ITRM940855A0 - PROCEDURE FOR THE RECOVERY OF CUTTING WHEAT - Google Patents

PROCEDURE FOR THE RECOVERY OF CUTTING WHEAT

Info

Publication number
ITRM940855A0
ITRM940855A0 ITRM940855A ITRM940855A ITRM940855A0 IT RM940855 A0 ITRM940855 A0 IT RM940855A0 IT RM940855 A ITRM940855 A IT RM940855A IT RM940855 A ITRM940855 A IT RM940855A IT RM940855 A0 ITRM940855 A0 IT RM940855A0
Authority
IT
Italy
Prior art keywords
recovery
procedure
cutting wheat
wheat
cutting
Prior art date
Application number
ITRM940855A
Other languages
Italian (it)
Inventor
Walter Frank
Maximilian Kaser
Albert Pemwieser
Original Assignee
Wacker Chemitronic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemitronic filed Critical Wacker Chemitronic
Publication of ITRM940855A0 publication Critical patent/ITRM940855A0/en
Publication of ITRM940855A1 publication Critical patent/ITRM940855A1/en
Application granted granted Critical
Publication of IT1274990B1 publication Critical patent/IT1274990B1/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
ITRM940855A 1994-02-23 1994-12-30 PROCEDURE FOR THE RECOVERY OF CUTTING WHEAT IT1274990B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4405829A DE4405829A1 (en) 1994-02-23 1994-02-23 Recovery of abrasive particles used to process semiconductor articles

Publications (3)

Publication Number Publication Date
ITRM940855A0 true ITRM940855A0 (en) 1994-12-30
ITRM940855A1 ITRM940855A1 (en) 1996-06-30
IT1274990B1 IT1274990B1 (en) 1997-07-29

Family

ID=6510998

Family Applications (1)

Application Number Title Priority Date Filing Date
ITRM940855A IT1274990B1 (en) 1994-02-23 1994-12-30 PROCEDURE FOR THE RECOVERY OF CUTTING WHEAT

Country Status (3)

Country Link
JP (1) JPH07251373A (en)
DE (1) DE4405829A1 (en)
IT (1) IT1274990B1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY138664A (en) * 1995-10-04 2009-07-31 Komatsu Ntc Ltd Slurry managing system and slurry managing for wire saws
JP3199159B2 (en) * 1996-01-26 2001-08-13 信越半導体株式会社 Oily slurry wastewater recycling system
US6161533A (en) * 1996-10-01 2000-12-19 Nippei Toyoma Corp. Slurry managing system and slurry managing method
JP3408979B2 (en) 1997-12-26 2003-05-19 株式会社日平トヤマ Slurry management system
US6231628B1 (en) 1998-01-07 2001-05-15 Memc Electronic Materials, Inc. Method for the separation, regeneration and reuse of an exhausted glycol-based slurry
IT1299540B1 (en) * 1998-07-01 2000-03-16 Memc Electronic Materials PROCEDURE TO SEPARATE AND REGENERATE WASTE ABRASIVE BASED ON GLYCOL AND SILICON CARBIDE FOR THE PURPOSE OF THEIR REUSE
DE19930353A1 (en) * 1999-07-01 2000-12-14 Wacker Siltronic Halbleitermat Method for slicing semiconductor bars with grinding suspension continuously refreshed
ITRM20050329A1 (en) * 2005-06-24 2006-12-25 Guido Fragiacomo PROCEDURE FOR TREATING ABRASIVE SUSPENSIONS EXHAUSTED FOR THE RECOVERY OF THEIR RECYCLABLE COMPONENTS AND ITS PLANT.
WO2009056152A1 (en) * 2007-10-30 2009-05-07 Pall Corporation Method for treating spent abrasive slurry
CN102229792B (en) * 2010-09-16 2013-10-09 蒙特集团(香港)有限公司 Solar silicon wafer cutting mortar

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01316170A (en) * 1988-06-13 1989-12-21 Osaka Titanium Co Ltd Cutting work method and abrasive liquid reutilizing device
DE4201525A1 (en) * 1992-01-21 1993-07-22 Wernicke & Co Gmbh Assembly to separate and recover optical grinding paste - has filter form waste incident in fabrication of spectacle lenses

Also Published As

Publication number Publication date
DE4405829A1 (en) 1995-08-31
JPH07251373A (en) 1995-10-03
ITRM940855A1 (en) 1996-06-30
IT1274990B1 (en) 1997-07-29

Similar Documents

Publication Publication Date Title
DE69500422D1 (en) HIGH FREQUENCY ABLATION SYSTEM
NO963221D0 (en) cutter
DE69505587T2 (en) Landing aid
DE59509742D1 (en) Perforating knife
LV11745A (en) Method for continuous varisan wheat
DE69522873T2 (en) cutter
DE29505306U1 (en) Slicer
IT1274990B1 (en) PROCEDURE FOR THE RECOVERY OF CUTTING WHEAT
IS4321A (en) New dialkoxy-pyridinyl-benzimidazole derivatives
NO965077D0 (en) cutters
DE69523108T2 (en) cutter
NO952628D0 (en) perforating
ITMI941043A0 (en) EQUIPMENT FOR THE CREATION OF TRANSLARYNGEAL TRACHEOSTORY
DE59510011D1 (en) perforating
DE69605991T2 (en) Corner cutter
BR9509295A (en) Reamer
ATE182133T1 (en) NAPHTOQUINONE DERIVATIVES
ITUD930212A0 (en) CUTTER FOR DIAPHRAGM JOINTS
ATA141094A (en) BACK OF THE CUTTER
KR960000746U (en) Cutter for cutter
FI950657A (en) Milling cutter
KR960020457U (en) Chassis cutter
DE69517425T2 (en) CUTTER
DE9407041U1 (en) Onion cutter
FI972094A (en) Cutter