1249854B publication Critical patent/IT1249854B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
ITTO910789A 1990-10-22 1991-10-18 ELECTROLYTIC NICKELING PROCESS WITH REDUCED ACCUMULATION OF NICKEL ION. IT1249854B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60886990A 1990-10-22 1990-10-22

Publications (3)

Publication Number Publication Date
ITTO910789A0 true ITTO910789A0 (en) 1991-10-18
ITTO910789A1 ITTO910789A1 (en) 1992-04-23
IT1249854B IT1249854B (en) 1995-03-28

Family

ID=24438391

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO910789A IT1249854B (en) 1990-10-22 1991-10-18 ELECTROLYTIC NICKELING PROCESS WITH REDUCED ACCUMULATION OF NICKEL ION.

Country Status (8)

Country Link
JP (1) JPH04333600A (en)
CA (1) CA2053342A1 (en)
DE (1) DE4134656C2 (en)
ES (1) ES2034897B1 (en)
FR (1) FR2668173A1 (en)
GB (1) GB2249107A (en)
IT (1) IT1249854B (en)
SE (1) SE9103061L (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4229917C1 (en) * 1992-09-08 1993-07-15 Lpw-Anlagen Gmbh, 4040 Neuss, De Electrolytic bath for meter coating - has sec. anode contg. alkaline or ammonium soln. with acid added to electrolyte to compensate for pH rise

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2393516A (en) * 1943-08-19 1946-01-22 Indiana Steel & Wire Company Process for electroplating
US2504238A (en) * 1945-07-13 1950-04-18 Int Nickel Co Anode assembly
BE564995A (en) * 1957-02-20
DE1250712B (en) * 1963-05-22 1967-09-21 International Nickel Limited, London Galvanic nickel sulfamate bath and process for depositing nickel coatings
US3374154A (en) * 1965-07-12 1968-03-19 Int Nickel Co Electroforming and electrodeposition of stress-free nickel from the sulfamate bath
US3474011A (en) * 1967-08-03 1969-10-21 American Bank Note Co Electroplating method and apparatus
JPS5135394B2 (en) * 1972-09-01 1976-10-01
JPS558493A (en) * 1978-07-05 1980-01-22 Mazda Motor Corp Nickel recovery system of nickel plating apparatus
JPS56112500A (en) * 1980-02-09 1981-09-04 Ebara Yuujiraito Kk Method for electroplating
US4466865A (en) * 1982-01-11 1984-08-21 Omi International Corporation Trivalent chromium electroplating process
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
DE3347593A1 (en) * 1983-01-03 1984-07-05 Omi International Corp., Warren, Mich. AQUEOUS ALKALINE CYANIDE-FREE COPPER ELECTROLYTE AND METHOD FOR GALVANICALLY DEPOSITING A GRAIN-REFINED DUCTILE AND ADHESIVE COPPER LAYER ON A CONDUCTIVE SUBSTRATE
JPS63317698A (en) * 1987-06-20 1988-12-26 Toyota Motor Corp Controlling device for concentration of metallic ion and concentration of hydrogen ion in electroplating liquid
US4778572A (en) * 1987-09-08 1988-10-18 Eco-Tec Limited Process for electroplating metals
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process

Also Published As

Publication number Publication date
ES2034897A1 (en) 1993-04-01
IT1249854B (en) 1995-03-28
CA2053342A1 (en) 1992-04-23
GB9122383D0 (en) 1991-12-04
SE9103061L (en) 1992-04-23
JPH04333600A (en) 1992-11-20
DE4134656A1 (en) 1992-04-23
DE4134656C2 (en) 1994-02-03
ES2034897B1 (en) 1994-04-16
ITTO910789A1 (en) 1992-04-23
GB2249107A (en) 1992-04-29
SE9103061D0 (en) 1991-10-21
FR2668173A1 (en) 1992-04-24

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Legal Events

Date Code Title Description
0001 Granted