IT980751B - Procedimento per collegare una fo glietta isolante comprendente pi ste conduttrici ai conduttori di corrente su un substrato - Google Patents

Procedimento per collegare una fo glietta isolante comprendente pi ste conduttrici ai conduttori di corrente su un substrato

Info

Publication number
IT980751B
IT980751B IT67953/73A IT6795373A IT980751B IT 980751 B IT980751 B IT 980751B IT 67953/73 A IT67953/73 A IT 67953/73A IT 6795373 A IT6795373 A IT 6795373A IT 980751 B IT980751 B IT 980751B
Authority
IT
Italy
Prior art keywords
procedure
substrate
several steps
including several
insulating strip
Prior art date
Application number
IT67953/73A
Other languages
English (en)
Italian (it)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Application granted granted Critical
Publication of IT980751B publication Critical patent/IT980751B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
IT67953/73A 1972-04-06 1973-04-03 Procedimento per collegare una fo glietta isolante comprendente pi ste conduttrici ai conduttori di corrente su un substrato IT980751B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204575A NL7204575A (https=) 1972-04-06 1972-04-06

Publications (1)

Publication Number Publication Date
IT980751B true IT980751B (it) 1974-10-10

Family

ID=19815787

Family Applications (1)

Application Number Title Priority Date Filing Date
IT67953/73A IT980751B (it) 1972-04-06 1973-04-03 Procedimento per collegare una fo glietta isolante comprendente pi ste conduttrici ai conduttori di corrente su un substrato

Country Status (9)

Country Link
JP (1) JPS5113994B2 (https=)
CA (1) CA987788A (https=)
CH (1) CH554599A (https=)
DE (1) DE2313327A1 (https=)
FR (1) FR2179104B1 (https=)
GB (1) GB1423868A (https=)
HK (1) HK4177A (https=)
IT (1) IT980751B (https=)
NL (1) NL7204575A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52156235A (en) * 1976-06-21 1977-12-26 Hitachi Ltd Transistor ignitor
JPS53101268U (https=) * 1977-01-20 1978-08-16
CN107623993B (zh) * 2017-10-31 2020-06-23 Oppo广东移动通信有限公司 一种电路板、电路板制作方法、电子设备及其装配方法
DE102019131950A1 (de) * 2019-11-26 2021-05-27 Landulf Martin Skoda Lötpad und Verfahren zum Löten

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3474297A (en) * 1967-06-30 1969-10-21 Texas Instruments Inc Interconnection system for complex semiconductor arrays

Also Published As

Publication number Publication date
FR2179104A1 (https=) 1973-11-16
FR2179104B1 (https=) 1977-12-30
NL7204575A (https=) 1973-10-09
JPS4917970A (https=) 1974-02-16
JPS5113994B2 (https=) 1976-05-06
GB1423868A (en) 1976-02-04
CH554599A (de) 1974-09-30
CA987788A (en) 1976-04-20
DE2313327A1 (de) 1973-10-18
HK4177A (en) 1977-01-28

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