ITTO20080632A1 - Procedimento per la configurazione a scala micrometrica e nanometrica di strati metallici su un substrato - Google Patents

Procedimento per la configurazione a scala micrometrica e nanometrica di strati metallici su un substrato

Info

Publication number
ITTO20080632A1
ITTO20080632A1 IT000632A ITTO20080632A ITTO20080632A1 IT TO20080632 A1 ITTO20080632 A1 IT TO20080632A1 IT 000632 A IT000632 A IT 000632A IT TO20080632 A ITTO20080632 A IT TO20080632A IT TO20080632 A1 ITTO20080632 A1 IT TO20080632A1
Authority
IT
Italy
Prior art keywords
micrometric
procedure
substrate
metallic layers
scale configuration
Prior art date
Application number
IT000632A
Other languages
English (en)
Inventor
Roberto Cingolani
Pier Paolo Pompa
Rosaria Rinaldi
Shiv Shankar Sangaru
Original Assignee
Consiglio Naz Delle Ricerche Infm Istituto
Fond Istituto Italiano Di T Ecnologia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consiglio Naz Delle Ricerche Infm Istituto, Fond Istituto Italiano Di T Ecnologia filed Critical Consiglio Naz Delle Ricerche Infm Istituto
Priority to IT000632A priority Critical patent/ITTO20080632A1/it
Publication of ITTO20080632A1 publication Critical patent/ITTO20080632A1/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
IT000632A 2008-08-12 2008-08-12 Procedimento per la configurazione a scala micrometrica e nanometrica di strati metallici su un substrato ITTO20080632A1 (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IT000632A ITTO20080632A1 (it) 2008-08-12 2008-08-12 Procedimento per la configurazione a scala micrometrica e nanometrica di strati metallici su un substrato

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT000632A ITTO20080632A1 (it) 2008-08-12 2008-08-12 Procedimento per la configurazione a scala micrometrica e nanometrica di strati metallici su un substrato

Publications (1)

Publication Number Publication Date
ITTO20080632A1 true ITTO20080632A1 (it) 2010-02-13

Family

ID=40547563

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000632A ITTO20080632A1 (it) 2008-08-12 2008-08-12 Procedimento per la configurazione a scala micrometrica e nanometrica di strati metallici su un substrato

Country Status (1)

Country Link
IT (1) ITTO20080632A1 (it)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000025136A1 (en) * 1998-10-27 2000-05-04 Technion Research And Development Foundation Ltd. Method for gold deposition
EP1260607A2 (en) * 2001-05-25 2002-11-27 Shipley Company LLC Plating method
GB2387392A (en) * 2001-06-08 2003-10-15 Murata Manufacturing Co Metal film for use in a laminated ceramic electronic component and manufacturing method thereof
US20070212871A1 (en) * 2006-03-10 2007-09-13 Seiko Epson Corporation Method of manufacturing interconnect substrate
WO2008044803A1 (en) * 2006-10-13 2008-04-17 Korea Institute Of Science And Technology Method for manufacturing metal structure and carbon nano tube by using immersion plating
JP2008127669A (ja) * 2006-11-24 2008-06-05 Fujitsu Ltd 樹脂筐体及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000025136A1 (en) * 1998-10-27 2000-05-04 Technion Research And Development Foundation Ltd. Method for gold deposition
EP1260607A2 (en) * 2001-05-25 2002-11-27 Shipley Company LLC Plating method
GB2387392A (en) * 2001-06-08 2003-10-15 Murata Manufacturing Co Metal film for use in a laminated ceramic electronic component and manufacturing method thereof
US20070212871A1 (en) * 2006-03-10 2007-09-13 Seiko Epson Corporation Method of manufacturing interconnect substrate
WO2008044803A1 (en) * 2006-10-13 2008-04-17 Korea Institute Of Science And Technology Method for manufacturing metal structure and carbon nano tube by using immersion plating
JP2008127669A (ja) * 2006-11-24 2008-06-05 Fujitsu Ltd 樹脂筐体及びその製造方法

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