ITTO20050478A1 - Procedimento per la realizzazione di cavita' sepolte all'interno di un corpo semiconduttore e corpo semiconduttore cosi' realizzato - Google Patents
Procedimento per la realizzazione di cavita' sepolte all'interno di un corpo semiconduttore e corpo semiconduttore cosi' realizzatoInfo
- Publication number
- ITTO20050478A1 ITTO20050478A1 IT000478A ITTO20050478A ITTO20050478A1 IT TO20050478 A1 ITTO20050478 A1 IT TO20050478A1 IT 000478 A IT000478 A IT 000478A IT TO20050478 A ITTO20050478 A IT TO20050478A IT TO20050478 A1 ITTO20050478 A1 IT TO20050478A1
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor body
- buried
- cavities
- realization
- procedure
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00047—Cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0636—Integrated biosensor, microarrays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/06—Auxiliary integrated devices, integrated components
- B01L2300/0627—Sensor or part of a sensor is integrated
- B01L2300/0645—Electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0809—Geometry, shape and general structure rectangular shaped
- B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/18—Means for temperature control
- B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
- B01L2300/1827—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using resistive heater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L7/00—Heating or cooling apparatus; Heat insulating devices
- B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0315—Cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0111—Bulk micromachining
- B81C2201/0116—Thermal treatment for structural rearrangement of substrate atoms, e.g. for making buried cavities
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000478A ITTO20050478A1 (it) | 2005-07-12 | 2005-07-12 | Procedimento per la realizzazione di cavita' sepolte all'interno di un corpo semiconduttore e corpo semiconduttore cosi' realizzato |
US11/486,387 US7811848B2 (en) | 2005-07-12 | 2006-07-12 | Method for forming buried cavities within a semiconductor body, and semiconductor body thus made |
US12/873,685 US8420428B2 (en) | 2005-07-12 | 2010-09-01 | Method for forming buried cavities within a semiconductor body, and semiconductor body thus made |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT000478A ITTO20050478A1 (it) | 2005-07-12 | 2005-07-12 | Procedimento per la realizzazione di cavita' sepolte all'interno di un corpo semiconduttore e corpo semiconduttore cosi' realizzato |
Publications (1)
Publication Number | Publication Date |
---|---|
ITTO20050478A1 true ITTO20050478A1 (it) | 2007-01-13 |
Family
ID=37854247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT000478A ITTO20050478A1 (it) | 2005-07-12 | 2005-07-12 | Procedimento per la realizzazione di cavita' sepolte all'interno di un corpo semiconduttore e corpo semiconduttore cosi' realizzato |
Country Status (2)
Country | Link |
---|---|
US (2) | US7811848B2 (it) |
IT (1) | ITTO20050478A1 (it) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1577656B1 (en) | 2004-03-19 | 2010-06-09 | STMicroelectronics Srl | Method for manufacturing a semiconductor pressure sensor |
ITTO20050478A1 (it) * | 2005-07-12 | 2007-01-13 | St Microelectronics Srl | Procedimento per la realizzazione di cavita' sepolte all'interno di un corpo semiconduttore e corpo semiconduttore cosi' realizzato |
ITMI20080532A1 (it) * | 2008-03-28 | 2009-09-29 | St Microelectronics Srl | Metodo di fabbricazione di un sensore di gas integrato su substrato semiconduttore |
US8751172B2 (en) * | 2009-06-29 | 2014-06-10 | Rochester Institute Of Technology | Microelectromechanical viscosity measurement devices and methods thereof |
US8727504B2 (en) | 2011-11-11 | 2014-05-20 | Stmicroelectronics, Inc. | Microfluidic jetting device with piezoelectric actuator and method for making the same |
US8956325B2 (en) | 2011-12-07 | 2015-02-17 | Stmicroelectronics, Inc. | Piezoelectric microfluidic pumping device and method for using the same |
ITTO20130502A1 (it) * | 2013-06-18 | 2014-12-19 | St Microelectronics Asia | Dispositivo elettronico con sensore di temperatura integrato e relativo metodo di fabbricazione |
ITUB20155716A1 (it) * | 2015-11-19 | 2017-05-19 | St Microelectronics Srl | Dispositivo micro-elettro-meccanico dotato di due cavita' sepolte e relativo procedimento di fabbricazione |
DE102017101672B4 (de) | 2017-01-27 | 2021-02-25 | Infineon Technologies Austria Ag | Verfahren zum Herstellen einer Isolationsstruktur mit einer gasgefüllten Kavität und Halbleiterbauelement |
US10365564B2 (en) | 2017-08-09 | 2019-07-30 | Saudi Arabian Oil Company | Calcite channel nanofluidics |
US10170304B1 (en) | 2017-10-25 | 2019-01-01 | Globalfoundries Inc. | Self-aligned nanotube structures |
US10676347B2 (en) | 2018-01-09 | 2020-06-09 | Stmicroelectronics S.R.L. | Micro-electro-mechanical device having two buried cavities and manufacturing process thereof |
US10782196B2 (en) | 2018-02-19 | 2020-09-22 | Stmicroelectronics S.R.L. | Strain gauge with mechanically decoupled temperature sensor |
US10466126B2 (en) * | 2018-02-27 | 2019-11-05 | Globalfoundries Inc. | MEMS capacitive pressure sensors in fully depleted semiconductor on insulator (FDSOI) |
US10761428B2 (en) | 2018-08-28 | 2020-09-01 | Saudi Arabian Oil Company | Fabricating calcite nanofluidic channels |
US11865581B2 (en) | 2018-11-21 | 2024-01-09 | Stmicroelectronics S.R.L. | Ultrasonic MEMS acoustic transducer with reduced stress sensitivity and manufacturing process thereof |
US10926227B2 (en) | 2018-12-03 | 2021-02-23 | Saudi Arabian Oil Company | Fabricating calcite nanofluidic channels |
IT201900005808A1 (it) | 2019-04-15 | 2020-10-15 | St Microelectronics Srl | Dispositivo mems a micropompa per la movimentazione o eiezione di un fluido, in particolare microsoffiante o flussimetro |
US11300554B2 (en) | 2020-01-14 | 2022-04-12 | Saudi Arabian Oil Company | Calcite channel structures with heterogeneous wettability |
US11454097B2 (en) | 2021-01-04 | 2022-09-27 | Saudi Arabian Oil Company | Artificial rain to enhance hydrocarbon recovery |
CN113479841A (zh) * | 2021-05-24 | 2021-10-08 | 中国电子科技集团公司第五十五研究所 | 一种硅基微流道基板制备方法 |
US11961702B2 (en) | 2021-12-09 | 2024-04-16 | Saudi Arabian Oil Company | Fabrication of in situ HR-LCTEM nanofluidic cell for nanobubble interactions during EOR processes in carbonate rocks |
US11787993B1 (en) | 2022-03-28 | 2023-10-17 | Saudi Arabian Oil Company | In-situ foamed gel for lost circulation |
US11913319B2 (en) | 2022-06-21 | 2024-02-27 | Saudi Arabian Oil Company | Sandstone stimulation |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3762136B2 (ja) * | 1998-04-24 | 2006-04-05 | 株式会社東芝 | 半導体装置 |
DE69930099T2 (de) * | 1999-04-09 | 2006-08-31 | Stmicroelectronics S.R.L., Agrate Brianza | Herstellung von vergrabenen Hohlräumen in einer einkristallinen Halbleiterscheibe und Halbleiterscheibe |
US7294536B2 (en) * | 2000-07-25 | 2007-11-13 | Stmicroelectronics S.R.L. | Process for manufacturing an SOI wafer by annealing and oxidation of buried channels |
US7069952B1 (en) * | 2001-11-14 | 2006-07-04 | Caliper Life Sciences, Inc. | Microfluidic devices and methods of their manufacture |
DE60127148T2 (de) | 2001-12-28 | 2007-12-13 | Stmicroelectronics S.R.L., Agrate Brianza | Herstellungsverfahren für SOI Scheibe durch Wärmebehandlung und Oxidation von vergrabenen Kanälen |
EP2280412A3 (en) * | 2002-11-29 | 2011-02-16 | STMicroelectronics S.r.l. | Semiconductor substrate comprising at least a buried insulating cavity |
ITTO20050478A1 (it) * | 2005-07-12 | 2007-01-13 | St Microelectronics Srl | Procedimento per la realizzazione di cavita' sepolte all'interno di un corpo semiconduttore e corpo semiconduttore cosi' realizzato |
-
2005
- 2005-07-12 IT IT000478A patent/ITTO20050478A1/it unknown
-
2006
- 2006-07-12 US US11/486,387 patent/US7811848B2/en active Active
-
2010
- 2010-09-01 US US12/873,685 patent/US8420428B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7811848B2 (en) | 2010-10-12 |
US20100330721A1 (en) | 2010-12-30 |
US20070057355A1 (en) | 2007-03-15 |
US8420428B2 (en) | 2013-04-16 |
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